The invention provides a 3D integrated framework of an ultrahigh frequency power converter. The 3D integrated framework comprises a PCB circuit layer and a winding unit erected on the PCB circuit layer. The winding unit is connected with the PCB circuit layer through a wire. The winding unit comprises winding layers formed on a first insulating layer and a first soft magnetic thin film layer formed on a second insulating layer. The first soft magnetic thin film layer is arranged below the winding layers in a laminated mode to be used for achieving magnetic shielding between the winding layers and the PCB circuit layer. Compared with the prior art, by the adoption of 3D integration, the size of the converter is reduced, and the power density is increased; soft magnetic materials are adopted to form the magnetic shielding layer, magnetic field interference between windings and the PCB circuit layer and between the windings and external metal is solved, the Q value of the windings is increased, the alternating current resistance and high-frequency loss of an inductor and a transformer are reduced, and the working efficiency of the converter is improved; a plane magnetic element is further adopted, and the miniaturization and flattening of products are guaranteed; temperature rising of the magnetic element is reduced greatly, and the working environment of a semiconductor device is improved.