2318results about "Fixed signal inductances" patented technology

A device comprising a die substrate; a plurality of interconnects located over the die substrate, wherein the plurality of interconnects comprise a first plurality of interconnects comprising a first plurality of via interconnects, wherein the first plurality of interconnects are configured as a first inductor; and a second plurality of interconnects comprising a second plurality of via interconnects, wherein the second plurality of interconnects are configured as a second inductor; wherein the first inductor and the second inductor are intertwined, at least one magnetic layer that surrounds at least part of the first plurality of via interconnects and at least part of the second plurality of via interconnects; and at least one dielectric layer located over the die substrate.

A multilayer filter includes: an element body formed by laminating a plurality of insulator layers; a first inductor and a second inductor; and a wall portion disposed between the first inductor and the second inductor and grounded, wherein at least the second inductor is a vertical winding type inductor of which a winding axis extends in a direction orthogonal to a laminating direction in which the plurality of insulator layers are laminated, a penetrating portion penetrating in a facing direction in which the first inductor and the second inductor face each other is formed in the wall portion, and a size of the penetrating portion in the laminating direction is larger than a size of one insulator layer.

A coil component in which stress inside thereof is alleviated and the DC resistance is low. A multilayer coil component includes an element body that includes an insulator portion and a coil embedded in the insulator portion; and outer electrodes disposed on surfaces of the insulator portion and electrically connected to ends of the coil. There is a groove-shaped void portion at a boundary between the coil and the insulator portion, and the void portion extends in a length direction of the coil. The coil has a ridge in the void portion, and the ridge extends in the length direction of the coil.

A filter device includes a body, a ground terminal, and resonators in the body and coupled to each other by electromagnetic field coupling. The resonators include a first resonator coupled to an input terminal, a second resonator coupled to an output terminal, and third and fourth resonators. The second resonator is adjacent to the first resonator in a first direction. The third resonator is adjacent to the first resonator in a second direction perpendicular to the first direction. The fourth resonator is adjacent to the third resonator in the first direction. The third and fourth resonators partially share a path to the ground terminal.

An electronic component is provided that includes a substrate, an insulator layer expanding over a surface of the substrate, a planar conductor on the substrate or in the insulator layer and expanding in a plane parallel to the surface of the substrate, and an inductor conductor pattern on the insulator layer or in the insulator layer. When viewed in a direction perpendicular to the surface of the substrate, a length in a longitudinal direction of a region in which a region with the inductor conductor pattern overlapping the planar conductor is represented by Ls, and a distance between the inductor conductor pattern and the planar conductor is represented by d, such that Ls / d is 1 or more and 60 or less.

The invention discloses an AI common mode inductance coil broken line material planting machine which comprises a first conveying line. A first material stripping module is arranged below the discharging end of the first conveying line. The m ejected inductance coils are grabbed by the first coil taking and placing manipulator and are transferred into the m bending jig grooves; the bending jig disc on the first transfer table is pushed to the feeding end of the second conveying line through a first jig disc push rod assembly; a T-core feeding device is arranged on the T-core feeding device; two pin bending machines; a second material stripping module is arranged below the second transfer table; and the discharging manipulator comprises an overturning manipulator and a rotating manipulator, the overturning manipulator is used for grabbing the m finished product materials and overturning the m finished product materials by 180 degrees, and the rotating manipulator is used for grabbing the m finished product materials overturned by 180 degrees, rotating the m finished product materials by 90 degrees and then discharging the m finished product materials to the material disc. According to the automatic feeding device, T-core magnetic core feeding, pin bending, finished product material overturning and material placing are integrated, and the inductance coil machining efficiency is improved.

A saturable-core inductor includes a magnetic core structure having a non-saturable part and a saturable part. The non-saturable core part includes at least one core body arranged to form a closed magnetic circuit with at least one air gap. The saturable core part includes a core bridge element inserted into each of the at least one air gap to form a magnetic bridge across the air gap for the closed magnetic circuit. Each bridge element and the core bodies are configured to be unsaturated at predetermined low current levels to provide a low-current high inductance. Each bridge element is configured to saturate fully first with increasing current levels and to quickly drop the inductance from the low-current high inductance to a low inductance, while the air gap is configured to prevent the core bodies from a full saturation.

A resin composition comprising (A) a Fe-Ni-Si type alloy magnetic powder and (B) a thermosetting resin, wherein an amount of Si included in the (A) component is 10 by mass to 8% by mass relative to 100% mass of the (A) component.

In an embodiment a choke module includes a choke with a magnetic core and at least two windings, a thermally conductive pad, and a footprint capacitor, which is a plate capacitor, and which is configured to provide a mechanical support for the choke, wherein the footprint capacitor comprises at least one first electrode layer, at least one dielectric layer and at least one second electrode layer located one above the other, wherein the choke is located on the footprint capacitor, wherein an upper surface of the footprint capacitor faces the choke, and wherein the thermally conductive pad is arranged on the upper surface of the footprint capacitor.

A band-pass filter includes a first port, a second port, first to third high-pass filters provided between the first port and the second port in this order from a first-port side in a circuit configuration, and a low-pass filter provided between the second high-pass filter and the third high-pass filter in the circuit configuration. Each of the first to third high-pass filters forms an attenuation pole on a low-pass side of the passband. A frequency of the attenuation pole formed by the second high-pass filter is higher than a frequency of the attenuation pole formed by each of the first and third high-pass filters.

An electric component having electric coils, the component formed by 3D printing of at least three different 3D-printed materials with spatial distributions yielding open magnetic circuit configuration of one of the electric coils. The electric component having a bulk formed by non-magnetic and dielectric 3D printed material; and an electric coil of the open magnetic circuit configuration, 3D-printed in the bulk. A magnetic channel of magnetic material 3D-printed in the bulk forming magnetic core of the electric coil; and an electric channel forming an inductor of the electric coil having conductive material 3D-printed in the bulk with a coil / helical geometry having electrically connected conductive windings arranged to circumference the magnetic channel, which is configured and operable with the open magnetic circuit configuration and has magnetic material occupying a central region of the coil / helical geometry of the inductor while not enclosing the windings with a closed loop of the magnetic material.

The invention discloses a multi-pad chip magnetic element and vertical integrated power supply module, which comprises a first magnetic element inductance part, a first electrical connection pad, a second electrical connection pad and a heat conduction pad, the first electrical connection bonding pad, the second electrical connection bonding pad and the heat conduction bonding pad are all directly pressed on the first magnetic piece inductor part through the pressing technology. The chip magnetic detection module has the advantages of being high in expansibility, excellent in heat dissipation performance and high in power density.

A reactor is provided with a coil including a pair of winding portions, a magnetic core to be arranged inside and outside the winding portions, a holding member for specifying mutual positions of the coil and the magnetic core, a case for accommodating an assembly including the coil, the magnetic core and the holding member, and a sealing resin portion to be filled into the case. The case includes a bottom plate portion on which the assembly is placed, a side wall portion for surrounding the assembly, and an opening facing the bottom plate portion. The side wall portion includes a pair of long side parts facing each other and a pair of short side parts facing each other. The assembly is so accommodated into the case that an axial direction of each winding portion is along a depth direction of the case.

The present application relates to the technical field of passive devices. Provided are an inductor structure and a filter. The inductor structure comprises a dielectric substrate, a first conductive structure and a second conductive structure; the dielectric substrate is provided with a plurality of connecting vias passing through in a thickness direction thereof, each connecting via being internally provided with a connecting electrode; the first conductive structure and the second conductive structure are electrically connected via the connecting electrodes, so as to form a coil of the inductor structure; one of the first conductive structure and the second conductive structure comprises at least three sub-layers, and the other comprises at least one sub-layer, the orthogonal projection of two sub-layers of the first conductive structure on the dielectric substrate partially overlapping the orthogonal projection of two sub-layers of the second conductive structure on the dielectric substrate, and the flowing directions of currents thereof being roughly parallel. The inductor structure is used for manufacturing high-performance filters.

The invention relates to the technical field of inductance components, in particular to a coil electrode layer and a laminated inductance component. The coil electrode layer includes an insulating substrate having a first surface; the inner ring electrode is arranged on the first surface and is coiled along the rectangle; the outer-ring electrode is arranged on the first surface and is coiled along the rectangle, one end of the outer-ring electrode is connected with one end of the inner-ring electrode and is arranged around the inner-ring electrode, a distance W0 is formed between the outer-ring electrode and the inner-ring electrode in the first direction, and the first direction is parallel to the first edge of the outer-ring electrode; the inner ring electrode is provided with a first electric connection end far away from the outer ring electrode, and the outer ring electrode is provided with a second electric connection end far away from the inner ring electrode; the width of the inner ring electrode and the width of the outer ring electrode are both WC, the distance between the first electric connecting end and the second electric connecting end in the first direction is W1, and W1 is larger than or equal to WC + 2W0. Therefore, the load reliability of the product can be improved, the short circuit phenomenon after the product is loaded is prevented, and the inductance value can be increased.

A core substrate is a core substrate with a built-in inductor for constructing an interposer to which a semiconductor element is mounted. The core substrate includes a ceramic substrate, a conductor portion, and a magnetic material portion. The ceramic substrate has a first surface, a second surface opposite the first surface in a thickness direction, and a through hole between the first surface and the second surface. The conductor portion extends through the through hole, and is made of a sintered material including sintered metal. The magnetic material portion surrounds the conductor portion within the through hole, and is made of ceramics. The ceramic substrate and the magnetic material portion are inorganically bonded together, and the magnetic material portion and the conductor portion are inorganically bonded together.

A z-disaggregated integrated circuit package substrate assembly comprises a first substrate component (a coreless patch), a second substrate component (a core patch), and a third substrate component (an interposer). The coreless patch comprises thinner dielectric layers and higher density routing and can comprise an embedded bridge to allow for communication between integrated circuit dies attached to the coreless patch. The core layer acts as a middle layer interconnect between the coreless patch and the interposer and comprises liquid metal interconnects to connect the core patch physically and electrically to the coreless patch and the interposer. Core patch through holes comprise liquid metal plugs. Some through holes can be surrounded by and coaxially aligned with magnetic plugs to provide improved power signal delivery. The interposer comprises thicker dielectric layers and lower density routing. The substrate assembly can reduce cost and provide improved overall yield and electrical performance relative to monolithic substrates.

[Problem] To form a terminal electrode such that an appropriate area is exposed from a magnetic element part. [Solution] The present invention comprises a coil part 111 which is embedded in a magnetic element part M and in which terminal electrodes 121, 122 are respectively exposed at main surfaces 101, 102. A conductor layer L1 includes terminal patterns 141, 142, end surfaces of which are respectively exposed at the main surfaces 101, 102, and a coil pattern C11 which is connected to the terminal pattern 141. A conductor layer L2 includes terminal patterns 143, 144, end surfaces of which are respectively exposed at the main surfaces 101, 102. The end surfaces of the terminal patterns 141, 143 are connected to each other via a via conductor 151 that is exposed at the main surface 101. The end surfaces of the terminal patterns 142, 144 are connected to each other via a via conductor 152 that is exposed at the main surface 102. The terminal electrodes 121, 122 are surrounded by an interlayer insulating film 130 on the main surfaces 101, 102.

A magnetic inductor core forms a three-dimensional figure eight pattern. An upper member of the core forms an upper half of the figure eight pattern, a lower member of the core forms a lower half of the figure eight pattern, and central portions of the upper and lower members are separated from one another in a depth dimension by a main gap that passes transversely through the core from left to right sides of the figure eight pattern. The upper and lower members are joined at top and bottom sides of the figure eight pattern by core members that extend in the depth dimension between the upper and lower members. Coupled inductor components are be formed using the core such that magnetic flux associated with electrical current flowing in the inductor windings follows the figure eight pattern of the core in opposite directions, producing a flux cancelation effect inside the core.

The present invention relates to the technical field related to the production of hollow coils, and discloses a hollow coil processing device and its processing technology. In order to solve the problem that the discharged hollow coil after processing is prone to deformation, an outer cylinder block and an adjustment cylinder block form a cylinder shape for coil winding. When the hollow coil is wound and needs to be discharged, the adjustment cylinder block is retracted into the outer cylinder block, and the two outer cylinder blocks are relatively close to each other, resulting in a relatively smaller diameter of the cylinder formed by the outer cylinder block and the adjustment cylinder block, so that the formed hollow coil does not closely adhere to the outer cylinder block and the adjustment cylinder block, and finally realizes the effect that the cylinder diameter is controllable for easy discharging.

A vibration reduction unit and a transformer including the same are disclosed. The vibration reduction unit according to one aspect of the present invention includes a sound absorbing member that is accommodated in a filling space formed in a housing and configured to absorb vibrations or noise generated inside the housing, and a cover member that is coupled to the housing, the filling space being formed between a plurality of reinforcing ribs that are provided in the housing and extend in one direction, and the cover member may be coupled to cover the reinforcing ribs, the filling space, and the sound absorbing member accommodated in the filling space from the outside.

A filter device includes a dielectric substrate, first and second ground electrodes connected to a ground terminal, and resonators between the ground electrodes and electromagnetically coupled to each other. The ground electrodes are at different positions in a normal direction of the dielectric substrate. Each of the resonators includes a first capacitor electrode partially overlapping with the first ground electrode in plan view of the dielectric substrate, a second capacitor electrode partially overlapping with the second ground electrode in plan view of the dielectric substrate, and a via connecting the capacitor electrodes. The resonators include a first resonator connected to an input terminal, a second resonator connected to an output terminal, and a third resonator between the first and second resonators. Shunt electrodes are connected to the via and the ground terminal in the first and second resonators, respectively.

The invention discloses a TSV-based tunable inductor structure and a tuning method thereof, the tunable inductor structure comprises a primary side inductor and an auxiliary inductor, the primary side inductor is nested in the auxiliary inductor to form a nested tunable inductor structure; wherein the auxiliary inductor is connected with the modulation source, and the primary inductor is connected with an actual application circuit, so that a voltage difference between a voltage V1 between two ports of the primary inductor and a voltage V2 between two ports of the auxiliary inductor is regulated and controlled through the modulation source, and the primary inductor and the auxiliary inductor are mutually coupled under the action of the voltage V1 and the voltage V2; and the inductance tuning of the primary side inductor is realized. According to the TSV tunable inductor, the TSV tunable inductor structure which is small in tuning range, large in area and high-frequency performance degradation of a traditional tunable inductor is converted into a TSV tunable inductor structure which is based on the magnetic coupling technology, is small in area and wide in tuning range and can be continuously tuned.

A substrate integrated with passive devices and a manufacturing method thereof are provided. The manufacturing method of the substrate integrated with passive devices includes: providing a transparent dielectric layer with first connection vias therein, wherein the transparent dielectric layer includes a first surface and a second surface, which are opposite to each other along a thickness direction of the transparent dielectric layer; integrating the passive devices onto the transparent dielectric layer, wherein the passive devices include at least an inductor, the integrating the passive devices onto the transparent dielectric layer includes: forming first sub-structures on the first surface of the transparent dielectric layer, forming second sub-structures on the second surface, and forming first connection electrodes in the first connection vias, respectively; wherein the first sub-structures, the first connection electrodes and the second sub-structures are connected together to form a coil structure of the inductor.

Various magnetic thin film inductor structures are disclosed that include one or more magnetic thin film (MTF) materials. During operation, an electric field passes through one or more conductive windings which, in turn, generates a magnetic field for storing energy within these magnetic thin film inductor structures. The magnetic thin film (MTF) materials within these magnetic thin film inductor structures effectively attract magnetic flux lines of this magnetic field. As a result, any magnetic leakage resulting from the magnetic field generated by these magnetic thin film inductor structures onto nearby electrical, mechanical, and / or electro-mechanical devices is lessened when compared to magnetic leakage resulting from the magnetic field generated by other inductor structures not having the one or more MTF materials.

To provide a coil component having a plurality of coil elements, and to reduce variations in the DC resistance between the coil elements.SOLUTION: A magnetic coupling coil component 1 comprises: a substrate 10 having a first principal surface 10a and a second principal surface 10b; a first coil conductor 25 facing the first principal surface; and a second coil conductor 35 between the first coil conductor and the second principal surface. The first coil conductor has a first circulation part 25a, a first one end lead-out part 25b extending from one end of the first circulation part to the second surface, and a first other end lead-out part 25c extending from the other end of the first circulation part to the second surface. The second coil conductor has a second circulation part 35a, a second one end lead-out part 35b extending from one end of the second circulation part to the second surface, and a second other end lead-out part 35c extending from the other end of the second circulation part to the second surface. The first cross-sectional area indicating the cross-sectional area of the first one end lead-out part and the second cross-sectional area indicating the cross-sectional area of the first other end lead-out part, are both larger than the third cross-sectional area indicating the cross-sectional area of the second one end lead-out part and the fourth cross-sectional area indicating the cross-sectional area of the second other end lead-out part.SELECTED DRAWING: Figure 1

A filter module includes a circuit board on or in which a ground electrode is provided, and a low pass filter on the circuit board. The low pass filter includes first and second inductors, and a capacitor. The first and second inductors are cumulatively connected to each other. Relationships of Lp+Lg−M≥0 and Lp−M<0 are satisfied, where Lp denotes an inductance of a path between a connection portion between the first and second inductors and a ground terminal, Lg denotes an inductance of a path between the ground terminal and the ground electrode, and M denotes a mutual inductance between the first and second inductors.

A resin film (100) comprising a core layer (2) and adhesive resin layers (1) which are respectively provided to both sides of the core layer (2), wherein: the adhesive resin layers (1) each comprise an adhesive resin composition that contains an epoxy resin; the dielectric breakdown strength of a cured product of the adhesive resin composition is not less than 300 kV / mm; the core layer (2) comprises a polyimide film; and the dielectric breakdown strength of the polyimide film is not less than 300 kV / mm.

Provided in the embodiments of the present disclosure are a base layer, an inner electrode layer, a lower lead layer, a substrate and an inductor. The base layer comprises an insulating layer and an electrode, wherein the electrode is arranged on the insulating layer; and the electrode comprises a coil, a first connecting disk and an extension portion, the coil having a first end, the first connecting disk being arranged at the first end, the extension portion being arranged on the first connecting disk, and the extension portion extending in a direction away from the first end from the side of the first connecting disk facing away from the first end.

The invention discloses a direct current reactor and a frequency converter. The direct-current reactor comprises a first iron yoke, a second iron yoke, a magnetic core, a first winding and a second winding, wherein the first iron yoke and the second iron yoke are oppositely arranged; the magnetic core is arranged between the first iron yoke and the second iron yoke and comprises a first side plate, a second side plate and a middle plate, the first side plate and the second side plate are arranged on the two sides of the middle plate respectively, the first side plate, the second side plate and the middle plate are arranged at intervals, at least one end of the first side plate is connected with the first iron yoke or the second iron yoke, and at least one end of the second side plate is connected with the second iron yoke. At least one end of the second side plate is connected with the first yoke or the second yoke, one end of the middle plate is connected with the first yoke, the other end of the middle plate is connected with the second yoke, the width of the first side plate is equal to that of the second side plate, and the width of the middle plate is smaller than that of the first side plate; the first winding is wound on the first side plate; the second winding is wound on the second side plate, and the winding directions of the first winding and the second winding are the same. According to the technical scheme, the structural size can be effectively reduced, and the assembling convenience is improved.