1376results about "Fixed signal inductances" patented technology

The invention discloses an AI common mode inductance coil broken line material planting machine which comprises a first conveying line. A first material stripping module is arranged below the discharging end of the first conveying line. The m ejected inductance coils are grabbed by the first coil taking and placing manipulator and are transferred into the m bending jig grooves; the bending jig disc on the first transfer table is pushed to the feeding end of the second conveying line through a first jig disc push rod assembly; a T-core feeding device is arranged on the T-core feeding device; two pin bending machines; a second material stripping module is arranged below the second transfer table; and the discharging manipulator comprises an overturning manipulator and a rotating manipulator, the overturning manipulator is used for grabbing the m finished product materials and overturning the m finished product materials by 180 degrees, and the rotating manipulator is used for grabbing the m finished product materials overturned by 180 degrees, rotating the m finished product materials by 90 degrees and then discharging the m finished product materials to the material disc. According to the automatic feeding device, T-core magnetic core feeding, pin bending, finished product material overturning and material placing are integrated, and the inductance coil machining efficiency is improved.

A band-pass filter includes a first port, a second port, first to third high-pass filters provided between the first port and the second port in this order from a first-port side in a circuit configuration, and a low-pass filter provided between the second high-pass filter and the third high-pass filter in the circuit configuration. Each of the first to third high-pass filters forms an attenuation pole on a low-pass side of the passband. A frequency of the attenuation pole formed by the second high-pass filter is higher than a frequency of the attenuation pole formed by each of the first and third high-pass filters.

The invention discloses a multi-pad chip magnetic element and vertical integrated power supply module, which comprises a first magnetic element inductance part, a first electrical connection pad, a second electrical connection pad and a heat conduction pad, the first electrical connection bonding pad, the second electrical connection bonding pad and the heat conduction bonding pad are all directly pressed on the first magnetic piece inductor part through the pressing technology. The chip magnetic detection module has the advantages of being high in expansibility, excellent in heat dissipation performance and high in power density.

A core substrate is a core substrate with a built-in inductor for constructing an interposer to which a semiconductor element is mounted. The core substrate includes a ceramic substrate, a conductor portion, and a magnetic material portion. The ceramic substrate has a first surface, a second surface opposite the first surface in a thickness direction, and a through hole between the first surface and the second surface. The conductor portion extends through the through hole, and is made of a sintered material including sintered metal. The magnetic material portion surrounds the conductor portion within the through hole, and is made of ceramics. The ceramic substrate and the magnetic material portion are inorganically bonded together, and the magnetic material portion and the conductor portion are inorganically bonded together.

The present invention relates to the technical field related to the production of hollow coils, and discloses a hollow coil processing device and its processing technology. In order to solve the problem that the discharged hollow coil after processing is prone to deformation, an outer cylinder block and an adjustment cylinder block form a cylinder shape for coil winding. When the hollow coil is wound and needs to be discharged, the adjustment cylinder block is retracted into the outer cylinder block, and the two outer cylinder blocks are relatively close to each other, resulting in a relatively smaller diameter of the cylinder formed by the outer cylinder block and the adjustment cylinder block, so that the formed hollow coil does not closely adhere to the outer cylinder block and the adjustment cylinder block, and finally realizes the effect that the cylinder diameter is controllable for easy discharging.

A substrate integrated with passive devices and a manufacturing method thereof are provided. The manufacturing method of the substrate integrated with passive devices includes: providing a transparent dielectric layer with first connection vias therein, wherein the transparent dielectric layer includes a first surface and a second surface, which are opposite to each other along a thickness direction of the transparent dielectric layer; integrating the passive devices onto the transparent dielectric layer, wherein the passive devices include at least an inductor, the integrating the passive devices onto the transparent dielectric layer includes: forming first sub-structures on the first surface of the transparent dielectric layer, forming second sub-structures on the second surface, and forming first connection electrodes in the first connection vias, respectively; wherein the first sub-structures, the first connection electrodes and the second sub-structures are connected together to form a coil structure of the inductor.

Various magnetic thin film inductor structures are disclosed that include one or more magnetic thin film (MTF) materials. During operation, an electric field passes through one or more conductive windings which, in turn, generates a magnetic field for storing energy within these magnetic thin film inductor structures. The magnetic thin film (MTF) materials within these magnetic thin film inductor structures effectively attract magnetic flux lines of this magnetic field. As a result, any magnetic leakage resulting from the magnetic field generated by these magnetic thin film inductor structures onto nearby electrical, mechanical, and / or electro-mechanical devices is lessened when compared to magnetic leakage resulting from the magnetic field generated by other inductor structures not having the one or more MTF materials.

A filter module includes a circuit board on or in which a ground electrode is provided, and a low pass filter on the circuit board. The low pass filter includes first and second inductors, and a capacitor. The first and second inductors are cumulatively connected to each other. Relationships of Lp+Lg−M≥0 and Lp−M<0 are satisfied, where Lp denotes an inductance of a path between a connection portion between the first and second inductors and a ground terminal, Lg denotes an inductance of a path between the ground terminal and the ground electrode, and M denotes a mutual inductance between the first and second inductors.

A resin film (100) comprising a core layer (2) and adhesive resin layers (1) which are respectively provided to both sides of the core layer (2), wherein: the adhesive resin layers (1) each comprise an adhesive resin composition that contains an epoxy resin; the dielectric breakdown strength of a cured product of the adhesive resin composition is not less than 300 kV / mm; the core layer (2) comprises a polyimide film; and the dielectric breakdown strength of the polyimide film is not less than 300 kV / mm.

Provided in the embodiments of the present disclosure are a base layer, an inner electrode layer, a lower lead layer, a substrate and an inductor. The base layer comprises an insulating layer and an electrode, wherein the electrode is arranged on the insulating layer; and the electrode comprises a coil, a first connecting disk and an extension portion, the coil having a first end, the first connecting disk being arranged at the first end, the extension portion being arranged on the first connecting disk, and the extension portion extending in a direction away from the first end from the side of the first connecting disk facing away from the first end.

Disclosed herein is a coil component that includes a drum core; a terminal fitting fixed respectively to the flange part of the drum core; and a wire wound around the winding core part of the drum core. The terminal fitting has a wire connecting part to which the wire is connected and a mounting part having springiness with respect to the drum core. The distance between the flange part and the mounting part is larger than the distance between the flange part and the wire connecting part.

The invention provides a laminated inductor capable of improving an inductance value and a Q value. The laminated inductor includes: a body having a first end surface and a second end surface facing each other in a first direction; a first external electrode provided on the first end surface; a second external electrode provided on the second end surface; an inner conductor provided inside the body and wound in a coil axis direction orthogonal to the first direction; a first lead-out conductor which is provided inside the green body and connects the internal conductor and the first external electrode; and a second lead-out conductor provided inside the body and connecting the inner conductor and the second external electrode, the second lead-out conductor being electrically connected to the second external electrode when viewed from the coil axis direction. A straight line extending in the first direction as a first boundary portion of the boundary between the first lead-out conductor and the inner conductor does not overlap with a second boundary portion of the boundary between the second lead-out conductor and the inner conductor. The second lead-out conductor has a curved shape protruding in a direction away from a straight line formed by extending the first boundary portion in the first direction.

A filter circuit includes a pair of balanced input ports, a pair of balanced output ports, first and second resonators provided in parallel between the pair of balanced input ports and the pair of balanced output ports in a circuit configuration, a first capacitor connected in parallel to the first resonator, and a second capacitor connected in parallel to the second resonator. The first and second resonators are magnetically coupled to each other and electrically connected to each other. The first and second capacitors are not electrically connected to ground.

To provide a coil component in which disconnection of a wire near a metal terminal can be suppressed.SOLUTION: A coil component 10 includes a drum core 10C, a first metal terminal 40, and a first wire 81. The drum core 10 includes: a columnar winding core 11; a first flange 21 provided at a first end in a direction along a central axis X of the winding core 11; and a second flange 31 provided at a second end opposite to the first end of the winding core 11. The first metal terminal 40 is provided on the first flange 21. The first metal terminal 40 has a first joining part 45 facing an upper surface of the first flange 21. The first joining part 45 has a first inclined portion 45B having an upper surface inclined in the downward direction toward the winding core 11 in a direction along a left-right axis Z. A first end 81A of the first wire 81 is joined to an upper surface of the first joining part 45. In addition, the first wire 81 overlaps the first inclined portion 45B when viewed downward.SELECTED DRAWING: Figure 2

A filter apparatus includes first to third resonators magnetically coupled and located in a signal transmission path from an input terminal to an output terminal. Each of the resonators includes a capacitor electrode and an inductor path. The capacitor and a ground electrode define a capacitor. The inductor path connects the capacitor and ground electrodes. The inductor path in the second resonator includes first and second lines electrically connected in parallel, between the capacitor electrode of the second resonator and the ground electrode. A first interconnection pattern connects the inductor path in the first resonator and the first line. A third interconnection pattern connects the inductor path in the third resonator and the second line. A second interconnection pattern connects the first and second lines at a position different from a position of connection of the first interconnection pattern in the first line.

An electronic component includes a body, an inner conductor inside the body, and an outer electrode that lies on part of at least a first main surface of the body and includes an underlying electrode and a plating electrode with which the underlying electrode is covered. The underlying electrode includes a first underlying electrode on part of the first main surface and connected directly to the inner conductor and a second underlying electrode at part of the first main surface away from the first underlying electrode and closer than the first underlying electrode to the center of the body in the length direction and not connected directly to the inner conductor. The plating electrode includes first and second plating electrodes. The first underlying electrode is covered with the first plating electrode, and the second underlying electrode is covered with the second plating electrode.

The invention provides a magnetic resin composition, a magnetic film and application thereof. The magnetic resin composition comprises (A) a magnetic filler, (B) epoxy resin, (C) a curing agent and (D) a flexibilizer, the magnetic filler (A) comprises carbonyl iron powder (A1), FeSiCr alloy (A2) and iron-based nanocrystals (A3); based on the total mass of the magnetic resin composition as 100%, the content of the (A) magnetic filler is 85% or more; based on 100% of the total mass of the magnetic filler (A), the content of the carbonyl iron powder (A1) is 55%-65%, the content of the FeSiCr alloy (A2) is 15%-25%, and the content of the iron-based nanocrystalline (A3) is 15%-25%. According to the magnetic resin composition and the preparation method thereof, specific types of magnetic fillers are introduced and compounded according to a specific content, so that the magnetic resin composition has relatively high magnetic conductivity and relatively low magnetic loss after being cured, and meanwhile, the binding force with a copper layer is relatively high.

To provide a coil device having a simple configuration and high heat dissipation.SOLUTION: A coil device 1 includes a bobbin 2, a first winding part disposed on an outer peripheral surface of the bobbin 2, a second winding part 40 disposed directly or indirectly on an outer peripheral surface of the first winding part, a first core 5a and a second core 6a attached to the bobbin 2, a case 8 that houses at least the bobbin 2, and a synthetic resin filled in the case 8. The first core side 5a has a first base portion 50 and a pair of first outer leg portions 51 that protrude from the first base portion 50 and face each other in a first direction perpendicular to the axial direction of the bobbin 2. The second core side 6a has a second base portion 60 and a pair of second outer leg portions 61 that protrude from the second base portion 60 and face each other in the first direction. The first outer leg portion 51 is separated from the second outer leg portion 61 such that a gap 12 is formed between the first outer leg portion 51 and the second outer leg portion 61 in a second direction perpendicular to the axial direction of the bobbin 2 and the first direction.SELECTED DRAWING: Figure 1

A radio-frequency module includes a module substrate, an inductor, and an acoustic wave filter. The inductor overlaps at least a portion of the acoustic wave filter when seen in a plan view from the normal direction of the module substrate. The inductor includes first and second coils connected in series. Each of the first and second coils is a spiral or helical coil that is wound with more than one turn. At least a portion of the first coil overlaps the second coil when seen in a plan view from the normal direction of the module substrate. A direction of a magnetic field generated by the first coil is opposite to a direction of a magnetic field generated by the second coil.

The invention relates to the field of reactor volume optimization design, in particular to a low-harmonic magnetically controlled reactor volume optimization design method. According to the scheme, the method comprises the following steps: selecting parameter variables of the low-harmonic magnetically controlled reactor, wherein the parameter variables comprise iron core length, iron core height, iron core cross section side length, single-side air gap length, total winding turns and single-side winding layer number; according to the selected parameter variables of the low-harmonic magnetically controlled reactor, variables needed in the optimization process are calculated; setting constraint conditions; and the optimal parameter combination enabling the iron core volume to be minimum is optimized and solved through the improved genetic algorithm. The objective function aims to minimize the outer volume of an iron core, punishment is applied to inductance deviation, and various constraint conditions including wire constraint, winding turn number constraint, winding thickness constraint, inter-winding insulation and appearance constraint, maximum inductance value constraint and peak magnetic flux density constraint are set. And performance failure caused by pure pursuit of volume minimization is avoided. The method is suitable for reactor volume optimization design.

The invention comprises a method and apparatus for processing power, comprising the steps of: generating / using 3-phase power; feeding an AC drive with the 3-phase power, the AC drive generating a first output; and transforming the first output with a zigzag transformer, the zigzag transformer linked to at least one load output / load connector. The method and apparatus comprises an optional filter for filtering the 3-phase power prior to the step of transforming, the filter including a distributed gap core material.

To provide a laminated filter capable of improving performance.SOLUTION: A laminated filter 1 comprises a wall 13 which is disposed and grounded between a first inductor 11 and a second inductor 12. Therefore, electromagnetic coupling between the first inductor 11 and the second inductor 12 can be suppressed. A penetration part 30 penetrating in an opposing direction, in which the first inductor 11 and the second inductor 12 are opposed, is formed in the wall 13. In a lamination direction, a size of the penetration part 30 is larger than a size of one insulator layer 7. The wall 13 includes the large penetration part 30 to make a magnetic flux of the second inductor 12 which is a longitudinally wound inductor pass from the penetration part 30. Therefore, it is possible to suppress disturbance of the magnetic flux of the second inductor 12 to enhance a Q-value.SELECTED DRAWING: Figure 2

To suppress degradation of characteristics, a high frequency module includes a mounting substrate, a first signal terminal, a second signal terminal, and ground terminals, and a hybrid filter. The hybrid filter is coupled between the first signal terminal and the second signal terminal. The hybrid filter includes an acoustic wave filter having at least one acoustic wave resonator, a first inductor, and a capacitor. The pass band width of the hybrid filter is larger than that of the acoustic wave resonator. A resin layer is disposed on a first principal surface of the mounting substrate. The resin layer covers at least part of the acoustic wave filter. A metal electrode layer covers at least part of the resin layer, and is coupled to the ground terminals. The second inductor is coupled between the hybrid filter and the second signal terminal.

The application provides a coil module, an electronic device and a wireless charging system, and relates to the technical field of wireless charging, and aims to solve the problem that the thickness of the wireless charging coil module is relatively large, which is not conducive to the arrangement of other functional devices in the electronic device. The coil module comprises a coil structure; the coil structure comprises a functional layer; along the thickness direction of the coil structure, the functional layer comprises a first wiring sublayer, a second wiring sublayer and an insulating sublayer located between the first wiring sublayer and the second wiring sublayer; the coil structure further comprises a first end, a second end and a plurality of groups of coils connected in series; the first end and the plurality of groups of coils are arranged on the first wiring sublayer, and the outermost group of coils is connected to the first end; the second end is arranged on the second wiring sublayer; a via hole is arranged on the insulating sublayer, and a connecting structure is arranged in the via hole; the innermost group of coils is connected to the second end through the connecting structure in the insulating sublayer, so that the first end is electrically connected to the second end through the plurality of groups of coils connected in series.

The invention belongs to the technical field of inductors, and discloses a laminated inductor and a preparation method of the laminated inductor, the laminated inductor comprises at least one first inner electrode and at least one second inner electrode, the first inner electrode comprises a first conductive part, the second inner electrode comprises a second conductive part, the first conductive part and the second conductive part are spiral, and the first conductive part and the second conductive part are spiral. The at least one first inner electrode and the at least one second inner electrode are arranged in a stacked mode, the at least one first conductive piece and the at least one second conductive piece are arranged in series, and on the premise that the number of the first inner electrodes and the number of the second inner electrodes are limited, the overall inductance strength of the laminated inductor is high.

An inductive device is provided. The inductive device includes a laminated body and two external electrodes. The laminated body includes an insulator and a plurality of conductive wiring layers stacked in a first direction. The conductive wiring layers are embedded within the insulator, and any two adjacent ones of the conductive wiring layers are electrically connected to each other to form a coiled conductor extending spirally. The external electrodes are disposed on the laminated body and electrically connected to the coiled conductor, and the external electrodes are spaced apart from each other. Each of the external electrodes includes a base plate, a lateral wall, and a plurality of stress dispersing structures extending toward the coiled conductor and protruding from at least one of the base plate and the lateral wall, and the stress dispersing structures are spaced apart from each other and engaged with the laminated body.

A molded inductor includes a winding having leads configured for attaching leads of the winding to pads on a package substrate, having a magnetic core with a body disposed within the winding, wherein the magnetic core has at least one mold flow enhancing feature that enhances a filling of a magnetic mold material as compared to a filling provided by a uniform cylindrical body. The magnetic mold material encases the winding and the magnetic core to form either a standalone discrete inductor component, or the magnetic component of an output filter of an integrated switching power converter module.

An inductive device with flux paths through a substrate may be made by depositing a malleable magnetically permeable material into a hole in the substrate and curing the malleable magnetically permeable material to form a substantially solid magnetic plug. Deposition of the malleable magnetically permeable material may comprise stencil-printing followed by use of a flexible runner. A uniform extension of the plug above an outer surface of the substrate may be provided by a spacer on the outer surface. The spacer may, e.g., be a conductive layer and / or a non-conductive material on the surface. Magnetic plates spanning two or more plugs may form a closed magnetic flux path. A plug may be surrounded by a winding on a layer of the substrate. Extension of the plug above an outer surface of the substrate may ensure the integrity of an essentially gap-free connection between the end of the magnetic plug and a mating surfaces of a magnetic plate. The plug may be reduced for co-planarity with the substrate surface, or to form a recess below the substrate surface, e.g. to form controlled gaps in the permeable medium.

A magnetic composite includes: a non-metallic inorganic base material; and a ferrite layer provided on a surface of the non-metallic inorganic base material, and the non-metallic inorganic base material has a thickness of 2.0 μm or more, the ferrite layer has a thickness (dF) of 2.0 μm or more and 50.0 μm or less, and contains spinel-type ferrite as a principal component, and a content of α-Fe2O3 in the ferrite layer is 3.0 mass % or more and 25.0 mass % or less.

The invention provides a laminated inductor capable of suppressing reduction in reliability caused by structural defects such as cracks. This laminated inductor is provided with: a laminated body in which a plurality of insulating layers are laminated in a lamination direction, and which has a coil therein; and first and second external electrodes provided on the outer surface of the laminate and electrically connected to the coil. The coil is configured by electrically connecting a plurality of coil conductor layers stacked in a stacking direction. The plurality of coil conductor layers have M + N layers of first coil conductor layers that are continuous in the lamination direction. The first coil conductor layers each have a first parallel portion. The first parallel portions of the first coil conductor layers adjacent in the stacking direction are connected in parallel with each other via at least two conductive conductors. The M layers in the first coil conductor layers are first lead-out layers having first lead-out conductors, and the N layers are first non-lead-out layers having no first lead-out conductors. M is a natural number greater than 2, and at least one first non-lead-out layer exists between at least one group of first lead-out layers in the stacking direction.