108results about "Fixed signal inductances" patented technology

A method for manufacturing a reactor includes a bonding process of joining molded cores with a molded coil with an adhesive, and a welding process of connecting, by welding, the lead wire of a coil to a busbar fixed to the molded core. The coils are attached to respective leg portions. The bonding process includes an applying process of applying the adhesive to the joining surfaces of the respective leg portions of each of the core members, and the inner circumferential surfaces of the respective yoke portions of the core members, a depressing process of spreading the applied adhesive by depression, and a curing process of curing the adhesive.

The present invention relates to a coil component in which a terminal electrode and a terminal end of a wire are connected by thermocompression bonding at a bottom surface of a flange portion, and the following effects are obtained as a result of thermocompression bonding being appropriately performed without being excessively insufficient, that is, a stable fixing force is obtained for the connection state between the terminal electrode and the terminal end of the wire, and problems caused by the terminal end of the wire protruding from the terminal electrode are less likely to occur. A terminal end (21a) of a wire (21) is in a state of being at least partially disposed inside a terminal electrode (17) and extending along a main surface (25) of the terminal electrode, and has a top surface (33) located at a side opposite to the bottom surface (23) of a flange portion (13) from the main surface. A solder tail surface (37) that rises from the main surface toward the top surface and forms a concave curved surface is formed on an outer surface of the terminal electrode. The main surface is realized by a parent solder material layer (31) composed of tin or a tin alloy that constitutes an outermost layer of the terminal electrode.

This invention relates to a stacked coil component, comprising: a stacked body formed by stacking multiple insulating layers along a length direction and having a coil internally therein; a first external electrode and a second external electrode electrically connected to the coil; the coil being electrically connected by multiple coil conductors stacked along the length direction together with the insulating layers; the stacked body having: a first end face and a second end face facing each other in the length direction; a first main face and a second main face facing each other in the height direction; a first side face and a second side face facing each other in the width direction; the first external electrode covering at least a portion of the first end face; the second external electrode covering at least a portion of the second end face; the stacking direction of the stacked body and the coil axis of the coil being parallel to the first main face; the size of the arrangement area of ​​the coil conductors in the stacking direction being 85% or more and 95% or less of the length dimension of the stacked body; and the distance between adjacent coil conductors in the stacking direction being 12 μm or more and 40 μm or less.

The present invention relates to an electrical cabinet (31) equipped with a high-power converter (11), the high-power converter (11) comprising at least three power modules (12), at least one reactor (13), a cooling system (14) configured to cool the at least three power modules (12) and the at least one reactor (13), and a plurality of high-power conductors (1) that establish a three-phase current path from the power inlet (15) of the electrical cabinet (31) to the power outlet (16) of the electrical cabinet (31) via the at least three power modules (12) and the at least one reactor (13), wherein at least one of the high-power conductors (1) is manufactured at least partially by additive manufacturing.

A coil assembly for a wireless power transfer (WPT) system includes a coil carrier tray constructed of a non-conductive, magnetically transparent material that has channels formed therein for receiving a coil. The coil includes a plurality of uninsulated rectangular Litz wire bundles that are woven, braided, or twisted together and then rolled or compressed into a rectangular shape and coated with a non-insulating thin film coating. Each Litz wire bundle, in turn, includes a plurality of uninsulated Litz wire sub-bundles that are woven, braided, or twisted together and then rolled or compressed into a rectangular shape. Each Litz wire sub-bundle, in turn, includes insulated Litz wire strands that are woven, braided, or twisted together and then rolled or compressed into a rectangular shape. The coil design maximizes the amount of conductive material in the channels, maximizing flux density while creating a uniform magnetic flux at the coil surface.

This invention provides a fixing structure for automotive components (e.g., magnetic components) with improved slip resistance. [Solution] The magnetic component 10 comprises at least a coil 4, a ferrite core 3, and a leaf spring 2 that presses the upper surface 30 of the ferrite core 3 against the housing 1 with elastic force. The upper surface 30 of the ferrite core 3 has a groove 31 extending in a direction intersecting the front-rear direction of the vehicle (the direction in which the vehicle moves forward and backward). The inner wall surface of the groove 31 is inclined, and the protruding portion 21 of the leaf spring 2 has a rounded R shape. The R-shaped tip portion 20 of the leaf spring 2 is pressed against the opposing inclined wall surfaces 32a and 32b, respectively, thus fixing the magnetic component at two locations 20a and 20b. The groove may also have a groove 35 extending in a direction intersecting the left-right direction of the vehicle (the direction in which the vehicle rotates), and inclined wall surfaces 36a and 36b may be formed in the same manner as described above.

A semiconductor structure includes one or more integrated circuits (ICs), a wiring layer coupled to the one or more ICs, an input power source, and a substrate located between the wiring layer and the input power source. The substrate having a first side coupled to the input power source, a second side coupled to the wiring layer, an integrated voltage regulator (IVR) located at the first side of the substrate, and a first through-silicon-via (TSV) coupled to the IVR and extending through the substrate and into the wiring layer.

To provide molded coils and reactors, as well as methods for manufacturing molded coils and reactors, that reduce the number of parts and improve production efficiency. [Solution] The molded coil 5 comprises a sensor bracket 72 to which the sensor 4 is attached and installed on the coil 2, and a coil mold resin 91 that covers at least the coil 2 and a part of the sensor 4. The sensor bracket 72 has a fitting groove 76 into which the sensor 4 is inserted. The fitting groove 76 has an opening 77 that surrounds the entire circumference of the body of the sensor 4, and a pair of clamping surfaces 81, 82 that sandwich the sensor 4 from both sides within the fitting groove 76. One of the clamping surfaces 81, 82 is an elastic plate piece 83 that extends along the depth direction of the fitting groove 76, with one end fixed and the other end free. In the installation process, the sensor 4 is press-fitted into the fitting groove 76 while the elastic plate piece 83 is elastically deformed.

To prevent a wire from breaking at a joint portion and at a boundary between the joint portion and a linear portion.SOLUTION: A coil component includes a core, a wire, and external electrodes 40. The core has a winding core portion and a pair of flange portions. A specific axis perpendicular to a central axis is defined to be a first axis X, one of the directions along the first axis X is defined as a first positive direction X1, and an opposite direction to the first positive direction X1 is defined as a first negative direction X2. The external electrodes 40 each cover an outer surface of the flange portion facing the first positive direction X1. The wire includes: a linear portion wound around the winding core portion; and a joint portion 51 located at each end of the wire and connected to each of the external electrodes. In a cross section perpendicular to the central axis and including the joint portion 51, an end of the joint portion 51 on the first negative direction X2 side is located on the first negative direction X2 side with respect to an end of the external electrode 40 on the first positive direction X1 side. Moreover, a dimension P1 in a direction along the first axis X from the end of the joint portion 51 on the first negative direction X2 side to the end thereof on the first positive direction X1 side is larger than a wire diameter of the linear portion.SELECTED DRAWING: Figure 3

A multiphase or high-level coupled inductor includes an iron core, which includes first and second side surfaces opposite to each other and a third side surface between the first and second side surfaces, the iron core including receiving portions spaced from each other; and coil windings each including first and second windings and respectively arranged on the receiving portions. The first winding is formed with a hollowed portion having a first length and a first width. The first winding includes first and second bend portions, which are bent in different directions. The first bend portion is exposed on the second side surface of the iron core. The second winding is arranged in the hollowed portion of the first winding and has a second length and a second width. The first length is greater than the second length, and the first width is greater than the second width.

A package comprising an integrated device and a substrate coupled to the integrated device through a plurality of solder interconnects. The substrate comprises at least one magnetic layer; at least one dielectric layer; and a plurality of interconnects. The plurality of interconnects comprise a first set of interconnects that are configured to operate as a first inductor and a second set of interconnects that are configured to operate as a second inductor. The second inductor and the first inductor are configured to operate as inductively coupled inductors.

This provides a reactor that makes it easy to obtain the desired inductance. [Solution] The reactor comprises a coil, a magnetic core, and a molded resin portion. The magnetic core comprises a first core piece, a second core piece, and a gap portion. The first core piece and the second core piece are combined in a first direction along the axis of the coil. The gap portion is provided between the first core piece and the second core piece. The molded resin portion covers at least a part of the magnetic core. The first end face of the first middle core portion provided on the first core piece has a specific ridge or projection.

A filter device includes an inductor component, and a substrate on which the inductor component is mounted, the substrate including a first dielectric layer having a mounting surface, a first pad electrode, which is provided on the mounting surface and to which a first terminal of the inductor component is connected, and a first electrode, which is connected and is provided such that the first dielectric layer is positioned between the first electrode and the first pad electrode. At least part of the first electrode overlaps the first pad electrode when the mounting surface is viewed in a plan view. The first pad electrode and the at least part of the first electrode form a first capacitor.

Even when the terminal block cannot be secured on all four sides of the case, this reactor provides a way to firmly fix the terminal block and prevent damage to the connection points between the busbar and the coil lead wires, as well as to the terminal block itself. [Solution] The reactor 10 has a reactor body with a coil 3, a bottom surface 51, a plurality of side walls rising from the edge of the bottom surface, an opening on the top surface, a case that houses the reactor body, a terminal block provided inside the case that holds a busbar connected to a filling molded part formed in the gap between the case and the reactor body, and covers a part of the opening. The case has terminal block fixing parts provided on each of the opposing side walls 52b,d, the terminal block is elongated and has a pair of short sides, a pair of longer sides 72, fastening parts 73 that overlap with the terminal block fixing parts and fix the terminal block to the case, and a protruding part 74 provided in the center or near the center of the long sides that protrudes toward the bottom surface of the case and is partially embedded in the filling molded part.

A device has a semiconductor chip comprising a substrate and an integrated circuit, a metal stack of metal layers connected to the semiconductor chip, and a planar spiral differential inductor comprising at least two metal layers of the metal stack, wherein the semiconductor chip defines a semiconductor plane having a semiconductor plane normal vector and the planar spiral differential inductor defines an inductor plane having an inductor plane normal vector, wherein an angle between the semiconductor plane normal vector and the inductor plane normal vector is between 1 and 90 degrees; a sensing membrane operable to become electrically charged when interacting with an ionized fluid, wherein the sensing membrane is operable to electrically communicate with the planar spiral differential inductor; and a fluid property measurement circuit operable to measure a quality factor or inductance of the planar spiral differential inductor and output a fluid property signal.

The present invention provides a method for manufacturing a reactor and a reactor that firmly joins the molded core and molded coil, and prevents damage to the welded joints of the busbar and lead wires. [Solution] The method for manufacturing the reactor includes an adhesive bonding step of joining molded cores 1a, 1b and molded coil 5 with an adhesive, and a welding step of connecting the lead wires of the coil 6 and the busbar fixed to the molded core 1a by welding. The coil 6 is mounted on the leg portion 23. The adhesive bonding step includes applying adhesive 8 to the joint surface 231 of the leg portion 23 of the core member and the inner circumferential surface 241 of the yoke portion 24, pressing the applied adhesive 8 to spread it out, and a curing step for the adhesive. In the pressing step, the adhesive 8 applied to the joint surface 231 is pressed out, causing it to overflow onto at least one of the upper and lower surfaces of the leg portion 23, and at least one of the inner side surface 236 and outer side surface 237 of the leg portion 23, and to adhere to the molded coil 5.

This utility model discloses a multilayer chip common-mode inductor, relating to the field of electronic devices. It includes a protective housing with electrode terminals inserted into its left and right sides. Multiple first ceramic plates are installed between a pair of upper and lower protective housings, and second ceramic plates are positioned between the first ceramic plates. After the multiple first ceramic plates are stacked, protrusions are inserted into corresponding positioning slots. Arc protrusions at corresponding heights engage with anti-detachment slots on the positioning ceramic plates, preventing the multiple first ceramic plates from detaching. Multiple C-shaped coil traces are installed in mounting slots, and connecting posts are installed in clearance holes, maintaining the multiple C-shaped coil traces in a staggered, symmetrical stack, saving space and preventing interference between them. After sintering, the multiple first and second ceramic plates form a single unit, jointly protecting the internal C-shaped coil traces. This design prevents misalignment during pre-sintering movement, which could affect the quality of the common-mode inductor.

A transmission line according to the present disclosure comprises: a first inductor part (10) having one end connected to a first terminal (1) and the other end connected to a second terminal (2); and a second inductor part (20) having one end connected to the other end of the first inductor part (10) and the other end connected to a third terminal (3). The coupling coefficient between the first inductor part (10) and the second inductor part (20) is a positive value.

This invention provides a multilayer electronic component with excellent moisture resistance reliability, reduced pores, and superior toughness and resistance to warping and cracking. [Solution] The stacked electronic component 1 includes a body comprising a dielectric layer 111 and internal electrodes 121 and 122 arranged alternately with the dielectric layer in the thickness direction, a first external electrode 131 and a second external electrode 132 arranged on the third surface 3 and the fourth surface, respectively, a first side margin portion 114 arranged on the fifth surface 5 and extending to a part of the first surface 1 and the second surface 2, and a second side margin portion 115 arranged on the sixth surface 6 and extending to a part of the first surface and the second surface. The first and second side margin portions include a first margin layer 114a and 115a arranged in contact with the body and a second margin layer 114b and 115b arranged on the first margin layer, and the first and second margin layers differ in at least one of the average size of the crystal grains and the dielectric composition.

A common mode choke (50, 52, 54, 56) is provided. The common mode choke comprises: a printed circuit board (40, 42); a first conductor path (66) on or within the printed circuit board (40, 42); and a second conductor path (68) on or within the printed circuit board (40, 42) underneath the first conductor path (66), wherein the second conductor path (68) is electrically isolated against the first conductor path (66), the second conductor path (68) follows the first conductor path (66), each of the conductor paths (66, 68) forms at least two coils (80, 82, 84, 86), and each conductor path (66, 68) has a clockwise orientation in at least one of its coils (80, 82, 84, 86), and the same conductor path (66, 68) has a counter-clockwise orientation in the other one of its coils (80, 82, 84, 86).

The present invention provides a technology that can contribute to a production step.　A core device applied to a DC-DC converter 100 comprises: two core members 130, 140 that form a core corresponding to a coil in a state where the two core members 130, 140 are combined in the direction along the axis of the coil without a gap between the joining surfaces of the two core members 130, 140; a core clip 160 that is assembled so as to surround the outer side of the core which includes at least two portions where the joining surfaces intersect on the outer surfaces of the two core members 130, 140 and that can hold the two core members 130, 140 in a state where the two core members 130, 140 are pressed against each other in the direction along the axis of the coil; and a core cover 150 that is provided between the core clip 160 and the core and that covers the outer surfaces of the two core members 130, 140 which include at least one portion where the joining surfaces intersect.

The present disclosure addresses the problem of achieving space saving.　An inductor (1) comprises a first conductor (21), a first core (31), a second conductor (22), a second core (32), a first connection section (41), and a second connection section (42). The first core (31) has a first end (E1) and a second end (E2). The second core (32) has a third end (E3) and a fourth end (E4). The first core (31) has a first region (F1), a second region (F2), and a third region (F3). The second core (32) has a fourth region (F4), a fifth region (F5), and a sixth region (F6). The first connection section (41) connects the first region (F1) of the first end (E1) and the fourth region (F4) of the fourth end (E4). The second connection section (42) connects the second region (F2) of the second end (E2) and the fifth region (F5) of the third end (E3). The relative magnetic permeability of the first connection section (41) and the relative magnetic permeability of the second connection section (42) are greater than the relative magnetic permeability of the third region (F3) and greater than the relative magnetic permeability of the sixth region (F6).

A semiconductor device package may include a package substrate, mold material formed over the package substrate, and a mold-embedded inductor that is embedded in the mold material. The mold-embedded inductor may be coupled to a die, such as a power management integrated circuit die, which may also be embedded in the mold material. The mold-embedded inductor may be formed by forming conductive traces and an inductor core in the mold material. For example, an active mold packaging (AMP) process and corresponding laser direct structuring (LDS) processes may be performed to form openings in the mold material and to activate surfaces of the mold material to facilitate subsequent plating of conductive material. Activated surfaces of the mold material may have micro-rough texture and may include bulk conductive material formed via the application of laser energy to additives in the mold material during the LDS process(es).

The present application provides a coil device capable of realizing large current and miniaturization. A first end (12a) of a first wire (12) is connected to a first wiring portion (63a) of a first terminal electrode (60), a first end (14a) of a second wire (14) is connected to a second wiring portion (63b) of the first terminal electrode (60), a second end (12b) of the first wire (12) is connected to a first wiring portion (73a) of a second terminal electrode (70), and a second end (14b) of the second wire (14) is connected to a second wiring portion (73b) of the second terminal electrode (70). The first wiring portion (63a) and the second wiring portion (63b) of the first terminal electrode (60) are arranged at positions apart from each other, and the first wiring portion (73a) and the second wiring portion (73b) of the second terminal electrode (70) are arranged at positions apart from each other.

Semiconductor devices and methods of manufacturing a balun having improved common mode rejection ratio. An electronic device has a first transformer and a second transformer. A first winding of the first transformer is coupled to a first winding of the second transformer by an interconnect transmission line. A phase compensation transmission line is coupled to a second winding of the first transformer. The phase compensation transmission line is configured to match an impedance of the interconnect transmission line.

We provide technology that can be useful in the manufacturing process. [Solution] The core device applied to the DC-DC converter 100 comprises two core members 130, 140 that form a core corresponding to a coil when assembled in a direction along the coil axis without providing a gap between their mating surfaces, a core clip 160 that is assembled to surround the outside of the core, including at least two points where the mating surfaces of the two core members 130, 140 intersect on their outer surfaces, and capable of holding the two core members 130, 140 pressed against each other in a direction along the coil axis, and a core cover 150 provided between the core clip 160 and the core, covering the outer surfaces of the two core members 130, 140, including at least one point where the mating surfaces intersect.

A common mode choke (50, 52, 54, 56) is provided. The common mode choke comprises: a printed circuit board (40, 42); a first conductor path (66) on or within the printed circuit board (40, 42); and a second conductor path (68) on or within the printed circuit board (40, 42) underneath the first conductor path (66), wherein the second conductor path (68) is electrically isolated against the first conductor path (66), the second conductor path (68) follows the first conductor path (66), each of the conductor paths (66, 68) forms at least two coils (80, 82, 84, 86), and each conductor path (66, 68) has a clockwise orientation in at least one of its coils (80, 82, 84, 86), and the same conductor path (66, 68) has a counter-clockwise orientation in the other one of its coils (80, 82, 84, 86).

We provide terminal connectors and electric drive assemblies. [Solution] The first connection terminal 11 and the second connection terminal 12 are provided at both ends of the extension body, respectively, to conduct current. Therefore, the extension body is provided with a plurality of first segments, and the plurality of first segments are arranged at intervals to form an intermediate assembly 14 provided within the magnetic ring 31. As a result, the conductive member can pass through the magnetic ring multiple times using the intermediate assembly, and as a result the coupling strength between the terminal block and the magnetic ring is increased, improving the common-mode noise rejection effect of the magnetic ring. On the other hand, there is no need to provide a capacitor in the terminal connector. This simplifies the structure of the terminal connector and allows for miniaturization of the terminal connector.