89 results about "Resistive element" patented technology

A tamper for making paraffin blocks for histology may include a pliable tamper head and a handle. The handle may be permanently or removably attached to the tamper by using screws, magnets, or the like. The tamper may be made from a pliable material, such as a silicone rubber, with improved thermal transfer and high latent heat. In use, the tamper may be warmed in advance to a working temperature by placing the tamper on a hot plate of the embedding station or on a dedicated smaller hot plate. Alternatively, the tamper may be heated with an electric resistive element, a thermoelectric device, or an electric induction coil.

The present description relates to a switching circuit (205) comprising at least one first bipolar transistor configured to be coupled to at least one electrical component (106, 109, 506, 507) to be switched, the bipolar transistor (60) having a first conduction electrode coupled to a reference electrical potential through at least one resistive (61) or inductive component or a second transistor (71).

This nitride semiconductor device (1) comprises a power FET (11), an ESD protection FET (12), a diode (13), and a resistor element (14). A gate structure (50G) of the power FET (11) includes a p-type semiconductor layer (52G) and a gate electrode (54G) that is Schottky-connected to the p-type semiconductor layer (52G). An anode structure (50A) of the diode (13) includes a p-type semiconductor layer (52A). The gate structure (50G), a drain structure (51D) of the ESD protection FET (12), and the anode structure (50A) are electrically connected to each other. A source structure (50S) of the power FET (11), a source structure (51S) of the ESD protection FET (12), and a terminal structure (50R) of the resistor element (14) are electrically connected to each other. A gate structure (51G) of the ESD protection FET (12), a cathode structure (50K) of the diode (13), and a terminal structure (51R) of the resistor element (14) are electrically connected to each other.

The present invention provides a non-volatile semiconductor memory device and a current-assisted voltage-controlled resistor that can supply an optimal voltage to each memory cell according to the state of the memory cell. [Solution] The non-volatile semiconductor memory device has a resistor element 10 and a current assist element arranged in parallel between the first voltage control line VCL1 and the second voltage control line VCL2, so that the optimal voltage can be supplied to each antifuse memory M arranged in the row direction via either the resistor element 10 or the current assist element depending on the state of the antifuse memory M.

In described examples, a low dropout voltage regulator includes an input voltage terminal, a resistive element, first and second transistors, an output terminal, a differential amplifier, and first and second saturation prevention circuits. The resistive element is coupled between the input voltage terminal and a gate of the first transistor. The output terminal is coupled to the drain of the first transistor and the source of the second transistor. A first input of the differential amplifier receives a reference voltage, and a second input is coupled to the output terminal. The first saturation prevention circuit provides a first clamp current to the differential amplifier output if the gate-source voltage of the first transistor is less than a first threshold voltage. The second saturation prevention circuit provides a second clamp current to the differential amplifier output if the gate-source voltage of the second transistor is greater than a second threshold voltage.

According to one embodiment, a semiconductor device includes a first terminal, a second terminal, a first transistor, a first circuit including a second transistor, and a second circuit including a first resistance element, a second resistance element, and a first switch element. A gate of the first transistor are coupled to a first node. A gate of the second transistor are coupled to a second node. One end and the other end of the first resistance element are coupled to the second node and the first node, respectively. One end and the other end of the second resistance element are coupled to a third node and the first node, respectively. The first switch element switches coupling and uncoupling between the second and third nodes. The second circuit adjusts a voltage difference between a gate voltage of the second transistor and a gate voltage of the first transistor by switching.

A receiver includes an input node coupled to receive an analog signal, a first switch coupled between the input node and a first node, a second switch coupled between the input node and a second node, a first resistive element coupled between the first node and a reference node, a second resistive element coupled between the second node and the reference node, a first capacitive element coupled to the first node, and a second capacitive element coupled to the second node. The receiver further includes a comparator having a first input coupled to the input node to receive the analog signal, and a second input coupled to the reference node to receive a reference voltage, wherein an output of the comparator controls the first and second switches.

The present application provides a semiconductor device that suppresses temperature rise of a heat generating component. The semiconductor device (10) includes: a substrate (15); a semiconductor element (21, 22, 23, 24) connected to a substrate surface (150); a P terminal (61) connected to the substrate (15) and having conductivity; and a resistance element (750) connected to the substrate (15) and generating heat by current flow; when the resistance element (750) is projected in a thickness direction (DT) of the substrate (15), the projected resistance element (750) overlaps the P terminal (61). Thus, a semiconductor device that suppresses temperature rise of a heat generating component can be provided.

A switched-mode power supply with a standby and a normal operating state includes a transformer with a primary side and a secondary side. A circuit arrangement on the primary side is coupled to the primary side of the transformer and comprises a start-up circuit. The start-up circuit includes a first buffer store, a first resistive element and a switch and is configured to generate the supply voltage for a switching regulator module in the standby operating state. A circuit arrangement on the secondary side is coupled to the secondary side of the transformer and is configured to provide at least one output voltage smoothed and buffered via a second buffer store. A coupling component with a signal path for a switching signal from the circuit arrangement on the secondary side to the primary side includes a first and a second side which are galvanically decoupled from one another.

A rotary knob device includes a seat, an operation cover, an annular circuit board, a braking ring, a resistance component, and a plurality of elastic components, conductive trigger components, and reset conductive components. The operation cover is pivotally mounted on the seat. The annular circuit board is disposed in the seat. The braking ring is fixed on the annular circuit board and connected to the operation cover. The resistance component is fixed on the seat and abuts against the braking ring. The elastic components are disposed on the braking ring or the annular circuit board. The conductive trigger components are fixed on the operation cover. The reset conductive components are disposed on the braking ring. When the operation cover is pressed, the conductive trigger component compresses the elastic component. When the operation cover is released, the elastic component pushes the conductive trigger component away.

This invention provides a triac-controlled LED driver control circuit, relating to the field of circuit technology. The circuit includes a circuit board with a microcontroller mounted on its top surface. One end of the microcontroller is electrically connected to a resistor dimmer via a power line, another end is electrically connected to a rectifier via a power line, and yet another end is electrically connected to an optocoupler via a power line. Several sets of resistive elements are arranged on the surface of the circuit board. In use, this invention enables dimming via three input signals: triac dimming, 0 / 1~10V dimming, and resistor dimmer dimming. These three dimming input signal voltage changes are converted into an output PWM signal pulse width by the microcontroller to control the turn-on time of the low-voltage MOS transistor Q3. The dimming process does not affect the normal operation of the driver power supply system, thus avoiding issues with flickering and dimming depth.

The present application provides an electric connector, which comprises an insulating body, a plurality of conductive terminals fixed in the insulating body, and a resistance element electrically connected with the corresponding conductive terminal. The insulating body has a receiving space for the reverse insertion of a mating socket connector and a mounting portion at the rear end. The conductive terminals are assembled into the insulating body from the rear to the front and have welding portions exposed to the mounting portion. The welding portions are all horizontally arranged flat plate structures. The mounting portion of the insulating body has a plurality of partitions arranged along the height direction. The partitions separate the adjacent welding portions from each other. The welding portions are arranged into two rows along the height direction. The resistance element is connected with one row of welding portions, and the other row of welding portions is connected with a cable. The electric connector of the present application has improved conductive terminals, thereby not only saving the cost of the built-in circuit board structure but also simplifying the connection process.

This application relates to the field of resistive element technology, and more particularly to a resistive element and an electronic device. The resistive element includes a ceramic body, two external electrodes, and lead-out electrodes. The ceramic body has two end faces disposed opposite each other along a first direction, and two side faces disposed opposite each other along a second direction. Each external electrode is disposed on one of the end faces, and each external electrode extends to one of the side faces along the second direction. Lead-out electrodes are disposed within the ceramic body. Each lead-out electrode has a lead-out end connected to one of the external electrodes, and an electrode body portion connected to the lead-out end. The electrode body portion extends along the first direction away from the connected lead-out end, and is spaced apart from the other external electrode. The width of the ceramic body is W1, the width of the lead-out end is W2, and the width of the electrode body portion is W3, where W1 > W2 > W3. The lead-out end is spaced apart from the external electrodes on each side face along the second direction to reduce the risk of false connections.

Various embodiments are directed to battery unit for use with surgical instruments. The battery units may comprise a plurality of cells and include a translatable discharge drain. When attached to the surgical instrument, the discharge drain may electrically connect an anode of the battery unit to a cathode of the battery unit, for example, via a resistive element in order to drain the battery unit.

This application provides an integrated resistive LED chip and LED strip. The chip includes: a support carrier with a first pad, a second pad, and a third pad spaced apart sequentially; a resistive element with its two ends electrically connected to the first pad and the second pad, respectively; and an LED chip fixed to the second pad, with its first electrode electrically connected to the first pad and its second electrode electrically connected to the third pad. By directly mounting the resistive element on the support carrier and electrically connecting it to the pad, this application integrates the resistive function within the LED chip, allowing the LED chip to be directly connected to external circuits without the need for additional resistors, reducing assembly steps before use and improving product integration.

A configuration for sensing current with higher accuracy is provided when a shunt resistor is arranged and connected between plate-shaped wiring, such as busbars or conductor frames. A current sensing device comprises: a resistor with a laminated structure, including a plate-shaped first electrode, a plate-shaped second electrode, and a plate-shaped resistive element arranged between the first and second electrodes; and a plate-shaped first conductor and a plate-shaped second conductor connected to the resistor, through which the current to be measured flows.The first conductor is connected to the first electrode, the second conductor is connected to the second electrode, the resistor is laminated between the first conductor and the second conductor, and a first insulating layer and a first voltage sensing pattern for transmitting a voltage signal are provided on a surface of the first conductor, the first voltage sensing pattern being formed by means of the first insulating layer.

The present invention relates to a shunt resistor and a shunt resistance device. The shunt resistor (1) includes at least two laminated elements (50) having a resistive elements (5) and attached to an electrode member (10). The electrode member (10) has at least two contact portions (10a) that contact the at least two laminated elements (50).

A first embodiment relates to an amplifier circuit including a positive bias circuit having a driving PMOS biased in subthreshold mode, a negative bias circuit having a driving NMOS biased in subthreshold mode, and an amplification circuit coupled to the bias circuit. The amplification circuit includes a first stage having a first boost stage, a second stage having a second boost stage, and a resistive element coupled between the first and second stages. A second embodiment relates to a folded cascaded operational amplifier, wherein the value of the resistive element is selected to place at least one of the driving MOS in subthreshold mode. A third embodiment relates to an integrated circuit having a resistive region adjacent to a first boost region and a second boost region, the resistive region including a resistive element directly connected to the driving PMOS and the driving NMOS. Embodiments of this application also relate to a folded cascaded operational amplifier and a method of operating the amplifier circuit.

An electrical connector for a vehicle chassis is disclosed. The electrical connector comprises: a body configured to be attached to the vehicle chassis; a first electrical contact and a first electrical conduit extending through the body to provide an electrical connection between the first electrical contact and the vehicle chassis when the body is attached to the vehicle chassis; a second electrical contact and a second electrical conduit extending through the body to provide an electrical connection between the second electrical contact and the vehicle chassis when the body is attached to the vehicle chassis; a resistive element in the first electrical conduit; and a barrier shielding the resistive element. Methods for installing an electrical connector to a vehicle chassis, methods for grounding a vehicle chassis, and systems and methods for testing an electrical connection to a vehicle chassis are also disclosed.

Memory circuit based on a phase change material This description relates to an electronic device comprising a memory circuit, the circuit comprising: - a substrate in and on which selection transistors are arranged; - an interconnect stack;- a plurality of memory elements (M) arranged above the interconnect stack and organized in a matrix, forming rows and columns, each memory element comprising a stack of a heating resistive element, a layer of a phase-change material (47) and an upper electrode (53), the upper electrode being common to the memory elements of the same row, in which the memory elements of two successive bit rows are separated by a trench (58) having, in a lower part, an enclosed space filled with a gas or a vacuum, the trench being closed by an insulating layer (59) extending over the upper face of the memory elements and into an upper part of the trench. Figure for the abstract: Fig. 5B;

According to one embodiment, a sensor includes a base and a first detection portion. The first detection portion includes a first base electrode fixed to the base, a first fixed portion fixed to the base, and a first element supported by the first fixed portion. The first element includes a first resistance member and a first element electrode. A first gap is provided between the first base electrode and the first element. A first electrical resistance of the first resistance member is configured to change in response to a detection target around the first element.

The present application relates to the technical field of computers, and provides a chassis intrusion monitoring system and method, a chip, and an electronic device. The chassis intrusion monitoring system comprises: a switch, a resistive element, a first power supply, and a chip having an intrusion monitoring function. A first end of the switch is connected to an input end of the chip, the first end of the switch is further connected to the first power supply by means of the resistive element, a second end of the switch is grounded, and the switch is used for being turned on in response to a cover of a chassis being opened, so that the input end of the chip is grounded. The chip is used for setting a value of a preset flag to a first value representing presence of an intrusion in response to the input end being grounded, and recording a current time as an intrusion time. In the present solution, intrusion monitoring is implemented without requiring elements such as a sensor to be deployed in a peripheral circuit, thereby reducing the complexity of the peripheral circuit.

To stabilize the operation of a circuit composed of multiple power semiconductor elements. [Solution] The power conversion device 1 comprises a signal generation unit 2 that generates an on / off command signal, a gate drive circuit 3 that receives the on / off command signal and generates a delayed on / off command signal by delaying the on / off command signal by a predetermined time, and a switching unit 4 that generates an output current using a power semiconductor element 41 that operates based on the delayed on / off command signal. The gate drive circuit 3 includes a first variable resistance element 31 disposed between the signal generation unit 2 and the switching unit 4, a capacitor 34 disposed between the wiring connecting the first variable resistance element 31 to the switching unit 4 and a first reference potential 35, a second variable resistance element 32 connected in parallel with the first variable resistance element 31, and a diode 33 provided on the path connecting the first variable resistance element 31 and the second variable resistance element 32 in parallel.

A radiant heating element adapted for a cooking appliance, comprising an insulating base (4), at least one resistance element (10a, 10b, 10c, 11a, 11b) fixed to the insulating base (4), and a connector (7) comprising a body (8) and terminals (15, 16, 17) mounted on the body (8), wherein the ends of the heating element (10a, 10b, 10c, 11a, 11b) are connected to the terminals (15, 16, 17), characterized in that the radiant heating element (1; 1') is configured to be powered directly via the connector (7) by a DC power supply, wherein the radiant heating element (1;1') comprises a plurality of resistive elements (10a, 10b, 10c, 11a, 11b) connected in parallel and grouped into at least two groups of resistive elements (10, 11), generating at least two cooking zones (A, B) in operation, and the connector (7) comprises busbars (15b, 16b, 16c, 17b, 17c) via which the ends of the plurality of resistive elements (10a, 10b, 10c, 11a, 11b) are fixed to the terminals (15, 16, 17), with at least two of the busbars (16b, 16c, 17b, 17c) extending from the body (8) of the connector (7) over the insulating base (2) towards the interior of the radiant heating element (1; 1'), such that the two busbars (16b, 16c, 17b, 17c) are surrounded by the plurality of resistive elements (10a, 10b, 10c, 11a, 11b), wherein the ends of the resistive elements (10a, 10b, 10c) of one of the groups of resistive elements (10) are fixed to the two busbars (16b, 16c, 17b, 17c).

A light source driver for a light source of a luminaire. The disclosure proposes monitoring a parameter responsive to a temperature change in a resistive element or a cause thereof, in order to determine whether the light source driver is compatible with an AC power supply. The resistive element is connected in series between a rectifying device of the light source driver and an energy storage capacitor for storing charge to power the light source.

The invention relates to measuring technology, and can be used for measuring the root-mean-square values of electrical quantities of direct current and high-frequency alternating current, such as current, voltage and power. A thermoelectric measuring device comprises a resistive element and a thermoelectric module, wherein the resistive element is designed to be capable of emitting heat when an electrical signal to be measured is supplied thereto, and is in thermal contact with a sensitive side of the thermoelectric module, and the thermoelectric module is designed to be capable of measuring the heat emitted by the resistive element and is disposed on a heat dissipating base. The thermoelectric measuring device is highly sensitive to heat flux and provides highly accurate measurement of electrical quantities.

This invention relates to a fully sealed sensor for motorcycles, used to transmit fuel level information from a motorcycle fuel tank. The sensor includes a cup-shaped base with a hollow connecting post, two springs mounted on the base, an inner rocker arm mounted on the base, a resistive element mounted on the inner rocker arm, an inner magnet mounted on the inner rocker arm, a top cover mounted on the base, and a terminal-coated wire harness assembly inserted into the base. The base has two terminal through holes. Each spring includes a horizontal portion and an elastic portion. The horizontal extension line of the horizontal portion of the spring is a cleaving line of the terminal through holes. The terminals of the terminal-coated wire harness assembly pass through the terminal through holes and press against the horizontal portion of the spring. The elastic portion of the spring elastically connects to the resistive element for conduction and retraction. This application provides better protection for the sensor components and extends the sensor's lifespan.

The present disclosure relates generally to high voltage systems. In one embodiment, a balancing and measuring circuit is disclosed, comprising: a first capacitor electrically coupled between a first voltage and a chassis voltage, wherein the first voltage is greater than the chassis voltage; a second capacitor electrically coupled between a second voltage and the chassis voltage, wherein the second voltage is less than the chassis voltage; a first circuit associated with the first capacitor; and a second circuit associated with the second capacitor, wherein the first circuit and the second circuit each comprise: a resistive element; a switching element; a voltage circuit configured to generate a reference voltage; and a controller configured to monitor a voltage of a reference capacitor and to control the switching element based on the monitored voltage, wherein the resistive element and the switching element are connected in series.

A differential amplifier circuit includes a basic differential amplifier circuit including an operational amplifier configured to amplify a potential difference between output ends of a first input resistor and a second input resistor, a feedback resistor connected to the output end of the first input resistor, and a first resistance element connected to the output end of the second input resistor. Furthermore, the differential amplifier circuit includes a high-precision operational amplifier having an offset voltage or a drift voltage lower than that of the operational amplifier. The high-precision operational amplifier includes an inverting input terminal connected to the output end of the first input resistor and an output terminal connected to the output end of the second input resistor.

A detection device includes a substrate that is flexible, and a bridge circuit disposed within the substrate. A first resistance element, a second resistance element, a third resistance element, and a fourth resistance element are connected in series in an order from the first to fourth resistance elements to constitute the bridge circuit in a closed loop shape. The first resistance element is an expandable and contractable resistance element that has a first part and a second part connected in series. Each of the second resistance element, the third resistance element, and the fourth resistance element is a non-expandable and non-contractable resistance element. The first part and the second part of the first resistance element are provided in different layers of the substrate, overlapped with each other in a length direction in a planar view, and disposed in parallel to each other.