819 results about "Resistive element" patented technology

A programmable driver circuit (54) and related method (600) for simultaneously controlling multiple tunable probabilistic bit generators are disclosed. The driver circuit comprises a plurality of programmable voltage generators (52; 30), a programming unit (35) and a non-volatile memory unit (34a-b). Input terminals of the plurality of programmable voltage generators are jointly connectible to a single voltage supply source. The programming unit is configured to generate a sequence of programming pulses for the different voltage generators. Each voltage generator comprises a single-stage or multi-stage voltage divider circuit (31) formed by a series of resistive elements (32-1; 32-2; 33). The non-volatile memory unit (34a-b) comprises at least the resistive element positioned first in the series of resistive elements as a programmable resistance and a program control transistor (34-1) connected in series between the programmable resistance and a fixed reference voltage. A control gate of the program control transistor is operatively coupled to the programming unit to receive the sequence of programming pulses for the programmable voltage generator when operated in a programming mode.

The present disclosure relates generally to high voltage systems. In one embodiment, a balancing and measuring circuit is disclosed, comprising: a first capacitor electrically coupled between a first voltage and a chassis voltage, wherein the first voltage is greater than the chassis voltage; a second capacitor electrically coupled between a second voltage and the chassis voltage, wherein the second voltage is less than the chassis voltage; a first circuit associated with the first capacitor; and a second circuit associated with the second capacitor, wherein the first circuit and the second circuit each comprise: a resistive element; a switching element; a voltage circuit configured to generate a reference voltage; and a controller configured to monitor a voltage of a reference capacitor and to control the switching element based on the monitored voltage, wherein the resistive element and the switching element are connected in series.

An antenna device includes an antenna array in which a plurality of antennas each including a negative differential resistance element and a resonance circuit are arranged, a voltage bias circuit which applies a voltage to the antenna array, a first shunt element which is connected between the antenna array and the voltage bias circuit in parallel relation to each of the negative differential resistance element and the voltage bias circuit, and in which a first resistor and a first capacitor of the first shunt element are connected in series, and a second shunt element which is connected between the first shunt element and the voltage bias circuit in parallel relation to each of the negative differential resistance element and the voltage bias circuit, and in which a second resistor and a second capacitor of the second shunt element are connected in series.

A CAN transmitter includes an output branch, a replica branch including a replica of the output branch, and a feedback network. The output branch includes a first resistive element controlled by a first bias voltage and a second resistive element controlled by a second bias voltage. The replica branch has a feedback node that is replicated at a midpoint between the CANH bus terminal and the CANL bus terminal. The feedback network has a first input coupled to the feedback node, a second input configured to receive a midpoint reference voltage indicative of a desired midpoint voltage between the CANH and CANL terminals, and an output at which the first bias voltage is provided. A resistance controller is coupled to a control terminal of the second resistive element and configured to generate the second bias voltage based on a predetermined reference voltage and a bias current.

A leakage current detection and interruption (LCDI) device includes a leakage current detection module, including a first and a second leakage current detection line and at least one resistive element and / or at least one semiconductor element, configured to detect a leakage current signal on the first or second current-carrying line and to generate a leakage fault signal in response to detecting the leakage current signal. The first and second leakage current detection lines are electrically insulated from each other, and respectively cover one of the first and second current-carrying lines. The at least one resistive element and / or semiconductor element is coupled in series between the first and second leakage current detection lines to form a current path for detecting an open circuit fault in the leakage current detection module. By detecting the fault in the first and second leakage current detection lines, the reliability of the LCDI device is improved.

Methods and apparatus for filtering a signal using a current mode filter circuit that enables source degradation. An example filter circuit generally includes an input node; an output node; a power supply node; a first transistor including a drain coupled with the input node; a second transistor including a drain coupled with the output node and including a gate coupled with a gate of the first transistor; a capacitive element coupled between a drain of the first transistor and the power supply node; a first resistive element coupled between the drain electrode and the gate electrode of the first transistor; a first source degeneration element coupled between a source of the first transistor and the power supply node; and a second source degeneration element coupled between a source of the second transistor and the power supply node.

The invention provides a buried resistor circuit board and a preparation method thereof. According to the resistance element, one resistance material is arranged on the dielectric layer to form the first resistance layer, and then the other resistance material is arranged on the first resistance layer to form the second resistance layer, so that the binding force of the resistance layers and the dielectric layer can be enhanced, and the surface flatness of the resistance element can be improved. The resistive layer of the resistive element is protected by using the protective film, so that the shape and the length of the resistive layer are prevented from being influenced by subsequent processes. According to the preparation method, the whole process is a dry process, a differential etching process is omitted, an alkaline etching solution does not need to be used, and the preparation method is environmentally friendly.

The utility model provides a leveled resistor element, which comprises a substrate, a resistor layer and an electrode layer, solves the problems of impedance increase and abnormal product characteristics caused by improper joint of an interface between the electrode layer and the resistor layer, and comprises the following steps of: after the electrode layer process is finished, forming the resistor layer on the substrate; and laser or grinding is utilized to eliminate the height difference of the interface and process the discontinuous structure of the outline of the electrode layer.

A tamper for making paraffin blocks for histology may include a pliable tamper head and a handle. The handle may be permanently or removably attached to the tamper by using screws, magnets, or the like. The tamper may be made from a pliable material, such as a silicone rubber, with improved thermal transfer and high latent heat. In use, the tamper may be warmed in advance to a working temperature by placing the tamper on a hot plate of the embedding station or on a dedicated smaller hot plate. Alternatively, the tamper may be heated with an electric resistive element, a thermoelectric device, or an electric induction coil.

A strain sensing structure and a fabricating method of the same are provided. The strain sensing structure includes a flexible substrate, strain resistor members, a first wiring layer and a second wiring layer. The flexible substrate has through holes which are distributed separately. The strain resistor members are respectively disposed in the through holes. The first wiring layer is stacked on an upper side of the flexible substrate and includes first wirings, where the first wirings are separate from each other. The second wiring layer is stacked on a lower side of the flexible substrate and includes second wirings, where the second wirings are separate from each other. Each strain resistor member is electrically connected to one of the first wirings and one of the second wirings, so that the strain resistor members form a series circuit through the first wirings and the second wirings.

A frame terminal 8 is bent so that its cross-sectional shape is an S-shape, and such that separation distances L1, L2 and L3 in a horizontal direction between an uppermost portion and a lowermost portion, in the vertical direction, of an end portion side face 21a of a resistance element 8 built into a mold divider 1, and a part substantially midway between an uppermost point and a lowermost point thereof, and the parts of the surface of the frame terminal 6 that correspond to these parts in the horizontal direction satisfy the relation L1>L2≥L3. As a result, in the mold divider 1, a space which is to be filled with a joining material and which has a non-uniform separation distance is formed between the frame terminal 6 and the end portion side face 21a, thereby making it possible to ensure the bonding strength between the resistance element 8 and the frame terminal 6.

The invention relates to sensing compositional information about material by measuring thermal properties of the material. In one arrangement there is provided a needle probe for sensing compositional information. The probe comprises a needle having a tip region. A resistive element is attached to the needle at the tip region. A measurement system is configured to: 1) drive an electrical current through the resistive element to apply heating to the resistive element, and 2) measure an electrical response of the resistive element to the heating. A processing unit analyses the measured electrical response of the resistive element to the heating to determine compositional information about material in contact with the tip region.

To prevent solder wetting on a resistor formed of a high specific resistance material, that can be used in the applications for large current detection.SOLUTION: A multilayer resistor includes a resistor having a plate shape and including a first flat surface and a second flat surface in a thickness direction, and a first electrode formed on the first flat surface and a second electrode formed on the second flat surface. The resistor includes a metal body formed of an electroconductive metal material, and an insulating particle formed of an insulating material. The insulating particle includes a first insulating particle with a particle diameter of 5 μm or more. At the implementation on a printed board, an end surface of the resistor is exposed and the second electrode is connected through the solder.SELECTED DRAWING: Figure 1

A cooking appliance assembly includes a cooking appliance including a heat source and a port including a socket; at least one cooking accessory including an accessory sensor, a plug, and a resistive element, the plug being removably received within the socket; a variable resistance module provided within the cooking appliance and operably connected with the port; and a controller communicatively coupled with the cooking appliance and the at least one cooking accessory, the controller configured to perform an operation. The operation includes determining an accessory type of the cooking accessory engaged with the port of the cooking appliance; adjusting, via the variable resistance module, a reference resistance at the variable resistance module based on the determined accessory type; and selecting a corresponding temperature table or equation based on the determined type of the cooking accessory.

Reliability of a semiconductor device is improved. A resistance element and a trench form a closed path in plan view.The semiconductor device includes: first and second contact members each electrically connecting a gate pad and the resistance element; third and fourth contact members each electrically connecting a gate wiring and the resistance element; and fifth to eighth contact members each electrically connecting a first conductive member and the resistance element. A current path passing from the gate pad to the gate wiring through the first conductive member is made of the plurality of contact members and the resistance element. The first conductive member functions together with the fifth to eighth contact members to form a bypass path for reducing the current that flows through some sections of the closed path made of the resistance element.

Systems described herein include a battery pack including one or more battery cells and a first resistive element connected to a positive electrode of a first battery cell. The systems also include an external device capable of receiving the battery pack. The external device includes a second resistive element, a switch, and a controller. The second resistive element is configured to be in series with the first resistive element upon the battery pack being received within the external device. The switch is positioned in series with the second resistive element and a common potential is coupled to both the battery pack and the external device. The controller is configured to activate the switch, measure a voltage between the first resistive element and the second resistive element in response to the switch being activated, and determine an identification of the battery pack based on the measured voltage.

The present invention relates to a resistor unit (1, 1', 1''), comprising: at least one electrical resistor (10), at least one fluid-carrying cooling unit (30) on and / or in which at least part of the at least one electrical resistor (10) is arranged, at least one detection unit (3, 4, 5, 6, 7, 71, 72) and at least one evaluation device (40) that can be operatively connected to the at least one detection unit (3, 4, 5, 6, 7, 71, 72), the at least one detection unit (3, 4, 5, 6, 7, 71, 72) being configured to measure a variable that represents the temperature (TR) of the at least one electrical resistor (10) per se or in combination with a further detection unit (3, 4, 5, 6, 7, 71, 72) and that relates to an electrical property of the at least one electrical resistor (10) and / or to a property of a fluid flowing through the fluid-carrying cooling unit (30). The present invention additionally relates to a brake system and to a vehicle having such a resistor unit and to a method for estimating a temperature of the fluid-cooled electrical resistor.

An amplifier circuit includes first and second amplifiers, first and second input-side coils, first and second output-side coils, a resistance element, a first switch including first to fourth terminals, and a second switch including fifth to seventh terminals. The first input-side coil is connected between the first amplifier and the first terminal, the second input-side coil is connected between the second amplifier and the third terminal, the first output-side coil is connected between a signal output terminal and the second terminal, the second output-side coil is connected between the fifth terminal and the fourth terminal, and the resistance element is connected between the sixth terminal and the ground.

The invention belongs to the technical field of electromagnetic microwaves, and particularly discloses an ultra-wideband wave-absorbing material based on a three-layer metasurface and application of the ultra-wideband wave-absorbing material based on the three-layer metasurface. Each wave-absorbing resonance unit comprises a first resistor loading metasurface layer, a first resistor loading metasurface substrate, a first resistor element, a first resistor loading metasurface supporting dielectric layer, a second resistor loading metasurface substrate, a second resistor loading metasurface layer and a second resistor element which are sequentially arranged from top to bottom; the device comprises a first resistor loading metasurface substrate, a second resistor loading metasurface supporting dielectric layer, a third resistor loading metasurface layer, a third resistor loading metasurface substrate, a third resistor element, a third resistor loading metasurface supporting dielectric layer and a pure metal backboard. According to the ultra-wideband wave-absorbing material based on the three-layer metasurface and the application of the ultra-wideband wave-absorbing material, 90% of ultra-wideband wave absorption can be achieved under a small-size structure, and the ultra-wideband wave-absorbing material has extremely high strategic value in the fields of electromagnetic stealth and the like.

The present disclosure is drawn to, among other things, a configuration bit including at least four resistive elements and a voltage amplifier. At least two first resistive elements may be electrically connected in series via a first electrode and at least two second resistive elements may be electrically connected in series via a second electrode. The at least two first resistive elements may be electrically connected in parallel to the at least two second resistive elements via a third electrode and a fourth electrode. The first electrode and the second electrode may be electrically connected to a voltage supply. The third electrode and the fourth electrode may be electrically connected to an input of the voltage amplifier.

Methods and apparatus for amplifying a signal via an amplification circuit are described. An example amplification circuit generally includes an amplifier including an inverting input configured to receive a signal for wireless transmission. The amplification circuit also includes an impedance coupled between the inverting input and an output of the amplifier. The amplification circuit further includes a resistive element including (i) a first terminal coupled to the inverting input and (ii) a second terminal coupled to a reference potential node for the amplification circuit.

The utility model relates to an air duct structure of a forced air cooling brake resistor. The air duct structure is arranged on a resistor box body, the resistor box body comprises a box body air duct and a resistor element arranged in the box body air duct, and the air duct structure comprises a conical air guide device, a fan, an air inlet mesh enclosure and an air outlet shell arranged at the outlet end of the box body air duct which are sequentially connected with the inlet end of the box body air duct; the air inlet mesh enclosure is a cuboid mesh enclosure, a fan receding hole is formed in one side of the air inlet mesh enclosure, and fan blades of the fan are rotationally arranged at the fan receding hole. Compared with the prior art, the air duct structure enables air flow to be evenly distributed in the air duct of the box body, prevents the air flow from generating a blind area in the air duct and causing local over-temperature of a brake resistor, can effectively reduce the adverse effect of walking wind generated when a train travels on heat dissipation of the resistor, and improves heat dissipation efficiency.

To improve the performance of a semiconductor device and ensure the reliability of the semiconductor device.SOLUTION: A lower electrode BE is formed in a wiring layer WL4. Two wirings M5 having a thickness greater than that of the lower electrode BE are formed in the wiring layer WL5 located above the wiring layer WL4. An insulating film IF1 and an upper electrode UE are formed on the lower electrode BE between the wiring layer WL4 and the wiring layer WL5. A resistive element RS1 is formed on the two wirings M5. The lower electrode BE, the insulating film IF1, and the upper electrode UE function as a capacitive element MIM.SELECTED DRAWING: Figure 1

An ESD protection circuit in an interface circuit has a first diode coupled between a power source of an integrated circuit device and an input / output pad of the integrated circuit device, a second diode coupled between a first terminal of a first resistive element and the input / output pad, with a second terminal of the first resistive element being coupled to the power source, a second resistive element that couples the second diode to the first diode and to the input / output pad; a first clamping circuit coupled between the power source and a ground reference of the integrated circuit device, and a second clamping circuit coupled between the first terminal of the first resistive element and the ground reference. The power source supplies a driver circuit coupled to the input / output pad.

The utility model relates to the technical field of NTC (Negative Temperature Coefficient) resistor element processing, in particular to an NTC resistor element lead branching assembly, which comprises a supporting seat, a centering clamping mechanism is arranged on the surface of the supporting seat, the centering clamping mechanism consists of a servo motor, a rotating arm, a pull rod and two groups of clamping plates, the two clamping plates are slidably connected to the surface of the supporting base. The surface of the clamping plate is connected with a branching mechanism, and the branching mechanism is used for branching NTC resistor element leads; the surface of the supporting seat is connected with a pushing mechanism; and the pushing mechanism is used for pushing the wire separating mechanism to move to realize wire separating work. According to the utility model, the automation degree is improved, manual auxiliary operation is not needed in the branching process, the labor intensity is reduced, and the working efficiency is improved; and the whole branching process is automatically completed by a machine, and manual operation does not exist in the process, so that the branching positions are relatively uniform.

A system, comprising: a sensing element including a plurality of resistive elements; a switching matrix that is configured to change a total resistance of the sensing element by bringing online or offline one or more of the plurality of resistive elements, the total resistance of the sensing element, at any point in time, being based on respective resistances of only those of the plurality of resistive elements that are currently online; a matrix controller that is configured to detect when a value of a counter signal is updated and cause the switching matrix to change the total resistance of the sensing element by bringing offline or online one or more of the plurality of resistive elements based on the value of the counter signal; and a counter signal generator configured to detect whether an offset signal satisfies a predetermined condition and update the value of the counter signal.

The present description relates to a switching circuit (205) comprising at least one first bipolar transistor configured to be coupled to at least one electrical component (106, 109, 506, 507) to be switched, the bipolar transistor (60) having a first conduction electrode coupled to a reference electrical potential through at least one resistive (61) or inductive component or a second transistor (71).

To provide an inspection circuit for a semiconductor wafer that can measure the dielectric strength of a semiconductor element for monitor test with high precision in a short time.SOLUTION: The present invention relates to an inspection circuit 100 for a semiconductor wafer provided in a PCMTEG region formed on a surface of a semiconductor substrate, and the inspection circuit has: a MOS transistor M1 and a MOS transistor M2 which are connected in parallel between a VDD terminal P1 and a VSS terminal P2; a resistance element R1 which is connected in series with the MOS transistor M1 between the VDD terminal P1 and MOS transistor M1; and a resistance element R2 which is connected between the VDD terminal P1 and MOS transistor M2 in series with the MOS transistor M2 so as to be parallel with the resistance element R1.SELECTED DRAWING: Figure 1

The invention relates to a circuit unit for controlling load currents of an electrical load, comprising a circuit logic, at least n switch elements with n≥2, resistance elements with m≥1, wherein the resistance elements can be bridged by means of the switch elements, wherein the circuit logic is designed such that it increases the load current in steps to a final value by means of an activation sequence of the switch elements, and a method for controlling load currents of an electrical load.