1076 results about "Resistive element" patented technology

A programmable driver circuit (54) and related method (600) for simultaneously controlling multiple tunable probabilistic bit generators are disclosed. The driver circuit comprises a plurality of programmable voltage generators (52; 30), a programming unit (35) and a non-volatile memory unit (34a-b). Input terminals of the plurality of programmable voltage generators are jointly connectible to a single voltage supply source. The programming unit is configured to generate a sequence of programming pulses for the different voltage generators. Each voltage generator comprises a single-stage or multi-stage voltage divider circuit (31) formed by a series of resistive elements (32-1; 32-2; 33). The non-volatile memory unit (34a-b) comprises at least the resistive element positioned first in the series of resistive elements as a programmable resistance and a program control transistor (34-1) connected in series between the programmable resistance and a fixed reference voltage. A control gate of the program control transistor is operatively coupled to the programming unit to receive the sequence of programming pulses for the programmable voltage generator when operated in a programming mode.

The present disclosure relates generally to high voltage systems. In one embodiment, a balancing and measuring circuit is disclosed, comprising: a first capacitor electrically coupled between a first voltage and a chassis voltage, wherein the first voltage is greater than the chassis voltage; a second capacitor electrically coupled between a second voltage and the chassis voltage, wherein the second voltage is less than the chassis voltage; a first circuit associated with the first capacitor; and a second circuit associated with the second capacitor, wherein the first circuit and the second circuit each comprise: a resistive element; a switching element; a voltage circuit configured to generate a reference voltage; and a controller configured to monitor a voltage of a reference capacitor and to control the switching element based on the monitored voltage, wherein the resistive element and the switching element are connected in series.

An antenna device includes an antenna array in which a plurality of antennas each including a negative differential resistance element and a resonance circuit are arranged, a voltage bias circuit which applies a voltage to the antenna array, a first shunt element which is connected between the antenna array and the voltage bias circuit in parallel relation to each of the negative differential resistance element and the voltage bias circuit, and in which a first resistor and a first capacitor of the first shunt element are connected in series, and a second shunt element which is connected between the first shunt element and the voltage bias circuit in parallel relation to each of the negative differential resistance element and the voltage bias circuit, and in which a second resistor and a second capacitor of the second shunt element are connected in series.

In an electro-optical device, a first substrate is provided with a temperature detection element and an electro-static protection circuit that protects the temperature detection element from a surge current. A first resistor element is electrically coupled to the temperature detection element in series. The electro-static protection circuit includes a transistor electrically coupled to the first resistor element and the temperature detection element in parallel. A first capacitance element is provided on a wiring substrate electrically coupled to the first substrate, and is provided between a first coupling wiring line electrically coupled to one side of the temperature detection element and a second coupling wiring line electrically coupled to the other side thereof.

A CAN transmitter includes an output branch, a replica branch including a replica of the output branch, and a feedback network. The output branch includes a first resistive element controlled by a first bias voltage and a second resistive element controlled by a second bias voltage. The replica branch has a feedback node that is replicated at a midpoint between the CANH bus terminal and the CANL bus terminal. The feedback network has a first input coupled to the feedback node, a second input configured to receive a midpoint reference voltage indicative of a desired midpoint voltage between the CANH and CANL terminals, and an output at which the first bias voltage is provided. A resistance controller is coupled to a control terminal of the second resistive element and configured to generate the second bias voltage based on a predetermined reference voltage and a bias current.

An integrated circuit (IC) device comprises a conductive contact at a surface of the IC device. A resistive element is coupled between the conductive contact and first circuitry. Second circuitry is coupled between the resistive element and the conductive contact. The second circuitry is further coupled with a supply line and comprises at least one of a diode or a power clamp. The resistive element is disposed in a first metallization layer of the IC device. A first dielectric layer is adjacent to the first metallization layer. A second metallization layer is adjacent to the first dielectric layer. A height of the first dielectric layer and the second metallization layer is a first distance. A zone overlaps the resistive element, and extends a second distance away from the resistive element. The zone is free of conductive material and the second distance is greater than the first distance.

A leakage current detection and interruption (LCDI) device includes a leakage current detection module, including a first and a second leakage current detection line and at least one resistive element and / or at least one semiconductor element, configured to detect a leakage current signal on the first or second current-carrying line and to generate a leakage fault signal in response to detecting the leakage current signal. The first and second leakage current detection lines are electrically insulated from each other, and respectively cover one of the first and second current-carrying lines. The at least one resistive element and / or semiconductor element is coupled in series between the first and second leakage current detection lines to form a current path for detecting an open circuit fault in the leakage current detection module. By detecting the fault in the first and second leakage current detection lines, the reliability of the LCDI device is improved.

Methods and apparatus for filtering a signal using a current mode filter circuit that enables source degradation. An example filter circuit generally includes an input node; an output node; a power supply node; a first transistor including a drain coupled with the input node; a second transistor including a drain coupled with the output node and including a gate coupled with a gate of the first transistor; a capacitive element coupled between a drain of the first transistor and the power supply node; a first resistive element coupled between the drain electrode and the gate electrode of the first transistor; a first source degeneration element coupled between a source of the first transistor and the power supply node; and a second source degeneration element coupled between a source of the second transistor and the power supply node.

A plurality of resistors are disclosed herein. The resistor may include one or more resistive elements and a plurality of conductive portions. Openings or slots, which can be configured to adjust temperature coefficient or resistance (TCR) values of the resistor, are formed in the resistive elements. The shape, quantity, and orientation of the openings or slots can vary. In one aspect, header assemblies are provided for securing or holding pins relative to the resistors.

A hydrogen detection device includes a bridge circuit including: a hydrogen sensor that is a first resistive element; a resistor that is a second resistive element; a reference element that is a third resistive element; and a resistor that is a fourth resistive element, and at least the hydrogen sensor and the reference element are provided on a single semiconductor chip. The hydrogen sensor includes a first electrode, a second electrode, a metal oxide layer, an insulating film, or the like, and the insulating film includes an opening through which part of the second electrode is exposed. The reference element includes a first electrode, a second electrode, a metal oxide layer, an insulating film, or the like, and the insulating film includes no opening through which part of the second electrode is exposed.

An air cooled resistor arrangement, comprising a resistor housing comprising an air inlet, an air outlet, a first side wall extending from the air inlet to the air outlet, and a second side wall extending from the air inlet to the air outlet on an opposite side to the first side wall, a plurality of elongated resistor elements arranged in the resistor housing, each one of the elongated resistor elements extending from the first side wall to the second side wall, wherein the plurality of elongated resistor elements is arranged in columns along a direction between the air inlet and the air outlet, wherein each one of the plurality of elongated resistor elements is arranged equidistantly to all its neighboring elongated resistor elements.

The invention provides a buried resistor circuit board and a preparation method thereof. According to the resistance element, one resistance material is arranged on the dielectric layer to form the first resistance layer, and then the other resistance material is arranged on the first resistance layer to form the second resistance layer, so that the binding force of the resistance layers and the dielectric layer can be enhanced, and the surface flatness of the resistance element can be improved. The resistive layer of the resistive element is protected by using the protective film, so that the shape and the length of the resistive layer are prevented from being influenced by subsequent processes. According to the preparation method, the whole process is a dry process, a differential etching process is omitted, an alkaline etching solution does not need to be used, and the preparation method is environmentally friendly.

The embodiment of the invention discloses an embedded packaging structure, a power supply device and electronic equipment. The embedded packaging structure comprises at least three layers of embedded frames which are sequentially overlapped, and chips, inductance elements and a plurality of electronic elements which are embedded in the embedded frames, at least one electronic element in the plurality of electronic elements is a capacitor element or a resistor element; the inductance element is embedded in the middle layer embedded frame of the at least three layers of embedded frames, and the thickness of the middle layer embedded frame is larger than or equal to that of the inductance element. The inductance element is embedded in the middle-layer embedded frame in the multi-layer embedded frame, so that the influence possibly caused by dimensional tolerance of devices such as the inductance element can be avoided, and the product yield can be ensured; and the processing of each layer of packaging module and the overlapping assembly of the modules can be completed in a substrate factory, so that the industrial chain can be further optimized. In addition, a fully embedded structure is realized by stacking multiple layers of embedded frames, the area occupied by the device on the board is remarkably reduced, and the risk of device exposure is reasonably controlled.

An apparatus and method to detect and locate electrical faults in an insulated supply conductor sheathed in a conductive screen is disclosed. The apparatus is positioned along the supply conductor between a power supply and an electrical load. The conductive screen is coupled to an electrical ground via a first resistive element. A voltage on the conductive screen is sensed and compared to a threshold to determine whether a fault condition exists. The apparatus is configured to inject a voltage pulse to the conductive screen and detect a reflected pulse therefrom. The location of the fault condition is determined based on an elapsed time between the injection of the voltage pulse and the detection of the reflected pulse.

The utility model provides a leveled resistor element, which comprises a substrate, a resistor layer and an electrode layer, solves the problems of impedance increase and abnormal product characteristics caused by improper joint of an interface between the electrode layer and the resistor layer, and comprises the following steps of: after the electrode layer process is finished, forming the resistor layer on the substrate; and laser or grinding is utilized to eliminate the height difference of the interface and process the discontinuous structure of the outline of the electrode layer.

A tamper for making paraffin blocks for histology may include a pliable tamper head and a handle. The handle may be permanently or removably attached to the tamper by using screws, magnets, or the like. The tamper may be made from a pliable material, such as a silicone rubber, with improved thermal transfer and high latent heat. In use, the tamper may be warmed in advance to a working temperature by placing the tamper on a hot plate of the embedding station or on a dedicated smaller hot plate. Alternatively, the tamper may be heated with an electric resistive element, a thermoelectric device, or an electric induction coil.

The invention relates to a semi-active pressure-resistant low-frequency sound absorption covering layer containing a piezoelectric composite material. The semi-active pressure-resistant low-frequency sound-absorbing covering layer containing the piezoelectric composite material structurally comprises a surface protecting layer which is arranged on the outermost side of the covering layer and converts sound energy into heat energy through a damping effect; the piezoelectric composite material layer is arranged on the inner side of the surface protection layer, converts sound energy into electric energy through a direct piezoelectric effect, and dissipates the electric energy through a shunt branch; the cavity layer is arranged on the inner side of the piezoelectric composite material layer and absorbs sound through a cavity resonance effect, waveform conversion and a damping effect; the substrate layer is arranged on the inner side of the cavity layer to seal the cavity layer so as to absorb sound with a damping effect; wherein the composite material layer is electrically connected with an external shunt branch, and the shunt branch is formed by connecting a negative capacitance element, a resistance element and an inductance element in series.

A strain sensing structure and a fabricating method of the same are provided. The strain sensing structure includes a flexible substrate, strain resistor members, a first wiring layer and a second wiring layer. The flexible substrate has through holes which are distributed separately. The strain resistor members are respectively disposed in the through holes. The first wiring layer is stacked on an upper side of the flexible substrate and includes first wirings, where the first wirings are separate from each other. The second wiring layer is stacked on a lower side of the flexible substrate and includes second wirings, where the second wirings are separate from each other. Each strain resistor member is electrically connected to one of the first wirings and one of the second wirings, so that the strain resistor members form a series circuit through the first wirings and the second wirings.

A frame terminal 8 is bent so that its cross-sectional shape is an S-shape, and such that separation distances L1, L2 and L3 in a horizontal direction between an uppermost portion and a lowermost portion, in the vertical direction, of an end portion side face 21a of a resistance element 8 built into a mold divider 1, and a part substantially midway between an uppermost point and a lowermost point thereof, and the parts of the surface of the frame terminal 6 that correspond to these parts in the horizontal direction satisfy the relation L1>L2≥L3. As a result, in the mold divider 1, a space which is to be filled with a joining material and which has a non-uniform separation distance is formed between the frame terminal 6 and the end portion side face 21a, thereby making it possible to ensure the bonding strength between the resistance element 8 and the frame terminal 6.

The invention relates to sensing compositional information about material by measuring thermal properties of the material. In one arrangement there is provided a needle probe for sensing compositional information. The probe comprises a needle having a tip region. A resistive element is attached to the needle at the tip region. A measurement system is configured to: 1) drive an electrical current through the resistive element to apply heating to the resistive element, and 2) measure an electrical response of the resistive element to the heating. A processing unit analyses the measured electrical response of the resistive element to the heating to determine compositional information about material in contact with the tip region.

The invention relates to a temperature sensor for a ship engine, and the temperature sensor comprises a metal protection outer tube, a thermal resistor element, a high-temperature-resistant wire and a high-temperature signal cable, the metal protection outer tube is formed by sequentially connecting a first metal tube, a variable cross-section sleeve and a second metal tube, and the end part of the second metal tube is welded with a sealing connection end; the thermal resistance element is arranged at the end part of the first section of metal tube; the high-temperature-resistant wire extends to the sealing connecting end from the first section of metal pipe; one end of the high-temperature-resistant wire is welded with the thermal resistor element, the other end is welded with one end of the high-temperature signal cable, and the welding point is located in the sealing connection end; the interior of the temperature measuring end is filled with an inorganic insulating material. High-temperature inorganic glue is filled in gaps among the leads of the thermal resistor element and gaps among the high-temperature-resistant wires; and the sealing connecting end is filled with high-temperature insulating sealant. The sensor can bear vibration, impact, bumping, inclined swinging and the like with a certain margin, and has good mechanical performance.

To prevent solder wetting on a resistor formed of a high specific resistance material, that can be used in the applications for large current detection.SOLUTION: A multilayer resistor includes a resistor having a plate shape and including a first flat surface and a second flat surface in a thickness direction, and a first electrode formed on the first flat surface and a second electrode formed on the second flat surface. The resistor includes a metal body formed of an electroconductive metal material, and an insulating particle formed of an insulating material. The insulating particle includes a first insulating particle with a particle diameter of 5 μm or more. At the implementation on a printed board, an end surface of the resistor is exposed and the second electrode is connected through the solder.SELECTED DRAWING: Figure 1

A cooking appliance assembly includes a cooking appliance including a heat source and a port including a socket; at least one cooking accessory including an accessory sensor, a plug, and a resistive element, the plug being removably received within the socket; a variable resistance module provided within the cooking appliance and operably connected with the port; and a controller communicatively coupled with the cooking appliance and the at least one cooking accessory, the controller configured to perform an operation. The operation includes determining an accessory type of the cooking accessory engaged with the port of the cooking appliance; adjusting, via the variable resistance module, a reference resistance at the variable resistance module based on the determined accessory type; and selecting a corresponding temperature table or equation based on the determined type of the cooking accessory.

To realize changeover between a main control circuit and a backup circuit of a lighting control device with a simple circuit configuration.SOLUTION: A lighting control device 10 includes a main control circuit 12 and a backup circuit 13, for controlling a semiconductor switch 11. The backup circuit 13 includes: a first switch element 131 connected to a power supply; a first resistance element 132 connected between the first switch element 131 and an output terminal of the main control circuit 12; and a second resistance element 133 connected between the output terminal of the main control circuit 12 and a reference voltage terminal. Resistance values of the first resistance element 132 and the second resistance element 133 are set so that the main control circuit 12 changes over on / off of the semiconductor switch 11 with a priority higher than the backup circuit 13. If abnormality occurs in the main control circuit 12, an output impedance of the main control circuit 12 becomes higher and the on / off of the semiconductor switch 11 is changed over by the backup circuit 13.SELECTED DRAWING: Figure 1

A photoelectric conversion apparatus including a first substrate including a first semiconductor layer and a first wiring structure stacked on the first semiconductor layer, and a second substrate including a second semiconductor layer and a second wiring structure stacked on the second semiconductor layer, includes an avalanche photodiode arranged on the first semiconductor layer, a first resistive element arranged on the first substrate and connected to the avalanche photodiode, a waveform shaping portion arranged on the second semiconductor layer and configured to shape an output signal of the avalanche photodiode, and a second resistive element arranged on the first substrate and connected to the avalanche photodiode, the waveform shaping portion, and the first resistive element.

Reliability of a semiconductor device is improved. A resistance element and a trench form a closed path in plan view.The semiconductor device includes: first and second contact members each electrically connecting a gate pad and the resistance element; third and fourth contact members each electrically connecting a gate wiring and the resistance element; and fifth to eighth contact members each electrically connecting a first conductive member and the resistance element. A current path passing from the gate pad to the gate wiring through the first conductive member is made of the plurality of contact members and the resistance element. The first conductive member functions together with the fifth to eighth contact members to form a bypass path for reducing the current that flows through some sections of the closed path made of the resistance element.

Systems described herein include a battery pack including one or more battery cells and a first resistive element connected to a positive electrode of a first battery cell. The systems also include an external device capable of receiving the battery pack. The external device includes a second resistive element, a switch, and a controller. The second resistive element is configured to be in series with the first resistive element upon the battery pack being received within the external device. The switch is positioned in series with the second resistive element and a common potential is coupled to both the battery pack and the external device. The controller is configured to activate the switch, measure a voltage between the first resistive element and the second resistive element in response to the switch being activated, and determine an identification of the battery pack based on the measured voltage.

The present invention relates to a resistor unit (1, 1', 1''), comprising: at least one electrical resistor (10), at least one fluid-carrying cooling unit (30) on and / or in which at least part of the at least one electrical resistor (10) is arranged, at least one detection unit (3, 4, 5, 6, 7, 71, 72) and at least one evaluation device (40) that can be operatively connected to the at least one detection unit (3, 4, 5, 6, 7, 71, 72), the at least one detection unit (3, 4, 5, 6, 7, 71, 72) being configured to measure a variable that represents the temperature (TR) of the at least one electrical resistor (10) per se or in combination with a further detection unit (3, 4, 5, 6, 7, 71, 72) and that relates to an electrical property of the at least one electrical resistor (10) and / or to a property of a fluid flowing through the fluid-carrying cooling unit (30). The present invention additionally relates to a brake system and to a vehicle having such a resistor unit and to a method for estimating a temperature of the fluid-cooled electrical resistor.

To provide a solenoid valve capable of suppressing change of a valve opening due to temperature.SOLUTION: A solenoid valve 1 comprises: an electromagnetic coil 11; a plunger 17 that operates due to a magnetic field generated when a current is supplied to the electromagnetic coil 11; a valve unit 20 that is connected to the plunger 17, and adjusts a valve opening relative to a flow path according to the operation of the plunger 17; and an electrical adjustment unit 30 that adjusts the current supplied to the electromagnetic coil 11 using a resistive element whose resistance value varies depending on temperature.SELECTED DRAWING: Figure 1