277 results about "Laser ablation" patented technology

The invention relates to the field of electronic component manufacturing, in particular to an AIOT module board half-hole burr intelligent removing method based on laser ablation, and aims to solve the problems that an existing AIOT module board half-hole burr removing method is low in efficiency, a substrate is prone to being damaged, removing is uneven, intelligent recognition and precise adaptive capacity are lacked, control precision is low, and a real-time feedback mechanism is achieved. According to the method, intelligent identification, accurate positioning and three-dimensional quantification are carried out on micron-sized burrs through a high-precision visual detection technology in combination with deep learning; using an artificial intelligence algorithm to intelligently generate customized laser ablation parameters according to burr characteristics and material physical attributes; non-contact removal is executed through a precise laser ablation system in cooperation with an optimized scanning path; by the adoption of the technical scheme, non-contact, high-efficiency, high-precision and lossless intelligent removal of burrs can be achieved, and the product yield, the electrical performance and the manufacturing level are greatly improved.

The invention provides a multi-energy-field auxiliary laser drilling method and device for a silicon carbide micropore with the large depth-diameter ratio, and relates to the technical field of hard and brittle material precision machining.The multi-energy-field auxiliary laser drilling method for the silicon carbide micropore with the large depth-diameter ratio comprises the following steps that a silicon carbide workpiece is ablated layer by layer through an ultrafast laser beam to form the micropore; and in the layer-by-layer ablation process, the workpiece or the ultrafast laser beam generates relative high-frequency micro-amplitude ultrasonic vibration in the axial direction of the micropore, and the low-temperature high-speed air flow is coaxially guided to an ablation point of the ultrafast laser beam so as to remove ablation products and cool the ablation point and the adjacent area of the ablation point. Through organic combination and synergistic effect of ultrafast laser ablation, ultrasonic vibration in the axial direction of a drill hole and coaxial low-temperature high-speed airflow, the problems that in the prior art, due to unsmooth chip removal of ablation products and the remarkable heat effect, the machining depth is limited, the hole wall quality is poor, and the machining efficiency is low are solved.

The invention discloses a CARS-LA-ICP-MS combined multimode analysis system. The CARS-LA-ICP-MS combined multimode analysis system comprises a fusion light path module, a mass spectrometry gas path module, a three-dimensional mobile station, a CARS signal acquisition system and a computer control system, the fusion light path module comprises a laser source, an optical parameter amplifier, a light pulse time delay system, three dichroscopes, a light beam adjusting system, a galvanometer, a movable objective lens and a camera; the mass spectrometry gas circuit module comprises a carrier gas supply device, a multimode analysis sample cell and a mass spectrometry device; the multimode analysis sample cell comprises an upper cover, a lower cover and a side wall shell. On the other hand, the invention discloses an analysis method which comprises initialization setting, CARS analysis, mass spectrum analysis task parameter setting, laser ablation mass spectrum analysis and data synthesis. Through coaxial optical path design and an intelligent algorithm, deep fusion of chemical imaging and elemental analysis is realized, and a brand new research tool is provided for the fields of life science, material science and the like.

The utility model provides a laser ablation device which comprises a first laser light source used for emitting treatment laser; the optical splitter is arranged at the output end of the first laser light source and is used for splitting the treatment laser into multiple paths of split laser; wherein the branch lasers are arranged in rows and columns; the optical modulator is arranged at the output end of the optical splitter and is used for performing independent power regulation and control on each branch laser; the optical fiber coupler is arranged at the output end of the optical modulator and is used for coupling the branch lasers into the optical fiber branches of the optical fiber array one by one; the optical fiber array is connected between the optical fiber coupler and the focusing micro-lens array, and each optical fiber branch corresponds to one focusing micro-lens of the focusing micro-lens array; and the focusing microlens array is used for focusing the split laser onto the diseased tissue in space through focusing microlenses for ablation treatment. The technical scheme can be used for ablation treatment of various irregular pathological tissues, and damage to surrounding healthy tissues is avoided.

The invention discloses a low-loss preparation method of a single crystal diamond wafer. The low-loss preparation method comprises the following steps: A, carrying out laser ablation on the surface of a single crystal diamond crystal ingot; b, performing laser-assisted polishing on the surface; c, the ultrafast pulse laser is modulated into N modified light spots, all the modified light spots are made to scan at the corresponding depth positions according to a preset path at the same time, and a scanning face formed by the same modified light spot covers the cross section of the single crystal diamond crystal ingot in the 100 crystal face direction, n laser modified layers distributed in the direction perpendicular to the 100 crystal face in the single crystal diamond crystal ingot are formed after scanning; d, performing stress-induced separation on the monocrystal diamond crystal ingot; e, performing laser ablation on the cutting surface of the single crystal diamond wafer; and F, the cutting face is subjected to laser-assisted polishing. According to the low-loss preparation method of the single-crystal diamond wafer, the material loss of the single-crystal diamond crystal ingot can be reduced, and the wafer yield of the single-crystal diamond crystal ingot can be increased.

The invention relates to the technical field of flexible electronic sensors, in particular to a flexible large strain sensor for crack detection and a preparation method thereof.The flexible large strain sensor comprises a skeleton-shaped packaging layer, the packaging layer comprises two rigid fixing ends, and the two rigid fixing ends are integrally connected through a sensitive unit section; a rigid reinforcing structure is embedded in each rigid fixing end, mechanical fixing holes are formed in each rigid fixing end and the corresponding rigid reinforcing structure in a penetrating mode, interdigital capacitor electrodes are embedded in the sensitive unit sections, and the interdigital capacitor electrodes are made of flexible conductive materials through laser ablation. The end part of the interdigital capacitor electrode is connected with a flexible extension wire, the tail end of the flexible extension wire is connected with an external lead, and the external lead is embedded between the packaging layer and the upper surface of the rigid fixed end; the problems that an existing flexible sensor is unstable in installation, contradictory in measuring range and precision and poor in environmental adaptability in structural crack detection are solved.

Aspects of the present disclosure relate generally to systems and methods for use in the implementation and / or operation of quantum information processing (QIP) systems, and more particularly, to a technique for the fabrication of laser-ablation targets used in atomic sources for QIP systems that are based on atomic-based qubits.

Described herein is a robotic laser ablation system that comprises a robot and processing circuitry. The robot has an end effector with laser componentry and a camera mounted thereto. Processing circuitry is configured, in response to stored instructions, to perform operations including: receiving the input image of a workpiece from the camera; segmenting the input image to produce an image segment that depicts at least a portion of the workpiece; applying a surface-fitting algorithm to generate a polynomial surface that is fit to the surface in the image segment; computing a set of surface normal vectors across the polynomial surface to generate a set of waypoints offset from the polynomial surface by an offset length; programmatically generating a motion path linking a plurality of the waypoints; and performing laser ablation of the surface of the portion of the workpiece based on the motion path.

Embodiments of a surgical laser system comprise a laser source (102), a laser fiber (104), a photodetector (106) and a controller (108). The laser source is configured to generate laser energy (1 10). The laser fiber is optically coupled to the laser source and is configured to discharge the laser energy generated by the laser source. The photodetector is configured to generate an output signal (1 12) that is indicative of an intensity level of electromagnetic energy feedback (114) that is produced in response to the discharge of the laser energy. The controller is configured to control the laser source based on the output signal.

Reference materials with increased lithium content for direct elemental analyses, wherein the glass contains 55 to 75 wt.% SiO2, 7 to 15 wt.% Na2O, 6 to 15 wt.% CaO, up to 3.5 wt.% AI2O3, up to 3.5 wt.% K2O, and up to 12 wt.% Li2O, and the value of the relative standard deviation (RSD) of homogeneous element distribution in the glass, determined by inductively coupled plasma mass spectrometry combined with laser ablation (LA-ICP-MS), is less than or equal to 5%.

The invention relates to a method (100) for manufacturing a multilayer composite article (10) with an integrated conductor arrangement (20). It is proposed to integrate a laser radiation-reflecting reflector element (30) under a cover layer (13) of the multilayer composite article (10). The reflector element (30) thus defines a processing path along which the cover layer (13) can be reliably ablated by means of laser ablation.

The application discloses a device and a process for laser ablation induced controllable damage assisted grinding of hard and brittle materials, which adopts laser irradiation on the material surface, focuses the laser focal point on the material surface to be processed, removes and induces specific depth damage to the material by ablation. By controlling the laser power, scanning speed and ablation track, the degree and type of laser ablation induced thermal damage of the material are effectively controlled. The grinding path of the grinding wheel and the ablation path of the laser are controlled on the same axis, and the distance between the laser ablation and the grinding wheel grinding is set, and the workpiece ablation surface is ground under the preferred grinding parameters. The application systematically puts forward a quantitative control strategy for the degree of laser ablation damage of the material surface, removes the laser induced damage layer by accurate control of the material surface damage and precision grinding, and realizes high-efficiency and high-quality processing of the hard and brittle materials.

The utility model discloses an angle-adjustable laser-induced breakdown spectrum acquisition device which comprises an objective table, a support frame, an acquisition lens, an ablation angle adjusting assembly, an acquisition distance adjusting assembly and an acquisition angle adjusting assembly, the ablation angle adjusting assembly comprises a first rotary driving part arranged on one side of the supporting frame, and an output shaft of the first rotary driving part is fixed to the side wall of the objective table; the acquisition distance adjusting assembly comprises a linear moving mechanism arranged right above the objective table, and the moving end of the linear moving mechanism is connected with the acquisition lens; the acquisition angle adjusting assembly comprises a second rotary driving part and a connecting frame; in the laser paint removal spectrum monitoring process, spectrum characteristic signals can be obtained when the laser ablation angle, the collection angle and the collection distance serve as single variables, when any one of the spectrum collection angle, the ablation angle and the spectrum collection distance serves as a single factor variable, the other two are kept unchanged, and the spectrum characteristic signals are obtained. Therefore, the influence on the real value of the spectral characteristic signal is reduced.

A method and system for calculating the arrival time window of a plume at an analyzer is presented. The plume is generated from a tissue or geological sample by laser ablation. In some embodiments, external sensors measure ambient parameters such as temperature and pressure to more accurately calculate the arrival time window. In other embodiments, direct measurements of the plume's arrival time or non-contact measurements of the plume's flow velocity in a pipe are used to determine the arrival time window of the plume at the analyzer.

A method and apparatus for processing a slotted sleeve. The processing method includes the following steps: spiral slot ablation, where a laser head emits laser light radially from a cylindrical rod to ablate it; the laser head moves parallel to the axial direction of the cylindrical rod, which rotates around its central axis, and the laser ablates a spiral slot on the outer circumferential surface of the rod; slag blowing, where a nozzle of an air blowing device approaches the spiral slot and blows air onto the laser-ablated area within the slot, blowing the slag generated during laser ablation out of the spiral slot. The nozzle can move with the laser head. The nozzle of this air blowing device can blow the slag generated during the laser ablation process out of the spiral slot, allowing for a deep and unobstructed spiral slot. Furthermore, laser processing of deep slots eliminates the need to consider the strength of the cutting tool, resulting in high processing efficiency. Four nozzles can be moved back and forth, ensuring that slag is not blown into other nozzles when one nozzle blows air.

This invention relates to a processing method for high thermal conductivity polycrystalline silicon carbide wafers, comprising the following steps: grinding and thinning a CVD-prepared polycrystalline silicon carbide wafer to obtain a pre-treated wafer; performing a full-coverage ablation treatment on the surface of the pre-treated wafer using a picosecond laser to form a modified wafer with an amorphous surface modification layer; and polishing and cleaning the modified wafer to obtain the finished wafer. This method introduces a picosecond laser into the CMP front-end for laser ablation and surface modification of the polycrystalline SiC wafer, followed by rough and fine polishing using CMP. The results show that CMP time is reduced by more than 40%, significantly improving CMP efficiency and reducing costs, while ultimately achieving a surface roughness of 0.2 nm, meeting the requirements of sub-nanometer roughness and no subsurface damage.

This invention provides a cryo-laser ablation chamber for reflected light fluid inclusions, belonging to the field of geosciences for the analysis of the composition of single fluid inclusions. The device mainly consists of an outer shell, a cryo chamber, an ablation chamber, and a top cover. The cryo chamber, located at the bottom of the outer shell, is made of pure silver, and its top is mirror-polished and connected to a liquid nitrogen tank and pump via a Teflon hose. The ablation chamber, located above the liquid nitrogen chamber, has a standard sample mounting hole. The chamber is spindle-shaped and has inlet and outlet ports at both ends, connected to a carrier gas pipeline. The top cover is equipped with a calcium fluoride glass viewing window, allowing 193nm laser light to pass through. This invention uses a silver cryo chamber to ensure the required cooling effect; simultaneously, the mirror design at the top of the cryo chamber converts the light emitted by the reflected light microscope into transmitted light, thus enabling precise observation and positioning of the fluid inclusions under test without relying on conventional transmitted light systems.

A method for processing a workpiece by laser ablation includes: a) preparing a mask having at least one transparent pattern segment and at least one light-shielding pattern segment, the transparent pattern segment and the light-shielding pattern segment being along a pattern edge corresponding to a main scanning direction, b) scanning a line-shaped laser beam over the mask; c) projecting a pattern beam that passes through the mask onto a workpiece by using a projection optical system; and d) processing a processing area in the workpiece. The width or size of the transparent pattern segment and the light-shielding pattern segment are smaller than a resolution depending upon a wavelength of the line-shaped laser beam and a numerical aperture of the projection optical system.

A method includes removing an oxide layer from select areas of a surface of a metal structure of a lead frame to create openings that extend through the oxide layer to expose portions of the surface of the metal structure. The method further includes attaching a semiconductor die to the lead frame, performing an electrical connection process that electrically couples an exposed portion of the surface of the metal structure to a conductive feature of the semiconductor die, enclosing the semiconductor die in a package structure, and separating the electronic device from the lead frame. In one example, the openings are created by a laser ablation process. In another example, the openings are created by a chemical etch process using a mask. In another example, the openings are created by a plasma process.

The application relates to the technical field of isotope detection, in particular to an isotope abundance and ratio detection device and method based on molecular emission spectrum. The device comprises a computer and a long-pulse laser unit, an optical path transmission unit, an LED illumination focusing unit, a three-dimensional displacement table and a spectrometer connected with the computer. The existing viewpoint considers that long-pulse laser is not conducive to micro-area excitation and high-resolution spectrum acquisition due to its wide pulse width, and is less applied in isotope subtle spectral line difference identification. The application breaks through the molecular emission cascade mechanism, enhances the signal intensity, realizes the possibility of micro-area high-resolution isotope molecular detection, generates plasma by in-situ laser ablation, induces molecular emission spectrum, realizes rapid, accurate and real-time in-situ detection of the isotope abundance and ratio in the sample. The device has few optical elements, simple structure and convenient optical path adjustment, and is conducive to miniaturization and on-site application promotion.

The present invention relates to a method for treating a surface (10a) of a part (10) of an implantable medical device (1), the method comprising the steps of: providing the part (10), the part (10) comprising a surface (10a) comprising titanium, exposing the surface to a gas (G) containing nitrogen, and applying laser light (L) to the surface (10a) to create a titanium nitride (TiN) layer (11) on the surface (10a) having an increased double layer capacitance compared to the untreated surface (10a).

We provide a laser ablation system equipped with a robot and processing circuitry. [Solution] The robot has an end effector having a laser component and a camera. The circuit receives an input image of a workpiece from the camera in response to a memory command, segments the image to generate image segments that depict the workpiece, applies a surface fitting algorithm to generate a polynomial surface that fits the inner surface of the segments, calculates a set of surface normal vectors crossing the surface to generate a set of waypoints offset from the polynomial surface, programs a motion path connecting the multiple waypoints, and performs operations including laser ablation of the workpiece surface based on the motion path.

The invention discloses a PCB (printed circuit board) circuit laser ablation method. The PCB circuit laser ablation method comprises the following steps: drilling holes in a copper-clad plate; carrying out full-board electroplating on the drilled copper-clad plate, and forming an electroplating copper layer on the surface of the copper foil and the hole wall; forming a tin protection layer on the surface of the electroplating copper layer; ablating the tin protection layer by adopting laser to remove the tin protection layer in a non-circuit pattern area in the PCB design, and at least partially exposing the electroplating copper layer below the tin protection layer; etching the exposed copper layer to expose the dielectric layer; and removing the residual tin protection layer to form a PCB circuit pattern. The indispensable photosensitive dry film in the traditional negative film and positive film process and matched film pasting, exposure and development procedures are abandoned. Therefore, not only is the material cost generated by using the dry film directly eliminated, but also hidden quality dangers such as open circuit and short circuit of a circuit caused by damage of the dry film in the processing process are avoided, so that the product yield is remarkably improved.

The application discloses a method for obtaining a graphitized in-situ antenna by ablation of a diamond surface and application thereof, and aims at solving problems of a current microwave antenna, such as great interference from external factors and poor system integration. The method for obtaining the graphitized in-situ antenna comprises the following steps: firstly, cleaning a diamond substrate; secondly, spin-coating a photoresist on the surface of the cleaned diamond substrate, performing photoetching according to an antenna pattern, and then immersing the photoresist in a developing solution to form a mask; opening a radio frequency power supply to input energy of 50-100 W to ignite plasma, and then opening a baffle to deposit a transition metal film; and finally, placing the diamond substrate into a quartz glass tube to perform vacuum sealing, and performing high-temperature heating treatment. The application further relates to a method for obtaining a graphitized in-situ antenna by laser ablation. The application obtains a graphitized antenna pattern by using a transition metal high-temperature catalytic etching or laser ablation on the surface of the diamond, and the antenna can better reduce interference from external factors and improve integration.

The invention discloses a selectively doped TOPCon solar cell and a preparation method thereof, and belongs to the technical field of photovoltaics. In order to solve the problems of'contact-recombination 'contradiction and difficult process adjustment existing in the uniform doping of the front surface of the existing TOPCon battery, the invention proposes to divide an emitter region on the front surface of the battery into a metal contact region and a non-metal contact region. According to the preparation method, after conventional boron diffusion, high doping of a metal contact area and non-doping of a non-metal contact area are realized through three procedures of laser ablation, selective texturing and thermal oxidation in sequence. According to the structure, the metal contact resistance is effectively reduced, meanwhile, doping induced recombination of carriers in an illumination area is thoroughly eliminated, and the conversion efficiency of the cell is improved by more than 0.2%. In addition, the structure is better in compatibility with low-silver-content paste, the silver paste cost can be greatly reduced, the production process is simplified, and the process stability is improved.

The application discloses a variable parameter laser ablation effect fast prediction method based on a finite element model and a neural network model, and solves the problems of limited application scenarios, limited application material ranges and insufficient real-time performance in the prior art. The application obtains simulation data (i.e. a second data set) through a laser ablation effect finite element model, trains and tests a neural network model through the simulation data, obtains an optimal neural network model, and then obtains corresponding data of a material to be measured according to actual working conditions, sets a calculation time step and a laser irradiation time, combines the optimal neural network model, and realizes real-time prediction of the laser ablation effect, so that the calculation precision is high, the time consumption is short, and the method is suitable for fast prediction of the laser ablation effect in a strong dynamic scene.

Aspects of the present disclosure relate generally to systems and methods for use in the implementation and / or operation of quantum information processing (QIP) systems, and more particularly, to a technique for the fabrication of laser-ablation targets used in atomic sources for QIP systems that are based on atomic-based qubits.

The invention provides a variable-depth multi-step ablation inhibition method for CO2 laser ablation knife lines of a fused quartz element, and belongs to the field of laser processing of optical elements. The invention aims to solve the problems that medium-frequency ripples are generated during conventional ablation of a fused quartz element, namely high processing knife lines influence the light transmission, and the service performance of a functional microstructure and the surface quality of a processing element are greatly influenced. According to the method, a processing strategy of gradually decreasing the ablation depth and a dislocation processing method adopted in each step of ablation processing are adopted, so that the height of the ablated knife lines on the processed surface of the fused quartz element can be effectively reduced, the surface roughness after processing is further reduced, the light transmission performance and the light transmission performance of a processed microstructure are improved, and the quality of the processed fused quartz element is ensured.

The application discloses a groove machining method. The groove machining method is specifically characterized in that, in the process that a laser beam and an air jet act on the surface of a workpiece to be grooved, a water jet is applied to the surface of the workpiece, the water jet is in an inclined posture with respect to the direction perpendicular to the surface of the workpiece, and the impact point of the water jet is spaced apart from the action point of the laser beam. The water jet offset from the laser beam by a certain offset distance is obliquely incident on the surface of the workpiece at a suitable angle, and a flowing water film is formed on the surface, which collides with the air jet to form a plume. The laser scanning direction needs to be opposite to the direction of the water jet, so that the impact point of the water jet is always on the surface of the workpiece, thereby ensuring the stability of the water film. The molten and gasified material generated by ablation of the workpiece can be removed along with the plume, and correspondingly, the heat generated by laser ablation can also be effectively taken away by the high-speed plume, thereby forming a nearly non-heat-damaged groove.

The invention discloses a hybrid passivation back contact cell and a production method thereof, and relates to the field of solar cells. The preparation method comprises the steps of silicon wafer polishing; sequentially depositing a tunneling oxide layer and a doped polycrystalline silicon layer on the back surface of the polished silicon wafer; a P region and an N region in future are defined on the doped polycrystalline silicon layer on the back surface of the silicon wafer through laser ablation; performing acid polishing treatment on the front surface of the silicon wafer; performing alkali texturing treatment on the front surface of the silicon wafer; depositing a passivation layer on the front surface of the silicon wafer; cleaning the back of the silicon wafer; an intrinsic microcrystalline silicon layer and a doped microcrystalline silicon layer are sequentially deposited on the back surface of the silicon wafer; carrying out laser ablation treatment on intrinsic and P-type microcrystalline silicon on an N-region contact region on the back surface of the silicon wafer, and exposing the N + doped polycrystalline silicon layer under the intrinsic and P-type microcrystalline silicon; depositing a TCO layer; laser ablation is carried out on the upper portion and the periphery of the polished lamination area of the N area and the P area, and an isolation ring groove is formed; the TBC passivation advantage is reserved, meanwhile, the technological process is simplified through laser patterning, and the efficiency bottleneck is broken through P-region intrinsic microcrystalline silicon and boron-doped microcrystalline silicon.