640 results about "Laser ablation" patented technology

A method for ultraviolet-laser transfer and cleaning of microelectronic devices includes transferring a microelectronic device from a donor substrate to a receiver substrate, and cleaning the microelectronic device after transfer. Prior to transfer, the microelectronic device is coupled to the donor substrate via a sacrificial layer containing gallium. A first ultraviolet laser beam ablates the sacrificial layer to release the microelectronic device from the donor substrate, leaving behind a gallium residue on the newly exposed surface of the microelectronic device. A second ultraviolet laser beam ablates the gallium residue to clean the microelectronic device. The first and second ultraviolet laser beams may be generated by the same ultraviolet laser. As compared to liquid etching, laser ablation of the gallium residue eliminates a wet-chemistry step and may be performed by the same laser apparatus used for transfer. Laser cleaning is particularly advantageous when the receiver substrate is intolerant to liquid etching.

The invention discloses a method for manufacturing a rigid-flex printed circuit board with a surface flexible layer, which comprises the following steps of: taking a double-sided flexible copper-clad plate, manufacturing a through hole and electroplating, and then manufacturing a circuit pattern to form a pattern plate; manufacturing a first windowing covering film for windowing corresponding to the golden finger area and covering the through hole and a second windowing covering film for windowing corresponding to the through hole and the ineffective area, respectively attaching the first windowing covering film and the second windowing covering film to the two surfaces of the pattern board, and then carrying out electrometallization to form a flexible core board; taking a rigid copper-clad plate, windowing the rigid copper-clad plate corresponding to the flexible layered area, and then manufacturing a circuit pattern to form a rigid core plate; stacking and laminating the structures to form a laminated plate; drilling and electroplating are carried out on the laminated plate, then laser ablation is carried out on a through hole area, and the rigid-flexible combined plate is formed through post-process processing; by forming a new processing flow, the defects of low adaptability, processing precision and reliability of a traditional rigid-flex printed circuit board manufacturing method are systematically solved, and high-precision processing of the rigid-flex printed circuit board with high integration level is formed.

The system can include a detection model; an optional camera system; and an optional control system. The system can function to detect plants within a field. Additionally, the system can function to facilitate an agriculture operation(s) based on the positions of plants within the field. Variants of the system can be configured to (autonomously) perform and / or facilitate agriculture operations which can include: agent dispersal (e.g., solid agent dispersal), fluid spraying, crop imaging (e.g., crop data collection), side dressing, weeding (e.g., mechanical actuation, targeted laser ablation, etc.), harvesting, planting, tilling, fertilizing, irrigating, and / or any other suitable operation(s). Variants of the system and / or method can be used to facilitate detection and / or agriculture operations for single crops, multi-crops (e.g., crop doubles, where agriculture operations may be based on stem proximity), ground cover plants, weeds, and / or agriculture operations in any other suitable scenarios.

The invention discloses a biaxial flexible strain sensor based on laser induced graphene. Comprising a flexible substrate, a flexible sensitive layer, a flexible spacing layer and a flexible upper cover, both the flexible substrate and the flexible upper cover are made of a polydimethylsiloxane (PDMS) material, the flexible sensitive layer is generated on a mixed substrate of polyimide (PI) and multi-walled carbon nanotubes (MWCNTs) through a laser ablation process, and then the sensitive layer is transferred to the PDMS substrate through a substrate transfer process. The flexible sensitive layer adopts an I-shaped structure, and two ends of the flexible sensitive layer are coated with electrode layer external wires. The method can be applied to the fields of wearable electronic equipment and medical monitoring. By means of the I-shaped structure, the sensitive layers in different directions can detect the strain in the main direction, and meanwhile interference caused by the strain in different directions is avoided. The preparation method is simple and efficient, a special gas environment is not needed, patterning preparation of graphene can be completed only through one step, and the production cost is reduced.

The invention belongs to the technical field of nickel-based single-crystal superalloy materials, and provides a nickel-based single-crystal superalloy and a strengthening method thereof, and the method comprises the following steps: cleaning and drying the nickel-based single-crystal superalloy to be strengthened; strengthening parameters and a shock strengthening path are set, and the nickel-based single crystal high-temperature alloy is subjected to absorption-layer-free laser shock strengthening; the strengthened nickel-based single crystal high-temperature alloy is cleaned and dried; polishing parameters and a polishing path are set, femtosecond laser oblique incidence polishing is conducted on the strengthened area of the nickel-based single crystal superalloy, and surface ablation is removed; the polished nickel-based single crystal high-temperature alloy is cleaned and dried; according to the method, the nickel-based single crystal superalloy is strengthened by adopting an absorption-layer-free laser shock strengthening mode, and femtosecond laser oblique incidence polishing is adopted, so that the procedures of pasting and removing an absorption layer for multiple times are avoided, the processing efficiency of laser shock strengthening is improved, and deterioration of the surface quality of a material caused by laser ablation is avoided.

The invention relates to the technical field of chip embedded module packaging, in particular to a blind hole processing method and a substrate. An embedded chip substrate is prepared, a chip is embedded in the embedded chip substrate, and the chip is covered with an insulating layer; determining a hole opening position on the insulating layer, wherein the hole opening position corresponds to the embedding position of the chip on the chip embedding substrate; laser ablation is conducted on the hole opening position through ultraviolet laser according to preset laser parameters, so that an initial blind hole is machined in the hole opening position; and performing residue removal processing on the initial blind hole through plasma equipment to obtain a target blind hole. Therefore, the initial blind hole is machined in the hole opening position through the ultraviolet laser, molecular bonds can be directly destroyed, cold ablation is achieved and thermal damage is reduced on the basis of the characteristic that photon energy of the ultraviolet laser is high, meanwhile, the target blind hole with the smooth hole wall can be obtained by conducting residue removing treatment on the initial blind hole through plasma equipment, and the hole opening precision is improved. Compared with the prior art, high-precision and high-quality machining of the blind hole is achieved.

The invention discloses a method for manufacturing a surface flexible layer rigid-flexible combined board for an intelligent video module, which comprises the following steps of: taking a double-sided flexible copper-clad plate, and windowing a first surface copper layer corresponding to a first via hole to form a flexible core board; taking the first cover film and windowing corresponding to the first via hole to form a windowing cover film; correspondingly attaching the windowing covering film to one side of the second copper layer of the flexible core plate to form a covering film core plate; taking a prepreg, manufacturing a glue-blocking film corresponding to a flexible area of the prepreg, forming a glue-blocking prepreg, and manufacturing a rigid core plate; sequentially stacking and laminating the plates from top to bottom, enabling the glue blocking film to face the covering film core plate, then manufacturing a through hole in the rigid region, performing laser ablation on an insulating medium layer corresponding to a copper layer windowing pattern, electroplating, performing uncovering processing, removing a second copper layer at the bottom of a blind hole, forming a first via hole, and performing molding to form the rigid-flexible combined plate. The metallization process of the flexible area and the metallization process of the rigid area are combined into one-time electroplating, so that the consistency of the thickness of a copper plating layer is ensured.

The invention relates to the technical field of laser cleaning processing, and particularly discloses a real-time monitoring method for laser cleaning of a carbon fiber composite material. An optical coherence tomography (OCT) detection unit and a sensor module are innovatively adopted to form a real-time monitoring system, and according to the surface treatment requirement of the carbon fiber composite material, a temperature sensor in the sensor module is used for collecting a heat radiation signal of a laser irradiation area in real time, and the surface layer temperature of a base material during machining is monitored in real time; the distance between a machining head and a base material is dynamically tracked through a laser ranging module in the sensor module, the OCT detection unit obtains micron-sized surface topography characteristics through frequency domain interference signal analysis, and surface roughness parameters are synchronously calculated. The data of the three channels are fused through the edge calculation module and then fed back in real time through the displayer, and the temperature field, the roughness and the focal length are effectively monitored in the cleaning process. According to the method, damage to the base material due to factors such as laser ablation can be avoided, the operation time is effectively shortened, and the operation efficiency is improved.

The invention relates to the technical field of laser micromachining, in particular to a laser ablation titanium alloy numerical simulation method based on a plasma shielding effect. In order to solve the problems that the precision and efficiency of an existing laser processing and manufacturing micro-nano structure are low, the plasma shielding effect is not fully considered in a simulation model and the like, two-dimensional and three-dimensional models are constructed by means of COMSOL Multiphysics software. According to the model, the plasma shielding effect is fully considered, a laser energy transfer equation is corrected, and the molten pool behavior and surface topography forming process is simulated by combining mass, momentum and energy conservation equations. A laser ablation process is accurately simulated by setting a heat source and boundary conditions, applying a level set method, considering various effects and calculating plasma related parameters. And inputting different laser parameters to simulate and analyze the influence on the groove morphology, and comparing an experiment with a simulation result to correct the model. Simulation precision is improved, laser processing parameters can be optimized, cost is reduced, universality is high, theoretical guidance can be provided for laser processing of various metal materials, and the laser processing technology is promoted to be developed in multiple fields.

The application discloses IC chip laser ablation printing equipment and relates to the field of chip letter removing processing. The equipment comprises a top base, the bottom of the top base is installed at the top of a receiving box, and a vibrating disc feeding module is sequentially installed at the top of the top base from left to right. The equipment further comprises a material taking manipulator, a laser ablation module, a cleaning module, an ink jet module, a drying module and a double-track moving and carrying module. The laser ablation module is used for laser ablation operation on the chip, thereby assisting in laser ablation cleaning of the letters on the surface of the chip. The cleaning module is used for assisting in cleaning of the particulate matter generated by ablation on the surface of the chip. The laser ablation replaces manual polishing or chemical corrosion to remove the letters, the uniformity of the letter removal is ensured through the precisely controllable light spot energy distribution of the laser, the laser letter removal is non-contact, the chip is not mechanically damaged, the laser letter removal has become a mainstream selection due to high precision and stability, the self-defined ablation depth can be realized, and no additional damage is caused to the IC chip.

The invention discloses a laser cleaning method for a magnesium-based foil, and belongs to the technical field of magnesium ion battery manufacturing. According to the laser cleaning method for the magnesium-based foil, the magnesium-based foil is magnesium foil or magnesium alloy foil, and the method comprises the following steps that laser cleaning is conducted on the magnesium-based foil through a laser device, and a laser beam conducts 45-degree cross filling path scanning on the surface of the magnesium-based foil; monitoring a plasma spectral line of laser ablation in real time by using a plasma spectrometer; based on the dynamic change of the magnesium characteristic plasma spectral line intensity, the cleaning parameters of the laser are adjusted; and after cleaning is completed, an oxide layer on the surface of the magnesium-based foil is removed. 45-degree cross filling path scanning is adopted, heat accumulation of a repeated scanning area can be reduced, during 45-degree cross filling, adjacent scanning lines cover in a cross mode, heat distribution is more uniform, heat of the scanning area can be reduced, and therefore the problems of local overheating and negative plate perforation or structural damage caused by too high energy are avoided.

The invention relates to a diagnosis and treatment integrated endoscopic catheter, and belongs to the technical field of medical instruments. The endoscopic catheter comprises a catheter probe, an imaging assembly and an ablation assembly. A first accommodating space and a second accommodating space are formed in the catheter probe, the first accommodating space is formed in the middle of the catheter probe in the axial direction, and the second accommodating space is formed in the catheter wall of the catheter probe in the axial direction; the imaging assembly is placed in the first accommodating space, laser beams emitted by the imaging assembly are emitted to one side of the second accommodating space, and an imaging area is formed after the laser beams are absorbed by the imaging tissue; the ablation assembly is placed in the second containing space, the laser emitting end face of the ablation assembly is an inclined face, the emitted ablation laser beams are emitted out along the inclination angle of the inclined face, laser ablation is directly conducted on the focus area of the imaging area, and the diagnosis and treatment integrated endoscopic catheter achieves integrated miniaturization integration of the imaging function and the ablation function.

The invention relates to a stretchable and wearable crop sensor and a preparation method thereof, and belongs to the technical field of sensors. According to the sensor, a flexible substrate is coated with a graphene layer, the sensor has good tensile strain capacity by means of a flexible material, then the graphene layer is subjected to laser ablation to construct a preset number of hollow-out areas, and the graphene layer forms a net-like structure by means of the hollow-out areas, so that the detection sensitivity and precision of the sensor are remarkably improved; and the tensile strain resistance of the graphene layer is improved, and the whole flexible sensor with high sensitivity and high stability is formed. Meanwhile, compared with an existing flexible sensor prepared by weaving a conductive fiber net, the sensor preparation method disclosed by the invention has the advantages that the performance is similar, but the preparation difficulty and the preparation cost are remarkably reduced, so that the use scene of crop detection which needs a large number of sensors can be better met; the technical problems that a current flexible sensor with high sensitivity and high stability is complex in preparation and too high in cost are solved.

The invention discloses an LIBS (laser-induced breakdown spectroscopy) heterogeneous sample detection and analysis system and method based on 3D (three-dimensional) mapping. The system comprises a laser spectrum emission device for providing carrier waves required by LIBS, and a sample positioning and ablation point control and adjustment device for adjusting a heterogeneous sample detection position and accurately positioning a laser ablation position, the sample positioning and ablation point control adjusting device comprises a 3D scanning mechanism used for scanning the surface of a heterogeneous sample to obtain a three-dimensional model of the sample, and an electronic adjustable lens used for receiving laser emitted by the laser spectrum module and adjusting the focusing position. The electronic adjustable platform is used for adjusting an ablation point on the surface of the sample in cooperation with the electronic adjustable lens, LIBS and space mapping are combined, accurate detection and analysis of all position areas on the surface of the irregular heterogeneous sample are achieved through the electronic adjustable platform and the electronic adjustable lens, the consistency of laser focusing at all positions can be guaranteed, and the detection accuracy is improved. The accuracy of detection and analysis data is ensured.

The invention relates to the field of electronic component manufacturing, in particular to an AIOT module board half-hole burr intelligent removing method based on laser ablation, and aims to solve the problems that an existing AIOT module board half-hole burr removing method is low in efficiency, a substrate is prone to being damaged, removing is uneven, intelligent recognition and precise adaptive capacity are lacked, control precision is low, and a real-time feedback mechanism is achieved. According to the method, intelligent identification, accurate positioning and three-dimensional quantification are carried out on micron-sized burrs through a high-precision visual detection technology in combination with deep learning; using an artificial intelligence algorithm to intelligently generate customized laser ablation parameters according to burr characteristics and material physical attributes; non-contact removal is executed through a precise laser ablation system in cooperation with an optimized scanning path; by the adoption of the technical scheme, non-contact, high-efficiency, high-precision and lossless intelligent removal of burrs can be achieved, and the product yield, the electrical performance and the manufacturing level are greatly improved.

The invention provides a method for improving passivation contact performance of a p region of a TBC battery, which comprises the following steps of: pretreating an n-type monocrystalline silicon wafer, depositing a SiO2 layer and boron (B) doped polycrystalline silicon (poly-Si), etching, performing laser ablation and the like, then depositing phosphorus (P) doped poly-Si, and finally depositing a passivation and anti-reflection layer and preparing a metal electrode. A tunneling oxide layer and boron in-situ doped polycrystalline silicon are deposited in a p region by adopting an ultra-low temperature plasma enhanced chemical deposition (PECVD) mode, the reaction of SiH4 and N2O is introduced to improve the deposition effect of the oxide layer at low temperature, the compactness of a film layer at low temperature is ensured to improve the separation of B on a SiO2 / c-Si interface, and the passivation performance is improved; b doping poly-Si is adopted in the p region, meanwhile, processing is matched with a nanosecond laser, non-equilibrium doping of the B to the poly-Si is achieved, the ultrahigh doping concentration is obtained, the p region passivation performance of the TBC is improved, and then the open-circuit voltage and the conversion efficiency of the TBC battery are finally improved.

An optical fiber combining-coupled ultraviolet laser ablation system, comprising a laser (1), a light homogenizing assembly (2), and an optical fiber combining assembly (3). The laser (1) is used for emitting laser light. The light homogenizing assembly (2) is arranged on an emergent light path of the laser light. The optical fiber combining assembly (3) is arranged on an emergent light path of the light homogenizing assembly (2). The light homogenizing assembly (2) is used for performing beam flat-top shaping and beam superposition on the laser light to obtain a target light spot. The optical fiber combining assembly (3) is used for performing multi-beam transmission on the target light spot, so that laser ablation can be efficiently and stably achieved.

The invention provides a multi-energy-field auxiliary laser drilling method and device for a silicon carbide micropore with the large depth-diameter ratio, and relates to the technical field of hard and brittle material precision machining.The multi-energy-field auxiliary laser drilling method for the silicon carbide micropore with the large depth-diameter ratio comprises the following steps that a silicon carbide workpiece is ablated layer by layer through an ultrafast laser beam to form the micropore; and in the layer-by-layer ablation process, the workpiece or the ultrafast laser beam generates relative high-frequency micro-amplitude ultrasonic vibration in the axial direction of the micropore, and the low-temperature high-speed air flow is coaxially guided to an ablation point of the ultrafast laser beam so as to remove ablation products and cool the ablation point and the adjacent area of the ablation point. Through organic combination and synergistic effect of ultrafast laser ablation, ultrasonic vibration in the axial direction of a drill hole and coaxial low-temperature high-speed airflow, the problems that in the prior art, due to unsmooth chip removal of ablation products and the remarkable heat effect, the machining depth is limited, the hole wall quality is poor, and the machining efficiency is low are solved.

Described is a laser ablation system arranged to dynamically adjust power output to provide increased stability and reduced fluctuations of emitted energy. Additionally described are a test catheter and calibration procedure for calibrating the laser ablation system for to dynamically adjust power output during an ablation procedure.

The invention discloses a laser ablation and parameter optimization system and method for a hemispherical harmonic oscillator. The system comprises a laser, a control system, a frequency difference test module, a vacuum cavity, and an electric rotating base, a working platform, a vibration test clamp, an electric control excitation hammer and a vibration stopping damper which are arranged in the vacuum cavity, the working platform is mounted on the electric rotating base; the vibration stopping damper, the vibration testing clamp and the electrically-controlled excitation hammer are all installed on the working platform. By means of the parameter optimization method of the ablation system, the fitting matching degree is judged according to experimental samples added in real time, and the fitting function is dynamically updated. Laser trimming parameters are determined according to the fitting function, the accuracy of the ablation amount is guaranteed, and the trimming efficiency and convergence are improved. The method is widely suitable for the size of the harmonic oscillator, and provides technical support for engineering development of the high-precision hemispherical harmonic oscillator.

A laser-splittable structures (for example, semiconductor wafers), methods for making a laser-splittable structure, systems for laser splitting a structure, and methods for laser splitting a structure. As non-limiting examples, various aspects of this disclosure provide laser-splittable semiconductor wafers, laser-splittable structures (for example, semiconductor wafers), methods for making a laser-splittable structure, systems for laser splitting a structure, and methods for laser splitting a structure, where the laser-splittable structure comprises a first layer characterized by a first laser ablation threshold, and a second layer characterized by a second laser ablation threshold that is less than the first laser ablation threshold.

A method for preparing a surface of a workpiece includes selecting a target area on the surface of the workpiece for ablation in a multi-pass approach using an ultraviolet laser scanner and performing four ablation passes of the target area with the ultraviolet laser scanner in a pulsed mode. Each ablation pass includes a start leg, a shift and a return leg. Another method for preparing a surface of a workpiece includes selecting a target area on the surface of the workpiece for ablation in a multi-pass approach using an ultraviolet laser scanner and performing a first ablation pass of the target area with the ultraviolet laser scanner in a pulsed mode. The first ablation pass includes a first start leg, a first shift and a first return leg. A laser ablation system for preparing a surface of a workpiece includes a computing device and an ultraviolet laser scanner.

The invention relates to the technical field of mineral defect screening, and particularly discloses an intelligent mineral defect screening method and system based on knowledge graph embedding, and the method comprises the steps: carrying out the three-dimensional grid division of a target mining area according to a rock stratum structure, building a mining area defect screening reference unit model, and obtaining the three-dimensional grid data of a mining area defect screening reference unit; an unmanned aerial vehicle group carrying an LIBS probe and a broadband microphone array carries out LIBS laser ablation on each three-dimensional grid, plasma emission spectrum values and sound wave oscillation signals are synchronously collected, and a multi-dimensional mineral response data set of each three-dimensional grid is obtained; sound wave signal feature decoupling analysis is conducted on the multi-dimensional mineral response data set, and crystal distortion feature parameters of all the three-dimensional grids are extracted; and the mineral defect evaluation coefficient of each three-dimensional grid is predicted, so that the operation efficiency of the mining area is improved, the development of the mining industry towards the digital and intelligent directions is promoted, and the sustainable development requirement of the modern mining industry is met.

The invention relates to the technical field of unmanned aerial vehicles, in particular to a laser ablation countering unmanned aerial vehicle internal temperature field analysis test method and device. The test method comprises the following steps: preparing a test device image; carrying out a laser ablation countering unmanned aerial vehicle test; performing finite element simulation on the laser ablation countering unmanned aerial vehicle test; adjusting the grid size of finite element simulation and COMSOL software parameters to enable the test temperature-time curve to be matched with the simulation temperature-time curve, and exporting a temperature-time simulation curve of key points in the fuselage; and combining a laser ablation countering unmanned aerial vehicle test and finite element simulation to analyze the relationship between the heat flow field in the unmanned aerial vehicle body and the flight attitude. According to the method, a laser ablation countering unmanned aerial vehicle test and finite element simulation are combined, the effectiveness of a finite element technology is verified through test and simulation comparison, and analysis of a heat flow field in a complex fuselage is achieved.

The invention discloses a CARS-LA-ICP-MS combined multimode analysis system. The CARS-LA-ICP-MS combined multimode analysis system comprises a fusion light path module, a mass spectrometry gas path module, a three-dimensional mobile station, a CARS signal acquisition system and a computer control system, the fusion light path module comprises a laser source, an optical parameter amplifier, a light pulse time delay system, three dichroscopes, a light beam adjusting system, a galvanometer, a movable objective lens and a camera; the mass spectrometry gas circuit module comprises a carrier gas supply device, a multimode analysis sample cell and a mass spectrometry device; the multimode analysis sample cell comprises an upper cover, a lower cover and a side wall shell. On the other hand, the invention discloses an analysis method which comprises initialization setting, CARS analysis, mass spectrum analysis task parameter setting, laser ablation mass spectrum analysis and data synthesis. Through coaxial optical path design and an intelligent algorithm, deep fusion of chemical imaging and elemental analysis is realized, and a brand new research tool is provided for the fields of life science, material science and the like.

The invention discloses a control method for robot-assisted laser in-situ windowing, which comprises the following steps: receiving an execution instruction sent by a main control end through a robot catheter system, sending a laser fiber into a target artery, and enabling the laser fiber to be in accurate contact with a stent covering film; a laser energy closed-loop control subsystem is combined to accurately ablate holes in a stent covering film through a photochemical effect and a photothermal effect, and laser windowing is achieved; in the laser windowing process, the thickness of the blood vessel wall is measured in real time based on optical coherence tomography, and the laser ablation process is detected based on photoacoustic monitoring, so that the laser power is dynamically adjusted, and it is ensured that the thermal damage range in the laser windowing process is smaller than 200 microns. Therefore, accurate creation of the channel between the aortic dissection false cavity and the true cavity is achieved, hemodynamic balance is recovered, the operation accuracy is improved, and the risk of complications in the perioperative period is reduced.

A method for forming a bore for a cavity within a semiconductor layer stack. The method includes forming a first partial bore using a first laser ablation step starting at an outer surface of the stack so that the first partial bore extends with a first mean dimension and aligned in parallel with the outer surface, starting from the outer surface, and a bottom surface of the first partial bore lying between the outer surface and the cavity, and forming a second partial bore using a second laser ablation step started from the bottom surface of the first partial bore so that the second partial bore extends with a second mean dimension, aligned in parallel with the outer surface and is smaller than the first mean dimension, through the bottom surface into the cavity or an access channel opening at the cavity or connected to the cavity.

The invention discloses a laser ablation and milling collaborative processing system and method for hard and brittle materials. The system comprises a machine tool milling system, a laser ablation system and a cooperative control device, the laser ablation system carries an ablation mechanism through a six-degree-of-freedom mechanical arm, the cooperative control device generates cooperative data based on a machining program, and cooperative machining with advanced laser ablation and lagged milling is achieved. According to the method, the milling lag time interval is calculated through the Newton's law of cooling, a laser ablation track is generated by combining G code analysis, a non-ablation section is added, and the machining safety and precision are ensured in cooperation with a visual obstacle avoidance module, a laser focusing adjustment module and other modules. According to the system and the method, the problems of cutter abrasion, low efficiency, difficulty in thermal damage control and the like in hard and brittle material processing are solved, high-efficiency, high-precision and low-damage processing is realized, the complex molded surface processing requirement is met, and the laser advanced ablation time is quantified to balance the processing efficiency and precision.

The invention discloses an ultrafast laser modification tuning method and device for a quartz gyroscope, and solves the defects of the existing tuning technology in the aspects of efficiency, precision and damage. According to the method, a laser Doppler vibration measurement system is used for accurately completing the frequency test of a harmonic oscillator, then an ultrafast laser processing system is used for carrying out ablation removal or modification treatment on a local area of a gyroscope, finally, the area is subjected to local chemical corrosion through a micromanipulation system, and operation is repeated according to a test result until the target precision is reached. The high efficiency of ultrafast laser ablation and the low damage characteristic of chemical corrosion are combined, the tuning efficiency and quality are remarkably improved, and meanwhile the tuning precision is effectively guaranteed through the vibration measuring system, the machining system and the micromanipulation system. The method and the device have the outstanding characteristics of high removal efficiency, low material damage, high tuning precision and wide applicable objects, and a better scheme is provided for precise tuning of the quartz gyroscope.

The utility model provides a laser ablation device which comprises a first laser light source used for emitting treatment laser; the optical splitter is arranged at the output end of the first laser light source and is used for splitting the treatment laser into multiple paths of split laser; wherein the branch lasers are arranged in rows and columns; the optical modulator is arranged at the output end of the optical splitter and is used for performing independent power regulation and control on each branch laser; the optical fiber coupler is arranged at the output end of the optical modulator and is used for coupling the branch lasers into the optical fiber branches of the optical fiber array one by one; the optical fiber array is connected between the optical fiber coupler and the focusing micro-lens array, and each optical fiber branch corresponds to one focusing micro-lens of the focusing micro-lens array; and the focusing microlens array is used for focusing the split laser onto the diseased tissue in space through focusing microlenses for ablation treatment. The technical scheme can be used for ablation treatment of various irregular pathological tissues, and damage to surrounding healthy tissues is avoided.