470 results about "Laser ablation" patented technology

The invention discloses a biaxial flexible strain sensor based on laser induced graphene. Comprising a flexible substrate, a flexible sensitive layer, a flexible spacing layer and a flexible upper cover, both the flexible substrate and the flexible upper cover are made of a polydimethylsiloxane (PDMS) material, the flexible sensitive layer is generated on a mixed substrate of polyimide (PI) and multi-walled carbon nanotubes (MWCNTs) through a laser ablation process, and then the sensitive layer is transferred to the PDMS substrate through a substrate transfer process. The flexible sensitive layer adopts an I-shaped structure, and two ends of the flexible sensitive layer are coated with electrode layer external wires. The method can be applied to the fields of wearable electronic equipment and medical monitoring. By means of the I-shaped structure, the sensitive layers in different directions can detect the strain in the main direction, and meanwhile interference caused by the strain in different directions is avoided. The preparation method is simple and efficient, a special gas environment is not needed, patterning preparation of graphene can be completed only through one step, and the production cost is reduced.

The invention belongs to the technical field of nickel-based single-crystal superalloy materials, and provides a nickel-based single-crystal superalloy and a strengthening method thereof, and the method comprises the following steps: cleaning and drying the nickel-based single-crystal superalloy to be strengthened; strengthening parameters and a shock strengthening path are set, and the nickel-based single crystal high-temperature alloy is subjected to absorption-layer-free laser shock strengthening; the strengthened nickel-based single crystal high-temperature alloy is cleaned and dried; polishing parameters and a polishing path are set, femtosecond laser oblique incidence polishing is conducted on the strengthened area of the nickel-based single crystal superalloy, and surface ablation is removed; the polished nickel-based single crystal high-temperature alloy is cleaned and dried; according to the method, the nickel-based single crystal superalloy is strengthened by adopting an absorption-layer-free laser shock strengthening mode, and femtosecond laser oblique incidence polishing is adopted, so that the procedures of pasting and removing an absorption layer for multiple times are avoided, the processing efficiency of laser shock strengthening is improved, and deterioration of the surface quality of a material caused by laser ablation is avoided.

The invention relates to the technical field of chip embedded module packaging, in particular to a blind hole processing method and a substrate. An embedded chip substrate is prepared, a chip is embedded in the embedded chip substrate, and the chip is covered with an insulating layer; determining a hole opening position on the insulating layer, wherein the hole opening position corresponds to the embedding position of the chip on the chip embedding substrate; laser ablation is conducted on the hole opening position through ultraviolet laser according to preset laser parameters, so that an initial blind hole is machined in the hole opening position; and performing residue removal processing on the initial blind hole through plasma equipment to obtain a target blind hole. Therefore, the initial blind hole is machined in the hole opening position through the ultraviolet laser, molecular bonds can be directly destroyed, cold ablation is achieved and thermal damage is reduced on the basis of the characteristic that photon energy of the ultraviolet laser is high, meanwhile, the target blind hole with the smooth hole wall can be obtained by conducting residue removing treatment on the initial blind hole through plasma equipment, and the hole opening precision is improved. Compared with the prior art, high-precision and high-quality machining of the blind hole is achieved.

The invention discloses a method for manufacturing a surface flexible layer rigid-flexible combined board for an intelligent video module, which comprises the following steps of: taking a double-sided flexible copper-clad plate, and windowing a first surface copper layer corresponding to a first via hole to form a flexible core board; taking the first cover film and windowing corresponding to the first via hole to form a windowing cover film; correspondingly attaching the windowing covering film to one side of the second copper layer of the flexible core plate to form a covering film core plate; taking a prepreg, manufacturing a glue-blocking film corresponding to a flexible area of the prepreg, forming a glue-blocking prepreg, and manufacturing a rigid core plate; sequentially stacking and laminating the plates from top to bottom, enabling the glue blocking film to face the covering film core plate, then manufacturing a through hole in the rigid region, performing laser ablation on an insulating medium layer corresponding to a copper layer windowing pattern, electroplating, performing uncovering processing, removing a second copper layer at the bottom of a blind hole, forming a first via hole, and performing molding to form the rigid-flexible combined plate. The metallization process of the flexible area and the metallization process of the rigid area are combined into one-time electroplating, so that the consistency of the thickness of a copper plating layer is ensured.

The application discloses IC chip laser ablation printing equipment and relates to the field of chip letter removing processing. The equipment comprises a top base, the bottom of the top base is installed at the top of a receiving box, and a vibrating disc feeding module is sequentially installed at the top of the top base from left to right. The equipment further comprises a material taking manipulator, a laser ablation module, a cleaning module, an ink jet module, a drying module and a double-track moving and carrying module. The laser ablation module is used for laser ablation operation on the chip, thereby assisting in laser ablation cleaning of the letters on the surface of the chip. The cleaning module is used for assisting in cleaning of the particulate matter generated by ablation on the surface of the chip. The laser ablation replaces manual polishing or chemical corrosion to remove the letters, the uniformity of the letter removal is ensured through the precisely controllable light spot energy distribution of the laser, the laser letter removal is non-contact, the chip is not mechanically damaged, the laser letter removal has become a mainstream selection due to high precision and stability, the self-defined ablation depth can be realized, and no additional damage is caused to the IC chip.

The invention discloses a laser cleaning method for a magnesium-based foil, and belongs to the technical field of magnesium ion battery manufacturing. According to the laser cleaning method for the magnesium-based foil, the magnesium-based foil is magnesium foil or magnesium alloy foil, and the method comprises the following steps that laser cleaning is conducted on the magnesium-based foil through a laser device, and a laser beam conducts 45-degree cross filling path scanning on the surface of the magnesium-based foil; monitoring a plasma spectral line of laser ablation in real time by using a plasma spectrometer; based on the dynamic change of the magnesium characteristic plasma spectral line intensity, the cleaning parameters of the laser are adjusted; and after cleaning is completed, an oxide layer on the surface of the magnesium-based foil is removed. 45-degree cross filling path scanning is adopted, heat accumulation of a repeated scanning area can be reduced, during 45-degree cross filling, adjacent scanning lines cover in a cross mode, heat distribution is more uniform, heat of the scanning area can be reduced, and therefore the problems of local overheating and negative plate perforation or structural damage caused by too high energy are avoided.

The invention relates to the field of electronic component manufacturing, in particular to an AIOT module board half-hole burr intelligent removing method based on laser ablation, and aims to solve the problems that an existing AIOT module board half-hole burr removing method is low in efficiency, a substrate is prone to being damaged, removing is uneven, intelligent recognition and precise adaptive capacity are lacked, control precision is low, and a real-time feedback mechanism is achieved. According to the method, intelligent identification, accurate positioning and three-dimensional quantification are carried out on micron-sized burrs through a high-precision visual detection technology in combination with deep learning; using an artificial intelligence algorithm to intelligently generate customized laser ablation parameters according to burr characteristics and material physical attributes; non-contact removal is executed through a precise laser ablation system in cooperation with an optimized scanning path; by the adoption of the technical scheme, non-contact, high-efficiency, high-precision and lossless intelligent removal of burrs can be achieved, and the product yield, the electrical performance and the manufacturing level are greatly improved.

The invention provides a multi-energy-field auxiliary laser drilling method and device for a silicon carbide micropore with the large depth-diameter ratio, and relates to the technical field of hard and brittle material precision machining.The multi-energy-field auxiliary laser drilling method for the silicon carbide micropore with the large depth-diameter ratio comprises the following steps that a silicon carbide workpiece is ablated layer by layer through an ultrafast laser beam to form the micropore; and in the layer-by-layer ablation process, the workpiece or the ultrafast laser beam generates relative high-frequency micro-amplitude ultrasonic vibration in the axial direction of the micropore, and the low-temperature high-speed air flow is coaxially guided to an ablation point of the ultrafast laser beam so as to remove ablation products and cool the ablation point and the adjacent area of the ablation point. Through organic combination and synergistic effect of ultrafast laser ablation, ultrasonic vibration in the axial direction of a drill hole and coaxial low-temperature high-speed airflow, the problems that in the prior art, due to unsmooth chip removal of ablation products and the remarkable heat effect, the machining depth is limited, the hole wall quality is poor, and the machining efficiency is low are solved.

The invention discloses a laser ablation and parameter optimization system and method for a hemispherical harmonic oscillator. The system comprises a laser, a control system, a frequency difference test module, a vacuum cavity, and an electric rotating base, a working platform, a vibration test clamp, an electric control excitation hammer and a vibration stopping damper which are arranged in the vacuum cavity, the working platform is mounted on the electric rotating base; the vibration stopping damper, the vibration testing clamp and the electrically-controlled excitation hammer are all installed on the working platform. By means of the parameter optimization method of the ablation system, the fitting matching degree is judged according to experimental samples added in real time, and the fitting function is dynamically updated. Laser trimming parameters are determined according to the fitting function, the accuracy of the ablation amount is guaranteed, and the trimming efficiency and convergence are improved. The method is widely suitable for the size of the harmonic oscillator, and provides technical support for engineering development of the high-precision hemispherical harmonic oscillator.

The invention discloses a CARS-LA-ICP-MS combined multimode analysis system. The CARS-LA-ICP-MS combined multimode analysis system comprises a fusion light path module, a mass spectrometry gas path module, a three-dimensional mobile station, a CARS signal acquisition system and a computer control system, the fusion light path module comprises a laser source, an optical parameter amplifier, a light pulse time delay system, three dichroscopes, a light beam adjusting system, a galvanometer, a movable objective lens and a camera; the mass spectrometry gas circuit module comprises a carrier gas supply device, a multimode analysis sample cell and a mass spectrometry device; the multimode analysis sample cell comprises an upper cover, a lower cover and a side wall shell. On the other hand, the invention discloses an analysis method which comprises initialization setting, CARS analysis, mass spectrum analysis task parameter setting, laser ablation mass spectrum analysis and data synthesis. Through coaxial optical path design and an intelligent algorithm, deep fusion of chemical imaging and elemental analysis is realized, and a brand new research tool is provided for the fields of life science, material science and the like.

The invention discloses a control method for robot-assisted laser in-situ windowing, which comprises the following steps: receiving an execution instruction sent by a main control end through a robot catheter system, sending a laser fiber into a target artery, and enabling the laser fiber to be in accurate contact with a stent covering film; a laser energy closed-loop control subsystem is combined to accurately ablate holes in a stent covering film through a photochemical effect and a photothermal effect, and laser windowing is achieved; in the laser windowing process, the thickness of the blood vessel wall is measured in real time based on optical coherence tomography, and the laser ablation process is detected based on photoacoustic monitoring, so that the laser power is dynamically adjusted, and it is ensured that the thermal damage range in the laser windowing process is smaller than 200 microns. Therefore, accurate creation of the channel between the aortic dissection false cavity and the true cavity is achieved, hemodynamic balance is recovered, the operation accuracy is improved, and the risk of complications in the perioperative period is reduced.

The invention discloses a laser ablation and milling collaborative processing system and method for hard and brittle materials. The system comprises a machine tool milling system, a laser ablation system and a cooperative control device, the laser ablation system carries an ablation mechanism through a six-degree-of-freedom mechanical arm, the cooperative control device generates cooperative data based on a machining program, and cooperative machining with advanced laser ablation and lagged milling is achieved. According to the method, the milling lag time interval is calculated through the Newton's law of cooling, a laser ablation track is generated by combining G code analysis, a non-ablation section is added, and the machining safety and precision are ensured in cooperation with a visual obstacle avoidance module, a laser focusing adjustment module and other modules. According to the system and the method, the problems of cutter abrasion, low efficiency, difficulty in thermal damage control and the like in hard and brittle material processing are solved, high-efficiency, high-precision and low-damage processing is realized, the complex molded surface processing requirement is met, and the laser advanced ablation time is quantified to balance the processing efficiency and precision.

The utility model provides a laser ablation device which comprises a first laser light source used for emitting treatment laser; the optical splitter is arranged at the output end of the first laser light source and is used for splitting the treatment laser into multiple paths of split laser; wherein the branch lasers are arranged in rows and columns; the optical modulator is arranged at the output end of the optical splitter and is used for performing independent power regulation and control on each branch laser; the optical fiber coupler is arranged at the output end of the optical modulator and is used for coupling the branch lasers into the optical fiber branches of the optical fiber array one by one; the optical fiber array is connected between the optical fiber coupler and the focusing micro-lens array, and each optical fiber branch corresponds to one focusing micro-lens of the focusing micro-lens array; and the focusing microlens array is used for focusing the split laser onto the diseased tissue in space through focusing microlenses for ablation treatment. The technical scheme can be used for ablation treatment of various irregular pathological tissues, and damage to surrounding healthy tissues is avoided.

The present application provides a method and system for estimating the on-target laser power density required to burn through protective materials. The method of the present application includes: constructing a tightly coupled model between fluid, structural heat transfer, and laser through several sets of protective material ablation simulation tests; using the tightly coupled model to analyze the factors affecting the laser ablation characteristics of the protective material to obtain the main influencing factors; conducting simulation tests on the main influencing factors under different working conditions to obtain the laser ablation characteristics of the protective material under different main influencing factors, and then establishing a laser ablation database for protective materials; obtaining the ablation rate required to burn through the protective material, and obtaining the on-target laser power density required to burn through the protective material through the protective material laser ablation database and the required ablation rate. The present application can quickly predict the on-target laser power density required to burn through aircraft protective materials under flight conditions, thereby providing technical support for future aircraft thermal protection design.

The invention discloses a low-loss preparation method of a single crystal diamond wafer. The low-loss preparation method comprises the following steps: A, carrying out laser ablation on the surface of a single crystal diamond crystal ingot; b, performing laser-assisted polishing on the surface; c, the ultrafast pulse laser is modulated into N modified light spots, all the modified light spots are made to scan at the corresponding depth positions according to a preset path at the same time, and a scanning face formed by the same modified light spot covers the cross section of the single crystal diamond crystal ingot in the 100 crystal face direction, n laser modified layers distributed in the direction perpendicular to the 100 crystal face in the single crystal diamond crystal ingot are formed after scanning; d, performing stress-induced separation on the monocrystal diamond crystal ingot; e, performing laser ablation on the cutting surface of the single crystal diamond wafer; and F, the cutting face is subjected to laser-assisted polishing. According to the low-loss preparation method of the single-crystal diamond wafer, the material loss of the single-crystal diamond crystal ingot can be reduced, and the wafer yield of the single-crystal diamond crystal ingot can be increased.

The present application provides a marking device, a pole piece production system and a pole piece marking method, which belong to the field of battery production equipment. Among them, the marking device includes a marking mechanism and a vibration mechanism. The marking mechanism is arranged on the side of the pole piece having the active material layer along the thickness direction of the pole piece. The vibration mechanism is connected to the marking mechanism, and the vibration mechanism is used to drive the marking mechanism to vibrate along the thickness direction of the pole piece, so that the marking mechanism squeezes the surface of the pole piece when rotating to form a mark on the pole piece. The marking device adopting this structure can drive the marking device to vibrate along the thickness direction of the pole piece through the vibration mechanism, thereby effectively compensating for the gap between the marking mechanism and the pole piece to ensure the marking effect of the marking mechanism on the pole piece, and there is no need to mark the pole piece through laser marking technology, thereby alleviating the phenomenon of the formation of a heat-affected zone on the pole piece after laser ablation, which is beneficial to reduce the damage to the pole piece during the marking process, so as to improve the production quality of the pole piece.

The invention relates to a laser ablation interventional catheter and a manufacturing method thereof, and relates to the field of interventional medical instruments.The laser ablation interventional catheter comprises a supporting tube section and a flexible tube section, the flexible tube section is integrally connected to the far end of the supporting tube section, and integrally-extending ablation optical fiber bundles are arranged in the supporting tube section and the flexible tube section; one end of the ablation optical fiber bundle extends to the end face of the flexible pipe section, a supporting wire is arranged in the supporting pipe section, a wire guide pipe is arranged in the flexible pipe section, and ablation laser can be transmitted into a more zigzag blood vessel to conduct laser ablation on lesion tissue. In addition, the invention further discloses a manufacturing method for manufacturing the laser ablation interventional catheter.

The utility model discloses a rotatable display screen and laser ablation equipment, the rotatable display screen comprises a first display screen, a second display screen and a connecting assembly, the connecting assembly comprises a supporting rod and a rotating part, and the rotating part is arranged on the supporting rod so as to rotate around the supporting rod; the first display screen and the second display screen are connected to the two ends of the rotating component respectively, so that the rotating component drives the first display screen and the second display screen to rotate. According to the scheme, the height and / or angle of the display screen can be adjusted according to needs.

The invention relates to the technical field of flexible electronic sensors, in particular to a flexible large strain sensor for crack detection and a preparation method thereof.The flexible large strain sensor comprises a skeleton-shaped packaging layer, the packaging layer comprises two rigid fixing ends, and the two rigid fixing ends are integrally connected through a sensitive unit section; a rigid reinforcing structure is embedded in each rigid fixing end, mechanical fixing holes are formed in each rigid fixing end and the corresponding rigid reinforcing structure in a penetrating mode, interdigital capacitor electrodes are embedded in the sensitive unit sections, and the interdigital capacitor electrodes are made of flexible conductive materials through laser ablation. The end part of the interdigital capacitor electrode is connected with a flexible extension wire, the tail end of the flexible extension wire is connected with an external lead, and the external lead is embedded between the packaging layer and the upper surface of the rigid fixed end; the problems that an existing flexible sensor is unstable in installation, contradictory in measuring range and precision and poor in environmental adaptability in structural crack detection are solved.

The invention relates to the technical field of plasma cleaning, and discloses a plasma treatment method for a metal plate after laser etching, which comprises the following steps: cleaning the surface of the metal plate after laser etching, putting the metal plate into plasma cleaning equipment, and carrying out plasma cleaning treatment at preset gas flow and preset radio frequency power; the duration of plasma cleaning treatment is preset as the first duration, cleanliness detection data and surface roughness detection data of the metal plate subjected to plasma cleaning for the first duration are obtained, a cleanliness score is calculated, and whether post-cleaning treatment is carried out or not is determined according to the cleanliness score; and after it is determined that post-cleaning treatment is carried out, after the post-cleaning treatment is finished for a second time length, metal plate treatment is completed. According to the method, the metal plate subjected to laser etching is subjected to plasma cleaning, and the process parameters of plasma cleaning equipment are controlled, so that the plasma is in full contact with the surface of the metal plate and reacts with the surface of the metal plate, and the cleaning purpose is achieved.

To develop a method for engraving and texturing an enamel capable of overcoming drawbacks of enamel engraving which is not widely used since it requires a mastery of the engraving technique to avoid scratching an enamel surface or altering its color.SOLUTION: A method for engraving and texturing an item (1) including a decoration (2) filled at least partially with an enamel (3) includes a step of laser ablation using a femtosecond laser or a picosecond laser onto a surface of the enamel (3) and / or within the enamel (3) to form a structure (7).SELECTED DRAWING: Figure 4A-4C

The utility model relates to a solid standard substance target required in laser ablation, in particular to a replaceable standard substance target, which is characterized in that the top surface of a target sleeve is provided with through holes in one-to-one correspondence with target position holes in the same number, and the bottom surface of the target sleeve is provided with cover plate holes in one-to-one correspondence with the target position holes in the same number; each target position hole is respectively communicated with the corresponding through hole and the corresponding cover plate hole, the diameter of the through hole is smaller than that of the target position hole, and a cover plate is put into the communicated target position hole from each cover plate hole; a small standard substance target is accommodated in each target position hole, a spring is arranged at the bottom of each small standard substance target, and two ends of the spring are respectively propped against the small standard substance target and the cover plate so as to fix the small standard substance target. The standard substance small target is simple to operate, the standard substance small target can be replaced by rotating the cover plate and taking out the spring, different types of standard substances can be flexibly used when different types of samples are subjected to laser in-situ micro-area analysis, the use efficiency of a limited space of a sample bin is improved, and waste of precious standard substances is reduced.

Aspects of the present disclosure relate generally to systems and methods for use in the implementation and / or operation of quantum information processing (QIP) systems, and more particularly, to a technique for the fabrication of laser-ablation targets used in atomic sources for QIP systems that are based on atomic-based qubits.

The present disclosure relates to patterning in a device having an organic light emitting diode display and a sensor. The electronic device may include a display and an optical sensor formed below the display. A pixel removal area on the display may at least partially overlap with the sensor. The pixel removal area may include a plurality of non-pixel areas, each non-pixel area not containing a thin film transistor. The plurality of non-pixel areas are configured to increase the transmittance of light through the display to the sensor. In addition to removing the thin film transistors in the pixel removal area, additional layers in the display stack structure may also be removed. Specifically, the cathode layer, polyimide layer and / or substrate in the display stack structure may be patterned to have openings in the pixel removal area. The polarizer may be bleached in the pixel removal area to obtain additional transmittance gain. The cathode layer may be removed using laser ablation using a point laser or blanket illumination.

Described herein is a robotic laser ablation system that comprises a robot and processing circuitry. The robot has an end effector with laser componentry and a camera mounted thereto. Processing circuitry is configured, in response to stored instructions, to perform operations including: receiving the input image of a workpiece from the camera; segmenting the input image to produce an image segment that depicts at least a portion of the workpiece; applying a surface-fitting algorithm to generate a polynomial surface that is fit to the surface in the image segment; computing a set of surface normal vectors across the polynomial surface to generate a set of waypoints offset from the polynomial surface by an offset length; programmatically generating a motion path linking a plurality of the waypoints; and performing laser ablation of the surface of the portion of the workpiece based on the motion path.

Embodiments of a surgical laser system comprise a laser source (102), a laser fiber (104), a photodetector (106) and a controller (108). The laser source is configured to generate laser energy (1 10). The laser fiber is optically coupled to the laser source and is configured to discharge the laser energy generated by the laser source. The photodetector is configured to generate an output signal (1 12) that is indicative of an intensity level of electromagnetic energy feedback (114) that is produced in response to the discharge of the laser energy. The controller is configured to control the laser source based on the output signal.

Reference materials with increased lithium content for direct elemental analyses, wherein the glass contains 55 to 75 wt.% SiO2, 7 to 15 wt.% Na2O, 6 to 15 wt.% CaO, up to 3.5 wt.% AI2O3, up to 3.5 wt.% K2O, and up to 12 wt.% Li2O, and the value of the relative standard deviation (RSD) of homogeneous element distribution in the glass, determined by inductively coupled plasma mass spectrometry combined with laser ablation (LA-ICP-MS), is less than or equal to 5%.

A processing technology structure for improving the alignment capability of a pattern and a laser hole relates to the field of circuit board production, and comprises a PCB body, the PCB body is subjected to laser ablation at the position where pattern alignment ring targets are designed to form grooves, the depth of each alignment ring target groove is smaller than the thickness of the PCB body, and the thickness of each alignment ring target groove is smaller than the thickness of the PCB body. The alignment ring targets are arranged in the PCB body, dry films cover the alignment ring targets through film pasting, exposure and development, laser holes are filled with copper through electroplating of the PCB body, then the dry films are removed, grooves of the alignment ring targets are not electroplated with copper, the diameters of the grooves of the alignment ring targets are consistent, and the two pairs of alignment ring targets are designed in a staggered mode. According to the utility model, the ablated groove is protected in the electroplating process in a manner that the alignment ring target is ablated and then the dry film is electroplated, so that the contrast ratio between the groove of the alignment ring target and a copper point is improved, the edge of the alignment ring target is easy to identify during pattern exposure, the problem that the pattern ring is small in width and easy to crack is solved, and the product yield is improved.

The invention relates to a method (100) for manufacturing a multilayer composite article (10) with an integrated conductor arrangement (20). It is proposed to integrate a laser radiation-reflecting reflector element (30) under a cover layer (13) of the multilayer composite article (10). The reflector element (30) thus defines a processing path along which the cover layer (13) can be reliably ablated by means of laser ablation.

The application discloses a device and a process for laser ablation induced controllable damage assisted grinding of hard and brittle materials, which adopts laser irradiation on the material surface, focuses the laser focal point on the material surface to be processed, removes and induces specific depth damage to the material by ablation. By controlling the laser power, scanning speed and ablation track, the degree and type of laser ablation induced thermal damage of the material are effectively controlled. The grinding path of the grinding wheel and the ablation path of the laser are controlled on the same axis, and the distance between the laser ablation and the grinding wheel grinding is set, and the workpiece ablation surface is ground under the preferred grinding parameters. The application systematically puts forward a quantitative control strategy for the degree of laser ablation damage of the material surface, removes the laser induced damage layer by accurate control of the material surface damage and precision grinding, and realizes high-efficiency and high-quality processing of the hard and brittle materials.