778 results about "Laser ablation" patented technology

The laser ablation system utilizes a variety of configurable laser beams to remove a substance from the surface of a substrate without damaging the underlying substrate. The present invention implements improvements to the laser ablation system to provide a gentle, yet thorough, ablating system through the use of a variety of rotating patterns. Furthermore, the system of the present invention is highly modifiable, such that a wide variety of parameters are adjustable to accommodate a wide variety of cleaning jobs.

A method for ultraviolet-laser transfer and cleaning of microelectronic devices includes transferring a microelectronic device from a donor substrate to a receiver substrate, and cleaning the microelectronic device after transfer. Prior to transfer, the microelectronic device is coupled to the donor substrate via a sacrificial layer containing gallium. A first ultraviolet laser beam ablates the sacrificial layer to release the microelectronic device from the donor substrate, leaving behind a gallium residue on the newly exposed surface of the microelectronic device. A second ultraviolet laser beam ablates the gallium residue to clean the microelectronic device. The first and second ultraviolet laser beams may be generated by the same ultraviolet laser. As compared to liquid etching, laser ablation of the gallium residue eliminates a wet-chemistry step and may be performed by the same laser apparatus used for transfer. Laser cleaning is particularly advantageous when the receiver substrate is intolerant to liquid etching.

The invention discloses a method for manufacturing a rigid-flex printed circuit board with a surface flexible layer, which comprises the following steps of: taking a double-sided flexible copper-clad plate, manufacturing a through hole and electroplating, and then manufacturing a circuit pattern to form a pattern plate; manufacturing a first windowing covering film for windowing corresponding to the golden finger area and covering the through hole and a second windowing covering film for windowing corresponding to the through hole and the ineffective area, respectively attaching the first windowing covering film and the second windowing covering film to the two surfaces of the pattern board, and then carrying out electrometallization to form a flexible core board; taking a rigid copper-clad plate, windowing the rigid copper-clad plate corresponding to the flexible layered area, and then manufacturing a circuit pattern to form a rigid core plate; stacking and laminating the structures to form a laminated plate; drilling and electroplating are carried out on the laminated plate, then laser ablation is carried out on a through hole area, and the rigid-flexible combined plate is formed through post-process processing; by forming a new processing flow, the defects of low adaptability, processing precision and reliability of a traditional rigid-flex printed circuit board manufacturing method are systematically solved, and high-precision processing of the rigid-flex printed circuit board with high integration level is formed.

The invention discloses a passivation contact cell with a selective polysilicon layer and a method of making the same. According to the invention, each laser scanning line on the back surface of the TOPCon solar cell adopts a separation form and is separated by the phosphorus heavily-doped polycrystalline silicon layer, so that overlapping of laser scanning paths does not exist, and a part of the phosphorus-doped polycrystalline silicon layer structure in the surrounding area of the main grid is reserved; according to the structure mode, the transmission distance of carriers in a laser ablation area can be reduced, the carriers can be collected by the fine grid more quickly, and the filling factor FF of the cell is improved especially under the special conditions of grid breakage and the like. According to the invention, the laser grooving area is 40%-80% of the total area of the back of the cell, which is beneficial for balancing the passivation performance of the cell while reducing the parasitic absorption of the polycrystalline silicon to light. The passivation contact cell has high short-circuit current, open-circuit voltage and fill factor.

The system can include a detection model; an optional camera system; and an optional control system. The system can function to detect plants within a field. Additionally, the system can function to facilitate an agriculture operation(s) based on the positions of plants within the field. Variants of the system can be configured to (autonomously) perform and / or facilitate agriculture operations which can include: agent dispersal (e.g., solid agent dispersal), fluid spraying, crop imaging (e.g., crop data collection), side dressing, weeding (e.g., mechanical actuation, targeted laser ablation, etc.), harvesting, planting, tilling, fertilizing, irrigating, and / or any other suitable operation(s). Variants of the system and / or method can be used to facilitate detection and / or agriculture operations for single crops, multi-crops (e.g., crop doubles, where agriculture operations may be based on stem proximity), ground cover plants, weeds, and / or agriculture operations in any other suitable scenarios.

The invention provides an anti-laser-ablation polymer-based protective coating and a preparation method thereof.The anti-laser-ablation polymer-based protective coating comprises a precursor solution and nano-particles, the nano-particles comprise TiO2, Al, VO2, SiC, B4C, cBN and carbon nanotubes, the mass ratio of TiO2 to Al to VO2 to SiC to B4C to cBN to carbon nanotubes is (2-5): (1-3): (1-2): (1-3): (2-3): (1-1.5): (1-1.5), and in the coating, the mass percentage of the nano-particles is 10%-25%, and the mass percentage of the nano-particles is 10%-25%. The mass percent of the precursor solution is 75%-90%. One technical effect of the invention lies in that the design is reasonable, and the coating is polysilazane-doped multiphase nanoparticles, and has the advantages of high laser reflectivity, good heat insulation effect and outstanding mechanical properties.

The invention discloses a biaxial flexible strain sensor based on laser induced graphene. Comprising a flexible substrate, a flexible sensitive layer, a flexible spacing layer and a flexible upper cover, both the flexible substrate and the flexible upper cover are made of a polydimethylsiloxane (PDMS) material, the flexible sensitive layer is generated on a mixed substrate of polyimide (PI) and multi-walled carbon nanotubes (MWCNTs) through a laser ablation process, and then the sensitive layer is transferred to the PDMS substrate through a substrate transfer process. The flexible sensitive layer adopts an I-shaped structure, and two ends of the flexible sensitive layer are coated with electrode layer external wires. The method can be applied to the fields of wearable electronic equipment and medical monitoring. By means of the I-shaped structure, the sensitive layers in different directions can detect the strain in the main direction, and meanwhile interference caused by the strain in different directions is avoided. The preparation method is simple and efficient, a special gas environment is not needed, patterning preparation of graphene can be completed only through one step, and the production cost is reduced.

The invention belongs to the technical field of nickel-based single-crystal superalloy materials, and provides a nickel-based single-crystal superalloy and a strengthening method thereof, and the method comprises the following steps: cleaning and drying the nickel-based single-crystal superalloy to be strengthened; strengthening parameters and a shock strengthening path are set, and the nickel-based single crystal high-temperature alloy is subjected to absorption-layer-free laser shock strengthening; the strengthened nickel-based single crystal high-temperature alloy is cleaned and dried; polishing parameters and a polishing path are set, femtosecond laser oblique incidence polishing is conducted on the strengthened area of the nickel-based single crystal superalloy, and surface ablation is removed; the polished nickel-based single crystal high-temperature alloy is cleaned and dried; according to the method, the nickel-based single crystal superalloy is strengthened by adopting an absorption-layer-free laser shock strengthening mode, and femtosecond laser oblique incidence polishing is adopted, so that the procedures of pasting and removing an absorption layer for multiple times are avoided, the processing efficiency of laser shock strengthening is improved, and deterioration of the surface quality of a material caused by laser ablation is avoided.

The invention relates to the technical field of chip embedded module packaging, in particular to a blind hole processing method and a substrate. An embedded chip substrate is prepared, a chip is embedded in the embedded chip substrate, and the chip is covered with an insulating layer; determining a hole opening position on the insulating layer, wherein the hole opening position corresponds to the embedding position of the chip on the chip embedding substrate; laser ablation is conducted on the hole opening position through ultraviolet laser according to preset laser parameters, so that an initial blind hole is machined in the hole opening position; and performing residue removal processing on the initial blind hole through plasma equipment to obtain a target blind hole. Therefore, the initial blind hole is machined in the hole opening position through the ultraviolet laser, molecular bonds can be directly destroyed, cold ablation is achieved and thermal damage is reduced on the basis of the characteristic that photon energy of the ultraviolet laser is high, meanwhile, the target blind hole with the smooth hole wall can be obtained by conducting residue removing treatment on the initial blind hole through plasma equipment, and the hole opening precision is improved. Compared with the prior art, high-precision and high-quality machining of the blind hole is achieved.

The invention discloses a method for manufacturing a surface flexible layer rigid-flexible combined board for an intelligent video module, which comprises the following steps of: taking a double-sided flexible copper-clad plate, and windowing a first surface copper layer corresponding to a first via hole to form a flexible core board; taking the first cover film and windowing corresponding to the first via hole to form a windowing cover film; correspondingly attaching the windowing covering film to one side of the second copper layer of the flexible core plate to form a covering film core plate; taking a prepreg, manufacturing a glue-blocking film corresponding to a flexible area of the prepreg, forming a glue-blocking prepreg, and manufacturing a rigid core plate; sequentially stacking and laminating the plates from top to bottom, enabling the glue blocking film to face the covering film core plate, then manufacturing a through hole in the rigid region, performing laser ablation on an insulating medium layer corresponding to a copper layer windowing pattern, electroplating, performing uncovering processing, removing a second copper layer at the bottom of a blind hole, forming a first via hole, and performing molding to form the rigid-flexible combined plate. The metallization process of the flexible area and the metallization process of the rigid area are combined into one-time electroplating, so that the consistency of the thickness of a copper plating layer is ensured.

The invention relates to the technical field of laser cleaning processing, and particularly discloses a real-time monitoring method for laser cleaning of a carbon fiber composite material. An optical coherence tomography (OCT) detection unit and a sensor module are innovatively adopted to form a real-time monitoring system, and according to the surface treatment requirement of the carbon fiber composite material, a temperature sensor in the sensor module is used for collecting a heat radiation signal of a laser irradiation area in real time, and the surface layer temperature of a base material during machining is monitored in real time; the distance between a machining head and a base material is dynamically tracked through a laser ranging module in the sensor module, the OCT detection unit obtains micron-sized surface topography characteristics through frequency domain interference signal analysis, and surface roughness parameters are synchronously calculated. The data of the three channels are fused through the edge calculation module and then fed back in real time through the displayer, and the temperature field, the roughness and the focal length are effectively monitored in the cleaning process. According to the method, damage to the base material due to factors such as laser ablation can be avoided, the operation time is effectively shortened, and the operation efficiency is improved.

The invention relates to the technical field of laser micromachining, in particular to a laser ablation titanium alloy numerical simulation method based on a plasma shielding effect. In order to solve the problems that the precision and efficiency of an existing laser processing and manufacturing micro-nano structure are low, the plasma shielding effect is not fully considered in a simulation model and the like, two-dimensional and three-dimensional models are constructed by means of COMSOL Multiphysics software. According to the model, the plasma shielding effect is fully considered, a laser energy transfer equation is corrected, and the molten pool behavior and surface topography forming process is simulated by combining mass, momentum and energy conservation equations. A laser ablation process is accurately simulated by setting a heat source and boundary conditions, applying a level set method, considering various effects and calculating plasma related parameters. And inputting different laser parameters to simulate and analyze the influence on the groove morphology, and comparing an experiment with a simulation result to correct the model. Simulation precision is improved, laser processing parameters can be optimized, cost is reduced, universality is high, theoretical guidance can be provided for laser processing of various metal materials, and the laser processing technology is promoted to be developed in multiple fields.

A laser machining system comprises a laser generator (202) producing ultrafast laser pulses, a galvanometric scanner mirror (102, 204) for precision deflection of the laser beam (101), and a main unit (100) comprising a folded optical system with focusing optics (207, 210, 212, 214) capable of delivering the laser beam focused waist onto the surface of a elongated thin workpiece (103), for example, cylindrically-shaped, or having quadrilateral or mullitlateral or elliptic perpendicular cross-section. The main unit (100) is attached directly to the scanning mirror subsystem (102) and they both comprise the optical path, which is separated into several, e.g., four, equal paths terminating on the workpiece (103) surface from orthogonal directions covering the workpiece from opposite sides. The optical path in the main unit (100) is arranged in such a way that the paraxial optical mode remains valid at all reflecting mirrors, mitigating the optical aberrations of the focused beam onto the surface of the workpiece (103). With controlled deflection of the scanner mirror (204), the laser beam can access the full area of the outer surface of the workpiece (103) and process the workpiece (103) using controlled laser ablation or surface treatment using direct laser writing (DLW). The workpiece (103) is mounted into a translation stage perpendicularly to the laser beam, allowing free-form laser processing onto a cylindrically- or multilaterally-round elongated shape, by synchronized deflection (204) of the laser beam, and longitudinal translation of the workpiece (103) by the translation stage.

An object of the present invention is to provide a chemical solution that, in the case of being used in a step of bringing a contact-target member and the chemical solution into contact with each other, is less likely to cause a predetermined defect in the contact-target member. A chemical solution according to the present invention includes an organic solvent and a metal-containing particle including a metal element selected from the group consisting of Fe, Ni, and Zn, wherein an I value determined by a method X is 0.010 to 10.000,method X: the chemical solution is applied onto a substrate to prepare a subject; a surface of the subject is analyzed by being scanned with laser using laser-ablation-inductively coupled plasma-mass spectrometry, to obtain charts for the metal elements in which an abscissa axis indicates laser scanning time and an ordinate axis indicates ion detection intensity; the ion detection intensity of the charts is accumulated for the scanning time to determine accumulated ion detection intensities of the metal elements; the accumulated ion detection intensities of the metal elements are added up to determine a total accumulated ion detection intensity; and the total accumulated ion detection intensity is divided by a laser scanning area to obtain an I value in units of counts / mm2.

The application discloses IC chip laser ablation printing equipment and relates to the field of chip letter removing processing. The equipment comprises a top base, the bottom of the top base is installed at the top of a receiving box, and a vibrating disc feeding module is sequentially installed at the top of the top base from left to right. The equipment further comprises a material taking manipulator, a laser ablation module, a cleaning module, an ink jet module, a drying module and a double-track moving and carrying module. The laser ablation module is used for laser ablation operation on the chip, thereby assisting in laser ablation cleaning of the letters on the surface of the chip. The cleaning module is used for assisting in cleaning of the particulate matter generated by ablation on the surface of the chip. The laser ablation replaces manual polishing or chemical corrosion to remove the letters, the uniformity of the letter removal is ensured through the precisely controllable light spot energy distribution of the laser, the laser letter removal is non-contact, the chip is not mechanically damaged, the laser letter removal has become a mainstream selection due to high precision and stability, the self-defined ablation depth can be realized, and no additional damage is caused to the IC chip.

The invention discloses a laser non-traditional machining ultrathin vapor chamber and a manufacturing method thereof. The laser non-traditional machining ultrathin vapor chamber comprises a first shell plate, a second shell plate and a liquid absorption core layer. The first shell plate and the second shell plate are welded through laser to form a closed accommodating cavity; the liquid absorption core layer is arranged in the containing cavity, a micro-nano structure is formed on the surface of the liquid absorption core layer through laser ablation, the capillary performance of a liquid absorption core is improved, and then the heat transfer performance of the vapor chamber is improved; meanwhile, the inner surfaces of the two shell plates can be subjected to laser ablation treatment to form a micro-channel structure. The manufacturing method comprises the steps of laser ablation of the wick layer and laser welding of the two shell plates. Based on the laser ablation technology, design and treatment of the microstructure morphology of the surface of the wick can be met; the influence on the mechanical property of a shell material in the manufacturing process can be reduced to the maximum extent through laser welding, the manufacturing yield of the vapor chamber is improved, and compared with traditional brazing, non-contact welding can avoid pollution to an internal wick.

The invention discloses a laser cleaning method for a magnesium-based foil, and belongs to the technical field of magnesium ion battery manufacturing. According to the laser cleaning method for the magnesium-based foil, the magnesium-based foil is magnesium foil or magnesium alloy foil, and the method comprises the following steps that laser cleaning is conducted on the magnesium-based foil through a laser device, and a laser beam conducts 45-degree cross filling path scanning on the surface of the magnesium-based foil; monitoring a plasma spectral line of laser ablation in real time by using a plasma spectrometer; based on the dynamic change of the magnesium characteristic plasma spectral line intensity, the cleaning parameters of the laser are adjusted; and after cleaning is completed, an oxide layer on the surface of the magnesium-based foil is removed. 45-degree cross filling path scanning is adopted, heat accumulation of a repeated scanning area can be reduced, during 45-degree cross filling, adjacent scanning lines cover in a cross mode, heat distribution is more uniform, heat of the scanning area can be reduced, and therefore the problems of local overheating and negative plate perforation or structural damage caused by too high energy are avoided.

The invention relates to a diagnosis and treatment integrated endoscopic catheter, and belongs to the technical field of medical instruments. The endoscopic catheter comprises a catheter probe, an imaging assembly and an ablation assembly. A first accommodating space and a second accommodating space are formed in the catheter probe, the first accommodating space is formed in the middle of the catheter probe in the axial direction, and the second accommodating space is formed in the catheter wall of the catheter probe in the axial direction; the imaging assembly is placed in the first accommodating space, laser beams emitted by the imaging assembly are emitted to one side of the second accommodating space, and an imaging area is formed after the laser beams are absorbed by the imaging tissue; the ablation assembly is placed in the second containing space, the laser emitting end face of the ablation assembly is an inclined face, the emitted ablation laser beams are emitted out along the inclination angle of the inclined face, laser ablation is directly conducted on the focus area of the imaging area, and the diagnosis and treatment integrated endoscopic catheter achieves integrated miniaturization integration of the imaging function and the ablation function.

The invention relates to a stretchable and wearable crop sensor and a preparation method thereof, and belongs to the technical field of sensors. According to the sensor, a flexible substrate is coated with a graphene layer, the sensor has good tensile strain capacity by means of a flexible material, then the graphene layer is subjected to laser ablation to construct a preset number of hollow-out areas, and the graphene layer forms a net-like structure by means of the hollow-out areas, so that the detection sensitivity and precision of the sensor are remarkably improved; and the tensile strain resistance of the graphene layer is improved, and the whole flexible sensor with high sensitivity and high stability is formed. Meanwhile, compared with an existing flexible sensor prepared by weaving a conductive fiber net, the sensor preparation method disclosed by the invention has the advantages that the performance is similar, but the preparation difficulty and the preparation cost are remarkably reduced, so that the use scene of crop detection which needs a large number of sensors can be better met; the technical problems that a current flexible sensor with high sensitivity and high stability is complex in preparation and too high in cost are solved.

The invention discloses an LIBS (laser-induced breakdown spectroscopy) heterogeneous sample detection and analysis system and method based on 3D (three-dimensional) mapping. The system comprises a laser spectrum emission device for providing carrier waves required by LIBS, and a sample positioning and ablation point control and adjustment device for adjusting a heterogeneous sample detection position and accurately positioning a laser ablation position, the sample positioning and ablation point control adjusting device comprises a 3D scanning mechanism used for scanning the surface of a heterogeneous sample to obtain a three-dimensional model of the sample, and an electronic adjustable lens used for receiving laser emitted by the laser spectrum module and adjusting the focusing position. The electronic adjustable platform is used for adjusting an ablation point on the surface of the sample in cooperation with the electronic adjustable lens, LIBS and space mapping are combined, accurate detection and analysis of all position areas on the surface of the irregular heterogeneous sample are achieved through the electronic adjustable platform and the electronic adjustable lens, the consistency of laser focusing at all positions can be guaranteed, and the detection accuracy is improved. The accuracy of detection and analysis data is ensured.

The invention relates to the field of electronic component manufacturing, in particular to an AIOT module board half-hole burr intelligent removing method based on laser ablation, and aims to solve the problems that an existing AIOT module board half-hole burr removing method is low in efficiency, a substrate is prone to being damaged, removing is uneven, intelligent recognition and precise adaptive capacity are lacked, control precision is low, and a real-time feedback mechanism is achieved. According to the method, intelligent identification, accurate positioning and three-dimensional quantification are carried out on micron-sized burrs through a high-precision visual detection technology in combination with deep learning; using an artificial intelligence algorithm to intelligently generate customized laser ablation parameters according to burr characteristics and material physical attributes; non-contact removal is executed through a precise laser ablation system in cooperation with an optimized scanning path; by the adoption of the technical scheme, non-contact, high-efficiency, high-precision and lossless intelligent removal of burrs can be achieved, and the product yield, the electrical performance and the manufacturing level are greatly improved.

The present invention discloses a passivated contact cell with a selective polysilicon layer and a preparation method thereof. In the present invention, each laser scanning line on the back of the TOPCon solar cell is separated by a phosphorus-heavy doped polysilicon layer in the middle, there is no overlap of the laser scanning path, and a partial phosphorus-doped polysilicon layer structure in the area around the main grid is retained. Such a structural method helps to reduce the transmission distance of carriers in the laser ablation area, and the carriers can be collected more quickly by the fine grid, thereby improving the fill factor FF of the cell, especially under special conditions such as broken grid. In the present invention, the laser grooving area is set to 40% to 80% of the total area of ​​the back of the cell, which is conducive to balancing the passivation performance of the cell while reducing the parasitic absorption of light by polysilicon. The passivated contact cell of the present invention has a higher short-circuit current, open-circuit voltage and fill factor.

The invention provides a method for improving passivation contact performance of a p region of a TBC battery, which comprises the following steps of: pretreating an n-type monocrystalline silicon wafer, depositing a SiO2 layer and boron (B) doped polycrystalline silicon (poly-Si), etching, performing laser ablation and the like, then depositing phosphorus (P) doped poly-Si, and finally depositing a passivation and anti-reflection layer and preparing a metal electrode. A tunneling oxide layer and boron in-situ doped polycrystalline silicon are deposited in a p region by adopting an ultra-low temperature plasma enhanced chemical deposition (PECVD) mode, the reaction of SiH4 and N2O is introduced to improve the deposition effect of the oxide layer at low temperature, the compactness of a film layer at low temperature is ensured to improve the separation of B on a SiO2 / c-Si interface, and the passivation performance is improved; b doping poly-Si is adopted in the p region, meanwhile, processing is matched with a nanosecond laser, non-equilibrium doping of the B to the poly-Si is achieved, the ultrahigh doping concentration is obtained, the p region passivation performance of the TBC is improved, and then the open-circuit voltage and the conversion efficiency of the TBC battery are finally improved.

A method (100) for ultraviolet laser transfer and cleaning of microelectronic devices includes transferring (102) a microelectronic device (110) from a donor substrate (120) to a receiving substrate (130) and cleaning (104) the microelectronic device (110) after the transfer. Prior to transfer, the microelectronic device (110) is coupled to the donor substrate (120) through a sacrificial layer (112) comprising gallium. The first ultraviolet laser beam (180) ablates the sacrificial layer (112) to release the microelectronic device (110) from the donor substrate (120) leaving a gallium residue (114) on a newly exposed surface (116) of the microelectronic device (110). The second ultraviolet laser beam (190) ablates the gallium residue (114) to clean the microelectronic device (110). The first ultraviolet laser beam (180) and the second ultraviolet laser beam (190) may be generated by the same ultraviolet laser (170). The laser ablation of the gallium residue omits a wet chemical step as compared to liquid etch and can be performed by the same laser device for transfer. Laser cleaning is particularly advantageous when the receiving substrate is not resistant to liquid etching.

The invention discloses a preparation method of a polycarbosilane composite coating for a radar radome, which comprises the following steps: step 1, pretreating a to-be-coated product, coarsening the to-be-coated product by using abrasive paper or acid corrosion, cleaning the to-be-coated product by using a cleaning solvent, and drying the to-be-coated product in a drying oven, and step 2, carrying out modification treatment on polycarbosilane and resin; 3, adding a flatting agent and a plasticizer into the modified polycarbosilane, and uniformly stirring to prepare a coating solution; 4, adding an inorganic filler and a solvent into the coating solution, and carrying out rapid ball milling to prepare a mixed coating; and 5, preparing a coating on the surface of the antenna housing by adopting an impregnation method, and putting the coating into a drying oven to be cured. Polycarbosilane is converted into SiC at high temperature, epoxy resin ablates and absorbs a part of heat of laser, the contained chopped fibers and inorganic filler can play a role in heat insulation and protection, and the generated SiC and filler can reflect laser, so that the shell has excellent laser ablation resistance, and the shell is effectively prevented from being damaged.

An optical fiber combining-coupled ultraviolet laser ablation system, comprising a laser (1), a light homogenizing assembly (2), and an optical fiber combining assembly (3). The laser (1) is used for emitting laser light. The light homogenizing assembly (2) is arranged on an emergent light path of the laser light. The optical fiber combining assembly (3) is arranged on an emergent light path of the light homogenizing assembly (2). The light homogenizing assembly (2) is used for performing beam flat-top shaping and beam superposition on the laser light to obtain a target light spot. The optical fiber combining assembly (3) is used for performing multi-beam transmission on the target light spot, so that laser ablation can be efficiently and stably achieved.

The invention provides a multi-energy-field auxiliary laser drilling method and device for a silicon carbide micropore with the large depth-diameter ratio, and relates to the technical field of hard and brittle material precision machining.The multi-energy-field auxiliary laser drilling method for the silicon carbide micropore with the large depth-diameter ratio comprises the following steps that a silicon carbide workpiece is ablated layer by layer through an ultrafast laser beam to form the micropore; and in the layer-by-layer ablation process, the workpiece or the ultrafast laser beam generates relative high-frequency micro-amplitude ultrasonic vibration in the axial direction of the micropore, and the low-temperature high-speed air flow is coaxially guided to an ablation point of the ultrafast laser beam so as to remove ablation products and cool the ablation point and the adjacent area of the ablation point. Through organic combination and synergistic effect of ultrafast laser ablation, ultrasonic vibration in the axial direction of a drill hole and coaxial low-temperature high-speed airflow, the problems that in the prior art, due to unsmooth chip removal of ablation products and the remarkable heat effect, the machining depth is limited, the hole wall quality is poor, and the machining efficiency is low are solved.

Described is a laser ablation system arranged to dynamically adjust power output to provide increased stability and reduced fluctuations of emitted energy. Additionally described are a test catheter and calibration procedure for calibrating the laser ablation system for to dynamically adjust power output during an ablation procedure.

A scanning path planning method for uniform laser ablation of a hemispherical resonator comprises the steps that the radius of the surface to be machined of the hemispherical resonator is measured, the azimuth angle change of each traversal point is calculated to ensure that the linear velocity of laser ablation is consistent, and then uniform ablation is achieved. And planning an ablation scanning path. Through the scanning path, uniform deposition of laser energy of each traversal point is realized, the effect of uniform laser ablation is achieved, and the problem of frequency splitting caused by non-uniformity of circumferential quality of the hemispherical harmonic oscillator is solved. The invention also relates to a method for controlling the two rotating platforms in the latitude and longitude directions of the hemispherical harmonic oscillator to move synergistically to ensure that each point on the surface is ablated by laser according to a preset path and speed. The laser ablation precision and efficiency are improved, the operation difficulty and complexity are reduced, a new efficient solution is provided for uniform laser ablation of the hemispherical harmonic oscillator, and the laser ablation device has wide application prospects.

The invention discloses a laser ablation and parameter optimization system and method for a hemispherical harmonic oscillator. The system comprises a laser, a control system, a frequency difference test module, a vacuum cavity, and an electric rotating base, a working platform, a vibration test clamp, an electric control excitation hammer and a vibration stopping damper which are arranged in the vacuum cavity, the working platform is mounted on the electric rotating base; the vibration stopping damper, the vibration testing clamp and the electrically-controlled excitation hammer are all installed on the working platform. By means of the parameter optimization method of the ablation system, the fitting matching degree is judged according to experimental samples added in real time, and the fitting function is dynamically updated. Laser trimming parameters are determined according to the fitting function, the accuracy of the ablation amount is guaranteed, and the trimming efficiency and convergence are improved. The method is widely suitable for the size of the harmonic oscillator, and provides technical support for engineering development of the high-precision hemispherical harmonic oscillator.