11 results about "Micro devices" patented technology

This application discloses a gas sensor and electronic device. The gas sensor includes a substrate, a micro-hot plate, and a microphone. At least one of the micro-hot plate and the microphone is disposed on the substrate. The micro-hot plate includes a heating element, and a thermoacoustic cavity is formed around the heating element. The microphone has a sensing cavity, with the sensing surface of the microphone facing the sensing cavity, and the sensing cavity communicating with the thermoacoustic cavity. The micro-hot plate also includes a first substrate and a heat insulation layer stacked together. The first substrate has a first through-hole, and the heating element is located within the heat insulation layer. Thus, the gas sensor of this embodiment, through the coordinated operation of the micro-hot plate and the microphone, can accurately detect the composition and concentration of gas using the thermoacoustic effect. Furthermore, it is fabricated using microfabrication technology, making it easy to integrate into various micro-devices and possessing broad application prospects.

Drive pump, liquid cooling module, electronic equipment and vibrator preparation method relate to medium drive micro device technical field, and drive pump includes casing and vibrator; The casing has first channel and second channel, and the casing is equipped with pump cavity, and the first channel, the pump cavity and the second channel are communicated in proper order to form flow channel; The vibrator includes electrode layer, piezoelectric layer, electrode connecting layer and support layer which are connected in layers; The piezoelectric layer, electrode connecting layer and support layer form co-sintered body, the electrode layer is attached on the side of piezoelectric layer away from support layer, and the electrode connecting layer is located between piezoelectric layer and support layer; The vibrator is located in the casing and constitutes part of the side wall of the pump cavity, for driving medium to flow in the flow channel. The co-sintered body formed by sintering the piezoelectric layer and the support layer can effectively improve the yield and reliability of the finished drive pump, increase the amplitude and conversion efficiency of the vibrator, and the connection between the piezoelectric layer and the support layer is more firm, so that the performance and reliability of the drive pump are improved.

The application provides a miniaturized ear stud type positioning device based on a hybrid power supply system and an active signal enhancement technology, and belongs to the technical field of pet positioning. The device comprises a titanium alloy shell, an inner wall of the titanium alloy shell is provided with a zirconia ceramic wave-transparent layer, the titanium alloy shell is externally provided with a magnetic ear stud and a safe contact electrode, the surface of the magnetic ear stud is provided with a transparent nanowire solar film electrically connected with the safe contact electrode, the inside of the titanium alloy shell is provided with a communication layer, a processing layer and a hybrid power supply layer, and the communication layer comprises a UWB / BLE dual-mode antenna array, an IMU inertial navigation module and a signal processing FPGA module. The application can solve the long-acting power supply problem of a miniaturized device in a continuous positioning mode, has strong endurance, improves the signal transmission reliability (a positioning success rate is greater than 95%) in a complex indoor environment, has better signal penetration, realizes non-inductive wearing through an ear stud type design, has comfortable wearing, is rich in functions, integrates multi-mode sensors to realize positioning-health monitoring integration.

What is disclosed is a method of selectively transferring micro devices from a donor substrate to contact pads on a receiver substrate. Micro devices being attached to a donor substrate with a donor force. The donor substrate and receiver substrate are aligned and brought together so that selected micro devices meet corresponding contact pads. A receiver force is generated to hold selected micro devices to the contact pads on the receiver substrate. The donor force is weakened and the substrates are moved apart leaving selected micro devices on the receiver substrate. Several methods of generating the receiver force are disclosed, including adhesive, mechanical and electrostatic techniques.

A method of selectively transferring micro devices from a donor substrate to contact pads on a receiver substrate. The method may comprise: providing a donor substrate comprising the plurality of micro devices, transferring the plurality of micro devices to an intermediate substrate, aligning a selected set of micro devices on the intermediate substrate proximal to the system substrate, providing a photo-sensitive layer between the selected set of micro devices and the system receiver; turning on the selected micro devices, curing the photo-sensitive layer in between the selected set of micro devices and the system substrate by light emitted by the selected micro devices; and bonding the selected set of micro devices to the corresponding contact pads on the system substrate.

The present invention discloses a method and a system in a microdevice transfer setup. In particular it describes, where the micro devices are on a donor substrate with bonding pads and micro bonding plates. In addition, it describes when there is a system substrate including traces, driving system, bonding pads and micro bonding plate. Further use of electroplating and an electrochemically assisted bonding process is discussed.

The utility model provides a kind of micro FFC embedded intelligent module, the interface of FFC connector is fixedly installed with U-shaped hollow groove block, the upper surface of U-shaped recess in U-shaped hollow groove block middle part is transversely provided with thin film thermocouple array, the inside of U-shaped hollow groove block is provided with including ADC converter, MCU single-chip microcomputer and capacitor, the top of the left and right ends of U-shaped hollow groove block is respectively provided with green pilot lamp and red pilot lamp and with MCU single-chip microcomputer communication connection, thin film thermocouple array, ADC converter and MCU single-chip microcomputer are sequentially connected, thin film thermocouple array, ADC converter and MCU single-chip microcomputer, green pilot lamp and red pilot lamp are electrically connected with capacitor. Through the technical scheme of the utility model, thin film thermocouple array and ADC converter realize ±0.1 ℃ temperature resolution, can observe FFC flat cable overheating condition in real time, significantly reduce the risk of connector failure caused by abnormal temperature rise of micro device due to FFC flat cable, give consideration to miniaturization, high precision and long-term stability.

This invention discloses a distributed multiple access system for a symbiotic radio network based on reconfigurable holographic devices, comprising: a background network (BS / UE) and an IoT network consisting of K reconfigurable holographic devices (RHDs) and IoT receivers (IRs); each RHD integrates an antenna, a load modulator, and a reconfigurable holographic surface (RHS), which converts a reference wave carrying IoT information into a target wave and radiates it into free space by activating subwavelength radiating elements, overcoming the size limitations of traditional RIS / phased arrays; the IoT receiver (IR) employs distributed decoding based on random code-based code division multiple access (CDMA), utilizing matched filter (MF) or minimum mean square error (MMSE) receivers combined with asymptotic signal-to-interference-plus-noise ratio (SINNR) theory to eliminate the need for real-time random code feedback; the radiation pattern is optimized based on the weighted minimum mean square error (WMMSE) algorithm to maximize RHD and data rate. The advantages of this invention are: device size supports integration of micro-IoT devices; IoT SINNR is improved by more than 20dB; and it enables massive IoT device access.

The application discloses a kind of optical integrated atomic chip, it includes transparent material cuboid, two ends of transparent material cuboid are equipped with diffraction light splitting micro device respectively, and it is equipped with atomic gas chamber in the middle, and it is equipped with three-dimensional waveguide between 2 diffraction light splitting micro devices and atomic gas chamber;The diffraction light splitting micro device of left end has two diffraction light splitting regions, and each diffraction light splitting region corresponds a laser beam;The diffraction light splitting micro device of right end has a diffraction light splitting region;Laser beam forms beam splitting laser after diffraction light splitting micro device, then it is corrected beam direction by three-dimensional waveguide, so that beam splitting laser is parallelly injected into atomic gas chamber;Two sides of parallel beam splitting laser meet in atomic gas chamber and are shot.This application also provides the manufacturing method of the above-mentioned optical integrated atomic chip.The application has simple structure, small volume, and can integrate spatial optical path system, beam splitting device and atomic gas chamber into one.

Methods and aspects of processing micro device wafers having non-uniformities that can cause non-uniformities in optoelectronic systems are disclosed. In particular, the use of a mixing zone and an interference zone in a cassette made of an array of micro devices is disclosed. Additionally, one or more wafers divided into different donor zones and selected sub-arrays of micro devices are discussed. Furthermore, the integration of a donor zone with a mixing zone in a cassette is disclosed.