5results about How to "High precision forming" patented technology

This invention provides a metal film forming apparatus that uses a mask member having a mask portion made of rubber material to form a metal film with a specified pattern with high precision. The mask member (60) of the film forming apparatus (1) has a through portion (68) and a mask portion (65) made of rubber material. An insulating porous plate (30) is disposed between the electrolyte membrane (13) and the mask portion (65) to cover the through portion (68). The porous plate has a plurality of fine holes through which the electroplating solution passes.

The optical semiconductor element comprises: a base having a base surface; a table surface protruding from the base surface in a first direction intersecting the base surface and extending along the base surface; an optical waveguide layer arranged in the table surface, or arranged in the base so as to have at least a portion overlapping with the table surface in the first direction; a resistor layer having a first portion arranged on the table surface and a first extension portion extending from the first portion intersecting with the extension direction of the table surface; and a wiring layer electrically connected to the resistor layer and having a second portion partially covering the first portion and a second extension portion at least partially covering the first extension portion and extending from the second portion intersecting with the extension direction of the table surface, wherein a connection portion electrically connected to the wiring is provided at a position of the second extension portion overlapping with the first extension portion.

The present application provides an information processing device, an information processing method, and a computer readable recording medium, which can form a structure such as a film on a substrate with high precision. An example of the information processing device includes: a prediction unit configured to calculate a predicted film thickness when a substrate processing device processes a substrate based on a film thickness model and prior data, the film thickness model indicating a relationship between a state of the substrate processing device and a film thickness of a coating film formed on a surface of the substrate by the substrate processing device, and the prior data indicating a state of the substrate processing device before the substrate processing device processes the substrate; and an output unit configured to output instruction information related to processing of the substrate based on the predicted film thickness before the substrate processing device processes the substrate.

Provided is a stamping method capable of forming a perforated portion on a workpiece made of a tough material with higher precision. The stamping method of the present invention applies a first load to the workpiece made of a tough material by a stamping member to impart a preload within the elastic region of the workpiece, and then applies a second load exceeding the first load to the workpiece by the stamping member to provide a perforated portion in the workpiece, wherein the elastic region is larger than 0 MPa and is below the value of the shear stress at the limit of elastic deformation of the workpiece, the workpiece is a metal tube, and the first load and the second load are applied while the interior of the tube is hollow.