47results about How to "Formed easily and efficiently" patented technology

The present invention can provide a resist cover film-forming material which is suitably used for a resist cover film for liquid immersion exposure and can transmit ArF excimer laser lights and provide a process for forming a resist pattern using the resist cover film-forming material. The resist cover film-forming material contains a resin having an alicyclic skeleton at any of the main chain and the side chains; it is nonphotosensitive and is used in forming a resist cover film that covers a resist film during liquid immersion exposure. The process for forming of a resist pattern includes forming a resist film on a surface of a workpiece to be processed, forming a resist cover film on the resist film using the resist cover film-forming material of the present invention, irradiating the resist film with exposure light through the resist cover film by liquid immersion exposure, and developing the resist film.

Provided is a three-dimensional object formation method including: a first step of forming a film by delivering a first liquid containing at least water and a hydrogel precursor: and a second step of curing the film formed in the first step, wherein the first step and the second step are repeated a plurality of times.

A probe tip section of an electrical test probe has a laminated structure consisting of a first deposition portion and a second deposition portion covering the first deposition portion, and by the laminated structure, a maximum cross-sectional area portion at which the cross-sectional area of the probe tip section is increased to a base portion is provided between a tip end of the probe tip section and the base portion in the probe tip section. At the maximum cross-sectional area portion, a dimension in the X direction as seen on a flat surface perpendicular to a protruding direction of the probe tip section is increased in a one-dimensional way, and in addition, a dimension in the Y direction perpendicular to the X direction is increased from the tip end toward the base portion, as a result of which the cross-sectional area of the probe tip section can be increased in a two-dimensional way. Thus, the cross-sectional area at the maximum cross-sectional area portion reaching the base portion of the probe tip section can be made to be larger than in the conventional case, and along with the increase of the cross-sectional area, the stress acting on the base portion can be lowered.

In the zinc oxide film forming apparatus (1), the deposit containing zinc oxide is formed on the conductive layer of the resin substrate (9) by electrodeposition in the deposition part (2), and the resin substrate (9) is carried to the applying part (4). Subsequently, the film forming material which is in liquid or paste form and contains particles of zinc oxide and solvent is applied onto the conductive layer, and then the solvent is removed from the film forming material on the conductive layer by volatilization. It is therefore possible to easily and efficiently form the porous zinc oxide film which has superior adhesion to the conductive layer of the resin substrate (9).