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4946results about "Electrical measurement instrument details" patented technology

Device for non-dissipative measurement of the current in an inductor

The invention relates to a device for measuring current in an inductor, which device is intended to be connected in parallel with said inductor, comprising two terminals A and B. The device comprises: a network in parallel with the inductor and connected to the terminals A and B having a resistor R2 in series with a resistor R1 in parallel with a capacitor C1; a voltage offset circuit having a DC voltage generator E connected in parallel with an offset resistor (Roffset) in series with two resistors in parallel R3 and R4, the positive pole of this voltage source being connected to terminal B of the inductor; a temperature compensation circuit comprising a current source controlled as a function of the temperature, one of the two terminals of the current source being connected to the negative pole of the generator E, the other terminal of the current source being connected to different points of the measurement device according to the direction of variation of the current of the source as a function of the temperature. The measurement of voltage Vmes, the image of the current I in the inductor 12, is performed between the common point between the resistors R1, R2 of the network and the common point between the offset resistor and the two resistors R3 and R4.
Owner:THALES SA

High density integrated circuit apparatus, test probe and methods of use thereof

InactiveUS20050062492A1High performance functional testingHigh-temperature burnElectrical measurement instrument detailsManufacture of electrical instrumentsConvertersContact pad
The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer. Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires. The elastomer is cured and the mold is removed, leaving an array of wires disposed in the elastomer and in electrical contact with the space transformer The space transformer can have an array of pins which are on the opposite surface of the space transformer opposite to that on which the elongated conductors are bonded. The pins are inserted into a socket on a second space transformer, such as a printed circuit board to form a probe assembly. Alternatively, an interposer electrical connector can be disposed between the first and second space transformer.
Owner:GLOBALFOUNDRIES INC

High density integrated circuit apparatus, test probe and methods of use thereof

InactiveUS20070271781A9High performance functional testingHigh-temperature burnElectrically conductive connectionsElectronic circuit testingElastomerElectricity
The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer. Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed ion the mold to fill the spaces between the wires. The elastomer is cured and the mold is removed, leaving an array of wires disposed in the elastomer and in electrical contact with the space transformer The space transformer can have an array of pins which are on the opposite surface of the space transformer opposite to that on which the elongated conductors are bonded. The pins are inserted into a socket on a second space transformer, such as a printed circuit board to form a probe assembly. Alternatively, an interposer electrical connector can be disposed between the first and second space transformer.
Owner:GLOBALFOUNDRIES INC
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