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436 results about "Soft core" patented technology

Probe card assembly and kit, and methods of using same

A probe card assembly includes a probe card, a space transformer having resilient contact structures (probe elements) mounted directly thereto (i.e., without the need for additional connecting wires or the like) and extending from terminals on a surface thereof, and an interposer disposed between the space transformer and the probe card. The space transformer and interposer are "stacked up" so that the orientation of the space transformer, hence the orientation of the tips of the probe elements, can be adjusted without changing the orientation of the probe card. Suitable mechanisms for adjusting the orientation of the space transformer, and for determining what adjustments to make, are disclosed. The interposer has resilient contact structures extending from both the top and bottom surfaces thereof, and ensures that electrical connections are maintained between the space transformer and the probe card throughout the space transformer's range of adjustment, by virtue of the interposer's inherent compliance. Multiple die sites on a semiconductor wafer are readily probed using the disclosed techniques, and the probe elements can be arranged to optimize probing of an entire wafer. Composite interconnection elements having a relatively soft core overcoated by a relatively hard shell, as the resilient contact structures are described.
Owner:FORMFACTOR INC

Probe card assembly and kit, and methods of making same

A probe card assembly includes a probe card, a space transformer having resilient contact structures (probe elements) mounted directly to (i.e., without the need for additional connecting wires or the like) and extending from terminals on a surface thereof, and an interposer disposed between the space transformer and the probe card. The space transformer and interposer are “stacked up” so that the orientation of the space transformer, hence the orientation of the tips of the probe elements, can be adjusted without changing the orientation of the probe card. Suitable mechanisms for adjusting the orientation of the space transformer, and for determining what adjustments to make, are disclosed. The interposer has resilient contact structures extending from both the top and bottom surfaces thereof, and ensures that electrical connections are maintained between the space transformer and the probe card throughout the space transformer's range of adjustment, by virtue of the interposer's inherent compliance. Multiple die sites on a semiconductor wafer are readily probed using the disclosed techniques, and the probe elements can be arranged to optimize probing of an entire wafer. Composite interconnection elements having a relatively soft core overcoated by a relatively hard shell, as the resilient contact structures are described.
Owner:FORMFACTOR INC

Method of making a contact structure with a distinctly formed tip structure

A probe card assembly includes a probe card, a space transformer having resilient contact structures (probe elements) mounted directly to (i.e., without the need for additional connecting wires or the like) and extending from terminals on a surface thereof, and an interposer disposed between the space transformer and the probe card. The space transformer and interposer are “stacked up” so that the orientation of the space transformer, hence the orientation of the tips of the probe elements, can be adjusted without changing the orientation of the probe card. Suitable mechanisms for adjusting the orientation of the space transformer, and for determining what adjustments to make, are disclosed. The interposer has resilient contact structures extending from both the top and bottom surfaces thereof, and ensures that electrical connections are maintained between the space transformer and the probe card throughout the space transformer's range of adjustment, by virtue of the interposer's inherent compliance. Multiple die sites on a semiconductor wafer are readily probed using the disclosed techniques, and the probe elements can be arranged to optimize probing of an entire wafer. Composite interconnection elements having a relatively soft core overcoated by a relatively hard shell, as the resilient contact structures are described.
Owner:FORMFACTOR INC

Convolutional-neural-network accelerating system based on field-programmable gate array

The invention discloses a convolutional-neural-network accelerating system based on a field-programmable gate array. The convolutional-neural-network accelerating system comprises a general processor,the field-programmable gate array, a storage module, a data bus and a control bus, wherein the general processor is a soft core of a reduced instruction set, and is responsible for starting an accelerator, being in communication with a host terminal, conducting time measurement and the like; a DDR3 DRAM serves as an external storage of the accelerator system; an AXI4-Lite bus is used for demand transmission, and an AXI4 bus is used for data transmission; the field-programmable gate array comprises multiple processing engines (PE), and each processing engine adopts a most-suitable fragment unfolding strategy to correspond to calculation of one layer in the convolutional neural network; all the processing engines are mapped onto a same FPGA chip, and therefore different layers can simultaneously work in a production line mode. Compared with an existing convolutional-neural-network accelerating system, the convolutional-neural-network accelerating system based on the field-programmable gate array can obtain higher energy efficiency benefit.
Owner:SUZHOU INST FOR ADVANCED STUDY USTC

Automatic test platform of high-speed ADC chip and software framework design method thereof

ActiveCN107390109AIncrease test rateReliable high-speed data signal transmissionElectronic circuit testingTest platformAlgorithm design
The invention discloses an automatic test platform of a high-speed ADC chip and a software framework design method thereof. The design method comprises the steps of step 1, FPGA underlying logic drive design: the FPGA underlying logic part completes construction of the hardware foundation, including realizing underlying logic control, foundation computation and soft core hardware configuration of the hardware module; and synchronous drive algorithm design including the tested high-speed ADC, calibration algorithm design, hardware drive design of the onboard high-precision ADC/DAC and register array and hardware FFT operation; step 2, test parameter acquisition: the FPGA soft core receives an upper computer command to control the test process and transmits the command to the FPGA hardware program to drive an external circuit to acquire data so as to obtain the test parameter value by applying the processing algorithm, wherein the test parameters are mainly divided into static parameters and dynamic parameters; and step 3, upper computer program design. The high-precision level characteristic and the high-speed data characteristic of the chip can be simultaneously measured, and "one-key acquisition" can be realized through programming control.
Owner:苏州迅芯微电子有限公司

Soft and hard combined printed wiring board production method

InactiveCN101272660AAvoid crackingFacilitate post-processing operationMultilayer circuit manufactureHigh densityInsulation layer
The invention discloses a manufacturing method for a rigid-flex printed circuit board. A single-side flexible substrate (SSFCCL) or a resin coated copper foil (RCC) is adopted for replacing a copper foil and then is added with a prepreg or a signal-side rigid substrate or a two-side rigid substrate and then is directly laminated for preparing an internal layer on one side or two sides of a soft core plate (FPC) together with the non-flowing or lower flowing prepreg. The rigid substrate, the copper foil and the prepreg are laminated for preparing an external layer. In the invention, the single-side flexible substrate (SSFCCL) or a resin coated copper foil (RCC) is used for laminating and the toughness of the SSFCCL or the RCC substrate is used for supporting the copper foil over the exposure part of the soft plate in the rigid-flex plate; therefore, the copper foil breaking can be remarkably reduced when preparing the internal layer. The operation treatment of the late procedure is convenient and the product yield rate can be remarkably improved; the thickness of an insulation layer can be easily controlled, thus facilitating the preparation of a multilayer rigid-flex printed circuit board with characteristics of multistage and thinness and an interconnection printed circuit board (HDI) with high density.
Owner:SHANGHAI MEADVILLE ELECTRONICS

Rapid extracting method for structure light welding seam image characteristic points

The invention relates to a structure light vision detection technology, in particular to a rapid extracting method for structure light welding seam image characteristic points. In the invention, an on-site programmable gate array and a soft-core processing system are used together for improving processing speed and reducing power consumption; and the rapid extracting task for structure light welding seam image characteristic points is divided by software and hardware to extract characteristic points by software and hardware cooperation. The invention comprises the following steps: building a Programmable System-on-Chip (PSoC); carrying out mathematical morphology processing and image preprocessing on structure light stripe-containing image which is acquired by a camera sensor by the on-site programmable gate array, wherein the mathematical morphology processing comprises filtering, image enhancement, dilation and erosion, and the image preprocessing comprises edge extraction and centre line extraction; and extracting characteristic points by the soft-core processing system. In the invention, production-line working way is used among steps, thereby improving image processing speed and meeting real-time requirement of seam tracking. The invention can be widely used in the field of laser automatic welding.
Owner:SHENYANG INST OF AUTOMATION - CHINESE ACAD OF SCI

Device for online detecting and locating cable fault based on SOPC (System On Programmable Chip) technology

The invention discloses a device for online detecting and locating cable fault based on SOPC (System On Programmable Chip) technology, which comprises an FPGA (Field Programmable Gate Array) module with a NIOS II soft core, a high-speed DA module, a signal conditioning module, a separating coupling module and a high-speed AD module, wherein the FPGA (Field Programmable Gate Array) module generates detecting signals for detecting cable faults; the detecting signals are converted into analog signals by the high-speed DA module; then the analog signals are converted into detecting signals with proper amplitude by the signal conditioning module; the detecting signals are coupled into the detected cable in working state by the separating coupling module; meanwhile, the feedback signals from the cable fault points are received from the separating coupling module; the feedback signals are converted into digital signals by the high-speed AD module and the digital signals are sent to the FPGA (Field Programmable Gate Array) module with NIOS II soft core; and the fault type and fault distance information of the tested cable is acquired by the digital signals through relative calculation and fault detecting and locating algorithm. The cable fault can be detected and located in real time by the device. In addition, the device has advantages of accurate test, high test precision, strong interference resistance, high integration level and the like.
Owner:NANJING UNIV OF AERONAUTICS & ASTRONAUTICS

Highly reliable network server system on chip and design method thereof

The invention discloses an on-chip network router system with high reliability and a design method thereof, wherein, the design method of the on-chip network router system with high reliability comprises the steps that: a router soft core based on a wormhole routing swap mode and a rotation routing selection mode is designed; a corresponding SCAC coding circuit, an SCAC decoding circuit and an SCAC error correction circuit are designed for data with a specified width; and the SCAC error correction circuit is added into the router; the SCAC coding circuit and the SCAC decoding circuit are connected with the router so as to from a framework of the router system; an SCAC-TMR fault tolerance proposal is designed for the framework of the router system and the on-chip network router system with high reliability is realized; the functions of the on-chip network router system with high reliability are tested and verified and the performance of the on-chip network router system with high reliability is evaluated. The on-chip network router system with high reliability of the invention can reduce the area, the energy consumption and the expenses of the on-chip network, ensure the reliable data transmission of the on-chip network and prevent a signal jumping with a relatively long time delay from appearing on the channel, thus being more applicable to the design of fault-tolerant and multi-core processors in the future.
Owner:INST OF COMPUTING TECH CHINESE ACAD OF SCI

Flexibility motion control IP (Intellectual Property) core and implementation method thereof

The invention discloses a flexibility motion control IP (Intellectual Property) core and an implementation method thereof, belonging to the field of motion control. The IP core comprises a acceleration/deceleration module, an interpolation module, a pulse counting module, a pulse generation module, a bus controller and an RAM (Random Access Memory) interface module. The flexibility motion control IP core and the implementation method thereof aim to solve the problems that high speed and high precision cannot be achieved due to incapability of further reducing a control period since a motion control algorithm has a long running period in a general MCU (Micro Controller Unit) or DSP (Digital Signal Processor). The IP core has the characteristics of short control period and high output pulse precision, non-symmetrical linear acceleration and deceleration can be achieved, non-symmetrical S-shaped curve acceleration and deceleration can be achieved, two-axis or three-axis linear interpolation with the linear or the S-shaped curve acceleration and deceleration can be achieved, and two-axis arc interpolation at an uniform speed also can be achieved. Through the adoption of the IP core, motion control relevant algorithm is realized in a Verilog hardware description language soft core mode, the motion control relevant algorithm can be implemented in an FPGA (Field Programmable Gate Array), can be implemented in an ASIC (Application Specific Integrated Circuit) mode, and can be integrated into SoC (System On Chip), the typical working frequency is 100MHz, and feasibility is provided for building a flexibility motion control system.
Owner:SOUTH CHINA UNIV OF TECH

Industrial automatic real-time control device and method based on communication bus

The invention relates to an industrial automatic real-time control device based on a communication bus. The industrial automatic real-time control device comprises an FPGA (Field Programmable Gata Array) chip, a driving chip and a physical layer chip, wherein the FPGA chip is connected with the physical layer chip through the driving chip; the physical layer chip is connected with a real-time communication bus; and the FPGA chip comprises a PCI-E (Peripheral Component Interconnect-E) bus interface, an embedded soft core module, a driving controller module, an FIFO (First In First Out) buffer module and a PCI-E data pack resolving module. The invention further relates to a method for implementing industrial automatic real-time control based on a communication bus by using the device. In the device and the method disclosed by the invention, the FPGA chip is adopted, so that appropriate resources can be selected flexibly according to user requirements in comparison to a DSP (Digital Signal Processor) chip in the prior art; meanwhile, the device and the method have the advantages of high expandability, high processing speed, high integration degree, easiness for updating and the like; the industrial automatic real-time control device based on the communication bus has a simple structure and low cost; and the method is easy and convenient to apply, and has a wide application range.
Owner:SHANGHAI WEIHONG ELECTRONICS TECH

Preparation method of suspension polymerization powdered ink with core-shell structure

The invention provides a preparation method of suspension polymerization powdered ink with a core-shell structure. The preparation method comprises the following steps of: (1) respectively preparing monomer oil phase which contains a certain amount of polar resin and forms into powdered ink soft core resin, and aqueous dispersion liquid; (2) adding the monomer oil phase into the aqueous dispersion liquid, shearing, suspending and pelleting at high speed, transferring into a reactor, and carrying out first warming polymerization reaction to obtain the powdered ink particles with a soft core-hard shell structure; (3) taking the powdered ink with the soft core-hard shell structure as a core layer, adding positive ion monomer components, and carrying out second polymerization reaction by a water-soluble initiator to obtain soft core-hard shell powdered ink particles of which the outer surfaces are evenly distributed with intensive charge surface layers; and (4) cleaning and filtering products, sufficiently drying, and adding silicon dioxide. According to the preparation method, the shell layer which is evenly distributed with the intensive charges can be obtained according to the characteristics of the polar resin and the cation monomer component, so that the electrification evenness of the surface of the powdered ink particles can be improved, and the preparation method is good in low-temperature fixation characteristics and environmental stability.
Owner:SHENZHEN LEPUTAI TECH CO LTD
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