Soft and hard combined printed wiring board production method

A printed circuit board, soft and hard combination technology, applied in the direction of multi-layer circuit manufacturing, etc., can solve problems affecting product yield, copper foil crushing, corrosion of soft boards, etc., and achieve high inter-layer alignment accuracy and easy control , Improve the effect of product qualification rate

Inactive Publication Date: 2008-09-24
SHANGHAI MEADVILLE ELECTRONICS
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

The problem with this method is that when making the inner layer, the non-fluidity or low-fluidity prepreg substrate for bonding needs to be opened in advance, but there is only copper foil above it without substrate support. There is a height difference with the surroun

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  • Soft and hard combined printed wiring board production method
  • Soft and hard combined printed wiring board production method
  • Soft and hard combined printed wiring board production method

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Embodiment Construction

[0028] combine Figure 1 to Figure 5 The cross-sectional diagrams of the operation process of each stage will describe the manufacturing process of a preferred embodiment of the present invention in detail later.

[0029] see figure 1 , the manufacturing method of the rigid-flex printed circuit board of the present invention, the flexible board core board 1 adopts a flexible printed circuit board (FPC) as the core board of the rigid-flex printed circuit board, which includes a flexible board base material 11 and Copper foils 12, 13 on both sides of the substrate; the copper foils 12, 13 contain pre-formed circuit patterns; the board needs to have certain exposed parts, corresponding to A1, A2;

[0030] see figure 2 , use laser milling or die forming to open windows (B1, B2) on the non-flowing or low-flowing prepreg substrates corresponding to the exposed parts A1, A2 of the flexible printed circuit board (FPC);

[0031] On one side or both sides of the soft board core boa...

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Abstract

The invention discloses a manufacturing method for a rigid-flex printed circuit board. A single-side flexible substrate (SSFCCL) or a resin coated copper foil (RCC) is adopted for replacing a copper foil and then is added with a prepreg or a signal-side rigid substrate or a two-side rigid substrate and then is directly laminated for preparing an internal layer on one side or two sides of a soft core plate (FPC) together with the non-flowing or lower flowing prepreg. The rigid substrate, the copper foil and the prepreg are laminated for preparing an external layer. In the invention, the single-side flexible substrate (SSFCCL) or a resin coated copper foil (RCC) is used for laminating and the toughness of the SSFCCL or the RCC substrate is used for supporting the copper foil over the exposure part of the soft plate in the rigid-flex plate; therefore, the copper foil breaking can be remarkably reduced when preparing the internal layer. The operation treatment of the late procedure is convenient and the product yield rate can be remarkably improved; the thickness of an insulation layer can be easily controlled, thus facilitating the preparation of a multilayer rigid-flex printed circuit board with characteristics of multistage and thinness and an interconnection printed circuit board (HDI) with high density.

Description

technical field [0001] The invention relates to a method for manufacturing a printed circuit board, in particular to a method for manufacturing a soft-rigid printed circuit board, which can significantly reduce the cracking phenomenon of copper foil when making an inner layer circuit board. Background technique [0002] With the development of high-performance, multi-functional and portable electronic information products, the printed circuit board (PCB), the key electronic component, is also developing towards thinner and multi-level. But ordinary rigid printed circuit boards also have certain limitations in terms of mounting interconnections. Therefore, more and more electronic products begin to use rigid-flex printed boards (Rigid-Flex), which can use rigid parts for support and flexible parts for flexible interconnection. In this way, not only three-dimensional space can be saved, three-dimensional interconnection can be realized, but also a high degree of flexibility a...

Claims

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Application Information

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IPC IPC(8): H05K3/46
Inventor 黄伟苏陟何海洋余德超
Owner SHANGHAI MEADVILLE ELECTRONICS
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