Soft and hard combined printed wiring board production method

Abstract

The invention discloses a manufacturing method for a rigid-flex printed circuit board. A single-side flexible substrate (SSFCCL) or a resin coated copper foil (RCC) is adopted for replacing a copper foil and then is added with a prepreg or a signal-side rigid substrate or a two-side rigid substrate and then is directly laminated for preparing an internal layer on one side or two sides of a soft core plate (FPC) together with the non-flowing or lower flowing prepreg. The rigid substrate, the copper foil and the prepreg are laminated for preparing an external layer. In the invention, the single-side flexible substrate (SSFCCL) or a resin coated copper foil (RCC) is used for laminating and the toughness of the SSFCCL or the RCC substrate is used for supporting the copper foil over the exposure part of the soft plate in the rigid-flex plate; therefore, the copper foil breaking can be remarkably reduced when preparing the internal layer. The operation treatment of the late procedure is convenient and the product yield rate can be remarkably improved; the thickness of an insulation layer can be easily controlled, thus facilitating the preparation of a multilayer rigid-flex printed circuit board with characteristics of multistage and thinness and an interconnection printed circuit board (HDI) with high density.

Description

technical field [0001] The invention relates to a method for manufacturing a printed circuit board, in particular to a method for manufacturing a soft-rigid printed circuit board, which can significantly reduce the cracking phenomenon of copper foil when making an inner layer circuit board. Background technique [0002] With the development of high-performance, multi-functional and portable electronic information products, the printed circuit board (PCB), the key electronic component, is also developing towards thinner and multi-level. But ordinary rigid printed circuit boards also have certain limitations in terms of mounting interconnections. Therefore, more and more electronic products begin to use rigid-flex printed boards (Rigid-Flex), which can use rigid parts for support and flexible parts for flexible interconnection. In this way, not only three-dimensional space can be saved, three-dimensional interconnection can be realized, but also a high degree of flexibility a...

AI Technical Summary

Problems solved by technology

The problem with this method is that when making the inner layer, the non-fluidity or low-fluidity prepreg substrate for bonding needs to be opened in advance, but there is only copper foil above it without substrate support. There is a height difference with the surrounding area, and the copper foil is easily crushed in the lamination and subsequent processes

Once the post-process chemical potion invades through the copper break, it will corrode the soft board, resulting in a lot of scrap, which seriously affects the yield of the product

Images