1550 results about "Height difference" patented technology

The invention relates to the technical field of computer vision detection, and discloses a height feature information generation method, device and equipment based on point cloud and a medium, and the method comprises the steps: obtaining three-dimensional point cloud data of the surface of an object to be detected, carrying out the preprocessing of the data to obtain a target point cloud, and carrying out the reference plane fitting of the target point cloud, and calculating the vertical distance of each point in the target point cloud based on the reference plane obtained by fitting and generating height difference data, and finally extracting and outputting surface height feature information according to the height difference data. According to the method, the three-dimensional point cloud data is subjected to preprocessing noise removal, datum plane accurate fitting and height difference data separation, high-precision extraction of tiny height changes of a complex surface is achieved, the detection efficiency is improved, dependence on high-cost optical equipment is reduced, and the method is compatible with various workpiece shapes.

The present disclosure provides a cylindrical structure construction platform that both a first telescopic portion and an elastic member drive a guiding wheel to tightly abut against an outer template, adjusting radial positions of a pouring pipe and a tamping device according to an outline of the outer template by a second telescopic portion to reduce construction errors, adjusting an inclination angle of the guiding wheel by an adjusting mechanism, a slewing mechanism driving a rotary table to drive the guiding wheel to climb along a surface of the outer template, the pouring pipe is poured layer by layer from the bottom to the top of a pouring cavity to reduce a height difference during pouring for further reducing generation of air holes, the tamping device vibrates layer by layer from the bottom to the top of the pouring cavity to further eliminate the air holes.

The invention relates to a wafer probe test calibration method, device and equipment, a medium and a product, and relates to the field of semiconductor equipment, and the method comprises the steps: obtaining an initial OD value of a wafer test machine in a zero-pressure contact state between a probe on a probe card and a contact point on a wafer, and a length value of the probe; acquiring a first height difference between a first reference measurement point above the wafer and a second reference measurement point below the wafer; acquiring a second height difference between the first reference measurement point and the top surface of the wafer; acquiring a third height difference between the bottom surface of the probe card and the second reference measurement point; calculating a measurement distance value between the bottom surface of the probe and the contact point according to the first height difference, the second height difference, the third height difference and the length value; according to the method, the influence of the WAT machine difference and the product film thickness on OD value setting can be eliminated, and meanwhile, the product film layer change and the equipment state are monitored according to the target displacement value obtained through calibration.

The invention relates to a deep trench isolation structure and a preparation method thereof, and aims to solve the problems that the height difference of an etching stop layer is too large and the processing precision of a deep trench is insufficient in the prior art. According to the method, the sacrificial layer is deposited on the surface of the substrate after the shallow groove is machined, the sacrificial layer is used for protecting a non-target area in the deep groove machining process, and high-precision machining of the deep groove is achieved through the multi-stage etching technology. In the first stage, sacrificial layer materials in a deep groove region are removed step by step, and a target region is exposed; and in the second stage, the mask effect of the sacrificial layer is utilized to accurately etch to the target depth, and meanwhile, the side wall form is optimized. By reducing the height difference of the etching stop layer, the uniformity of the filling material is improved, and the smoothness of chemical mechanical polishing is improved. The method has the functions of mask protection and depth regulation and control, simplifies the process steps, reduces the manufacturing cost, is suitable for manufacturing high-density integrated circuits and power devices, and has excellent processing effect and industrial applicability.

The invention relates to the technical field of size detection, and provides a size detection method, system and device and a medium, and the method comprises the steps: obtaining a shadow image of a to-be-detected workpiece, carrying out the gray conversion or binarization processing, and smoothing the image through a Gaussian kernel filter, so as to reduce the noise and enhance the edge information; performing edge detection by using an improved Canny operator to extract object contour pixel points, calculating by using an interpolation algorithm to obtain a higher-precision object contour image, gradually traversing the contour image according to a preset track and a reference template by means of a sliding window algorithm, and calculating similarity to select a target local area; and finally, finding the highest point and the lowest point of the object contour image in the target local area, and integrating the data of each target local area according to the height difference, thereby accurately obtaining the overall size of the workpiece to be measured, and improving the accuracy and convenience of size measurement.

The invention provides an elevation data measurement method, device and equipment for a large-fall area, and relates to the technical field of engineering survey and geological survey. The method comprises the following steps: acquiring level gauge height difference data and measurement gravity data of each measurement point in a large-fall measurement area; carrying out regional division on the large-fall measurement region to obtain measurement sub-regions, and determining a gravity interference coefficient corresponding to a measurement point according to measurement gravity data and regional environment data of the measurement sub-regions; determining corrected gravity data based on the gravity interference coefficient and the measured gravity data, and determining an elevation correction item and measured elevation data; and correcting the measured elevation data according to the elevation correction item to obtain corrected elevation data corresponding to the large-fall measurement area. According to the technical scheme, the reliability and precision of elevation data measured by the level gauge in a large-fall area can be effectively improved.

A method for determining and adjusting the landing safety area of ​​an aircraft based on laser radar. It includes the following steps: setting a landing safety area; calculating whether there are points in the landing safety area that are more than 1 / 2H in height; moving the landing point A outward; calculating the height difference between the highest point and the lowest point in the landing surface, if the height difference is ≤10cm, it is considered to be relatively flat; otherwise, moving the landing point A outward. Beneficial effects of the present invention: 1. It can accurately determine the landing safety area, thereby greatly improving the safety of the aircraft during landing, which is of great significance; 2. It can automatically adjust the landing safety area without the need to pre-equip the landing point, thus saving energy consumed by the transfer, which has very important economic benefits; 3. As the price of laser radar becomes lower and lower, it has a higher cost-effectiveness than equipment such as millimeter-wave radar, image recognition and other equipment and technologies, so it has a wider application prospect.

The invention provides an open caisson sinking control method based on dynamic balance of a soil resistance field, which comprises the following steps of: judging whether an open caisson posture dynamic balance condition is met or not according to an open caisson bottom surface soil resistance vector field and an open caisson posture offset, if not, intervening space distribution of the open caisson bottom surface soil resistance vector field, and reconstructing the open caisson bottom surface soil resistance vector field; the dynamic balance condition of the open caisson posture is met; and based on the open caisson bottom surface soil resistance vector field, the height difference vectors of the adjacent bins on the open caisson bottom surface and the soil taking control matrix, a dynamic decision objective function is constructed, the objective function is solved, an optimal soil taking control matrix is obtained, and an actuator cluster is controlled to take soil from the bins on the open caisson bottom surface. According to the method, the influence of dynamic evolution of the soil resistance field of the bottom face of the open caisson on the open caisson attitude offset is considered, the soil resistance field is dynamically adjusted, the open caisson attitude is accurately controlled, and soil taking control is optimized.

The invention relates to a hydrostatic guideway and a manufacturing method thereof. The hydrostatic guideway mainly comprises four structural components, namely a supporting component, a linear shaft moving component, an oil way channel component and a connecting component. The manufacturing method of the static pressure guide rail comprises the steps that firstly, plastic pasting is conducted on the installation positions of the static pressure plates on the bottom face of the stand column, then the plastic pasting faces are scraped manually to improve contact precision and geometric precision, then the upper end faces and the lower end faces of all the static pressure plates are ground to be consistent in thickness on a grinding machine, and the height difference is within 0.002 mm; finally, the static pressure plate is connected to the stand column bottom through a torque wrench through screws, and manufacturing of the static pressure guide rail pair is completed. The invention has the following advantages: 1) the process of firstly pasting plastic and then scraping and grinding is relatively simple, and the machinability is strong; 2) the modular manufacturing cost of the components is low, and subsequent assembly debugging, maintenance and replacement are facilitated; and 3) the oil sealing edge and the guide rail surface of the lathe bed are grinding surfaces, the oil film thickness is uniform after floating, the hydrodynamic performance is close to the theoretical performance, and the problems of leakage of the oil sealing edge, non-uniform floating and the like in the traditional method are solved.

The invention belongs to the technical field of semiconductor processing, and particularly discloses a processing auxiliary device for thinning a wafer, which comprises a base body and at least one limiting piece, the limiting piece is connected with the end part of the base body, the limiting piece is provided with a mounting hole, the mounting hole is used for mounting and placing the wafer, and the limiting piece is arranged on the base body. The wafer is detachably connected with one end of the base body, and the height difference between the limiting piece and the end portion of the base body is smaller than the height difference between the wafer to be machined and the end portion of the base body. According to the invention, the wafer breaking or bending phenomenon can be reduced while the wafer thinning quality is ensured.

The embodiment of the invention relates to the technical field of automatic unstacking robots, and discloses an unstacking method and system, a controller and a computer readable storage medium, and the method comprises the steps: obtaining RGB image information and point cloud information of an ROI region through a 3D camera, recognizing a to-be-unstacked article in the RGB image information, and generating a grabbing point; the camera coordinates of the grabbing points, the length and width information of the box body of the top layer to be unstacked and the height information of the top surface of the box body are obtained through the point cloud information; and the grabbing step is executed, after the current grabbed box leaves the stack, the height difference of the original position of the current box is obtained through the 3D camera again, the detection height value of the current box is obtained, laser radar verification is selectively adopted according to different conditions, and finally efficient unstacking is achieved. By means of the technical scheme, the problem that in the unstacking process in the prior art, the detection efficiency and the operation precision are difficult to consider at the same time is solved.

The invention provides an anti-collision wafer taking method and system capable of recognizing wafer warping and a storage medium, and the method comprises the steps: arranging a contour collector on a vertical surface of a wafer of an aligner, collecting the contour point data of the wafer in the process that the wafer is rotated by the aligner, and obtaining the contour point data of the wafer; the center position determining module is used for determining the center position of the wafer, the eccentric distance between the center position and the wafer rotation center and the included angle between the projection position of the contour collector on the wafer surface and the direction of the wafer center and the wafer rotation center; according to the eccentric distance, the direction included angle and the known wafer radius, the theoretical distance from the wafer rotation center to the wafer contour is determined under the ideal condition that the wafer is not warped; according to the theoretical distance and the actual distance from the wafer contour to the wafer rotation center, the height difference between the ideal posture and the actual posture of the wafer is determined so as to judge the warping degree of the wafer, and the wafer taking height of the robot is correspondingly adjusted. Therefore, the manipulator is prevented from interfering with the wafer when taking the wafer.

The embodiment of the invention provides a container alignment control method, device and equipment and a field bridge, and relates to the technical field of port equipment. The method comprises the following steps: receiving radar data acquired by all laser radar sensors, converting the radar data into a coordinate system where the center of a lifting appliance is located, and splicing the converted radar data to obtain three-dimensional point cloud data; based on the point cloud data, determining the height difference between the lifting appliance and the corresponding end point of the target container; and generating and outputting a lifting appliance control instruction based on the height difference. According to the method, the problem of insufficient alignment control accuracy based on the laser sensor is effectively solved.

The invention provides a height-adaptive double-sided radio frequency chip performance test fixture. The height-adaptive double-sided radio frequency chip performance test fixture comprises an upper test assembly and a lower test assembly, the upper test assembly comprises an upper seat, an upper mounting groove, an upper connecting groove and an upper limiting frame. Through unique upper and lower test assembly structures, such as cooperative operation of each part in a groove and assistance of an elastic gasket, accurate alignment and stable compression of front and back test probes during double-sided chip test are ensured, the problems of alignment precision and compression strength are solved, and meanwhile, the test efficiency is improved for poor chip flatness, inclination and substrate height difference. Slidable conductor connecting blocks and elastic gaskets in the upper test assembly and the lower test assembly can be adjusted in a self-adaptive mode, good contact is guaranteed, the error test rate is reduced, and the test consistency and accuracy are improved. Through the principles of thread transmission and the like in the height adjusting assembly and in cooperation with various limiting and buffering structures, accurate and stable height adjustment is achieved, the clamp is adaptive to chip specifications of different thicknesses, the universality and the use flexibility of the clamp are enhanced, and the cost is reduced.

The invention discloses a construction method of a large-span rigid entrance porch, comprising the following steps: step 1: porch design; step 2: arch foot construction; step 3: arch column installation: 3.1, segmentation and ground assembly: segment the arch column; assemble the adjacent arch columns into larger hoisting units on the ground; 3.2, high-altitude positioning: gradually hoist from both sides to the middle according to the arch column hoisting section and adjust the spatial positioning; 3.3, measurement and design: high-altitude hoisting accurately adjusts the arch column position and position, measures the position coordinates of the arch column pipe mouth, checks the real-time height difference of the arch column to determine whether the arch column is adjusted to the position state; 3.4, high-altitude fixing: after the adjacent hoisting sections are fixed, the connecting beam and tie rod at each arch column are hoisted and fixed; step 4: arch column unloading; step 5: canopy system hoisting; step 6: canopy unloading. The application method is convenient for controlling the installation accuracy of the arch column, improving the convenience of arch column installation, and ensuring the safety and efficiency of construction.

The invention discloses a shield type hydraulic support, and belongs to the technical field of underground support safety. Comprising a base and a top beam; the bottom end of the top beam is rotationally connected with two supporting rods, and the tops of the two supporting rods are hinged. The bottom ends of the two supporting rods are rotationally connected with sliding blocks, the sliding blocks are slidably connected with the base, the sliding blocks are connected with a limiting mechanism, and an unfolding mechanism is arranged in the base; the contact area of the base is effectively enlarged and the stability of the support in mine hole operation is improved through the clamping design of clamping strips arranged in the sliding blocks and helical racks and the moving-out and supporting of the frame body; and a parallelogram structure is formed among the threaded sliding block, the supporting rod and the telescopic block, so that the threaded rod can push the telescopic block to move when rotating until the telescopic block is in contact with the ground and fill the height difference, and the adaptability of the bracket to different terrains and working environments is enhanced.

The invention provides a mountain slope transmission system catenary determining method and device, and the method comprises the steps: obtaining the arrangement parameters of a transmission system on a mountain slope, and the arrangement parameters at least comprise the horizontal distance between two fixed points of the transmission system, the vertical height difference, and the total length of a rope of the transmission system; based on the arrangement parameters, a simultaneous equation with the catenary opening coefficient as a core unknown quantity is established, and the simultaneous equation comprises the arc length constraint of the catenary and the height difference constraint of the two end points at the same time; solving the simultaneous equation to obtain a numerical solution of the catenary opening coefficient; and determining a catenary shape and a core engineering index of the transmission system on the mountain slope under the action of gravity according to the solved catenary opening coefficient. According to the method and the device, the engineering design precision is improved, and material redundancy and adjustment cost caused by shape uncertainty are saved.

The invention discloses a high-precision two-dimensional flow field measurement method based on multiple parameters of an ocean surface. In interference measurement, an along-track baseline can provide along-track interference for SAR imaging, and along-track interference SAR complex images can invert the radial velocity of a sea surface flow field; a cross-rail baseline can provide cross-rail interference for SAR and altimeter imaging, a cross-rail interference complex image can generate sea surface elevation information, the height difference between an ocean current area and other sea areas is measured to assist in judging the flow direction and position of ocean current, and an ocean earth transfer flow field is inverted; the mixed baseline can provide multi-angle observation freedom degrees of along-track and cross-track baselines for system imaging, the system can obtain multi-angle scattering characteristics of the sea surface, image saturation can be avoided under complex sea conditions, a two-dimensional sea surface wind field and sea waves can be inverted through multi-angle interference complex images, and the system has a wide application prospect. When the sea surface two-dimensional flow field is inverted, the sea background field (sea surface wind, sea wave and sea surface height) is removed, so that the measurement precision of the two-dimensional flow field can be further improved.

A fine structure manufacturing method based on mask protection and a non-contact polishing process. The method comprises the following steps: pretreatment; photoresist applying; exposure; development; non-contact polishing; and photoresist removal detection. In a fine structure machining procedure, a region of a substrate (1) that is not covered by a photoresist (2) is polished to realize material removal, and with regard to a region that is protected by the photoresist (2), that is, a mask protected region, material removal is not realized on the substrate (1), and only the photoresist (2) is removed. Since a material removal rate of the photoresist (2) is less than a material removal rate of the substrate (1), a height difference is generated between the mask protected region and the unprotected region, that is, a fine structure that needs to be manufactured is obtained.

The invention belongs to the technical field of automatic optical detection, and particularly discloses a focusing distance out-of-range pre-adjustment device and method and an automatic focusing system and method.The focusing distance out-of-range pre-adjustment device comprises distance detection equipment and a first controller which are electrically connected; the distance detection equipment is parallel to a target microscope objective, aligned with a to-be-detected object, in the automatic focusing device, and is used for detecting first height information of a to-be-detected area of the to-be-detected object and sending the first height information to the first controller; the first controller is used for judging whether a first height difference between the first height information and the first standard height information exceeds a preset focusing range of the target microscope objective or not; if yes, in the process that the to-be-detected area moves from the detection range of the distance detection equipment to the view center of the target microscope objective, the automatic focusing device and the distance detection equipment are controlled to synchronously carry out focusing coarse adjustment movement in advance along the Z axis based on the first height difference, and the over-range focusing condition of microscopic automatic focusing imaging is effectively handled.

The utility model relates to a device for measuring the three-dimensional shape of a sample with non-uniform reflectivity. The device comprises a structured light illumination element DLP, a collimating lens group, a polarizing beam splitter, a 1 / 4 wave plate, a motor, a dispersion tube lens, an objective lens, an objective table for placing the sample to be measured, a focusing lens, a dichroic mirror, a first optical filter, a first camera, a total reflection prism, a second optical filter, a second camera and a microprocessor, the 1 / 4 wave plate, the motor, the dispersion tube lens, the objective lens, the objective table, the focusing lens, the first camera and the second camera are perpendicular to the same optical axis, and the structured light illumination element DLP, the polaroid and the collimating lens group are parallel to the same optical axis and are perpendicular to the optical axis reflected by a tested sample. According to the utility model, the structure is simple, the first camera and the second camera can rapidly acquire images of two wavebands of a sample with non-uniform reflectivity based on the structured light illumination element DLP, and the microprocessor rapidly measures the height difference of the sample with non-uniform reflectivity based on the images of the two wavebands.

According to the parcel stack removing method and system on the stack removing device, the positions of parcels are detected on the basis of multiple sets of conveying belts with height differences, the positions of the parcels are corrected in combination with a compensation offset formula, and the positions of the parcels on the belts and corresponding speed information are accurately obtained; key indexes such as area distribution, number and positions (front section / middle section / tail section) of the packages on each section of conveyor belt are calculated; on the basis of key indexes, the speed of each section of belt is dynamically adjusted according to inverted-order calculation logic, and a targeted strategy is formulated by combining the parcel position (whether the parcel reaches the tail section or not), the downstream belt state (the number and area threshold) and the like; through accurate position compensation and correction, the problem of detection deviation caused by belt operation delay is solved; by means of reverse-order calculation and multi-gear speed control, dynamic matching of the speed of the upstream belt and the speed of the downstream belt is achieved, and secondary stacking is reduced; the cooperative operation strategy of the inlet conveyor belt avoids parcel slipping, and the delay starting rule of the fall belt reduces the overlapping risk.

The invention discloses an application method of an on-machine measurement technology for a three-axis machine tool. The method comprises the following steps: 1) supporting incoming material detection, calculating a Z-direction height difference, and judging whether an incoming material detection requirement is met or not; the device has the advantages of being simple in structure, convenient to operate, capable of supporting edge-finding centering detection including rectangular centering, L-shaped centering, U-shaped centering and circular centering, avoiding manual metering centering, capable of supporting measurement compensation machining detection including plane measurement compensation, circular compensation and two-point distance compensation, avoiding secondary clamping of workpieces and improving machining efficiency.

An inspection device in a radiation protection housing comprises an electromagnetic radiation-based inspection device, especially an X-ray device and a weighing device. The inspection device an endless conveyor belt for transporting products in a transport direction from an entry region to an inspection region, from there to a region for weighing, and from there to an exit region of the inspection device. An upper run of the endless conveyor belt in its path from the region for weighing to the exit region, traverses a height difference in in a height direction by means of an inclined region. The conveyor belt circulates around at least part of the inclined region and the weighing device, looking in the transport direction, is disposed immediately in front of the inclined region in the inspection device.

The invention discloses a laser point cloud bridge pier top flatness detection method, device and equipment and a storage medium, and the method comprises the steps: obtaining laser point cloud data of the surface of the top of a bridge pier, carrying out the preprocessing of the laser point cloud data, and obtaining the preprocessed target point cloud data; performing data cutting on the target point cloud data according to a preset top area and fitting a first plane equation of the preset top area; combining the point cloud data after data cutting, taking a maximum fitting plane as a guiding rule plane, respectively calculating the average distance from the plane point cloud data of all preset top areas to the guiding rule plane as a height difference, and performing color assignment and nature determination on height difference results of different areas according to a first plane equation to obtain a color determination result; and the coloring qualitative result is used as the flatness detection result of the top surface of the pier, so that the precision of the flatness detection of the top of the pier and the level of intelligent construction of the bridge are effectively improved, and the speed and efficiency of laser point cloud pier top flatness detection are improved.

The invention discloses a semiconductor structure, a forming method thereof and a method for measuring overlay error, and the structure comprises a to-be-measured wafer which comprises a measurement area; the first measuring mark is located in the measuring area, the first measuring mark comprises a first strip-shaped structure extending in the first direction and directly facing the first strip-shaped structure and a second strip-shaped structure extending in the second direction and directly facing the second strip-shaped structure, and the first direction is perpendicular to the second direction; the shape defined by the first strip-shaped structures right facing the first strip-shaped structures and the second strip-shaped structures right facing the second strip-shaped structures is rectangular. The second measurement mark is located in the measurement area, the second measurement mark surrounds the first measurement mark, the shape defined by the second measurement mark is rectangular, and a height difference exists between the top of the second measurement mark and the top of the first measurement mark. The accuracy of overlay error monitoring of the first-layer pattern of the wafer is improved, and the product yield of the wafer is improved.

The invention provides a calibration process and a calibration block of a contourgraph, and relates to the technical field of contour parameter calibration, in the calibration process of the contourgraph, first scanning data is obtained by scanning a gauge block calibration part of the calibration block, second scanning data is obtained by scanning a standard ball calibration part of the calibration block, and the first scanning data and the second scanning data are obtained based on a physical model among a probe, a rotating shaft and a sensor. The measuring height difference between the first calibration plane and the second calibration plane, the straightness of the inclined plane, the measuring diameter of the fitting circle, the actual height difference of the gauge block calibration part and the actual diameter of the standard ball calibration part are calculated, and the position relation among the probe, the rotating shaft and the sensor is calculated at least with the minimum straightness of the inclined plane as the constraint. The calibration data not only have the height of the gauge block and the diameter of the standard ball, but also introduce the straightness of the inclined plane, and the calibration data is increased, so that the calibration precision is improved, and the nonlinear error caused by the difference between a mechanical structure and a theoretical model can be reduced.

The utility model discloses a forming die of a hand bag, which comprises a bottom wall, a pair of support walls opposite to each other in the width direction and positioned on two sides of the bottom wall, and a limiting component matched with the bottom wall and used for limiting the bottom surface of a bag body, and the bottom wall is arranged at the lower ends of the pair of support walls in a relatively rotating manner; when the hand bag is formed, the two front faces of the hand bag are attached to the pair of supporting walls, the bottom face of the hand bag is attached to the bottom wall all the time through the limiting component, and then the bottom wall rotates relative to the supporting walls in the length direction, so that the height difference generated by the tops of the two opposite sides of the upper end of each side face in the height direction is changed; and finally, the bottom wall is turned back to the original position, so that the bag opening folded edges at the tops of the two opposite sides of the upper end of each side face are mutually inserted in the height direction of the bag body, in the process, the bottom face is not prone to deformation, the attractiveness of the appearance of the hand bag is guaranteed, and the yield of the hand bag is increased.

The invention provides an automatic focusing method, a measurement method and a measurement module, and the method comprises the steps: obtaining the height value of any point on the surface of a calibration wafer in m working regions, and calculating the height difference value between any two working regions in different working regions relative to the surface of the calibration wafer; m is an integer greater than or equal to 2; obtaining a first height value of a selected point on the surface of the to-be-measured wafer in the first working area through an automatic focusing system, and calculating a second height value corresponding to the selected point when the to-be-measured wafer moves to the second working area based on a height difference value between the first working area and the second working area; and automatically focusing a selected point on the surface of the wafer to be measured in the second working area based on the second height value. According to the invention, on the premise that an automatic focusing system is not added, each set of optical measurement module can be rapidly and accurately positioned to the position of the focus, and the accuracy of the wafer when the wafer is measured under the plurality of sets of optical measurement modules is improved.

The invention discloses a fiberboard polishing and grinding device and a using method thereof, and relates to the field of fiberboard polishing and grinding devices. According to the fiberboard polishing and grinding device and the using method thereof, a transmission frame, a limiting unit, an extrusion unit, a contact unit and a connecting frame are arranged in a sanding machine. According to the fiberboard polishing and grinding device and the using method thereof, the limiting plates make contact with and extrude the two sides of the fiberboard, under the action of the limiting plates, the fiberboard is limited, the situation that the fiberboard deviates in the polishing and grinding process, the polishing and grinding effects of different areas are different is avoided, the grinding effect is better adjusted by adjusting the compression degree of the guide rods, and the polishing and grinding efficiency is improved. The two connecting frames have a height difference, so that the two grinding wheels can be in contact with the fiberboard conveniently, rough grinding is performed through the front grinding wheel, fine grinding is performed through the rear grinding wheel, and the grinding effect and the grinding efficiency are guaranteed.