The invention provides a substrate chip carrier CSP package and a production method thereof. The package comprises a substrate having a middle supporting layer, opposite side walls of the middle supporting layer are provided with a plurality of connecting holes, a first metal layer is formed in each connecting hole, two end faces of the middle supporting layer are provided with first bonding pads and second bonding pads having the same quantity with the connecting holes, two ends of each first metal layer are respectively connected to the corresponding first bonding pad and the corresponding second pad, the pipe core adhering area of the middle supporting layer is provided with a plurality of ventilation holes in which cylindrical second metal layers are formed, the bonding pads of an IC chip are connected to the second bonding pads, a package body is fixedly packaged on the substrate. The substrate chip carrier CSP package is produced through the steps of thinning and scribing a wafer, connecting pipe cores by adhesive, bonding by a wire, packaging, marking, cutting and separating, testing and visually inspecting. The package body is compact in size, applied to IC components with fewer leading-out terminals, and replaces TSSOP and other conventional packaging; for an IC chip which is 0.350mm thick, the packaging thickness can be lower than 1mm.