9807 results about "Rosin" patented technology

Production of ester-based fuels such as biodiesel or jet fuel from renewable starting materials such as lignocellulosic material or algae is disclosed. Pulping and saccharification of the renewable starting materials produces carboxylic acids such as fatty acids or rosin acids, which are esterified via a gas sparged, slurry form of heterogeneous reactive distillation to yield ester-based fuels.

To provide a toner produced by emulsifying or dispersing in an aqueous medium particles containing at least polyester resin particles and by aggregating the polyester resin particles, wherein the polyester resin particles contain a polyester resin, the polyester resin is produced by condensation polymerization of an alcohol component containing 65 mol % or more 1,2-propanediol in a dihydroxy alcohol component and a carboxylic acid component containing purified rosin, and the softening point of the polyester resin is 80° C. or more and less than 120° C., and wherein the toner comprises a colorant and a releasing agent.

The invention is concerned with low rosin type halogen-free and cleaning-free flux using for lead-free solder paste, belonging to flux field. About the existing rosin type flux, the leftover after welding is high and the leavings with halogen has cauterization. The matter of this invention is 5 to 20 wt percent of organic acid activator, 10 to 29 wt percent of modified rosin, 1 to 10 wt percent of binder, 0.5 to 6 wt percent of stabilizer, 1 to 6 wt percent of surfactant, 1 to 8 wt percent of corrosion inhibitor, 1 to 10 wt percent of thickener, and the rest is solvent with high boiling point. The copper mirror after welding is not penetration, and this invention without halogen has high insulation resistance and good assistant jointing capability. The viscosity of matched solder paste is advisable to solve the high content of rosin in the flux and great smoke. The leftover after welding is colorless and transparent film and it dose not absorb water with the normal temperature without clearing to fit for the welding demand of common production.

The invention relates to a rosin cationic bitumen emulsifier. The rosin intermediate is reacted by the rosin and the polyethylene polyamine, then to condensate with the different types of the quaternary ammonium salt to get the emulsifier. The emulsifier can be used to produce the normal cationic emulsifying asphalt or the SBR modified emulsifying asphalt for the road priming oil and the felting oil. The character of the invention is to use the nature resin rosin as the material, so the cost has decreased and it meets the environment need. The emulsifying asphalt can reach the need of the standard of the China ministry of communications and the America ASTMD2397.

The invention relates to a lead free soldering clean free soldering flux with the mass percentage of organic acid activating agent 1. 5-3. 5%, surface active agent 0. 04-0. 6%, organic amine and derivant 2. 0-5. 0%, with the rest being film forming matter. The said organic acid could be one or more of the aliphatic acid mono acid or bi-acid, aromatic acid, or amino acid. The said surface active agent is one or more of the nonion surface active agent, and the said organic amine and the derivant being ethanediamine, tetramethylenediamine, diethyl ethanolamine and so on, with the said film forming material being diethyl ethanolamine or resin. The soldering flux does not have halogen, being environmental protective, good in welding, welding spot being full and luminous, without residue, no corrosion, high in isolation resistance.

Golf ball compositions including a rosin-modified polymeric composition including a conventional ionomer, acid copolymer, highly neutralized polymer, or other suitable polymer that has been modified with a rosin material to impart stiffness through increasing the flexural modulus of the material.

The invention relates to the technical field of soldering pastes, in particular to a halogen-free tin-bismuth-copper soldering paste and a preparation method thereof. A soldering flux of the halogen-free tin-bismuth-copper soldering paste consists of the following components in percentage by weight: 20 to 40 percent of polymerized rosin, 1 to 6 percent of rosin amine, 4 to 8 percent of thixotropic agent, 5 to 10 percent of organic acid, 5 to 10 percent of organic amine, 1 to 5 percent of antioxidant, 0.5 to 3 percent of surfactant and an organic solvent. The halogen-free tin-bismuth-copper soldering paste is mainly characterized by adopting the organic acid and the organic amine serving as activating agents and comprising no halogens at all, so not only the solderability is not reduced, but also the expansion rate and the insulation resistance value of the soldering paste are improved, and simultaneously the corrosivity of residues after soldering to a base material is reduced and the service life of the soldering paste is prolonged; and particularly, the peak temperature of the soldering paste during soldering is lower in favor of reducing the thermal damages to electronic components.

The invention aims to provide a thermosetting flux suitable for solder bonding of a semiconductor element and an electronic part and making solder bonding with a high bonding strength and a high heat resistant strength at a high temperature possible and a paste containing the flux and a non-lead type solder paste and with respect to the thermosetting flux, an epoxy resin, a hardening agent, and at least one of rosin derivatives having functional groups reactive on the epoxy resin and selected from maleic acid-modified rosin, a fumaric acid-modified rosin, and acrylic acid-modified rosin are used. The flux can be used in form of a solder paste while being mixed and kneaded with the non-lead type solder alloy powder.

The water soluble soldering flux specially for lead-free soldering material consists of boric acid and organic acid activator 5.0-10.0 wt%, non-ionic surfactant or cationic surfactant 0.1-1.0 wt%, co-solvent 8.0-20.0 wt%, filming agent 0.1-1.0 wt%, corrosion retardant 0.1-0.5 wt%, except deionized water. The compounding process includes the following steps: mixing co-solvent and partial deionized water, adding filming agent under stirring, adding the rest deionized water, activator and surfactant after dissolving, adding corrosion retardant while stirring to dissolve, stilling, and filtering to obtain the filtrate as the soldering flux. The water soluble soldering flux has excellent soldering assisting performance on lead-free soldering material, environment friendship and other advantages.

The invention discloses a hot melt adhesive which comprises the following components in parts by mass: 5-10 parts of EVA (ethylene-co-vinyl acetate), 2-6 parts of tackifier, 5-10 parts of diluent, 0.5-1.5 parts of antioxidant and 0.5-1.5 parts of plasticizer. The tackifier is one of rosin resin, petroleum resin, terpene resin, phenolic resin and epoxy resin; the diluent includes one or both of wax and low-molecular polyolefin; the antioxidant is phenolic antioxidant; and the plasticizer is DCHP (Dicyclohexyl phthalate). The EVA contains 20-30% of vinyl acetate monomer; and the wax is microcrystalline wax with molecular weight of 3,000-4,000 and melting point of 65-85 DEG C.

A liquid developer includes: toner particles containing a rosin resin; an insulating liquid containing an epoxy-modified compound in liquid form; and a cationic photopolymerization initiator.

The invention discloses a halogen-free cleaning-free rosin flux, and preparation and application thereof, and particularly relates to a flux suitable for surface mount lead-free welding paste, preparation of the flux and application of the flux. The flux comprises 20-50% (mass fraction, the same below) of rosin, 5-25% of film-forming agent, 30-50% of high boiling solvent, 3-8% of activator and 2-5% of thixotropic agent, and the flux does not contain any halogen. In order to control growth of interface IMC (intermediate compound) during welding, 0.3-1% of combined inhibitor is added. The welding paste prepared with the flux and lead-free tin-silver-copper powder has the advantages of excellent printing performance, fine weldability, less post-weld residue, thin and even welding spot interface IMC and excellent mechanical property, and is capable of meeting the requirement of high-end electronic products on packaging.

A primer coating is provided for use on polymeric substrates to enhance adhesion of liquid toner to the substrates for printing in an electrophotographic printing device. The primer coating is water-based and includes a dispersion of a copolymer of ethylene and acrylic or methacrylic acid, and a compatible adhesion enhancer selected from an aliphatic polyurethane dispersion, a hydrogenated hydrocarbon rosin or rosin ester dispersion, and an amorphous acrylic polymer dispersion. The coating may also include additives such as wetting agents, antiblocking agents, matting agents, and waxes. The primer coating may be applied to a variety of polymeric substrates including polypropylene, biaxially oriented polpypropylene, polyethylene terephthalate, and polyvinyl chloride.

The present invention relates to a composite water-proof material. It is made up by using (by weight portion) 20-70 portions of plant fibre, 10-60 portions of flyash and 5-40 portions of adhesive through the processes of mixing them, die-pressing and polymerization. The described adhesive is formed from maleic anhydride, phthalic anhydride, polyalcohol, styrene or mixture of their homologous compounds, also can include trimeric cyanamide, acrylic acid or rosin and dicyclopentadiene. Its raw material composition also can include 10-40 portions of new and old plastics. Said plate material has strong strength and good water-proof property, so that it has extensive application range.

This invention is related to modified alkylphenol aldehyde resins and a method for preparing them from the reactions of alkylphenols, aldehydes, amines, rosins and fatty acids. When used in rubber compounds, these modified alkylphenol aldehyde resins provide much improved tack properties.

The invention discloses a laboratory model testing device for tunnel excavation. The laboratory model testing device comprises a model box, a tunnel structure model, a loading device and an excavation device, wherein the model box is composed of a floor trough and an organic glass plate, the organic glass plate is fixed on the opening surface of the floor trough through a groove; model testing fillers are padded in the model box; the tunnel structure model is made of rosin materials in a casting manner according to the ratio of similitude of an actual tunnel section, and is arranged in the middle of the model box; the loading device mainly comprises a counter-force beam, a steel plate and a hydraulic jack, and is arranged on the top of the model box; the excavation device mainly comprises a heating wire, a lead and a power supply switch, wherein the heating wire is arranged in the tunnel structure model. Due to the adoption of the testing device, the shape and size simulation in the tunnel excavation process can be performed conveniently, an excavation boundary can be well matched with a geometric boundary designed in advanced, the simulated tunnel excavation can be relatively well matched with an actual engineering; the testing device is simple in structure, convenient to operate, low in cost, and convenient to develop and apply.

The invention discloses a hot melt adhesive used for automotive interiors, and a preparation method of the hot melt adhesive. The hot melt adhesive used for automotive interiors is characterized by comprising a proportion of paraffin, polyethylene wax, a thermoplastic elastic body SBS, random polyolefin, polyethylene vinyl acetate, C5 petroleum resin, rosin pentaerythritol ester, antioxygen, coupling agent and filler. The preparation method comprising the following steps: heating a stirring kettle to 140 to 160 DEG C, and adding the paraffin and the polyethylene wax; adding the thermoplastic elastic body SBS, vacuum-pumping and keeping warm, adding HMW(high molecular weight) random polyolefin I, HMW random polyolefin II and the antioxygen; adding the coupling agent and the filler; cooling, and adding polyethylene vinyl acetate I and polyethylene vinyl acetate II; cooling and adding the C5 petroleum resin; adding the rosin pentaerythritol ester and keeping warm; and emptying the stirring kettle, pressurizing, discharging and forming. No pollution or poison is produced during the production process of the hot melt adhesive; and the hot melt adhesive has the advantages of high adhesion strength, long opening time, good temperature resistance, strong ageing resistance, good tenacity, strong waterproofness and the like.