5results about How to "Improve solderability" patented technology

The utility model relates to medical instrument technical field especially, more particularly to a kind of adapter applied to monitor, including shell, shell is covered with plug, connecting seat and socket connected in sequence, wherein, the front end of plug is provided with two rows of connecting holes, the rear end of plug is equipped with two rows of elastic sheet corresponding with connecting hole and two skeletons for fixing elastic sheet, and skeleton is connected with plug.The elastic sheet is installed in the plug in the application, the connecting hole is corresponding with the elastic sheet, when the adapter is inserted or pulled out from the connector of monitor, the convex needle is contacted or disconnected with the elastic sheet, so that the elastic sheet occurs elastic deformation or rebound movement, the structure and manufacturing process of elastic sheet are simple, and have good elasticity, conductivity and weldability, the production cost is lower, meet the demand of disposable wrapping use.

This utility model relates to the field of flattening roller technology, and proposes a flattening roller structure, including a fixing part and a flattening part. The flattening part is coaxially fixed to the fixing part and is used to flatten the electrode tab. The flattening part has a conical structure, and the outer diameter of the end of the flattening part near the fixing part is larger than the outer diameter of the end away from the fixing part. It also includes a blocking part, which is coaxially fixed to the end of the flattening part away from the fixing part, and the periphery of the blocking part extends outward from the periphery of the flattening part. This utility model, by providing a blocking part at the end of the flattening part and allowing the periphery of the blocking part to extend outward from the periphery of the flattening part, allows the blocking part to guide the electrode tab when the flattening part flattens it, preventing the electrode tab from blocking the center hole of the winding core. This eliminates the need for other components to block the center hole of the winding core in the flattening mechanism, reducing the structural complexity of the flattening mechanism and improving its overall performance and cost-effectiveness.

This invention provides a high-temperature conductive silver paste for a microcrystalline glass thick-film heating plate, its preparation method, and sintering process. The high-temperature conductive silver paste for the microcrystalline glass thick-film heating plate, by mass percentage, comprises: silver powder: 75-85%; composite glass powder: 1-5%; organic carrier: 10-24%. The composite glass powder comprises component A and component B in a mass ratio of 1-3:1. Component B is silicon micropowder. Component A, by mass percentage, comprises: silicon oxide: 35-50%; boric acid: 20-30%; magnesium oxide: 10-15%; aluminum oxide: 5-10%; titanium oxide: 3-5%; and zirconium oxide: 1-2%. The high-temperature conductive silver paste for the microcrystalline glass thick-film heating plate prepared by this invention has high solderability, strong adhesion, a maximum operating temperature exceeding 450℃, strong resistance to high current impact, high re-firing stability, and excellent overall performance.

The application discloses a kind of composite tin paste for SEM chip and preparation method thereof, belong to composite tin paste technical field, including SnAgCu alloy spherical powder, spherical copper powder and soldering paste;Wherein, the particle size range of SnAgCu alloy spherical powder is 20~75 μm;The particle size range of the spherical copper powder is 1~60 μm;The mass percentage of the spherical copper powder in the total mass of alloy contained in the composite tin paste is 20%~70%;The soldering paste includes by mass percentage: rosin resin 40%~60%, organic acid activator 5%~15%, thixotropic agent 3%~8%, antioxidant 0.1%~5%, and the balance is organic solvent.The application adds the spherical copper powder with mass percentage 20%~70% and particle size range 1~60 μm in SnAgCu alloy spherical powder, substantially replaces expensive silver, significantly reduces the raw material cost of tin paste under the premise of guaranteeing or even improving welding performance, overcome the technical problems that the cost of existing SnAgCu tin paste is high due to high silver content.

The utility model belongs to shielding case technical field, concretely relates to a new energy automobile sensor shielding case, including the cover body of integrated structure, elastic buckle and support leg, material selection chooses white copper or tinplate, is made through blanking, bending process, has nickel on the surface electroplating, on the basis of nickel plating layer, electroplating has a layer of bright tin again, the side of cover body is equipped with the reserved hole, the part of cover body connection is shaped to have dovetail block, forms the dovetail groove between every two dovetail blocks, the dovetail block of cover body both ends is alternately distributed, and the elastic buckle is used for reinforcing sensor and cover body fixed strength, is located in the reserved hole, the support leg is L type, and the length end of a section is vertically arranged with cover body, the other section is parallel with cover body, and the lower end of the section of support leg parallel with cover body is equipped with the protruding part, and the vertical mounting hole is equipped in the support leg middle. Through the setting of above-mentioned component, not only shielding case shielding effect is good, and makes the installation fixed effect of shielding case and sensor good while the convenience of dismounting improves, reduces production cost simultaneously.