Non-halide cleaning-free welding flux for leadless solder

A lead-free solder and flux technology, used in welding media, welding equipment, welding/cutting media/materials, etc., can solve the problems of large board surface corrosion, high ion residue, low insulation resistance, etc., to achieve high insulation resistance, Good solderability, full and bright solder joints

Inactive Publication Date: 2007-10-31
CENT SOUTH UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the fluxing effect of this flux is good, but the hydrochloride or hydrobromide containing organic amines has high ion residues after welding, which will corrode the board surface greatly and the insulation resistance is not high.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0016] Embodiment 1: Add the film-forming substance in the raw material, that is, rosin or resin, into a stainless steel rosin barrel and heat it to about 130°C to make it completely melted; Or the mixed solvent of isopropanol and ethanol (the mass percent of mixed solvent is isopropanol 75%, ethanol 25%) slowly joins in the rosin of melting or resin after dissolving completely, and constantly stirs, and medicament is dispersed evenly. After the solvent is completely volatilized, use a hydraulic press to press the prepared agent into the tin wire. Finally, it can be drawn into solder wires of various specifications by a wire drawing machine.

[0017] The concrete mass percent of each raw material component is:

[0018] Palmitic Acid 0.7%

[0019] Salicylic Acid 2.8%

[0020] Dibromobutenediol 0.3%

[0021] Aniline 2.0%

[0022] Triethanolamine 1.2%

[0023] Hydrogenated rosin balance

[0024] The halogen-free no-clean flux in the lead-free solder wire of the present inv...

Embodiment 2

[0026] Embodiment 2: preparation method and using method are the same as embodiment 1.

[0027] The concrete mass percent of each raw material component is:

[0028] Salicylic Acid 2.5%

[0029] 4-tert-Butylbenzoic acid 1.0%

[0030] Dibromobutenediol 0.4%

[0031] Diethylhydrazine 2.0%

[0032] Triethanolamine 1.0%

[0033] FSN0.04%

[0034] Hydrogenated rosin balance

[0035] The flux expansion rate of this solution is 82%, the wetting time is less than 2 seconds, and the surface insulation resistance after constant temperature and humidity is 5×10 11 Ω, no copper mirror corrosion. Fully meet the Japanese Industrial Standard JIS Z 3197-1999.

Embodiment 3

[0036] Embodiment 3: preparation method and using method are the same as embodiment 1.

[0037] Adipic acid 2.5%

[0038] Malic acid 1.0%

[0039] TX-10 0.06%

[0040] Aniline 2.0%

[0041] Ethylenediamine 1.2%

[0042] Maleic acid rosin resin balance

[0043] The flux of this solution has passed the test of Japanese Industrial Standard JIS Z 3197-1999, the expansion rate is 80%, the wetting time is less than 2 seconds, and the surface insulation resistance after constant temperature and humidity is 3×10 11 Ω, no copper mirror corrosion.

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PUM

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Abstract

The invention relates to a lead free soldering clean free soldering flux with the mass percentage of organic acid activating agent 1. 5-3. 5%, surface active agent 0. 04-0. 6%, organic amine and derivant 2. 0-5. 0%, with the rest being film forming matter. The said organic acid could be one or more of the aliphatic acid mono acid or bi-acid, aromatic acid, or amino acid. The said surface active agent is one or more of the nonion surface active agent, and the said organic amine and the derivant being ethanediamine, tetramethylenediamine, diethyl ethanolamine and so on, with the said film forming material being diethyl ethanolamine or resin. The soldering flux does not have halogen, being environmental protective, good in welding, welding spot being full and luminous, without residue, no corrosion, high in isolation resistance.

Description

technical field [0001] The invention relates to soldering flux, in particular to a halogen-free and no-cleaning flux for lead-free solder wires. Background technique [0002] At present, most of the fluxes in lead-free solder wires used for manual or automatic soldering in the electronics industry contain halide activators, which not only have many residues but also are highly corrosive, which will seriously affect the reliability of products. In order to ensure the quality of the product, it needs to be cleaned with a solvent, and most of the cleaning agents used today are hydrocarbon compounds containing fluorine and chlorine substituents, such as CFC113 and trichloroethane. These substances have a serious damage to the atmospheric ozone layer and will give It has caused serious damage to the human ecological environment and has been banned by the United Nations from production and use. Therefore, with the rapid development of the electronics industry and the improvement ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/363
Inventor 司士辉肖辉
Owner CENT SOUTH UNIV
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