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1247 results about "Polyetherimide" patented technology

Polyetherimide (PEI) is an amorphous, amber-to-transparent thermoplastic with characteristics similar to the related plastic PEEK. Relative to PEEK, PEI is cheaper, but is lower in impact strength and usable temperature.

Preparation method of graphene oxide and magnetic mesoporous silica composite material capable of adsorbing pollutants in water

InactiveCN103432996AAdjust the content of magnetic substancesLow costOther chemical processesAlkali metal oxides/hydroxidesAlkanePolyetherimide
The invention relates to a preparation method of a composite material prepared by graphene oxide and magnetic mesoporous silica microspheres through chemical bonding interaction. The magnetic particles are prepared by a hydrothermal process; after acid ultrasonic treatment, the magnetic particles are firstly coated with a thin silicon oxide shell layer by a sol-gel method; after that, long-chain alkane is taken as a pore-forming agent, the magnetic particles are copolymerized with tetraethyl orthosilicate (TEOS) in the sol-gel reaction, and then the pore-forming agent is removed by thermal etching, so that the magnetic mesoporous silica particles with certain hydroxyl on the surfaces can be obtained; polyetherimide (PEI) surface modification is carried out on the magnetic mesoporous silica particles, and strong interaction between PEI and silicon hydroxyl is utilized; finally, the carboxyl on ethylene dichloride (EDC) activated graphene oxide reacts with amino on the PEI, so that the graphene oxide magnetic mesoporous silica composite material can be obtained. The preparation method is simple, convenient and controllable and is favorable for amplification preparation. The composite material has large specific surface area and good magnetic controllability, and can adsorb humic acid and heavy metal ions Pb (II) at the same time by virtue of surface groups.
Owner:TONGJI UNIV

Multi-layer plastic articles and methods of making the same

A three-dimensional, multi-layer plastic product that is resistant to damage caused by environmental factors such as heat, chemicals, desiccants, oxygen, and/or weather is disclosed. The multi-layer product includes an engineering resin layer affixed to a commodity resin layer. The engineering resin layer of the multi-layer film may be directly fused to the commodity resin or post-consumer regrind layer. Alternatively, the engineering resin layer may be tied to the commodity resin or post-consumer regrind layer through the use of one or more adhesive and/or tie layers. The commodity resin layer may be manufactured from an economical polymer material such as a polypropylene, polyethylene, polystyrene or post-consumer regrind. Suitable engineering resins may be any of a variety of suitable materials such as a polysulphone, polymethylpentene, polyester, polycarbonate, polyetherimide, nylon, polyarylate, polyphenylenesulphide, polyphenylene oxide, polyethersulphone, aromatic polyketone, liquid crystal polymer, and mixtures thereof, for example, a method for manufacturing a three-dimensional multi-layer plastic product is also disclosed which includes the steps of providing an extruded or laminated sheet comprising an engineering resin layer, thermoforming a three-dimensional shell from the sheet, and injection molding a commodity resin layer onto the thermoformed shell.
Owner:RUBBERMAID

Resin composition and adhesive film for multi-layered printed wiring board

Resin compositions, which contain: (a) a heat-resistant resin which is soluble in organic solvents wherein the heat-resistant resin is one or more heat-resistant resin(s) selected from the group consisting of a polyimide resin, a polyamide-imide resin, a polyamide resin, a polyether imide resin, a polybenzoxazol resin, a polybenzimidazole resin, copolymers thereof, and mixtures thereof; (b) a thermosetting resin; (c) a filler; and (d) resin having a polybutadiene structure and/or a polysiloxane structure, wherein: the heat-resistant resin (a) and the thermosetting resin (b) are present in a weight ratio of heat-resistant resin (a) to thermosetting resin (b) of from 100:1 to 1:1; the heat-resistant resin (a), thermosetting resin (b), and filler (c) are present in relative amounts such that weight ratio of the total amount of heat-resistant resin (a) and thermosetting resin (b) to filler (c) by weight is from 100:1 to 3:2; the resin having a polybutadiene structure and/or a polysiloxane structure (d) is present in an amount of 0.1 to 15 parts by weight based on 100 parts by weight of the heat-resistant resin (a); and the heat-resistant resin (a), thermosetting resin (b), filler (c), and resin having a polybutadiene structure and/or a polysiloxane structure (d) are present in a total amount of not less than 70% by weight, based on the total weight of the resin composition, are useful for preparing adhesive films, which are, in turn, useful for forming interlayer insulation layers for multi-layered printed wiring boards having an excellent mechanical strength and capable of being roughened by an oxidizing agent.
Owner:AJINOMOTO CO INC
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