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Leadless tellurate low melting glass used as cementation phase in electronic slurry

A technology of lead-free tellurite and low-melting glass, which is applied in the composition of lead-free and cadmium-free low-melting tellurate glass, and in the field of lead-free and cadmium-free low-melting tellurate glass, which can solve the problems of inability to react badly , to achieve good hardness and chemical stability

Inactive Publication Date: 2008-04-23
BEIJING INSTITUTE OF GRAPHIC COMMUNICATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, another requirement for the bonding phase of the electronic paste is that the various components in the low-melting glass cannot chemically react with the functional powder of other components in the electronic paste or have adverse effects during application

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] The various raw materials in the glass composition use the corresponding industrial grade oxide or carbonate powder, and the glass composition is: TeO 2 80%, V 2 o 5 5%, Bi 2 o 3 5%, Sb 2 o 3 2%, Ag 2 O 5%, BaO 3%. Grind commercially available industrial grade tellurium oxide, vanadium pentoxide, silver oxide, bismuth oxide and barium carbonate, accurately measure according to the formula, and mix evenly. Melt in an alumina crucible at 750°C for 30 minutes, and then pour and press the molten glass into thin sheets. After the glass flakes are ground, pass through a 100-mesh sieve, and then be ground to an ultrafine powder with an average particle size of 4 μm by airflow for use.

[0030] The glass transition temperature of the glass obtained by differential thermal analysis was 271°C.

[0031] Low-melting glass is used to make silver conductive pastes. The silver conductive paste is composed of ultrafine flaky and spherical silver powder with an average par...

Embodiment 2

[0034] The various raw materials in the glass composition use the corresponding industrial grade oxide or carbonate powder, and the glass composition is: TeO 2 50%, V 2 o 5 35%, Bi 2 o 3 3%, B 2 o 3 1%, ZnO 2%, SiO 2 3%, CaO 2%, BaO 4%. Grind commercially available industrial grade tellurium oxide, vanadium pentoxide, bismuth oxide, boric anhydride, zinc oxide, silicon oxide, calcium carbonate and barium carbonate, accurately measure according to the formula, and mix evenly. Melt in an alumina crucible at 900°C for 40 minutes, and then pour and press the molten glass into thin sheets. After the glass flakes are ground, pass through a 100-mesh sieve, and then be ground to an ultrafine powder with an average particle size of 3 μm by airflow for use.

[0035] The glass transition temperature of the glass obtained by differential thermal analysis was 347°C.

[0036] Low melting glass is used to make graphite conductive paste. The average particle size of the conduct...

Embodiment 3

[0039] The various raw materials in the glass composition use the corresponding industrial grade oxide or carbonate powder, and the glass composition is: TeO 2 25%, V 2 o 5 25%, Bi 2 o 3 15%, Al 2 o 3 4%, SiO 2 4%, BaO 6%, ZnO 8%, Sb 2 o 3 4%, MgO 2%, CaO 2%, B 2 o 3 5%. After grinding commercially available industrial grade tellurium oxide, vanadium pentoxide, bismuth oxide, aluminum oxide, silicon oxide, zinc oxide, antimony oxide, magnesium carbonate, barium carbonate, calcium carbonate and boric anhydride, and accurately measuring according to the formula, well mixed. Melt in a quartz crucible at 1000°C for 50 minutes, then pour the molten glass into clean water. After drying in an oven at 130°C, the glass particles are ground, passed through a 100-mesh sieve, and then ground to an ultra-fine powder with an average particle size of 3 μm for use.

[0040] The glass transition temperature of the glass obtained by differential thermal analysis was 389°C. ...

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Abstract

The leadless tellurate low melting glass is used as binder phase for preparing electron paste. Said glass is mixed with functional powder to produce composite powder, which is then dispersed in organic solution to prepare thick paste, i.e. electron paste, used for making various kinds of electron devices. Said low melting glass, during sintering, melts-out and takes effect of adhering. The sintering temperature is between 350-600deg.C when making electron device. The components of the glass are (mass percentages): TeO2 10-90%,V2O5 0-40%,SiO2 0-5%,B2O3 0-5%,ZnO 0-10%,Bi2O3 0-20%,Sb2O3 0-8%,Al2O3 0-4%,SnO2 0-6%,Ag2O 0-10%,BaO 0-5%,MgO+CaO 0-5%.

Description

technical field [0001] The invention relates to a composition of lead-free and cadmium-free low-melting tellurate glass used as a bonding phase in electronic paste. Electronic paste is mainly used to make various electronic components, involving a wide range of industrial fields, including conductive paste, resistance paste and dielectric paste. Electronic paste is mainly composed of three parts: functional powder, organic carrier and low-melting glass that acts as a bond during high-temperature sintering. The invention relates to a lead-free and cadmium-free low-melting tellurate glass used as a bonding phase in electronic paste. It melts and softens when the electronic paste is sintered to play a bonding role. Background technique [0002] Most of the low-melting glasses currently used as the binder phase in electronic pastes are lead borate and lead silicate glasses. Due to the harm of lead to the environment and human body, various electronic components are required t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C03C8/24
Inventor 罗世永
Owner BEIJING INSTITUTE OF GRAPHIC COMMUNICATION
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