56 results about "Ground pattern" patented technology

A printed wiring board includes: a first insulating layer having a first main surface and a second main surface opposite to the first main surface; a first wire pattern, a second wire pattern, and a first ground pattern that are disposed on the second main surface and extend along a first direction in a plan view; a second ground pattern disposed on the first main surface; an adhesive layer disposed on the second main surface so as to cover the first wire pattern, the second wire pattern, and the first ground pattern; a second insulating layer disposed on the adhesive layer and having a third main surface facing the adhesive layer and a fourth main surface opposite to the third main surface; a third ground pattern disposed on the fourth main surface; and a first conductor layer and a second conductor layer.

A characteristic impedance control structure includes a first and a second transmission line, a ground pattern and a ground component. The first transmission line and the ground pattern extend along a plane. The ground pattern is spaced from the first transmission line by a first distance. The second transmission line extends along a direction and electrically connects to the first transmission line. An angle between the direction and the plane is greater than zero. The second transmission line has an outer diameter. The ground component extends along the direction and is electrically connected to the ground pattern. The ground component is next to and spaced from the second transmission line by a second distance. The ground component has a length along the direction. The first distance is less than or equal to twice the length. The second distance is less than or equal to five times the outer diameter.

A wearable electronic device that can be worn on the ear of a user, according to one embodiment of the present disclosure, comprises: a housing including a body and a stem extending from the body; a carrier disposed inside the stem; a printed circuit board which is disposed on the carrier and which has a power supply disposed thereon; a flexible connection member connected to the printed circuit board; and a conductive pattern formed on the outer surface of the carrier, wherein the conductive pattern can include: a power supply point electrically connected to the power supply; an antenna pattern extending from the power supply point; and a ground pattern which extends from the power supply point, and which overlaps the flexible connection member so as to form capacitive coupling.

To provide a vehicle display device capable of suppressing the propagation of noise through an elastic member.SOLUTION: A vehicle display device 10 comprises: a display 50 having a display surface 51a for displaying information; a housing 30 that accommodates the display 50 and has an opening 31; a protective panel member 40 that is formed in a plate shape with light transmittance, and that closes the opening 31 of the housing 30, and has the display surface 51a bonded to its rear surface on the side of an accommodation space Sp of the housing 30; a circuit board 20 that is positioned on a rear surface side of the display 50 and has a ground pattern 21; and an elastic member 70 that is mounted on a surface 20F of the circuit board 20 facing the display 50, and made of a conductive material that presses the display 50. The circuit board 20 has a mounting pattern 22 being a region where the elastic member 70 is mounted, and formed as a conductive pattern different from the ground pattern 21 on the surface 20F at a position apart from the ground pattern 21.SELECTED DRAWING: Figure 1

An apparatus for providing a thin film and an electronic device including a display device fabricated by the apparatus are disclosed. The apparatus may include an electrostatic chuck to absorb and support a substrate and a supply nozzle to supply chemical liquid onto the substrate, and wherein the electrostatic chuck includes a base, at least one first electrode pattern on the base, at least one second electrode pattern provided on the base and spaced and / or apart (e.g., spaced apart or separated) from the first electrode pattern (e.g., the at least one first electrode pattern), and at least one ground pattern provided on the base and spaced and / or apart (e.g., spaced apart or separated) from the first electrode pattern (e.g., the at least one first electrode pattern) and the second electrode pattern (e.g., the at least one second electrode pattern).

To realize a substrate configuration suitable for inspection and maintenance.SOLUTION: A game machine includes a first substrate, which is a multilayer substrate having a surface layer, a back layer, and one or more inner layers. On the first substrate, a power supply voltage pattern connected to the power supply voltage terminal of a connector attached to the surface layer or back layer and a ground pattern connected to the connector's ground terminal on the inner layer. A test point for either the power supply voltage pattern or the ground pattern is provided, on the surface layer or back layer, near an interlayer conductor part for electrical connection to the inner layer.SELECTED DRAWING: Figure 41

An antenna module according to one embodiment comprises: a flexible printed circuit board (FPCB) having a first ground pattern formed on both sides of a feed line, which is formed on one surface thereof, and spaced apart from the feed line; a first dielectric substrate connected to a feeding pattern in which a first metal mesh pattern operating as a radiator is formed on one surface of the FPCB; and a second dielectric substrate connected to a second ground pattern in which a second metal mesh pattern operating as a ground is formed on the other surface of the FPCB.

A printed circuit board includes a bendable portion. The bendable portion is bendable in a bending direction in plan view and has a first dielectric layer, a signal pattern, a second dielectric layer, a cloth, and a ground pattern. The first dielectric layer has a first main surface. The signal pattern is arranged on the first main surface. The second dielectric layer has a second main surface and a third main surface opposite to the second main surface, and the second main surface is arranged to face the first main surface. The cloth includes a plurality of first reinforced fibers extending in a first direction in plan view and a plurality of second reinforced fibers extending in a second direction inclined with respect to the first direction in plan view, the plurality of first reinforced fibers and the plurality of second reinforced fibers being knitted together in a cloth form.

The utility model provides a display device for a vehicle. The display device can restrain noise from being transmitted through an elastic component. A vehicle display device is provided with: a display having a display surface on which information is displayed; a housing that accommodates the display and has an opening; a protective panel member that is formed in a translucent plate shape that blocks the opening of the housing, and that adheres the display surface to the rear surface of the housing on the housing space side; a circuit board located on the rear surface side of the display and having a ground pattern; and an elastic member which is made of a conductive material, is mounted on the surface of the circuit board facing the display, and presses the display. The circuit board has a mounting pattern, which is a region where the elastic member is mounted, and which is formed on the surface at a position away from the ground pattern as a conductive pattern different from the ground pattern.

Disclosed herein is a wireless module that includes an oscillation circuit component and an RFIC mounted on a multilayer substrate. The oscillation circuit component includes a clock terminal and a first ground terminal. The RFIC has a second ground terminal that supplies a ground potential to a clock circuit therein and a third ground terminal that supplies a ground potential to an RF circuit therein. The multilayer substrate includes a first conductor layer positioned closest to the plurality of pad electrodes of the RFIC and including a first ground pattern connected to the first and second ground terminals and a second ground pattern connected to the third ground terminal. The first and second ground patterns form a gap between the second and third ground terminals in a plan view as viewed in a stacking direction of the multilayer substrate.

An electronic apparatus includes: an electronic component; a substrate including a first layer at which the electronic component and a first ground pattern are disposed, and a second layer at which a second ground pattern is disposed; and a case which is in contact with the first ground pattern, covers the electronic component, reduces magnetic noise, and is fixed to the substrate, and plural conductors connecting the first ground pattern and the second ground pattern are disposed along a portion of the first ground pattern, the portion being in contact with the case.

To provide an electronic device capable of suppressing deterioration of radiation noise.SOLUTION: The electronic device 100 includes a main board 20, a semiconductor package 30, a shield cover 60, and a ground conduction portion 70. A main ground pattern 27 is formed on the main substrate 20. The semiconductor package 30 is mounted on the main board 20, and includes a semiconductor chip 40, a package substrate 50 on which the semiconductor chip 40 is mounted, and a package ground pattern 57 formed around the semiconductor chip 40 on the package substrate 50. The shield cover 60 is used to dissipate heat from the semiconductor chip 40 and includes a shield portion 62. The shield portion 62 is formed of a conductive material and is disposed so as to cover the semiconductor chip 40. The ground conductive portion 70 electrically connects the shield portion 62 to the package ground pattern 57.SELECTED DRAWING: Figure 3

To provide a game machine capable of suppressing a decline in security against unauthorized access to an electronic board.SOLUTION: An insulating film is formed and multiple surface-mounted electronic components and insertion-mounted electronic components are mounted on the front board surface of a first main-side board on which solid ground patterns are applied. The insulating film is formed and only multiple surface-mounted electronic components are mounted without mounting insertion-mounted electronic components on the front board surface of a second main-side board on which solid ground patterns are not applied. The multiple surface-mounted electronic components mounted on the front board surface of the first main-side board include specific surface-mounted electronic components having an exterior of a specific color. The insertion-mounted electronic components mounted on the front board surface of the first main-side board include special insertion-mounted electronic components having an exterior of a special color different from the color of the insulating film formed on the first main-side board and the color of the specific surface-mounted electronic components. The specific surface-mounted electronic components and the special insertion-mounted electronic components are arranged adjacent to each other with an electronic component-unmountable area in between.SELECTED DRAWING: Figure 129

Disclosed is a semiconductor package comprising a redistribution substrate and a semiconductor chip on the redistribution substrate. The redistribution substrate includes a plurality of first conductive patterns including a pair of first signal patterns that are adjacent to each other, and a plurality of second conductive patterns on surfaces of the first conductive patterns and coupled to the first conductive patterns. The second conductive patterns include a ground pattern insulated from the pair of first signal patterns. The ground pattern has an opening that penetrates the ground pattern. When viewed in plan, the pair of first signal patterns overlap the opening.

A circuit board of a switching power supply device includes a positive terminal circuit pattern and a negative terminal circuit pattern that are provided on a component mount surface and respectively supply currents from input parts to two input terminals of a common mode choke coil. The positive terminal circuit pattern and the negative terminal circuit pattern are positioned in parallel and close to each other. The component mount surface of the circuit board includes a component mount surface side ground pattern arranged below the common mode choke coil. A heat dissipation ground surface of the circuit board includes a ground pattern and a plurality of heat dissipation conductor patterns. Input terminals and output terminals of the common mode choke coil are respectively electrically and thermally connected to the heat dissipation conductor patterns via through-hole conductors provided between the component mount surface and the heat dissipation ground surface.

An electronic device according to one embodiment of the present invention comprises: a housing including a first surface, a second surface, and a side member surrounding a space between the first surface and the second surface; a volume key disposed on the outer surface of the side member; a support member disposed inside the side member and integrally formed with the side member; a printed circuit board disposed on one surface of the support member; and a processor, wherein the volume key includes a first conductive pattern, a second conductive pattern, a ground pattern, a first switch for conducting the first conductive pattern and the ground pattern, and a second switch for conducting the second conductive pattern and the ground pattern. The side member and the support member include a first conductive portion formed by being surrounded by a first non-conductive portion, a second conductive portion formed by being surrounded by a second non-conductive portion, and a ground formed between the first non-conductive portion and the second non-conductive portion. The printed circuit board includes a first terminal and a second terminal, a first conductive path connecting the first terminal and the processor, and a second conductive path connecting the second terminal and the processor. The first conductive pattern may be bonded to the first conductive portion through a first conductive adhesive member, the second conductive pattern may be bonded to the second conductive portion through a second conductive adhesive member, and the ground pattern may be bonded to the ground through a third conductive adhesive member.

A crosstalk measuring method includes: preparing a printed wiring board having a first signal pattern and a second signal pattern arranged side by side at an interval in a first direction and extending in a second direction orthogonal to the first direction, and a ground pattern disposed between the first signal pattern and the second signal pattern in the first direction and extending in the second direction; preparing a probe having a first pin, a second pin, and a shield plate that is made of a conductive material; and measuring crosstalk between the first signal pattern and the second signal pattern. Each of the first pin and the second pin has a distal end and a proximal end opposite to the distal end.

A strip substrate comprises a dielectric layer comprising a unit region and a saw line region, a saw line pattern on the saw line region, a conductive dummy pattern extending from the saw line pattern and toward the unit region, and power / ground patterns on the unit region. The power / ground pattern includes a first lateral surface that extends in a first direction and is proximate to the saw line pattern, a second lateral surface that extends in a second direction and is proximate to the conductive dummy pattern, and a third lateral surface that connects the first lateral surface and the second lateral surface.

The present invention comprises: a control element (2) that is disposed on a signal ground pattern (14) and includes a serial communication unit (3a); a parallel-serial conversion IC (5) that is disposed on an IO ground pattern (15) and transmits and receives serial data to and from the serial communication unit (3a); an insulating element (4) that has a plurality of terminals disposed on the signal ground pattern (14) and connected to the serial communication unit (3a) and a plurality of terminals disposed on the IO ground pattern (15) and connected to the parallel-serial conversion IC (5); an input circuit (7) that is composed of limiting resistors and filters and is connected to the parallel-serial conversion IC (5); and a capacitor (6a) that has a first electrode connected to the signal ground pattern (14) and a second electrode connected to the IO ground pattern (15).

An electronic device (10) comprising: a housing (11); a circuit board (12) arranged within the housing (11) on which a plurality of circuit elements are mounted; and a shielding housing (15) provided on the circuit board (12) and made of metal. Among the plurality of circuit elements, a circuit element requiring electromagnetic shielding is located in a region of the circuit board (12) where the shielding housing (15) is provided. For example, the electronic device (10) further comprises a plurality of shielding clips (16) that electrically connect the shielding housing (15) to a ground pattern of the circuit board (12). The intervals of the plurality of shielding clips (16) are configured based on a noise propagation characteristic in a vacuum.

A semiconductor device includes a multi-layer board which a wiring pattern and a grounding pattern are formed. A plurality of semiconductor elements are mounted on the multi-layer board. An insulating sealing member is provided on the multi-layer board and is covering the plurality of semiconductor elements. A metal film is provided on the insulating sealing member. An in-groove metal is provided in contact with a plurality of grooves extending from a side-surface upper end of the insulating sealing member to a side-surface lower end of the multi-layer board. An in-hole metal is provided in an inner wall of a hole penetrating through the insulating sealing member and is extending to the multi-layer board. The in-hole metal is contacting with the metal film and the grounding pattern.

A wiring board has a high-frequency transmission path and a ground plane, in which a return current flows in the ground plane due to an AC signal through the transmission path. The ground plane is formed with a first cutout portion for an electronic component formed at a position corresponding to an electronic component, and a second cutout portion serving as a slit portion. In a transparent plan view, the first and second cutout portions are arranged such that at least a portion is overlapping. A ground pattern for an electronic component extends in a transmission direction of an AC signal across the second cutout portion serving as a slit portion. Each of a first and second ground planes is electrically connected to the ground pattern of an electronic component by through-conductors, and a bypass path is formed that allows a return current to flow around the second cutout portion.

Provided is an electromagnetic wave shielding sheet, a flexible printed circuit board attached with the electromagnetic wave shielding sheet, and a manufacturing method thereof. The flexible printed circuit board attached with the electromagnetic wave shielding sheet comprises: an electromagnetic wave shielding sheet including a nonwoven fabric having a plated surface and including an adhesive layer adsorbed therein without containing conductive particles, and a nonwoven fabric layer including a first insulating layer formed on the nonwoven fabric; and a flexible printed circuit board attached with the electromagnetic wave shielding sheet, wherein the flexible printed circuit board includes: a base film having a wiring pattern and a ground pattern formed on one side; and a second insulating layer covering the wiring pattern and exposing the ground pattern, and the nonwoven fabric layer having the adhesive layer adsorbed therein is in direct contact with the ground pattern.

An electronic component holding member includes a first base material including an electronic component, a first resin molded product, and first metal patterns in which a signal pattern and a grounding pattern are formed on a non-planar surface, a second base material including a second resin molded product, and a second metal pattern formed on a non-planar surface so as to overlap at least part of the first metal patterns, and grounding wiring configured to connect the grounding pattern and the second metal pattern.

Disclosed is an input sensing part that includes sensing electrodes disposed in an active area, a first ground pattern disposed in an inactive area around the active area, a first ground pad disposed in the inactive area and electrically connected to the first ground pattern, a first antenna pattern insulated from the sensing electrodes and disposed in the active area, a first signal pad that extends from the first antenna pattern and disposed in the inactive area, a 1-1-th ground pad disposed adjacent to the first signal pad and electrically connected to the first ground pattern, and a 1-2-th ground pad disposed adjacent to the first signal pad.

In a wiring board with a high-frequency transmission line, the impedance increase and disturbance caused by reflections, etc., of the return current flowing to the ground plane due to the AC signal flowing through the high-frequency transmission line is reduced without requiring major changes to the wiring pattern. [Solution] The ground plane has a first cutout BR1 for electronic components and a second cutout SL as a slit formed at a position corresponding to the electronic component. In the perspective view, the first and second cutouts are arranged so that at least a portion of them overlap. The ground pattern 42 for electronic components extends across the second cutout SL as a slit in the direction of AC signal transmission. Each of the first and second ground planes 10a and 10b is electrically connected to the ground pattern 42 for electronic components by through conductors 40a to 40c, and a bypass path is formed that allows the return current 29 to flow around the second cutout SL.

The invention relates to a flexible printed circuit board and an antenna assembly including the same. A flexible printed circuit board according to one embodiment of the present disclosure is configured from a plurality of layers, and includes: a first substrate portion including a first power supply pattern disposed in any one of the plurality of layers and electrically connected to an antenna, and a plurality of first ground patterns disposed on both sides of the first power supply pattern; a second substrate part including a second power supply pattern disposed in any one of the plurality of layers and electrically connected to a cable, and a plurality of second ground patterns disposed on both sides of the second power supply pattern; and a third substrate part disposed between the first substrate part and the second substrate part so as to cover a part of a side edge of the glass, the third substrate part including: a third power supply pattern disposed in a first layer adjacent to the glass among the plurality of layers; and a third ground pattern disposed on the second layer, both ends of the third power supply pattern being electrically connected to the first power supply pattern and the second power supply pattern, respectively, and both ends of the third ground pattern being electrically connected to the first ground pattern and the second ground pattern, respectively. The third feed pattern includes a first feed portion adjacent to one surface of the glass, a second feed portion adjacent to a side edge of the glass, and a third feed portion adjacent to the other surface of the glass. The interval between the orthographic projections of the first feed section and the third feed section is gradually increased as the distance from the second feed section is greater than the distance between the orthographic projections of the first feed section and the third feed section.

The utility model provides a circuit substrate. The circuit board (10) is provided with an electric power connector (20) for inputting electric power from a power supply, a control part (40) for controlling the display of the display part by using the electric power input from the electric power connector (20) as an operation power supply, and a noise filter element (33) which is electrically connected between the electric power connector (20) and the control part (40) and is used for removing noise. The circuit board (10) has a plurality of conductor layers (L1-L4) arranged in the Z direction. The plurality of conductor layers (L1-L4) have a ground pattern. The ground pattern is located in a range including a portion of the noise filter element (33) when viewed from the Z-direction of the circuit board (10), and is formed outside a ground extraction region (43) set at a corner of the circuit board (10). According to the circuit substrate provided by the utility model, the noise can be further reduced.

This electronic control device is provided with: a circuit board on which an electronic component can be mounted and on which a ground pattern is formed; a conductive case that houses the circuit board; and an electromagnetic wave shielding material disposed between the ground pattern of the circuit board and the housing and electrically connecting the ground pattern and the housing. The circuit board or the housing has a conductor reference surface that can be pressed by the electromagnetic wave shielding material, and a conductor protruding portion that protrudes further toward the electromagnetic wave shielding material than the conductor reference surface. The electromagnetic wave shielding material is disposed in a state of being in contact with the conductor reference surface and the conductor protrusion.

A semiconductor package includes a substrate including signal patterns and ground patterns, an upper protective layer on an upper surface of the substrate and including a first opening exposing a first portion of each of the signal patterns and the ground patterns and a second opening exposing a second portion of the ground patterns, a first semiconductor chip on the upper protective layer and coupled with the signal patterns and the ground patterns, a second semiconductor chips around the first semiconductor chip and coupled with the signal patterns and the ground patterns, a mesh pattern layer on the upper protective layer, overlapping respective portions of the signal patterns and the ground patterns, and coupled with the ground patterns, a molded layer covering the first semiconductor chip, the second semiconductor chips, and the mesh pattern layer, and external connection bumps below the substrate.