630 results about "Ground pattern" patented technology

An antenna comprises a dielectric member, an antenna pattern formed on one surface of the dielectric member, and a ground pattern formed on the other surface of the dielectric member. A part or the whole of the antenna is implanted in a dielectric layer on the side from which a laser beam does not come in of an optical recording medium symmetrically having a metal layer reflecting the laser beam and the dielectric layer, thereby to provide a radio tag antenna structure for an optical recording medium which is simple, is small-sized, and can secure necessary reading performance.

A printed circuit board is disclosed. A top layer power supply pattern and a top layer ground pattern are formed. The top layer power supply pattern and the top layer ground pattern are connected to a power supply layer and a ground layer through a plurality of viaholes, respectively. A plurality of capacitors or a plurality of capacitor resistor series circuits are disposed at predetermined intervals between the top layer power supply pattern and the top layer ground pattern.

A metallic film and a grounding pattern are surely connected to each other so as to achieve electrical shield of an electronic circuit unit. In an electronic circuit unit, the metallic film is provided on a top surface of a sealing resin portion for burying an electronic component, the side surfaces of the sealing resin portion that are opposite to each other, and the side surfaces of the multi-layered substrate that are opposite to each other. The metallic film is connected to the grounding patterns that are provided on the top surface of the multi-layered substrate or between the laminated layers of the multi-layered substrate. Therefore, it is possible to achieve a superior electrical shielding effect through the metallic film, as compared with the related art. Since the metallic film is formed on the side surfaces of the sealing resin and the side surfaces of the multi-layered substrate, when the metallic film is formed by a plating method, the blind hole may not be provided in the related art. Therefore, it is possible to achieve the superior circulation of the plating liquid, which results in sure connection between the sure connection between the grounding pattern and the metallic film.

A printed circuit board has an inverted-L-shaped antenna pattern, which is provided with a conductor pattern connected to a ground pattern, so formed thereon as to be in close proximity to the outside of an inverted-F-shaped antenna pattern which is provided with a conductor pattern connected to a feeding point and with a conductor pattern connected to a ground pattern. By making resonance frequency of each of the inverted-F-shaped antenna pattern and the inverted-L-shaped antenna pattern different, it is possible to compose a frequency antenna using different frequency bands.

An upper case (1) is connected to a lower case (2) in a hinge portion (3) so as to freely rotate. A plate shaped conductor (4) and a plate shaped conductor (5) are disposed along the surface of the case in the upper case (1). A ground plate (6) is formed in a ground pattern of a circuit board disposed in the lower case (2). The plate shaped conductor (4) and the plate shaped conductor (5) are selected by a high frequency switch (14) and connected to one end of a feeding portion (15). The other end of the feeding portion (15) is connected to the ground plate (6) to form a dipole antenna.

An antenna consisting of a single small and lightweight package, where each radiating element operates independently with reduced interference among the radiating elements. An integrated multi-element planar antenna includes a ground pattern 2 with a notch 2b formed at an end 2a, first radiating element 3 placed on one side of the notch 2b and equipped with a feeder 5, and second radiating element 4 placed on the other side of the notch 2b and equipped with a feeder 5. For example, inverted F antennas are used as the first radiating element 3 and second radiating element 4. The first radiating element 3 and second radiating element 4 are placed symmetrically about the notch 2b such that separation distance will be the largest at locations where their radiation fields are the highest.

A metallic film and a grounding pattern are surely connected to each other so as to achieve electrical shield of an electronic circuit unit. In an electronic circuit unit, the metallic film is provided on a top surface of a sealing resin portion for burying an electronic component, the side surfaces of the sealing resin portion that are opposite to each other, and the side surfaces of the multi-layered substrate that are opposite to each other. The metallic film is connected to the grounding patterns that are provided on the top surface of the multi-layered substrate or between the laminated layers of the multi-layered substrate. Therefore, it is possible to achieve a superior electrical shielding effect through the metallic film, as compared with the related art. Since the metallic film is formed on the side surfaces of the sealing resin and the side surfaces of the multi-layered substrate, when the metallic film is formed by a plating method, the blind hole may not be provided in the related art. Therefore, it is possible to achieve the superior circulation of the plating liquid, which results in sure connection between the sure connection between the grounding pattern and the metallic film.

The present invention is to provide an intelligent pluggable transceiver improving an EMI tolerance with a simple mechanism. The optical transceiver of the invention comprises upper and lower housings (11, 12), a holder (81), optical assemblies (51, 61), a cover (14), a substrate (15) and a grip (13). The optical assemblies are fixed with the upper and lower housings together with the holder with interposing the conductive elastic member. Although the rear end of the substrate exposes outside the transceiver, the shield gasket and the ground pattern on the substrate shields the contact portion between the substrate and the upper housing and between the substrate and the cover. Moreover, the grip and the latch lever installed in the lower housing, and the elastic piece realize the latching / releasing mechanism of the transceiver with the host system.

Disclosed herein is a display device having a capacitive touch screen, including: a display unit; and a capacitive touch screen that is coupled to the display unit by an adhesive layer and includes a base substrate, a plurality of first electrode patterns that are formed on an active region of the base substrate, ground patterns that are formed on the active region of the base substrate and are separated from the first electrode pattern, a transparent insulating layer that covers the first electrode patterns and the ground patterns and is formed on the base substrate, and a plurality of second electrode patterns that are formed on an active region of the transparent insulating layer.

A module component with a good shield effect and a low height including a circuit board having mounted thereon a mount device including an electronic part. The device is sealed with a sealing body having a metal film formed on the sealing body surface. A ground pattern is formed at the outer periphery of the principal surface of the circuit board. The metal film is conductively connected with the ground pattern.

A module includes a component, a circuit board having the component mounted thereon, a first grounding pattern formed on an outermost periphery of a surface portion of the circuit board; a first sealer provided on the circuit board and having a dimension projected on the circuit board, and a metal film covering the sealer and connected to the grounding pattern. The dimension of the first dealer is smaller than an outside dimension of the circuit board. The first sealer is made of first resin and sealing the component. The module has a low profile and is adequately shielded.

The surface-acoustic-wave device has surface-acoustic-wave element 1 provided with interdigital electrodes 2, shut-off member 32 and ground patterns 35-1, 35-2. Interdigital electrodes 2 are formed on a first surface of surface-acoustic-wave element 1 and covered with protective film 33. Surface-acoustic-wave element 1 is mechanically supported above mounting substrate 36. Shut-off member 32 serves to shut off surface-acoustic-wave element 1 electrically and airtightly from an ambience. The ground patterns 35-1, 35-2, grounded electrically, serve to discharge an electric charge. Ground patterns 35-1, 35-2 contact a surface of mounting substrate 36. Shut-off member 32 covers surface-acoustic-wave element 1 and also is connected with ground patterns 35-1, 35-2 that are in contact with the surface of mounting substrate 36.

A cable connector includes a contact assembly including an electrical insulating block part which is configured to incorporate plural signal contacts; and a relay wiring substrate mounted to a back of the contact assembly. The relay wiring substrate includes, on a surface, a contact connecting pad electrically connected to one of the signal contacts, a wiring connecting pad, and a wiring pattern connecting the contact connecting pad and the wiring connecting pad. The relay wiring substrate further includes a ground layer inside the relay wiring substrate. The cable connector further includes a cable connected to the relay wiring substrate by electrically connecting an end of a wiring with the wiring connecting pad. The relay wiring substrate further includes a ground pattern for matching impedance inside the relay wiring substrate.

The present invention is to provide an intelligent pluggable transceiver improving an EMI tolerance with a simple mechanism. The optical transceiver of the invention comprises upper and lower housings (11, 12), a holder (81), optical assemblies (51, 61), a cover (14), a substrate (15) and a grip (13). The optical assemblies are fixed with the upper and lower housings together with the holder with interposing the conductive elastic member. Although the rear end of the substrate exposes outside the transceiver, the shield bracket and the ground pattern on the substrate shields the contact portion between the substrate and the upper housing and between the substrate and the cover. Moreover, the grip and the latch lever installed in the lower housing, and the elastic piece realize the latching / releasing mechanism of the transceiver with the host system.

A connector device to be used with a flexible printed circuit board including a connector. The flexible printed circuit board has on its front and rear surfaces ground patterns, signal patterns and phase inversion signal patterns arranged such that the signal pattern and the phase inversion signal pattern are arranged between the two ground patterns, and has a ground layer between the front and rear surfaces and exposed portions located at predetermined positions and reaching the ground layer. The connector has first and second contacts of two kinds. The first and second contacts are arranged in one and the same inserting hole of the housing such that their contact portions are opposite to each other. When a pivoting member has been pivotally moved, the first and second contacts come into contact with the corresponding ground, signal and phase inversion signal patterns on the flexible printed circuit board and the members at the predetermined positions enter the exposed portions so as to contact the ground layer, thereby achieving a miniaturization of the connector and high speed transmission of signals.

A conductor is mounted on a circuit board parallel to its side along which a radiation of a radio frequency signal is generated. The proximal end of the L-shaped conductor is electrically connected to a ground pattern formed on the rear surface of a circuit board 1, and the distal end of the L-shaped conductor is open. The position at which the conductor is connected to the ground pattern is set to be a position spaced apart by a quarter-wavelength of a radio-frequency signal from a feed point of an antenna. The total length of the conductor is set to be a half-wavelength of the radio-frequency signal.

Provided are semiconductor devices including a peripheral region and a cell region stacked thereon and a method of fabricating the same. The semiconductor device may include a peripheral region including a lower substrate and a peripheral circuit provided thereon and a cell region including an upper substrate and a cell array provided thereon. The cell region may be stacked on the peripheral region. When an operation signal is applied to the cell region from the peripheral region, at least a portion of the peripheral and cell regions may be used as a ground pattern applied with a ground signal, thereby being in an electrical ground state.

An electrical connector includes, in substitution for contacts, a substrate having a plurality of signal patterns and a plurality of ground patterns on at least one surface, each of these patterns having at one end a contact portion adapted to contact a mating object and at the other end a connection portion to be connected to a cable, a housing having an inserting hole for inserting the substrate therethrough, and holding members for fixing the substrate to the housing. A capacitor and a resistance chip connected in parallel are mounted on at least one of the signal patterns. In this manner, the connector achieves its miniaturization, stability of impedance, reduction in cross talk, and better return loss level and transmission characteristics.

An antenna duplexer is provided, which can be built with a smaller size and lower height than ever without compromising out-of-band attenuation characteristic and isolation characteristic between a transmit terminal and a receive terminal. The antenna duplexer includes a transmit filter provided between an antenna terminal and the transmit terminal, and a receive filter provided between the antenna terminal and the receive terminal. The filters are enclosed by a package, in which a ground pattern for the receive filter is separated from other ground patterns.

The flat panel display includes a receiving unit, a substrate and a conductive compressible body. The receiving unit receives a flat panel. The substrate has a driving circuit that applies a signal to the flat panel to display an image. The conductive compressible body electrically connects a ground pattern of the substrate to the receiving unit. Therefore, a conductive compressible body for electrically connecting is between the ground pattern of the driving circuit unit and the top chassis, so that noise and EMI are shielded.

Regardless of a user's hand holding condition, it is possible to obtain excellent antenna performance in both of folded and unfolded calling conditions. A folder type mobile radio apparatus includes an upper case 1301 having a first antenna element made of a metal plate 1305 , a lower case 1302 having a second antenna element made of a circuit board 102 , a hinge portion 1303 pivotably connecting the upper and lower cases 1301 and 1302 , a first circuit board 101 having a ground pattern provided in an end side near the hinge portion 1303 in the lower case, an antenna switching unit 103 for selecting one of a first feed means for feeding the first antenna element for the radio circuit 1314 on the first circuit board 101 or a second feed means for feeding the second antenna element.

An electronic device (1) has an information processor (3) including a circuit board (31) and an integrated circuit element (32). The integrated circuit element is mounted on the circuit board for controlling input and output of information. Further, the circuit board is provided with a cover member (33A) having thermal conductivity and electrical conductivity and covering the integrated circuit element. The cover member, which is electrically connected to ground patterns (G) formed on the circuit board, includes an electromagnetic radiation suppressor (5) for suppressing radiation of electromagnetic waves generated from the integrated circuit element.

A front end module having a multilayered structure is provided. The front end module includes a transmitter, a receiver, and a duplex unit. A ground layer is provided with an ground pattern having a plurality of separated blocks on a surface of a substrate of the front end module.

A leadframe for a contact module assembly includes a terminal set having first, second and third terminals configured to operate in one of a signal-signal-ground pattern and a ground-signal-signal pattern. Each of the terminals have a length that extends between a mating end and a mounting end, wherein a difference in lengths between the first terminal and the second terminal is the same as a difference in lengths between the second terminal and the third terminal such that the terminal set has the same amount of skew between the terminals defining signal contacts in both the signal-signal-ground pattern and the ground-signal-signal pattern.

The present invention relates to a high frequency module board device having a high frequency transmitting and receiving circuit for modulating and demodulating a high frequency signal. The high frequency module board device comprises a base board (2) whose main surface is formed as a build-up surface (2a) and a high frequency circuit part (3) formed on the build-up surface of the base board (2) and having passive elements formed. The base board (2) has an area (29) in which wiring is not formed in a lower layer from a fourth wiring layer (8b). The high frequency circuit part (3) has an upper electrode part (36) and a lower electrode part (35) in positions corresponding to the area (29) in which the wiring is not formed. Thus, since a capacitance (18) is provided just above the area (29) in which the wiring is not formed, a parasitic capacity that the capacitance (18) receives from ground patterns (14) is reduced. Accordingly, the characteristics of the capacitance (18) can be improved.

In a diversity antenna apparatus, chip antennas are used as antenna elements, and the chip antennas are disposed in association with a ground pattern with certain gaps from the ground pattern. The chip antennas are disposed so as to surround the ground pattern formed on a substrate, and the ground pattern is shared among the chip antennas. Furthermore, hybrid patterns are included in the substrate, and the hybrid patterns also share the ground pattern with the chip antennas to achieve compact design. Alternatively, a transmitting chip antenna and a ground pattern associated with the transmitting chip antenna together form a vertically polarized antenna, and the transmitting chip antenna and the ground pattern associated with the transmitting chip antenna are separated from receiving chip antennas and a ground pattern associated with the receiving chip antennas.

A circuit board is arranged on an end face of a lens barrel on a lens mount side and installed with an electronic circuit device, a plurality of connection terminals which are arranged in an electrically insulating state in the lens mount and serve to connect the electronic circuit device on the circuit board with an electronic circuit device inside a camera body, and a wiring member is for connecting the plurality of connection terminals with the circuit board, where the wiring member is provided with a ground connection section which is connected to a ground pattern of the circuit board and also electrically connected to a connection terminal that is to be a ground terminal among the plurality of connection terminals, and an extended wiring pattern is for electrically grounding the ground connection section on a metal portion of the lens mount.

Disclosed is a dielectric resonator antenna. The dielectric resonator antenna includes: a dielectric resonator; an antenna layer formed inside the dielectric resonator, and including a plurality of vias positioned at a surrounding area of the dielectric resonator; a metal pattern forming an opened surface in an upper portion of the antenna layer; a dielectric layer configured to cover the metal pattern on the dielectric resonator; an internal ground pattern including a coupling aperture for inputting a signal into the dielectric resonator under the dielectric resonator; and a feeding layer including a strip transmission line for transmitting a signal to the dielectric resonator, and positioned under the antenna layer.