10 results about "Ground pattern" patented technology

An apparatus for providing a thin film and an electronic device including a display device fabricated by the apparatus are disclosed. The apparatus may include an electrostatic chuck to absorb and support a substrate and a supply nozzle to supply chemical liquid onto the substrate, and wherein the electrostatic chuck includes a base, at least one first electrode pattern on the base, at least one second electrode pattern provided on the base and spaced and / or apart (e.g., spaced apart or separated) from the first electrode pattern (e.g., the at least one first electrode pattern), and at least one ground pattern provided on the base and spaced and / or apart (e.g., spaced apart or separated) from the first electrode pattern (e.g., the at least one first electrode pattern) and the second electrode pattern (e.g., the at least one second electrode pattern).

An electronic apparatus includes: an electronic component; a substrate including a first layer at which the electronic component and a first ground pattern are disposed, and a second layer at which a second ground pattern is disposed; and a case which is in contact with the first ground pattern, covers the electronic component, reduces magnetic noise, and is fixed to the substrate, and plural conductors connecting the first ground pattern and the second ground pattern are disposed along a portion of the first ground pattern, the portion being in contact with the case.

A strip substrate comprises a dielectric layer comprising a unit region and a saw line region, a saw line pattern on the saw line region, a conductive dummy pattern extending from the saw line pattern and toward the unit region, and power / ground patterns on the unit region. The power / ground pattern includes a first lateral surface that extends in a first direction and is proximate to the saw line pattern, a second lateral surface that extends in a second direction and is proximate to the conductive dummy pattern, and a third lateral surface that connects the first lateral surface and the second lateral surface.

An electronic device (10) comprising: a housing (11); a circuit board (12) arranged within the housing (11) on which a plurality of circuit elements are mounted; and a shielding housing (15) provided on the circuit board (12) and made of metal. Among the plurality of circuit elements, a circuit element requiring electromagnetic shielding is located in a region of the circuit board (12) where the shielding housing (15) is provided. For example, the electronic device (10) further comprises a plurality of shielding clips (16) that electrically connect the shielding housing (15) to a ground pattern of the circuit board (12). The intervals of the plurality of shielding clips (16) are configured based on a noise propagation characteristic in a vacuum.

Provided is an electromagnetic wave shielding sheet, a flexible printed circuit board attached with the electromagnetic wave shielding sheet, and a manufacturing method thereof. The flexible printed circuit board attached with the electromagnetic wave shielding sheet comprises: an electromagnetic wave shielding sheet including a nonwoven fabric having a plated surface and including an adhesive layer adsorbed therein without containing conductive particles, and a nonwoven fabric layer including a first insulating layer formed on the nonwoven fabric; and a flexible printed circuit board attached with the electromagnetic wave shielding sheet, wherein the flexible printed circuit board includes: a base film having a wiring pattern and a ground pattern formed on one side; and a second insulating layer covering the wiring pattern and exposing the ground pattern, and the nonwoven fabric layer having the adhesive layer adsorbed therein is in direct contact with the ground pattern.

A semiconductor package includes a substrate including signal patterns and ground patterns, an upper protective layer on an upper surface of the substrate and including a first opening exposing a first portion of each of the signal patterns and the ground patterns and a second opening exposing a second portion of the ground patterns, a first semiconductor chip on the upper protective layer and coupled with the signal patterns and the ground patterns, a second semiconductor chips around the first semiconductor chip and coupled with the signal patterns and the ground patterns, a mesh pattern layer on the upper protective layer, overlapping respective portions of the signal patterns and the ground patterns, and coupled with the ground patterns, a molded layer covering the first semiconductor chip, the second semiconductor chips, and the mesh pattern layer, and external connection bumps below the substrate.

This invention provides an electric oil pump that grounds the grounding pattern of a substrate while suppressing the scaling up of a rotary electric motor. One embodiment of the rotary electric motor includes: a rotor capable of rotating about a central axis; a stator facing the rotor with a gap; a substrate electrically connected to the stator; a first metal housing with an axial opening on one side and housing the stator therein; a second housing fixed to one axial side of the first housing, housing the substrate therein and having insulation; and a conductive member electrically connecting the substrate to the first housing. The substrate has a grounding pattern. The conductive member has: a first connecting portion electrically connected to the first housing inside the first housing; and a second connecting portion electrically connected to the grounding pattern.

Disclosed herein is an antenna device that includes a substrate, a ground pattern provided on a surface of the substrate, an antenna element mounted on the surface of the substrate, and first and second conductor patterns provided in a ground clearance area free from the ground pattern on the surface of the substrate. The first conductor pattern extends in a first direction, and the second conductor pattern extends in a direction different from the first direction. One end of the first conductor pattern is connected to the antenna element, and another end of the first conductor pattern is connected to a connection point positioned between both ends of the second conductor pattern.

This invention provides an electric oil pump that grounds the grounding pattern of a substrate while suppressing the scaling up of a rotary electric motor. One embodiment of the rotary electric motor includes: a rotor capable of rotating about a central axis; a stator facing the rotor with a gap; a substrate electrically connected to the stator; a first metal housing with an axial opening on one side and housing the stator therein; a second housing fixed to one axial side of the first housing, housing the substrate therein and having insulation; and a conductive member electrically connecting the substrate to the first housing. The substrate has a grounding pattern. The conductive member has: a first connecting portion electrically connected to the first housing inside the first housing; and a second connecting portion electrically connected to the grounding pattern.

An aspect of a rotary electric machine of the disclosure includes: a rotor, able to rotate about a central axis as a center; a stator, opposite to the rotor, with a gap being interposed between the rotor and the stator; a substrate, electrically connected with the stator; a first housing, formed of metal, being open on a side in an axial direction, and accommodating the stator; a second housing, fixed, on the side in the axial direction, to the first housing, accommodating the substrate, and having an insulating property; and a conductor, electrically connected with the substrate and the first housing. The substrate has a grounding pattern. The conductor has: a first connector, electrically connected with the first housing inside the first housing; and a second connector, electrically connected with the grounding pattern.