111 results about "Ground pattern" patented technology

Disclosed is an input sensing part that includes sensing electrodes disposed in an active area, a first ground pattern disposed in an inactive area around the active area, a first ground pad disposed in the inactive area and electrically connected to the first ground pattern, a first antenna pattern insulated from the sensing electrodes and disposed in the active area, a first signal pad that extends from the first antenna pattern and disposed in the inactive area, a 1-1-th ground pad disposed adjacent to the first signal pad and electrically connected to the first ground pattern, and a 1-2-th ground pad disposed adjacent to the first signal pad.

This electronic control device comprises: a circuit board on which an electronic component is mounted and on which a ground pattern is formed; an electroconductive housing that accommodates the circuit board; and an electromagnetic wave shield member that is disposed between the ground pattern of the circuit board and the housing, the electromagnetic wave shield member electrically connecting the ground pattern and the housing. The circuit board or the housing has a conductor base surface against which the electromagnetic wave shield member is pressed, and conductor protrusions that protrude further toward the electromagnetic-wave-shield-member side than the conductor base surface. The electromagnetic wave shield member is disposed in contact with the conductor base surface and the conductor protrusions.

A phase shifter including a 90 degree hybrid circuit having two reflection ends, a variable stub having a line formation layer made of vanadium dioxide and extending from each of the two reflection ends, and a ground pattern formed with a groove in which the variable stub is disposed and connected to a side end of the variable stub disposed in the groove.

According to an embodiment of the present invention, an antenna package and an image display device are provided. The antenna package includes an antenna unit having a radiation pattern, a transmission line extending from the radiation pattern, and an antenna ground pad arranged around the transmission line, and a circuit board electrically connected to the antenna unit. The circuit board includes: a core layer; a circuit wiring layer arranged on one surface of the core layer, the circuit wiring layer including a signal transmission wiring electrically connected to the transmission line of the antenna unit and a first ground pattern bonded to the antenna ground pad; and a ground layer arranged on an opposite surface of the core layer opposite to the above-mentioned one surface. In a plan view, the ground layer does not overlap with a portion of the antenna ground pad outside the area bonded to the first ground pattern.

An antenna structure according to an embodiment includes a radiator including a plurality of radiating portions integrally connected to each other, the plurality of radiating portions having sequentially reducing widths, a transmission line electrically connected to the radiator, and a pair of ground patterns facing each other with the transmission line interposed therebetween to be physically spaced apart from the radiator and the transmission line. A broadband antenna structure capable of providing a multi-band radiation can be implemented.

A printed wiring board includes: a first insulating layer having a first main surface and a second main surface opposite to the first main surface; a first wire pattern, a second wire pattern, and a first ground pattern that are disposed on the second main surface and extend along a first direction in a plan view; a second ground pattern disposed on the first main surface; an adhesive layer disposed on the second main surface so as to cover the first wire pattern, the second wire pattern, and the first ground pattern; a second insulating layer disposed on the adhesive layer and having a third main surface facing the adhesive layer and a fourth main surface opposite to the third main surface; a third ground pattern disposed on the fourth main surface; and a first conductor layer and a second conductor layer.

A characteristic impedance control structure includes a first and a second transmission line, a ground pattern and a ground component. The first transmission line and the ground pattern extend along a plane. The ground pattern is spaced from the first transmission line by a first distance. The second transmission line extends along a direction and electrically connects to the first transmission line. An angle between the direction and the plane is greater than zero. The second transmission line has an outer diameter. The ground component extends along the direction and is electrically connected to the ground pattern. The ground component is next to and spaced from the second transmission line by a second distance. The ground component has a length along the direction. The first distance is less than or equal to twice the length. The second distance is less than or equal to five times the outer diameter.

A current path is provided through an interposer to ground a grounding pattern associated with a transmission line, by exploiting an interposer substrate that has a high-resistivity portion at a first surface and a low-resistivity portion extending from the high-resistivity portion to a second surface of the interposer. Moreover, a set of blind via-holes comprising electrically-conductive material extend from the first surface of the interposer substrate through the high-resistivity portion and into the low-resistivity portion. Top-to-bottom connection can be made using the conductive material in the blind vias and using the low-resistivity portion of the substrate, while the high-resistivity portion of the substrate impedes current leakage from the transmission line to the second surface of the substrate. The number and dimensions of the blind via-holes control the impedance of the grounding pattern relative to the transmission line's characteristic impedance.

A wearable electronic device that can be worn on the ear of a user, according to one embodiment of the present disclosure, comprises: a housing including a body and a stem extending from the body; a carrier disposed inside the stem; a printed circuit board which is disposed on the carrier and which has a power supply disposed thereon; a flexible connection member connected to the printed circuit board; and a conductive pattern formed on the outer surface of the carrier, wherein the conductive pattern can include: a power supply point electrically connected to the power supply; an antenna pattern extending from the power supply point; and a ground pattern which extends from the power supply point, and which overlaps the flexible connection member so as to form capacitive coupling.

To provide a vehicle display device capable of suppressing the propagation of noise through an elastic member.SOLUTION: A vehicle display device 10 comprises: a display 50 having a display surface 51a for displaying information; a housing 30 that accommodates the display 50 and has an opening 31; a protective panel member 40 that is formed in a plate shape with light transmittance, and that closes the opening 31 of the housing 30, and has the display surface 51a bonded to its rear surface on the side of an accommodation space Sp of the housing 30; a circuit board 20 that is positioned on a rear surface side of the display 50 and has a ground pattern 21; and an elastic member 70 that is mounted on a surface 20F of the circuit board 20 facing the display 50, and made of a conductive material that presses the display 50. The circuit board 20 has a mounting pattern 22 being a region where the elastic member 70 is mounted, and formed as a conductive pattern different from the ground pattern 21 on the surface 20F at a position apart from the ground pattern 21.SELECTED DRAWING: Figure 1

The ground terminal (11b), the first to third ground patterns (11a, 21a, 21b), the first and second ground vias (12b, 22), and the third connection member (25) constitute an electromagnetic shielding structure covering the periphery of the signal terminal (14b), the first and second signal patterns (14a, 24), the first signal via (12a), the semiconductor chip (103), and the first and second connection members (26a, 26b).

The present invention relates to a multiple-input multiple-output antenna having a decoupling structure in a non-grounded region, the antenna comprising: a substrate comprising a grounded region and a non-grounded region; a first antenna and a second antenna formed to be spaced apart from each other in the non-ground region; and a pattern portion provided in a non-ground region between the first antenna and the second antenna and having a plurality of sensing patterns that cancel coupling between the first antenna and the second antenna. The pattern portion includes: a quadrilateral spiral first pattern disposed to be spaced apart from the first antenna by a predetermined distance; a ground pattern connecting an end portion of the first pattern to the ground region; a quadrilateral spiral second pattern disposed at a position symmetrical to the first pattern with respect to the ground pattern; and a quadrilateral spiral-shaped third pattern disposed between the ground pattern and the ground region, which, when there are two or more antennas using the same frequency band, can block mutual electromagnetic interference between the two antennas, and can improve isolation by preventing current from flowing into the other antennas via coupling.

An apparatus for providing a thin film and an electronic device including a display device fabricated by the apparatus are disclosed. The apparatus may include an electrostatic chuck to absorb and support a substrate and a supply nozzle to supply chemical liquid onto the substrate, and wherein the electrostatic chuck includes a base, at least one first electrode pattern on the base, at least one second electrode pattern provided on the base and spaced and / or apart (e.g., spaced apart or separated) from the first electrode pattern (e.g., the at least one first electrode pattern), and at least one ground pattern provided on the base and spaced and / or apart (e.g., spaced apart or separated) from the first electrode pattern (e.g., the at least one first electrode pattern) and the second electrode pattern (e.g., the at least one second electrode pattern).

To realize a substrate configuration suitable for inspection and maintenance.SOLUTION: A game machine includes a first substrate, which is a multilayer substrate having a surface layer, a back layer, and one or more inner layers. On the first substrate, a power supply voltage pattern connected to the power supply voltage terminal of a connector attached to the surface layer or back layer and a ground pattern connected to the connector's ground terminal on the inner layer. A test point for either the power supply voltage pattern or the ground pattern is provided, on the surface layer or back layer, near an interlayer conductor part for electrical connection to the inner layer.SELECTED DRAWING: Figure 41

An antenna module according to one embodiment comprises: a flexible printed circuit board (FPCB) having a first ground pattern formed on both sides of a feed line, which is formed on one surface thereof, and spaced apart from the feed line; a first dielectric substrate connected to a feeding pattern in which a first metal mesh pattern operating as a radiator is formed on one surface of the FPCB; and a second dielectric substrate connected to a second ground pattern in which a second metal mesh pattern operating as a ground is formed on the other surface of the FPCB.

A printed circuit board includes a bendable portion. The bendable portion is bendable in a bending direction in plan view and has a first dielectric layer, a signal pattern, a second dielectric layer, a cloth, and a ground pattern. The first dielectric layer has a first main surface. The signal pattern is arranged on the first main surface. The second dielectric layer has a second main surface and a third main surface opposite to the second main surface, and the second main surface is arranged to face the first main surface. The cloth includes a plurality of first reinforced fibers extending in a first direction in plan view and a plurality of second reinforced fibers extending in a second direction inclined with respect to the first direction in plan view, the plurality of first reinforced fibers and the plurality of second reinforced fibers being knitted together in a cloth form.

The utility model provides a display device for a vehicle. The display device can restrain noise from being transmitted through an elastic component. A vehicle display device is provided with: a display having a display surface on which information is displayed; a housing that accommodates the display and has an opening; a protective panel member that is formed in a translucent plate shape that blocks the opening of the housing, and that adheres the display surface to the rear surface of the housing on the housing space side; a circuit board located on the rear surface side of the display and having a ground pattern; and an elastic member which is made of a conductive material, is mounted on the surface of the circuit board facing the display, and presses the display. The circuit board has a mounting pattern, which is a region where the elastic member is mounted, and which is formed on the surface at a position away from the ground pattern as a conductive pattern different from the ground pattern.

Disclosed herein is a wireless module that includes an oscillation circuit component and an RFIC mounted on a multilayer substrate. The oscillation circuit component includes a clock terminal and a first ground terminal. The RFIC has a second ground terminal that supplies a ground potential to a clock circuit therein and a third ground terminal that supplies a ground potential to an RF circuit therein. The multilayer substrate includes a first conductor layer positioned closest to the plurality of pad electrodes of the RFIC and including a first ground pattern connected to the first and second ground terminals and a second ground pattern connected to the third ground terminal. The first and second ground patterns form a gap between the second and third ground terminals in a plan view as viewed in a stacking direction of the multilayer substrate.

An electronic apparatus includes: an electronic component; a substrate including a first layer at which the electronic component and a first ground pattern are disposed, and a second layer at which a second ground pattern is disposed; and a case which is in contact with the first ground pattern, covers the electronic component, reduces magnetic noise, and is fixed to the substrate, and plural conductors connecting the first ground pattern and the second ground pattern are disposed along a portion of the first ground pattern, the portion being in contact with the case.

A card edge connector system includes a socket body 12 forming a socket 14 having opposing sides 16 and a bottom 19. A plurality of spring elements 20 are positioned along at least one of the opposing sides of the socket and form a plurality of spring fingers 22 flexing inwardly in the socket. A ground contact 40 is positioned on the bottom of the socket 14 and includes a spring finger 42 configured for flexing upwardly in the socket. A printed circuit board 26 having opposing sides 36, 38 and an edge 46 includes data signal patterns 32, 34 plated on a side of the board for handling a data signal. A ground pattern 62 is plated on each of the opposing sides of the board and a ground pattern 64 is plated on an edge of the board. Other ground layers 66 are positioned within the printed circuit board and electrically coupled with the ground patterns on the opposing sides and the ground pattern 64 on the edge of the board so that when the printed circuit board is received in the socket, the spring fingers engages the data signal pattern and the spring finger of the ground contact engages the edge of the board.

A resolver stator (2) of a resolver (1) which detects a rotation angle of a resolver rotor (3), comprises a plate-shaped carrier (21), a first winding (11, 12) provided on the carrier (21) and to which an input signal generated at an external device (4) is fed, a second winding (15) provided on the carrier (21) and outputting an output signal to the external device (4), a core (22) made of a magnetic body which is arranged superimposed on the carrier (21) in an axial direction and is arranged opposite the first winding (11, 12) and the second winding (15) in the axial direction, respectively, and a grounding pattern (7) which grounds the core (22) to the external device (4).

A planar illumination device (1) according to an embodiment comprises a baseboard (20) and a metal frame (10). In the baseboard (20), a plurality of light sources (21) are two-dimensionally arranged on a first surface (20a), and control circuits (23, 24) for controlling lighting of the light sources (21) are disposed on the first surface (20a) and / or a second surface (20b). The metal frame (10) supports the baseboard (20) and is electrically connected to a ground pattern formed on the baseboard (20).

The laminated common mode filter of the present invention has a filter stack including: a coil stack including a plurality of coils forming different channels; and a stack stacked under the coil stack and having a capacitor pattern, a floating pattern, an inductor pattern, and a ground pattern. Wherein a resonant frequency characteristic may vary according to the inductor pattern.

To provide an electronic device capable of suppressing deterioration of radiation noise.SOLUTION: The electronic device 100 includes a main board 20, a semiconductor package 30, a shield cover 60, and a ground conduction portion 70. A main ground pattern 27 is formed on the main substrate 20. The semiconductor package 30 is mounted on the main board 20, and includes a semiconductor chip 40, a package substrate 50 on which the semiconductor chip 40 is mounted, and a package ground pattern 57 formed around the semiconductor chip 40 on the package substrate 50. The shield cover 60 is used to dissipate heat from the semiconductor chip 40 and includes a shield portion 62. The shield portion 62 is formed of a conductive material and is disposed so as to cover the semiconductor chip 40. The ground conductive portion 70 electrically connects the shield portion 62 to the package ground pattern 57.SELECTED DRAWING: Figure 3

The utility model provides a color-changeable high-reliability touch screen sensor structure, which comprises a touch screen cover plate, a touch layer, an optical adhesive layer, an electrochromic film layer and an FPC (Flexible Printed Circuit), one more electrochromic film layer is fixed through the optical adhesive layer, the electrochromic film layer is bound with the FPC through a power-on pattern circuit and is powered on and powered off through a circuit on the FPC, and the color-changeable high-reliability touch screen sensor structure is arranged on the touch screen cover plate. The electrochromic film becomes colorless and transparent after being powered on and becomes semi-transparent black when being powered off, so that the integrated black effect of the touch screen is enhanced through the electrochromic film layer, a layer of grounding pattern circuit is printed on the electrochromic film layer in a silk-screen mode, a whole pattern is formed, a shielding cover can be formed in space, and the electrostatic shielding effect is achieved; damage and interference caused by static electricity can be isolated, and the reliability of the touch layer is greatly improved.

To provide a game machine capable of suppressing a decline in security against unauthorized access to an electronic board.SOLUTION: An insulating film is formed and multiple surface-mounted electronic components and insertion-mounted electronic components are mounted on the front board surface of a first main-side board on which solid ground patterns are applied. The insulating film is formed and only multiple surface-mounted electronic components are mounted without mounting insertion-mounted electronic components on the front board surface of a second main-side board on which solid ground patterns are not applied. The multiple surface-mounted electronic components mounted on the front board surface of the first main-side board include specific surface-mounted electronic components having an exterior of a specific color. The insertion-mounted electronic components mounted on the front board surface of the first main-side board include special insertion-mounted electronic components having an exterior of a special color different from the color of the insulating film formed on the first main-side board and the color of the specific surface-mounted electronic components. The specific surface-mounted electronic components and the special insertion-mounted electronic components are arranged adjacent to each other with an electronic component-unmountable area in between.SELECTED DRAWING: Figure 129

Disclosed is a semiconductor package comprising a redistribution substrate and a semiconductor chip on the redistribution substrate. The redistribution substrate includes a plurality of first conductive patterns including a pair of first signal patterns that are adjacent to each other, and a plurality of second conductive patterns on surfaces of the first conductive patterns and coupled to the first conductive patterns. The second conductive patterns include a ground pattern insulated from the pair of first signal patterns. The ground pattern has an opening that penetrates the ground pattern. When viewed in plan, the pair of first signal patterns overlap the opening.

A circuit board of a switching power supply device includes a positive terminal circuit pattern and a negative terminal circuit pattern that are provided on a component mount surface and respectively supply currents from input parts to two input terminals of a common mode choke coil. The positive terminal circuit pattern and the negative terminal circuit pattern are positioned in parallel and close to each other. The component mount surface of the circuit board includes a component mount surface side ground pattern arranged below the common mode choke coil. A heat dissipation ground surface of the circuit board includes a ground pattern and a plurality of heat dissipation conductor patterns. Input terminals and output terminals of the common mode choke coil are respectively electrically and thermally connected to the heat dissipation conductor patterns via through-hole conductors provided between the component mount surface and the heat dissipation ground surface.

A ground terminal (11b), first to third ground patterns (11a,21a,21b), first and second ground via holes (12b,22) and a third connecting member (25) configure an electromagnetic shield structure covering peripheries of a signal terminal (14b), first and second signal patterns (14a,24), a first signal via hole (12a), a semiconductor chip (103) and first and second connecting members (26a,26b).