291 results about "Return loss" patented technology

The invention discloses an orthogonal directional coupler and a microwave system based on a micro-coaxial technology, the orthogonal directional coupler comprises a metal outer conductor, an upper inner conductor and a lower inner conductor, the upper inner conductor and the lower inner conductor are suspended in the metal outer conductor through a periodic medium support loading structure; the upper inner conductor and the lower inner conductor serve as two identical micro coaxial coupling lines to be cascaded, the micro coaxial coupling lines are symmetrical multi-stage impedance stepped couplers, each micro coaxial coupling line is provided with n coupling units, the coupler structure is symmetrical about the center coupling unit, the upper inner conductor and the lower inner conductor are overlapped in the axial direction at the center coupling unit, and the upper inner conductor and the lower inner conductor are overlapped in the axial direction at the center coupling unit. The upper inner conductor and the lower inner conductor extend from the center coupling unit to the two ends, the upper inner conductor and the lower inner conductor deviate from the center to the two sides, and the closer to the coupling units at the two ends, the larger the offset is; the ultra-wideband orthogonal antenna can work in the frequency range of 5 GHz to 100 GHz, the return loss is superior to 15 dB, the phase change is smaller than 5.5 degrees, the directivity is superior to 10 dB, and the ultra-wideband orthogonal antenna can be used for generating ultra-wideband orthogonal signals.

The invention provides a comprehensive shielding signal cable and a manufacturing method thereof.The comprehensive shielding signal cable comprises a cable core and a protective layer wrapping the cable core, and the protective layer sequentially comprises a composite shielding layer and an outer sheath layer from inside to outside; the composite shielding layer comprises an iron-based amorphous nanocrystalline alloy layer, a 3D woven mesh layer and a conductive polymer coating which are sequentially arranged on the outer side of the cable core from inside to outside; through the gradient composite structure of the iron-based amorphous nanocrystalline alloy layer (low-frequency magnetic shielding), the 3D woven mesh layer (medium-frequency electromagnetic shielding) and the conductive polymer coating (high-frequency electric field shielding), the full-band shielding effectiveness is realized for the first time, meanwhile, the return loss is greatly reduced, the electromagnetic transmission performance and reliability of the cable are improved, and the service life of the cable is prolonged. And the structural stability of the cable is improved.

Provided in the present disclosure are a patch antenna, an antenna array and a communication device. The patch antenna comprises: a feed circuit, a slotted ground plane, and a first patch layer, a second patch layer and a third patch layer, which are sequentially stacked in the direction of the slotted ground plane facing away from the feed circuit and are spaced apart from each other, wherein the feed circuit comprises two feed ports and an open-loop annular feed portion connecting the two feed ports; the slotted ground plane is located on one side of the feed circuit; the slotted ground plane is provided with a plurality of slots; the slotted ground plane is spaced apart from the feed circuit; the orthographic projections of the slots on the feed circuit at least partially overlap the open-loop annular feed portion; and the first patch layer comprises a first patch, the second patch layer comprises a second patch, and the third patch layer comprises a first annular patch. The simplification of the structure of a polarization switchable antenna, the reduction of the return loss and the increase of the signal gain and impedance bandwidth are facilitated.

The invention discloses a circuit board printing control method and system based on signal transmission loss. And obtaining a target differential transmission line parameter and a circuit board lamination parameter. And establishing an electromagnetic simulation model, and simulating insertion loss, return loss and impedance discontinuous point distribution. The line width, the line spacing and the interlayer hollowed-out area of the differential transmission line are dynamically adjusted through the reinforcement learning model, the proportion of the line width to the shielding layer spacing is limited by a preset critical value, and the line spacing is configured based on the multiple relation of the shielding layer spacing. And a sectional optimization strategy is adopted for the corners of the transmission line. The ratio of the aperture to the diameter of the anti-pad is optimized, and impedance mutation is reduced. According to the method, the key parameters of the target differential transmission line and the circuit board lamination parameters are acquired, and the electromagnetic simulation model is combined with the multi-physical field coupling algorithm, so that the insertion loss, the return loss and the impedance discontinuous point distribution can be accurately simulated. The method improves the adjustment efficiency, guarantees the accuracy of an adjustment result, and effectively reduces the signal transmission loss.

The invention relates to the technical field of optical communication equipment testing, in particular to an integrated optical module multi-parameter testing system and method.The method comprises the steps that a multi-channel parallel testing unit synchronously collects light spot morphology, divergence angles, insertion loss and return loss space and transmission characteristic parameters through a transmission light path and a reflection light path; the parameter collaborative analysis module performs nonlinear correlation analysis and dynamic performance threshold evaluation based on a cross-dimension correlation model; the intelligent calibration engine dynamically adjusts the test benchmark and compensation parameters according to the environment temperature and the equipment aging attenuation model; the fault diagnosis and prediction unit identifies potential defect types of the collimator, constructs a performance degradation prediction model in combination with a working state and environmental stress, and predicts a performance evolution trend according to test data; and the test report generation module automatically generates a standardized and customized dual-mode test report, a quality grade label and a performance optimization suggestion according to the prediction result and the diagnosis conclusion. Therefore, the problems of poor test precision, low test efficiency and the like in the prior art are solved.

The invention relates to a slip ring wireless transmission structure applied to X-ray tomography equipment, which comprises a transmitting antenna and a receiving antenna, the transmitting antenna is composed of a transmitting transmission line and a transmitting adapter plate, the transmitting antenna is arranged on the radial outer side surface of a slip ring, and the receiving antenna is fixed on an equipment rack. The structures of the matching end of the transmitting antenna, the transmitting conversion plate and the receiving antenna are optimally designed, and the microstrip line with a periodic structure is used in the transmitting transmission line, so that compared with the wireless transmission structure of the existing equipment, the near-field coupling efficiency is improved, the return loss of the system is effectively improved, the signal-to-noise ratio is reduced, and the transmission efficiency is improved. Therefore, the transmission stability and reliability are effectively improved, and the use requirements of CT equipment can be better met.

The utility model relates to the technical field of optical communication, in particular to a waveguide terminator and an optical module.The waveguide terminator comprises an optical absorber and a transmission waveguide which are stacked and arranged at intervals; wherein the transmission waveguide comprises a first waveguide section and a second waveguide section, and the second waveguide section is located in a projection area of the light absorber and used for diverging a light field. One end of the first waveguide section is connected with the second waveguide section, and the other end of the first waveguide section extends out of the projection area of the light absorber and is used for transmitting externally input incident light to the second waveguide section. And the included angle between the tangent line of the first waveguide section at the boundary of the projection area of the light absorber and the boundary is smaller than 90 degrees, so that a small amount of light reflected at the boundary of which the refractive index suddenly changes can enter the cladding to be dissipated, additional return loss is avoided as far as possible, and the return loss of the optical chip can be further reduced.

The broadband coaxial-to-microstrip line converter comprises a coaxial line, a gold strip and a substrate, the coaxial line comprises a coaxial outer conductor, a central medium and a coaxial inner conductor which are arranged from outside to inside, the coaxial inner conductor at one end of the coaxial line is shorter than the coaxial outer conductor, and a containing space for installing the gold strip and the substrate is formed. The substrate comprises a top-layer conduction band, a middle insulating layer and a bottom-layer conduction band, the top-layer conduction band comprises a top-layer gradual change area and a microstrip line which are located on the same center line with the coaxial inner conductor, and the bottom-layer conduction band is provided with a gradual change hollow area right below the top-layer gradual change area to jointly form a mode gradual change area. According to the utility model, the structure is exquisite, a TEM mode transmitted in a coaxial line can be smoothly transited to a quasi TEM mode transmitted by a microstrip line, the working bandwidth of the whole conversion circuit is effectively improved, the working frequency can reach up to 50GHz, and the return loss of each frequency point is less than-15dB.

The present invention discloses a microwave topological photonic crystal metasurface antenna, which belongs to the field of communication technology. The present invention adopts a layered structure similar to a patch antenna, including a ground plate, a dielectric layer, a topological photonic crystal, a rectangular metal frame, and a microstrip feeder arranged from bottom to top. The topological photonic crystal is arranged above the dielectric layer, the rectangular metal frame is coated on the periphery of the topological photonic crystal, and the microstrip feeder is connected to the rectangular metal frame. The present invention can achieve multi-band characteristics and extended bandwidth. In addition, most of the electromagnetic waves propagated by the antenna within the band gap range are suppressed, and only electromagnetic waves of the angular state frequency can propagate, with smaller return loss, and the topological angular state can achieve unidirectional radiation, with better directivity at high frequencies. As a result, the antenna performance is greatly improved, which is very suitable for on-chip optical interconnection and photonic chip integration, and meets the needs of 5G / 6G communications, quantum computing, etc. for miniaturized devices.

The invention relates to the technical field of optical fiber connector connection monitoring, in particular to an AI-based optical fiber connector connection reliability monitoring method and system, and the method comprises the steps: constructing a multi-mode monitoring data source through synchronously collecting time sequence parameters including optical power, insertion loss, return loss and other physical quantities and a connector end face image, the image is subjected to feature mapping through the convolutional neural network, spatial features of pollution, scratches and alignment deviation are automatically extracted, manual inspection is replaced, and the recognition efficiency and objectivity are improved. Time sequence parameters are input into the modeling performance evolution trend of the long-short-term memory network, and weak dynamic characteristics such as chronic degradation are effectively captured. And through fusing image space features and parameter trend features, strengthening key factor characterization, and outputting a reliability determination result of the connector through a residual error classification network, accurate classification of normal, to-be-maintained and fault states is realized, traceability alarm information can be generated, and intelligent monitoring and early warning of the operation state of the connector are realized.

The present invention relates to an adaptive matching circuit and a matching method for a magnetic resonance radio frequency coil, and belongs to the field of magnetic resonance imaging technology. The circuit includes a receiving coil, an adjustable matching circuit, a radio frequency switch, a return loss detection circuit, and a single-chip control circuit; the circuit uses a binary method to adjust the voltage value across the variable capacitance diode in the adjustable matching circuit, and automatically detects the adaptation of the matching circuit through the return loss detection circuit to achieve instant adaptive circuit matching, and through the joint action of the adjustable matching circuit, the radio frequency switch, and the single-chip control circuit, the return loss at the center frequency point of the receiving coil reaches the maximum value to achieve the best matching. The present invention can effectively avoid the situation where the matching circuit cannot match, and improve the transmission efficiency of high-frequency signal energy.

The invention provides a low-coupling rewiring packaging structure and a preparation method thereof, and relates to the chip packaging technology, the packaging structure comprises a chip, a plastic package body, a dielectric layer, a reconfiguration circuit layer and solder balls, and the front surface of the chip is provided with a metal layer; the plastic package body wraps the periphery of the chip; the dielectric layer is arranged on the surface of the metal layer and covers the plastic package body; the reconstruction line layer is arranged in the dielectric layer and is connected with the metal layer; the solder ball is arranged on one side, far away from the chip, of the dielectric layer and is connected with the reconfiguration circuit layer; wherein the metal layer is etched to form an avoiding gap, the avoiding gap penetrates through the metal layer, and the projection of the reconstruction circuit layer on the front surface of the chip is at least partially overlapped with the avoiding gap. Compared with the prior art, by forming the avoiding gap overlapped with the reconstruction circuit layer on the metal layer, the overlapping area of the reconstruction circuit layer and the metal layer can be greatly reduced, the coupling effect with the RDL is reduced, and the return loss result of a high-frequency signal is greatly improved.

The invention discloses a broadband double-layer interconnection structure based on a silicon adapter plate technology, and belongs to the technical field of radio frequency microsystems. According to the method, a three-dimensional compensation structure is formed by adding square conductive metal and TSVs into lower-layer metal at one end, close to a transition structure, of an original coplanar waveguide transmission line, and a resonance point with return loss of-51dB is introduced at 17.59 GHz, so that the broadband interconnection effect that the return loss of 0-33GHz is smaller than or equal to-20dB is achieved, and the in-band insertion loss fluctuation value is reduced by 11.6% compared with that of the original structure. Compared with a traditional interconnection structure broadband design, the method has the advantages that on the premise that the plane area is not increased, the broadband interconnection design difficulty is greatly reduced through the three-dimensional structure design.

The invention discloses a method and device for measuring electrical input and output performance in a high-speed optical module, and the device is characterized in that an optical module golden finger interface module is connected with multiple groups of P / N poles of a to-be-measured high-speed optical module through golden fingers before a finished product is assembled; the electric switch chip is connected with the golden finger interface; the controller controls the on-off of the plurality of groups of P / N poles through the electric switch chip; the network distribution test equipment controls electric signals with different frequencies to be output to a group of P / N poles of the high-speed optical module to be tested every time under a test control signal of the industrial personal computer, acquires return loss electric signals generated by the high-speed optical module to be tested through the group of P / N poles, generates a frequency-return loss electric signal atlas and sends the atlas to the industrial personal computer; and the industrial personal computer enables the spectrum of the frequency-return loss electric signal to correspond to the channel of the high-speed optical module to be detected, and judges whether the high-speed optical module to be detected is qualified or not according to a preset return loss condition. According to the invention, defective products of the optical modules can be screened out before the optical modules are assembled into finished products.

The invention discloses a 16-in-one high-power combiner working in a radio frequency band, and belongs to the technical field of fusion radio frequency heating. The invention comprises a coaxial input hard feeder line, a radial transmission line (RTL), a gradient impedance matching coaxial line and a coaxial output hard feeder line. The physical size is designed through theoretical calculation, electromagnetic field distribution is optimized through simulation, 16 radio-frequency signal input ports are designed through radial symmetric topology, a radial transmission line serves as a main synthesis path of radio-frequency signal source power, the power input by the 16 radio-frequency signal source ports is subjected to one-step efficient synthesis in the center of the radial transmission line, and the radio-frequency signal source power is obtained. And the 50-ohm characteristic impedance standard output of the synthesized radio frequency signal power is realized through an impedance matching technology. The sixteen-in-one power combiner designed by the invention has the characteristics of high synthesis efficiency, symmetrical structure, good amplitude and phase consistency, high isolation, low return loss, low reflection loss, simple design structure, easiness in manufacturing and the like.

The invention relates to an optical fiber insertion loss and return loss test management system and method, an optical power detection module comprises an input optical power detection unit, an output optical power detection unit and a reflected light power detection unit, and further comprises an optical emission module, an optical switch matrix and a data processing module, and the optical emission module is a quantum dot tunable laser module; the optical switch matrix is a bionic optical switch matrix, and multi-channel optical path reconstruction is realized; the optical power detection module is internally provided with a multi-physical field sensing array and detects optical power data in real time; the data processing module is used for receiving the optical power data and processing the data; comprising a test module for acquiring optical power data based on the optical power detection module and calculating optical fiber insertion loss and optical fiber return loss according to the acquired optical power data. The technical problems that the insertion loss measurement error is influenced by temperature drift, the switching time of an optical switch is too long, the rapid detection requirement of a 5G bearing network for batch optical fibers is difficult to meet, the real-time sensing and compensation capability is lacked, and the test result is not accurate in a complex environment are solved.

The invention provides a packaging structure, an optical module and an optical communication system. The packaging structure comprises an insertion core which comprises an optical fiber which is used for transmitting signal light; the pipe cap comprises a lens, and the lens is used for focusing the signal light; the tube base is matched with the tube cap to form a containing cavity, a light receiving chip is arranged in the containing cavity and used for receiving focused signal light, and the included angle between the normal of the plane where the light receiving chip is located and the main optical axis of the lens is larger than 0 degree. Therefore, the focused signal light received by the light receiving chip can form large-angle reflection at the light receiving chip, so that most of the signal light reflected by the light receiving chip is emitted from the edge of the lens and cannot be converged at the optical fiber, and the return loss capability of the packaging structure is improved.

The invention belongs to the technical field of microwave filter design, and particularly relates to a microstrip filter of a CQ frequency-variable coupling structure and a design method of the microstrip filter. The method comprises the following steps: firstly, according to required filter indexes, such as order, center frequency, bandwidth, return loss and transmission zero position, solving a transverse matrix M of a filter by utilizing a filter comprehensive theory; then performing similarity transformation and scaling transformation on the transverse matrix to eliminate unnecessary coupling terms in the transverse matrix so as to obtain a filter topological structure and a frequency-dependent coupling matrix M'which are easier to implement; a quarter-wavelength short-circuit stepped impedance resonator is selected as a resonance unit of the micro-strip filter simulation model; finally, relevant coupling parameters of the micro-strip filter simulation model are made to approach the theoretical coupling coefficient by adjusting relevant physical structure parameters of the resonator, and then design is completed. By introducing a frequency-dependent coupling mechanism into the structure, the position of a transmission zero point is flexible and controllable, and the spectrum selectivity and the out-of-band rejection capability of the filter can be effectively improved.

The invention provides an antenna test method and an antenna test system. The antenna test method comprises the following steps: acquiring test parameters of n to-be-tested products; the test parameters comprise any one of return loss, voltage standing wave ratio and reflection coefficient; determining a feature mean value of the n to-be-tested products based on the test parameters of the n to-be-tested products; determining a feature deviation mean value of the pth to-be-tested product based on the test parameters and the feature mean value of the pth to-be-tested product in the n to-be-tested products; if the characteristic deviation mean value is greater than or equal to a first preset value, determining that the pth to-be-detected product does not meet a preset requirement; n and p are integers, n is greater than or equal to 2, and p is greater than or equal to 1 and less than or equal to n. According to the application, the test parameters of the n to-be-tested products are introduced into the test evaluation of the pth to-be-tested product to obtain the feature deviation mean value of the pth to-be-tested product, so that the accuracy of the test result and the consistency of the to-be-tested products can be improved.

The invention provides a system and a method for measuring insertion loss and return loss of a multi-core optical fiber link based on an OFDR (Optical Frequency Domain Reflectometer), and belongs to the field of optical fiber link diagnosis and measurement. The system is composed of a multi-wavelength laser, three wavelength division multiplexers, two couplers, N circulators, a photoelectric detector, a data acquisition card, a to-be-measured link and an upper computer, the multi-wavelength laser outputs laser with N wavelengths, the wavelength division multiplexers multiplex signals and then divide the signals into signal light and reference light through a first coupler, the signal light is used for being output to the to-be-measured link, and the reference light is used for being output to the to-be-measured link. A mixing signal formed by the reflected light of the to-be-measured link and the reference light interferes in the photoelectric detector, a coherent mixing signal containing the insertion loss and return loss information of the to-be-measured link is measured, and the insertion loss and return loss of each node of the to-be-measured link can be calculated by analyzing the coherent mixing signal. By using the OFDR technology, the full-range measurement from the starting point to the ending point of the optical fiber is realized, so that the OFDR can comprehensively diagnose the health state of the optical fiber link.

The invention relates to the technical field of radio frequency processing, discloses a radio frequency chip fan-out packaging design method based on machine learning optimization, and aims at the design of high-speed packaged high-frequency pins. A high-frequency pin GSG structure design process is decoupled into a mapping problem of an RDL signal line length L, a signal line and ground line spacing S, a signal involute angle alpha and pin characteristic impedance, loss and return loss electrical performance. And by taking the solving process of the positive problem as a training environment, reversely solving a specific combination of GSG structure design size parameters meeting different design demand responses. Meanwhile, in the face of small-batch radio frequency chip product design of customized, small-crowd or technical exploration stage scenes with few products and various forms, a non-ergodic sample collection and later-stage small-amount adjustment mode is adopted, and the situation that ergodic simulation covers all parameter ranges to generate models and simulations in batches is avoided; and the earlier-stage investment time and computing power cost are higher than the small-batch production income.

The present invention discloses a double-clad fiber pump return filter, which relates to the technical field of fiber amplifiers and fiber lasers. The filter includes an input fiber collimator, a triangular prism, a supporting glass tube, a filter, an output fiber collimator, and a bridge glass tube; the supporting glass tube is fixedly installed in the middle position inside the bridge glass tube, and the triangular prism and the filter are respectively fixedly installed at both ends of the supporting glass tube; the input fiber collimator and the output fiber collimator are respectively inserted into the two ends of the bridge glass tube and fixed after optical debugging; the present invention uses the dispersion effect to cause the transmission angles of the pump light and signal light transmitted on the same optical fiber to deviate, and then the residual pump light can be returned to the original path while maintaining high return loss of the signal light, effectively improving the utilization efficiency of the pump light and having positive significance for improving the conversion rate of fiber amplifiers and fiber lasers.

The invention discloses a phase and amplitude modulation noise iterative compensation method and system for an optical frequency domain reflectometer, and belongs to the technical field of optical measurement and sensing, and the phase and amplitude modulation noise iterative compensation method for the optical frequency domain reflectometer comprises the steps: collecting an auxiliary interferometer signal and a measured device interference signal; extracting phase information of the auxiliary interferometer signal, and obtaining amplitude modulation noise information based on the phase information; carrying out phase noise suppression on the interference signal of the tested device, then carrying out Fourier transform to obtain a frequency spectrum, and calculating background noise and a signal peak value; generating an amplitude-modulated noise signal based on the signal peak position and the amplitude-modulated noise information; subtracting the amplitude modulation noise signal from the frequency spectrum to obtain a compensated signal; when the signal-to-noise ratio of the signal peak value to the background noise is lower than a set threshold value, iteration is stopped, and phase and amplitude modulation noise iteration compensation is completed. According to the invention, the system compensation cost can be saved, the compensation precision is improved, the system complexity is reduced, the robustness is improved, and the return loss measurement precision is improved.

The invention relates to an adjustable gain slope compensator. The invention discloses an adjustable gain slope compensator and a method of use. In one aspect, a compensator having a plurality of switchably engaged stages may be positioned in a signal path. The stages selectively switch into or out of the signal path to achieve a desired gain slope compensation to counteract over-amplification in the signal path. In other aspects, the compensator can be dynamically adjusted. In other aspects, the stages may be fully bypassed in order to avoid adding undesirable attenuation to the signal path. The ability to digitally control the compensator allows greater control to provide specific slope values while providing improved return loss and improved bandwidth characteristics.

The application discloses an optical link test method and device based on optical frequency domain reflection, which comprises the following steps: measuring echo optical signals of an optical link in an initial state by using a frequency domain reflectometer to obtain a first signal; measuring the echo optical signals of the optical link after changing the function state of the optical link again by using the frequency domain reflectometer to obtain a second signal; performing fast Fourier transform on the measured first signal and second signal respectively to obtain corresponding frequency domain signals and a distance-power relationship curve; converting the same frequency band in the two frequency domain signals into time domain signals by sliding window interception; performing cross-correlation operation on the time domain signals of the two groups of signals to obtain Rayleigh scattering frequency shift; and obtaining a distance-power distribution curve by calculation in combination with a coefficient. The application can realize fast and accurate measurement and calibration of optical field amplitude and phase parameters of an integrated system from a device level to a link level, and efficiently measure return loss, insertion loss, spectrum, delay and other parameters of an optical link on a chip.

The invention discloses a radio frequency signal bonding pad optimization method based on SiP packaging. Belongs to the technical field of radio frequency system SiP packaging, realizes introduction of structural variables to change signal transmission characteristics, improves characteristic impedance by adding a chamfer and a grounding hole at the joint of a bonding pad and a transmission line, increases return loss, reduces insertion loss and improves signal transmission characteristics. Through three-dimensional electromagnetic simulation verification, in the frequency band of 500 MHz to 20 GHz, the return loss is increased by more than 5 dB and the insertion loss is reduced by 0.5 dB compared with the traditional structure by adding the pad structure of the chamfers and the grounding holes. Along with more miniaturization, multi-functionalization and high integration of products, the requirements of the market on advanced packaging technology are continuously increased. The technology of the invention can integrate more and more radio frequency and microwave electronic equipment into a wireless communication system.

An antenna system formed by one or more layers of a Printed Circuit Board (PCB). The antenna system includes a first antenna element configured to resonate in a first frequency band centered at about 5.4 GHz and a second antenna element configured to resonate in a second frequency band centered at about 2.4 GHz. The first antenna element and the second antenna element fit within a rectangular area of less than about 100 square millimeters on the PCB. The first antenna element has a bandwidth of at least 2 GHz and the second antenna element has a bandwidth of at least 100 MHz, wherein the bandwidth is defined as having less than a −10 dB return loss within the band. The first antenna element and the second antenna element may be formed on a common conductive layer of a PCB.

The invention relates to the technical field of resonators, in particular to a resonator parameter analysis method and system based on artificial intelligence, and the method comprises the steps: generating an ideal coupling matrix of a target resonator according to the center frequency, the passband bandwidth and the in-passband return loss; acquiring a corresponding relationship among an external quality factor, a coupling coefficient between resonant cavities, a coupling window width and a resonant cavity length through electromagnetic simulation or theoretical calculation, constructing a training data set, and training a regression model to predict the coupling window width; obtaining an external quality factor and a coupling coefficient of a target frequency band by utilizing baseband-passband transformation, solving the width of each coupling window through a prediction model, calculating the length of a resonant cavity by combining interpolation and scale transformation to form an initial size, establishing a three-dimensional simulation model to extract a coupling matrix, and iteratively correcting the length of the resonant cavity according to diagonal elements, so as to obtain an initial size; and obtaining a final physical size meeting the index. According to the method, the problems that an existing resonator design and parameter analysis process depends on experience, the number of simulation iterations is large, and the parameter reverse solving efficiency is low can be solved.

The invention discloses a flexible transmission system for superconducting quantum computing, and belongs to the technical field of flexible transmission, the flexible transmission system comprises a normal temperature mounting disc, a sealing cavity capable of expanding in the Z-axis direction is mounted on the normal temperature mounting disc, and a multi-channel airtight connector module is mounted on the sealing cavity; the actual installation number of the multi-channel airtight connector modules can be adjusted within the range of 1-20 or above. According to the invention, through the designed multi-channel radio frequency rigid-flex board or flexible circuit board, the circuit in the FPC can stably work at a high frequency up to 10GHz at normal temperature and low temperature, and has excellent performances of low insertion loss, return loss and the like, the installation height and the bending degree are adjusted through the first section of flexible transmission circuit board Rigiid-Flex PCB / FPC, and the installation efficiency is improved. The path length difference is compensated, the transmission length of each path of signal is ensured to be consistent, the transmission loss consistency of each channel is further ensured, and a stable and reliable signal transmission basis is provided for the superconducting quantum computer.

The invention relates to the technical field of wireless communication, and provides a differential matching structure which comprises a first metal layer, a second metal layer, a third metal layer and a capacitor, a first coupling coil is integrated on the second metal layer, a second coupling coil and a third coupling coil are respectively integrated on the first metal layer, and the second coupling coil and the third coupling coil are positioned on the same side of the first metal layer; the third metal layer is used for grounding; the first end of the first coupling coil is used for accessing a radio frequency signal, the second end of the first coupling coil is grounded after being connected with a capacitor in series, the first end of the second coupling coil and the first end of the third coupling coil are connected and jointly connected to the third metal layer, and the second end of the second coupling coil is used for outputting the radio frequency signal; the second end of the third coupling coil is used for outputting a radio frequency signal; the first coupling coil is coupled with the second coupling coil and the third coupling coil. According to the invention, the return loss is small, and the broadband matching effect is good.