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705results about How to "Made small" patented technology

System and method for data input

The invention provides a system and a method for data input that can be used with or incorporated into electronic, computer, and portable devices. The interface includes a small set of control buttons or keys that are used to provide access to an associated set of secondary keys, from which the user can select a character for input into the device. Intelligent ordering and grouping of the control and secondary keys allows the user to input information in a manner conducive to speed, accuracy, and ease of use, while the interface can be minimized to require less real estate than traditional keyboards. In accordance with one embodiment, a set of characters or symbols is divided into subsets, each subset being represented by a control button. Selecting a control button displays a secondary set of buttons representing actual characters or symbols that can be selected, stored, or displayed.
Owner:NUANCE COMM INC

GaN Substrate, Substrate with an Epitaxial Layer, Semiconductor Device, and GaN Substrate Manufacturing Method

Affords a GaN substrate from which enhanced-emission-efficiency light-emitting and like semiconductor devices can be produced, an epi-substrate in which an epitaxial layer has been formed on the GaN substrate principal surface, a semiconductor device, and a method of manufacturing the GaN substrate. The GaN substrate is a substrate having a principal surface with respect to whose normal vector the [0001] plane orientation is inclined in two different off-axis directions.
Owner:SUMITOMO ELECTRIC IND LTD

Method and apparatus for using an array of grating light valves to produce multicolor optical images

A multicolor optical image-generating device comprised of an array of grating light valves (GLVs) organized to form light-modulating pixel units for spatially modulating incident rays of light. The pixel units are comprised of three subpixel components each including a plurality of elongated, equally spaced apart reflective grating elements arranged parallel to each other with their light-reflective surfaces also parallel to each other. Each subpixel component includes means for supporting the grating elements in relation to one another, and means for moving alternate elements relative to the other elements and between a first configuration wherein the component acts to reflect incident rays of light as a plane mirror, and a second configuration wherein the component diffracts the incident rays of light as they are reflected from the grating elements. The three subpixel components of each pixel unit are designed such that when red, green and blue light sources are trained on the array, colored light diffracted by particular subpixel components operating in the second configuration will be directed through a viewing aperture, and light simply reflected from particular subpixel components operating in the first configuration will not be directed through the viewing aperture.
Owner:THE BOARD OF TRUSTEES OF THE LELAND STANFORD JUNIOR UNIV

Horizontal chalcogenide element defined by a pad for use in solid-state memories

A process for fabricating phase-change elements having ultra small cross-sectional areas for use in phase change memory cells specifically and in semiconductor devices generally in which pads are implemented to create horizontally aligned phase change elements is disclosed. The elements thus defined may be used within chalcogenide memory cells or other semiconductor devices.
Owner:MACRONIX INT CO LTD

Microelectromechanical systems using thermocompression bonding

Improved microelectromechanical systems (MEMS), processes and apparatus using thermocompression bonding are disclosed. For example, process embodiments are disclosed in which wafer-scale as well as die-scale thermocompression bonding is utilized to encapsulate MEMS and / or to provide electrical interconnections with MEMS. Apparatus embodiments include apparatus for performing thermocompression bonding and bonded hybrid structures manufactured in accordance with the process embodiments. Devices having various substrate bonding and / or sealing configurations variously offer the advantage of reduced size, higher manufacturing yields, reduced costs, improved reliability, improved compatibility with existing semiconductor manufacturing process and / or greater versatility of applications.
Owner:MICROASSEMBLY TECH

Horizontal chalcogenide element defined by a pad for use in solid-state memories

A process for fabricating phase-change elements having ultra small cross-sectional areas for use in phase change memory cells specifically and in semiconductor devices generally in which pads are implemented to create horizontally aligned phase change elements is disclosed. The elements thus defined may be used within chalcogenide memory cells or other semiconductor devices.
Owner:MACRONIX INT CO LTD

Embedded electronic component package

A method of forming an embedded electronic component package includes coupling a substrate to a first dielectric layer, strip, or panel, and forming first electrically conductive vias and traces in the first dielectric layer. A cavity is then formed in the first dielectric layer and an electronic component is attached in the cavity. A second dielectric layer, strip, or panel, is then applied to the first dielectric layer, thereby encasing the electronic component in dielectric. Second via apertures are then formed through the second dielectric layer to expose selected electronic component bond pads and / or selected first electrically conductive vias and traces. The second via apertures are then filled with an electrically conductive material to form second electrically conductive vias electrically coupled to selected bond pads and selected first electrically conductive vias and traces.
Owner:AMKOR TECH SINGAPORE HLDG PTE LTD

Control circuits and methods for switching mode power supplies

Circuits and method for sensing a system output voltage change and transmitting an electrical signal to an auxiliary winding on the primary side. In an embodiment, a primary side controller detects the electrical signal and turns a power switch on and off to transfer energy from a primary winding to a secondary winding. A secondary side controller generates a voltage pulse at a terminal of the secondary winding when the system output voltage is below a reference voltage. The secondary side controller includes an input terminal connected to a system output, an output terminal connected to a terminal of the secondary winding, and a ground terminal connected to a ground potential of the system output.
Owner:BCD SHANGHAI MICRO ELECTRONICS CO LTD

Optical identification element using separate or partially overlapped diffraction gratings

An optical identification element 8 includes an optical substrate 10 having at least one diffraction grating 12 disposed therein. The grating 12 has a one or more of collocated pitches Λ which represent a unique identification N bit digital code that is detected when illuminated by incident light 24. The incident light 24 may be directed transversely onto the side or onto an end of the substrate 10 with a narrow band (single wavelength) or multiple wavelength source, in which case the code is represented by a spatial distribution of light or a wavelength spectrum, respectively. The element 8 can provide a large number of unique codes, e.g., greater than 67 million codes, and can withstand harsh environments. The element 8 can be used in any application that requires sorting, tagging, tracking or identification, and can be made on a micron scale “microbeads” if desired, or larger “macro-elements” for larger applications. The code may be digital binary or may be other numerical bases.
Owner:ILLUMINA INC

Flip-Chip Package Structure

A flip-chip (FC) package structure is provided. The FC package structure includes a substrate, a chip, a plurality of copper platforms, a plurality of copper bumps, a plating layer, a circuit layer and a solder mask layer. The copper bumps are disposed on the substrate. The copper platforms are stacked on the copper bumps. The plating layer covers the copper bumps and the copper platforms, for contacting with chip foot pads configured at a bottom of the chip. The FC package structure does not need to reserve a space for wire bonding, thus saving the area of the substrate. The copper platforms are stacked on the copper bumps, and are higher than the circuit pattern layer. Therefore, the chip is blocked up, and the gap between the chip and the substrate is enlarged, thus preventing the risk of configuring voids when filling the cladding material and improving the packaging yield.
Owner:KINSUS INTERCONNECT TECH

Diffraction grating-based encoded particle

An encoded particle 8 includes a particle substrate 10; at least a portion of the substrate having at least one diffraction grating disposed therein, the grating having a resultant refractive index variation at a grating location, the grating being embedded within a substantially single material of the substrate; and the grating providing an output optical signal indicative of a code when illuminated by an incident light signal propagating in free space, the output optical signal being a result of passive, non-resonant scattering from the grating when illuminated by the incident light signal.
Owner:ILLUMINA INC

Intraocular lens insertion device

An intraocular insertion device capable of safely performing discharge operation of a lens by a simpler construction. The intraocular lens insertion device has a body provided with a lens placement section where the lens is placed and a tube section for inserting the lens into an eye and has a plunger for discharging the lens placed on the lens placement section. The lens placement section has an upper holding member and a lower holding member. The upper holding member has a rib projecting on advancement axis A, to the lower side of the lens placement section. The lower holding member has a U-shaped cross-section and is constituted of a left and right pair of uprising sections and a pressing section uniting the uprising sections at their lower ends.
Owner:HOYA CORP

Illumination source and method therefor

ActiveUS7719766B2Made smallReduced mechanical tolerancesDisplay meansCoupling light guidesLight guideEffect light
An illumination source and a method therefor. A light source includes a light circuit configured to process light and direct light, and a lighting element optically coupled to the light circuit to provide multiple colors of light. The light circuit propagates light using light guides. The use of light guides eliminates the use of free space optical elements, enabling the creation of more compact light sources. Furthermore, the use of light guides may enable the creation of light sources with fewer mechanical restrictions, thereby making the light sources potentially more reliable and less expensive.
Owner:TEXAS INSTR INC

Wireless communication apparatus and method

A wireless communication apparatus and method is provided which makes discrete functional elements perform a cooperative work without various limitations caused by a wired configuration. The wireless communication apparatus has a plurality of fine functional elements 3 each having a communication unit for data transmission and reception by using radio waves or light and one or more unit other than the communication unit, and a base station 4 for controlling and collectively managing the fine functional elements through communications with the fine functional elements, wherein one or more units other than the communication unit are activated through communications of one of the fine functional elements 3 received control information from the base station 4 with another of the fine functional elements 3 via the communication units, to thereby make the discrete functional elements 3 perform a cooperative work.
Owner:CANON KK

Stent delivery system with diameter adaptive restraint

Medical device and methods for delivery or implantation of prostheses within hollow body organs and vessels or other luminal anatomy are disclosed. The subject technologies may be used in the treatment of atherosclerosis in stenting procedures. For such purposes, a self-expanding stent may be deployed in connection with an angioplasty procedure with a stent delivery system having a diameter adaptive restraint. Upon withdrawal of the restraint, the stent is freed, while the restraint or connections thereto assumes a reduced diameter within a tubular body of the delivery guide.
Owner:BIOSENSORS INT GROUP

Photoconductor on active pixel image sensor

A MOS or CMOS based photoconductor on active pixel image sensor. Thin layers of semi-conductor material, doped to PIN or NIP photoconducting layers, located above MOS and / or CMOS pixel circuits produce an array of layered photodiodes. Positive and negative charges produced in the layered photodiodes are collected and stored as electrical charges in the MOS and / or CMOS pixel circuits. The present invention also provides additional MOS or CMOS circuits for reading out the charges and for converting the charges into images. With the layered photodiode of each pixel fabricated as continuous layers of charge generating material on top of the MOS and / or CMOS pixel circuits, extremely small pixels are possible with almost 100 percent packing factors. MOS and CMOS fabrication techniques permit sensor fabrication at very low costs. In preferred embodiments all of the sensor circuits are incorporated on or in a single crystalline substrate along with the sensor pixel circuits. Techniques are disclosed for tailoring the spectral response of the sensor for particular applications.
Owner:E PHOCUS

Pressure wave generator and process for manufacturing the same

Even when compression stress is generated because a volume of a thermal insulation layer 2 is expanded due to oxidized by oxygen in the air, occurrence of cracks and fractures of the thermal insulation layer and a heating conductor 3 caused by the cracks are prevented by dispersing the compression stress. A pressure wave generator comprises a substrate 1, the thermal insulation layer 2 of porous material which is formed on a surface of the substrate 1 in thickness direction, and the heating conductor 3 of thin film formed on the thermal insulation layer 2, and generates pressure waves by heat exchange between the heating conductor 3 and a medium. When a thickness at the center of the thermal insulation layer 2 in width direction W is used as a reference thickness, and it is assumed that distribution of thickness of thermal insulation layer in the width direction is averaged with the reference thickness, porosity in an outer peripheral portion of the thermal insulation layer is made smaller than porosity in the center portion. By making the porosity in the outer peripheral portion of the thermal insulation layer 2 smaller, a number of immovable points on the outer periphery of the thermal insulation layer 2 restricted by the substrate 1 is increased and the positions of them are dispersed, so that the compression stress compressed in the outer peripheral portion of the thermal insulation layer 2 can be dispersed.
Owner:MATSUSHITA ELECTRIC WORKS LTD

Image recording device

When a recording starting point of a color photosensitive material reaches a position on which light beams are focused by a condenser lens and a reflecting mirror, a light beam is emitted from a red organic EL element of a light source by a controller, and red image data corresponding to a plurality of lines is transferred to a DMD. In accordance with the image data, on-off control of micromirrors of the DMD is carried out, and the red light beam emitted from the light source is made incident on the DMD. When the micromirrors are on, the incident light beam is reflected toward the reflecting mirror. The light beam is focused onto a recording surface of the color photosensitive material by the condenser lens and the reflecting mirror, and red exposure is carried out. Subsequently, green exposure and blue exposure are carried out in the same way.
Owner:FUJIFILM HLDG CORP +1

Rotary electric shaver

A rotary electric shaver including a plurality of substantially disc-shaped outer cutters, which are provided in the upper part of a shaver main body housing therein a motor, and inner cutters, which engage the outer cutters from below and are rotationally driven by the motor so as to cut hair entering into the hair introduction openings formed in the outer cutters; and in addition, substantially cylindrical cutter frames 18 for respectively holding the outer cutters in a depressible manner are provided so that cutter frames 18 can pivot in the upper surface of the shaver main body.
Owner:IZUMI PROD CO

Multiplexed Olfactory Receptor-Based Microsurface Plasmon Polariton Detector

The invention provides a bio-sensing nanodevice comprising: a stabilized G-protein coupled receptor on a support, a real time receptor-ligand binding detection method, a test composition delivery system and a test composition recognition program. The G-protein coupled receptor can be stabilized using surfactant peptide. The nanodevice provides a greater surface area for better precision and sensitivity to odorant detection. The invention further provides a microfluidic chip containing a stabilized G-protein coupled receptor immobilized on a support, and arranged in at least two dimensional microarray system. The invention also provides a method of delivering odorant comprising the step of manipulating the bubbles in complex microfluidic networks wherein the bubbles travel in a microfluidic channel carrying a variety of gas samples to a precise location on a chip. The invention further provides method of fabricating hOR17-4 olfactory receptor.
Owner:MASSACHUSETTS INST OF TECH

Hologram element, production method thereof, and optical header

A method of producing a hologram element is disclosed that is able to prevent spread of a polymerization reaction and light leakage during exposure with interference light, and improve productivity in mass production. The hologram element is for transmitting, reflecting, diffracting, or scattering incident light, and includes a pair of substrates, an isolation member between the substrates that forms an isolated region, and a photo-sensitive recording material sealed in the isolated region. The hologram element includes a periodic structure formed by exposing the recording material to interference light. The interference light is generated by two or more light beams, or by using a master hologram. The recording material is formed from a composite material including a polymerized polymer or a polymerized liquid crystal. The periodic structure is formed by exposing the recording material to the interference light to induce the polymerization reaction and phase separation in the composite material.
Owner:RICOH KK

Camber angle controlling device

A camber angle applying device is controlled to adjust the camber angle of wheels to a predetermined value. Therefore, the characteristics (or a high gripping property) of a high gripping force and the characteristic (or a low rolling resistance) of a small rolling resistance can be separately used as the performance of the wheels. By utilizing the high gripping property of the wheels, therefore, a vehicle is enabled to reduce its energy consumption, while retaining its running characteristics (such as a turning performance, an accelerating performance or a braking performance), by utilizing the rolling resistance of the wheels. Moreover, the camber angle applying device is controlled to reduce the rolling resistance of the wheels, so that the energy loss to occur in the wheels during running can be reduced to further reduce the energy consumption of the vehicle.
Owner:EQUOS RES

EMP Actuators for Deformable Surface and Keyboard Application

A localized multimodal haptic system includes one or more electromechanical polymer (EMP) transducers, each including an EMP layer, such as an electrostrictive polymer active layer. In some applications the EMP transducer may perform an actuator function or a sensor function, or both. The EMP polymer layer has a first surface and a second surface on which one or more electrodes are provided. The EMP layer of the EMP actuator may be 5 microns thick or less. The EMP transducers may provide local haptic response to a local a stimulus. In one application, a touch sensor may be associated with each EMP transducer, such that the haptic event at the touch sensor may be responded to by activating only the associated EMP transducer. Furthermore, the EMP transducer may act as its own touch sensor. A variety of haptic responses may be made available. The EMP transducers may be used in various other applications, such as providing complex surface morphology, keyboard, braille display, and audio speakers.
Owner:KEMET ELECTRONICS CORP

System of Audio Speakers Implemented Using EMP Actuators

A localized multimodal haptic system includes one or more electromechanical polymer (EMP) transducers, each including an EMP layer, such as an electrostrictive polymer active layer. In some applications the EMP transducer may perform an actuator function or a sensor function, or both. The EMP polymer layer has a first surface and a second surface on which one or more electrodes are provided. The EMP layer of the EMP actuator may be 5 microns thick or less. The EMP transducers may provide local haptic response to a local a stimulus. In one application, a touch sensor may be associated with each EMP transducer, such that the haptic event at the touch sensor may be responded to by activating only the associated EMP transducer. Furthermore, the EMP transducer may act as its own touch sensor. A variety of haptic responses may be made available. The EMP transducers may be used in various other applications, such as providing complex surface morphology and audio speakers.
Owner:KEMET ELECTRONICS CORP

Camera with MOS or CMOS sensor array

A novel MOS or CMOS based active sensor array for producing electronic images from electron-hole producing light. Each pixel of the array includes a layered photodiode for converting the electron-hole producing light into electrical charges and MOS and / or CMOS pixel circuits located under the layered photodiodes for collecting the charges. The present invention also provides additional MOS or CMOS circuits in and / or on the same crystalline substrate for converting the collected charges into images and manipulating image data. The layered photodiode of each pixel is fabricated as continuous layers of charge generating material on top of the MOS and / or CMOS pixel circuits so that extremely small pixels are possible with almost 100 percent packing factors. In a preferred embodiment the sensor is a 0.3 mega pixel (3.2 mmx2.4 mm, 640x480) array of 5 micron square pixels which is compatible with a lens of {fraction (1 / 4.5 inch optical format. In a preferred embodiment the sensor along with focusing optics is incorporated into a cellular phone camera or a camera attachment the cellular phone to permit transmission of visual images along with the voice communication.
Owner:E PHOCUS
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