1000 results about "Solder mask" patented technology

The invention provides a packaging substrate structure and a preparation method thereof. The preparation method comprises the following steps: providing a core plate layer; forming a multilayer substrate adding layer covering two opposite surfaces of the core plate layer and electrically connected with the core plate layer; providing an interconnection structure layer which comprises a bottom circuit layer, a bottom dielectric layer and a middle interconnection layer; pressing the interconnection structure layer in a preset area of the substrate adding layer in an inverted manner to obtain a required substrate structure layer; solder mask layers are formed on the two opposite faces of the substrate structure layer, contact holes are formed in the preset positions of the solder mask layers, and at least one contact hole exposes the conductive part of the interconnection structure layer. According to the invention, packaging with finer lines, lighter and lighter weight and higher line density can be realized, and signal transmission loss can be substantially reduced at the same time. Besides, the packaging substrate structure has high design flexibility, and the thickness and the circuit density of the interconnection structure layer can be accurately controlled by adjusting the thickness, the number of layers and the circuit design of each dielectric layer and each circuit layer so as to meet specific packaging requirements.

A described example includes a package substrate having an array of die pads arranged in rows and columns on a die mount surface, and having an opposing board side surface; a solder mask layer overlying the die mount surface; a first plurality of solder mask defined openings in the solder mask layer at die pad locations, the solder mask defined openings exposing portions of a surface of corresponding die pads, the surface facing away from the package substrate; and at least one non-solder mask defined opening in the solder mask layer at a die pad location, exposing the entire surface of the die pad and sidewalls of the die pad at the non-solder mask defined opening.

The invention relates to a printed circuit board with a ceramic substrate embedded in a local area and a preparation method of the printed circuit board, and belongs to the technical field of semiconductor devices. The preparation method comprises the following steps: performing surface treatment on the upper surface and the lower surface of the core plate to form the L3 layer and the L4 layer; processing a through groove; sticking an adhesive tape; mounting the power chip module in the through groove; forming a first bonding layer and an L2 layer on the surface of the L3 layer; removing the adhesive tape; forming a second bonding layer and an L5 layer on the surface of the L4 layer; processing a blind hole and filling copper; processing a through hole and metalizing the inner wall; performing surface treatment on the L2 layer and the L5 layer; the ceramic substrate is bonded to the area, corresponding to the power chip module, of the surface of the L5 layer through silver paste and is baked and fixed; forming a third bonding layer and an L1 layer on the surface of the L2 layer; forming a fourth bonding layer and an L6 layer on the surface of the L5 layer; processing a blind hole and filling copper; performing surface treatment on the L1 layer; and resistance welding processing, anti-oxidation treatment and cutting forming are carried out. According to the preparation method, the heat dissipation performance and the voltage tolerance of the printed circuit board can be effectively improved.

The invention discloses a manufacturing method of a back-drilling solder-resistant plug hole, which comprises the following steps: drilling holes on a production board and metalizing the holes, the drilled holes comprising a first through hole and a second through hole, the first through hole comprising a small hole with the aperture of less than or equal to 0.35 mm and a large hole with the aperture of more than 0.35 mm, and the two surfaces of the production board being a first surface and a second surface respectively; manufacturing an outer layer circuit on the production board; performing depth-controlled back drilling at the second through hole, wherein the back drilling holes in the first surface and the second surface are respectively a first back drilling hole and a second back drilling hole; enabling the first surface of the production board to face upwards, and performing resin hole plugging on the first back drilling hole and the small hole; enabling the second surface of the production board to face upwards, and performing resin hole plugging on the second back drilling hole and the large hole; and carrying out silk-screen printing of solder resist ink on the production board, and carrying out pre-baking, exposure and development in sequence, so that the resin in the plug hole is cured and a surface solder resist layer is prepared. According to the method, the exposure and development times are reduced, the bad problem caused by multiple times of silk-screen hole plugging is solved, and the production efficiency and the production quality are improved.

The invention relates to the technical field of circuit board manufacturing, and discloses a PCB manufacturing method and a PCB.The PCB manufacturing method comprises the steps that a PCB is provided, the PCB comprises a base material, the base material is provided with a connecting face, the connecting face is provided with a circuit, an OSP bonding pad and a to-be-plated part, the PCB is provided with a solder mask layer, the solder mask layer is provided with a first window, a sunken part and a second window, the OSP bonding pad is exposed out of the first window, and the OSP bonding pad is exposed out of the sunken part; a first character is arranged in the concave part, and the second window exposes the to-be-plated part; a protective layer is arranged on the solder mask layer, the protective layer shields the first window and shields the sunken part, the protective layer and the first character are arranged at intervals in the direction perpendicular to the connecting face, the protective layer is provided with a third window, and the to-be-plated part is exposed out of the third window; performing electrogilding treatment on the to-be-plated part; and removing the protective layer. According to the PCB manufacturing method and the PCB provided by the invention, the problem that the OSP bonding pad is easily gilded after the gold finger and the like are subjected to electrogilding in the related technology can be improved.

The invention discloses a method for manufacturing a circuit board of a thick copper slope circuit, which comprises the following steps of: attaching a first dry film layer on a thick copper layer, manufacturing a dry film pattern, retaining the dry film layer on the thick copper circuit, developing and removing the dry film layer on a thin copper circuit, developing the dry film layer on the slope circuit to form a matrix developing pattern, etching a slope circuit area to form a matrix etching pattern, and manufacturing the circuit board of the thick copper slope circuit. The method comprises the following steps of: grinding off a thick copper slope line, processing a line pattern, manufacturing a second dry film pattern, forming a surrounding pattern of all slope line areas, manufacturing a first solder mask layer in the surrounding pattern, manufacturing a second solder mask layer in other areas, and carrying out post-process processing to form a circuit board of the thick copper slope line; the processing precision and reliability of a slope circuit are improved through a mode of taking chemical processing of developing and etching as a main mode and taking polishing as an auxiliary mode, and a solder mask layer with the thickness reaching the standard and a complete covering effect is formed through manufacturing an encircling pattern and manufacturing a first solder mask layer and a second solder mask layer; the whole machining process effectively improves the machining precision and reliability.

The invention relates to white solder mask ink based on hydrogenated bisphenol A epoxy resin and a preparation method of the white solder mask ink. The white solder mask ink comprises a component A and a component B, the component A is prepared from the following ingredients in parts by mass: 10 to 30 parts of alkali-soluble hydrogenated bisphenol A epoxy resin, 5 to 10 parts of polyurethane resin, 1 to 10 parts of active monomers, 5 to 20 parts of modified boron nitride, 1 to 5 parts of photoinitiators and 10 to 50 parts of solvents; the component B comprises the following components in parts by mass: 1-10 parts of bisphenol A epoxy resin, 1-10 parts of an auxiliary agent and 1-10 parts of a solvent; wherein the modified boron nitride is a product obtained by reacting boron nitride with a silane coupling agent, urethane acrylate and reactive hindered amine. According to the present invention, the good anti-yellowing ability is achieved, the excellent mechanical strength and the excellent stability are provided, the defects in the prior art are overcome, and the important significance is provided for the further development and the application of the solder mask ink.

The invention discloses an intelligent visual detection system for a high-precision printed circuit board, and relates to the technical field of precision optical detection.The intelligent visual detection system comprises the steps that based on a printed circuit board substrate with a quantum dot mark layer attached to the surface, confocal scanning is conducted through laser wavelength, and an original image data set is generated; performing multispectral feature analysis on the original image data set, capturing focus offset rules of light rays with different wavelengths, and generating a wavelength-focus mapping relation compensation instruction set; according to the compensation instruction set of the wavelength-focus mapping relation, an imaging light path is adjusted in real time, and a high-fidelity fusion image is generated; and analyzing optical signal feature changes in the high-fidelity fusion image, identifying an abnormal region, extracting microdefect features, and generating a detection report containing the defect features. According to the invention, through uniform dispersion of the quantum dot modified ink in the inert atmosphere and a plasma substrate activation process, molecular-level combination of the solder mask layer and the fluorescent marking material is realized.

The invention discloses a semiconductor packaging alignment mark manufacturing method and a semiconductor packaging alignment mark product. The semiconductor packaging alignment mark manufacturing method comprises the following steps that a cofferdam is manufactured at the position, corresponding to a TSV area, on light glass; the cofferdam is coated with bonding glue; bonding the wafer on the optical glass and grinding and thinning the wafer; performing etching to form a first-order groove and an alignment Mark; completing the etching of the silicon through hole; preparing a dielectric layer on the wafer; preparing a passivation layer on the dielectric layer; preparing an RDL (redistribution layer); pre-cutting a groove, and half-cutting to a cofferdam; preparing a solder mask layer; and planting or printing a solder ball, and then cutting into a final finished product. According to the invention, the alignment function of the photoetching process after pre-cutting can be realized, the overall process capability can be improved, the process steps are reduced, the product manufacturing period is shortened, the packaging cost is reduced, and the product competitiveness is improved; a special laser marking station is not needed, wafer surface pollution caused by laser marking is reduced, operators of the original laser marking station are saved, manpower and material resources are saved, one manufacturing process is saved, and the packaging cost is reduced.

A substrate unit includes an insulating substrate; a first pad provided on the insulating substrate; a second pad provided on the insulating substrate; a solder resist layer including a portion provided on the insulating substrate and an opening configured to expose the first pad and the second pad; a first insulating portion provided between the first pad and the second pad in the opening; and an electronic part having a first terminal connected to the first pad and a second terminal connected to the second pad. The solder resist layer includes a first insulating material. The first insulating portion includes a second insulating material. A length in a direction of the first insulating portion is greater than a length in the direction of the first pad, the direction extending from the first pad toward the insulating substrate.

The present disclosure relates to carrier tapes, IC modules, and smart card devices. According to one embodiment, an article of manufacture comprises: a non-conductive substrate having a front side and a rear side, and a plurality of through holes extending from the front side to the rear side; a smart card contact area arranged on the front side of the substrate and having a plurality of conductive pads which are mutually insulated and close front-side ends of the through holes; a plurality of through-hole solder pads and a plurality of conductive traces arranged on the rear side of the substrate, wherein the through-hole solder pads are arranged at rear-side ends of the through holes, wherein the conductive traces are conductively coupled to the through-hole solder pads respectively; and a solder mask at least partially overlaying the conductive traces.

A printed circuit board (PCB) includes a solder resist layer including at least one of an opening and a depression and a solder resist patch disposed in at least one of the opening and the depression to have an interface with the solder resist layer in at least one of the opening and the depression.

The invention discloses a Tenting process-based system-level vehicle-mounted packaging substrate and a processing method thereof. The processing method comprises the following steps of: providing a first PNL plate provided with an outer-layer copper foil and a through hole; a connecting copper layer is formed on the inner wall of the through hole, and the connecting copper layer extends to the outer copper foil and surrounds a preset area outside the two ports of the through hole to form a ring hole copper layer; performing resin hole plugging on the through hole; grinding two ports of the through hole, reducing copper of the ring hole copper layer and grinding the whole plate in sequence so as to form a micro step between the outer copper foil and the ring hole copper layer; a thickened copper layer is formed on the outer copper foil and the ring hole copper layer, an outer pattern is manufactured on the thickened copper layer, and a second PNL plate is obtained; and after solder mask treatment is carried out on the second PNL, gold plating treatment is carried out in the mode of arranging false gold plating fingers on the edge of the second PNL and between the SET and the SET by adopting the optimal control current density, and an outer layer pattern finished product with the thickness consistency is manufactured. According to the processing method, the size consistency of the outer-layer pattern finished product is remarkably improved, and the market requirement is met.

The invention provides LDI solder resist ink and a preparation method thereof, and belongs to the technical field of solder resist ink, raw materials of the LDI solder resist ink comprise the following components: carboxylic acid modified carboxyl-polycaprolactone acrylate epoxy resin, an inorganic filler, a photoinitiator and an auxiliary agent, the carboxylic acid modified carboxyl-polycaprolactone acrylate epoxy resin is prepared by the following steps: adding carboxyl-polycaprolactone acrylate and acrylic acid into an epoxy resin modified solution, uniformly dispersing by a certain preparation method, grinding and the like. According to the LDI solder resist ink obtained by the invention, the photosensitivity can be improved, and the problems of long exposure time and low curing speed caused by mismatching of an LDI exposure machine and ink are solved.

A high-precision impedance circuit board ink thickness uniformity control method relates to the circuit board processing field, and comprises the following steps: solder resist pretreatment: cleaning a circuit board, and roughening a copper surface; the circuit board is covered with the liquid photosensitive ink through extrusion type roller coating, the extrusion force is 2.5 + / -0.2 kg / cm < 2 >, and the speed is 1.2 + / -0.2 m / min; pre-baking: pre-curing and baking the ink; pressure is applied to the circuit board to flatten the ink on the surface of the circuit board, the applied pressure is 2 + / -0.2 kg / cm < 2 >, and the temperature is 82 + / -3 DEG C; exposure: protecting the ink at the position needing solder mask coverage through photocuring; developing: removing the unexposed ink, and exposing the electrical connection points needing surface treatment; and post-baking: further curing the ink at a high temperature to form a solder mask layer. According to the method, the ink range is reduced in an extrusion roll coating mode, the uniformity is improved through vertical coating, the requirement for the performance of the circuit board is guaranteed, and the method has high practicability.

A printed circuit board includes a substrate base, a plurality of substrate wiring patterns on an upper surface and a lower surface of the substrate base, the plurality of substrate wiring patterns including at least one equipotential plane, a plurality of equipotential plating lines, a plurality of signal plating lines, and a plurality of upper connection pads on the upper surface of the substrate base, the at least one equipotential plane including at least one main equipotential plane and a plurality of sub-equipotential planes, a plurality of upper pad layers covering at least portions of the plurality of upper connection pads, and an upper solder resist layer covering a portion of the upper surface of the substrate base and portions of the plurality of substrate wiring patterns, wherein the upper solder resist layer includes a plurality of etchback openings arranged in a column in a first lateral direction.

The invention relates to the technical field of PCB (Printed Circuit Board) production, and particularly discloses PCB solder mask spraying equipment and a spraying method. The equipment comprises a first spraying device, a turnover device, a second spraying device and a pre-baking device which are sequentially arranged, the spraying device comprises a conveying module, a first spraying gun, a second spraying gun and a third spraying gun, the conveying module is used for conveying the PCB, the first spraying gun is used for spraying first ink on the top face of the PCB and forming a first layer through standing, and the second spraying gun is used for spraying second ink on the first layer and forming a second layer through standing. The third spray gun is used for spraying third ink on the second layer and standing to form a third layer, and the viscosity of the first ink is greater than that of the second and third ink; the turnover device can turn over the PCB on the first spraying device and convey the PCB to the second spraying device; the pre-baking device can pre-bake the PCB on the second spraying device and move the PCB out. The equipment can simultaneously meet the oil thickness requirements of the circuit and the board surface, and solves the problems of ink entering and hole blocking.

The invention provides an asymmetric rigid-flex board and a processing method, and relates to a printed circuit board manufacturing technology, and the method comprises the steps: processing a core board of a flexible board; processing a hard core board; processing the PP layer; processing a gasket layer; the soft board core board, the PP layer, the gasket layer and the hard board core board are sequentially overlapped and pressed, and the soft-hard combined board is obtained through hot pressing; processing an outer-layer circuit of the soft board and an outer-layer circuit of the hard board; quickly pressing an outer layer covering film on the outer side surface of the soft board core board in the soft board area; spraying solder mask on the outer side surface of the soft core board in the hard board area and the outer side surface of the hard core board in the hard board area to form solder mask layers, and exposing and developing the solder mask layers to expose the positions of the bonding pads; and performing depth-controlled groove milling in a soft board area on the outer side of the hard board core board, and removing the gasket layer. According to the invention, the easy bending performance of the soft board area can be ensured, the welding resistance of the hard board area can be ensured, and the practicability is relatively high.

The invention discloses a circuit board golden finger processing method which comprises the following steps: providing circuit board precursors which comprise a circuit area, a golden finger area and a lead area, the circuit area is provided with a metal circuit, the golden finger area comprises a plurality of golden finger precursors, the lead area comprises a plurality of leads, and the leads are connected with the golden finger precursors; the gold finger precursor is connected with the metal circuit, a solder mask layer covering the circuit area is formed, a wet film covering the lead area is formed, a first dry film covering the lead area is formed on the wet film, a gold layer is formed on the gold finger precursor in an electroplating mode, the first dry film and the wet film are removed, and the lead is removed in an etching mode. The first dry film can completely cover the lead in the lead area, the problem that the edge of the lead is exposed does not exist, the problem that the edge of the lead is plated with gold in the gold plating process, consequently, the edge of the lead cannot be etched and removed subsequently, and then the connection stability of the circuit board is affected is solved, and the connection stability and quality of the circuit board are improved.

The invention relates to the technical field of PCB identification, in particular to an optical identification point manufacturing method of a PCB and an optical point structure, and the method comprises the following steps: S1, adding a process edge on a long edge of the PCB, and arranging the optical point structure on the process edge; s2, melting the tin bar in a tin cylinder through high temperature to form soldering tin alloy slurry of copper, tin and nickel in a proper proportion; and S3, the PCB is immersed in a tin furnace for a period of time, relevant parameters of a tin spraying machine and an air knife are adjusted to a proper range, and hot air leveling is conducted on the PCB. And S4, the PCB is taken out, whether the tin spraying thickness meets the requirement or not is checked, and if not, the air pressure of the tin spraying machine is adjusted. And S5, fixing the PCB which is processed and meets the requirement, and adjusting a lens to identify the PCB. Compared with the prior art, the copper optical points on the surface of the PCB are exposed through the solder resist windowing of the point A, the color of the base material below the point A is exposed, identification is convenient, the point B adopts the NPTH hole, the solder resist windowing is also used, and the point A and the point B control the tin thickness meeting the requirement through the tin spraying process.

According to the photoelectric system packaging structure and the preparation method thereof provided by the invention, in the packaging process, the first through hole is formed in the back surface of the image sensor chip, and the metal wiring layer and the solder mask layer are sequentially formed in the first through hole and the back surface of the image sensor chip, so that an electric signal of the image sensor chip is led to the back surface from the front surface; in this way, the distance between the image sensor chip and the grating coupling-out surface of the optical chip can be controlled within 10 [mu] m, so that the optical signal of the optical chip can be received in a close-range fit manner; in addition, electric signals of the image sensor chip can be led to the substrate through the metal wiring layer on the back face of the image sensor chip in the formed solder resist window, the signal transmission difficulty between the optical chip and the image sensor chip and between the optical chip and other devices is effectively reduced, in addition, the photoelectric system packaging structure is simple, the manufacturing cost is low, and the photoelectric system packaging structure is suitable for large-scale popularization and application. And the yield and the service life of a finished product of the photoelectric system packaging structure can be improved.

The invention relates to a circuit board solder mask hole plugging method, which comprises the following steps: S1, manufacturing a hole plugging bottom plate and a hole plugging screen, and processing the corresponding hole plugging bottom plate and hole plugging screen according to the size and position of a to-be-plugged hole in a circuit board; s2, coating ink for the first time, placing a circuit board between the plug hole bottom plate and the plug hole screen printing plate, and coating the ink into the to-be-plugged hole from the plug hole screen printing plate; s3, ink pressing is conducted, specifically, the ink is further extruded into the to-be-plugged hole, and the ink sinks to the lower portion in the to-be-plugged hole; s4, the ink is coated for the second time, specifically, the ink is coated to the upper portion of the interior of the to-be-plugged hole from the hole plugging screen so as to completely fill the to-be-plugged hole; and S5, returning the printing ink, and scraping redundant printing ink. According to the invention, only the same surface of the circuit board needs to be plugged, and the to-be-plugged hole can be plugged at one time through one-time screen printing without residual bubbles, so that the production process is shortened, and the hidden danger of quality failure caused by poor hole plugging quality is effectively avoided.

This invention proposes a micro / nano-scale imprinting FPC solder resist layer forming device, relating to the field of circuit board solder resist layer forming technology. It includes a forming base with a limiting base mounted on it. An imprinting head is positioned directly above the limiting base and driven by a servo electric cylinder. The limiting base has a groove, within which a rigid base is installed. A vacuum adsorption assembly is mounted inside the forming base, and a forming placement cavity is located inside the rigid base. From top to bottom, a PI thin film layer, a silicone layer, and a carbon fiber heating film layer are sequentially arranged at the bottom of the forming placement cavity. Micro / nano patterns are etched on the imprinting head, and a PDMS elastic layer is located at the lower end of the imprinting head. This invention, through the cooperation of the PI thin film layer, silicone layer, carbon fiber heating film layer, and microporous array, can adsorb, flatten, and preheat the FPC substrate before imprinting, fundamentally compensating for the deformation of the flexible substrate and providing a stable and flat reference plane for high-precision imprinting.

The invention relates to a stepped printed circuit board preparation method and a printed circuit board, and belongs to the technical field of printed circuit boards. The method comprises the following steps of: plugging through holes in a first sub-board and a second sub-board with resin and electroplating caps; performing pattern etching on the step region of the second sub-board; after the step area of the second daughter board is coated with solder resist ink and a glue-resistant protective material is placed, the first daughter board and the second daughter board are laminated to form a mother board; covering a dry film on the through hole which is plugged by resin in the step area, and performing thinning and copper reduction on the corresponding step area on the surface of the mother board; secondary drilling is carried out on the corresponding step area of the mother board, and resin in secondary drilling holes is removed; and drilling a step area on the first daughter board in a blind fishing mode to expose the pattern etched on the second daughter board. According to the method provided by the invention, solder leakage and impurities can be prevented from entering the through hole in the operation process, the through hole is effectively protected, and meanwhile, the etching precision of the golden finger pattern in the step region is improved.

The invention discloses a PCB solder mask adhesion quality evaluation method based on slice analysis, and the method comprises the following steps: (1) PCB pretreatment: carrying out a thermal shock test on a PCB, and then carrying out a neutral salt spray test; (2) optical inspection: performing solder mask color difference inspection on the pretreated PCB by using a microscope, marking an area which is deeper than the surrounding color or has obvious change, and determining the area as a solder mask adhesion quality risk area; and (3) performing slice analysis: performing slice analysis on the solder mask adhesion quality risk area, and checking the bonding conditions of the solder mask, the copper foil circuit and the PCB substrate, thereby evaluating the solder mask adhesion quality.

The invention relates to the technical field of electromagnetic shielding devices, and discloses an electromagnetic shielding structure for a keyboard chip, a manufacturing method of the electromagnetic shielding structure and a wireless keyboard applying the electromagnetic shielding structure, and the method comprises the following steps: a first circuit layer is provided with a signal wire and a grounding wire, and is connected to a second circuit layer provided with a welding pad and a false welding pad through a via hole; the chip is welded on the welding pad, and the false welding pad is electrically connected with the grounding wire; an insulating layer and a third circuit layer are formed outside the chip, and a coverage area is connected with the false welding pad through a via hole; the electromagnetic shielding layer is arranged on the solder mask layer, and the electromagnetic shielding layer is electrically connected with the grounding wire through the conductive adhesive layer, so that the chip is wrapped and shielded in all directions. The structure can effectively reduce electromagnetic interference and improve the stability of wireless keyboard signals, and is suitable for thin keyboard circuit design.

The invention relates to the technical field of semiconductor manufacturing, and provides a manufacturability analysis method and device for PCB design, electronic equipment and a storage medium. A manufacturing constraint matrix is generated according to PCB design rule data and PCB design data, geometric conflict detection is carried out in combination with layout data to generate a conflict topological graph, island copper sheet marking is carried out on a routing path according to the conflict topological graph and a three-dimensional morphological corrosion algorithm, and hole ring integrity verification is carried out in combination with drilling data. According to the method, an annular ring defect list is obtained, connectivity analysis is carried out on a solder mask according to the annular ring defect list, a solder mask bridge fracture report is generated, and finally character interference matrix calculation is carried out on silk-screen layer data according to the solder mask bridge fracture report to generate a manufacturability design report. According to the method, manufacturability analysis is carried out from design constraint to layout conflict, copper sheet integrity, hole ring verification, solder bridge resistance and character interference, potential problems in PCB design are detected and corrected, and the manufacturing reliability of the PCB design is improved.

The invention provides an anti-diffusion agent, a preparation method of the anti-diffusion agent, a circuit board and a solder mask processing method of the circuit board. The anti-diffusion agent comprises the following components in parts by mass: 0.2-5 parts of a sulfydryl nitrogen heterocyclic compound; 0.1 to 5 parts of 3-piperazinyl propyl methyl dimethoxy silane; 0.1 to 5 parts of organic acid; 0.1 to 20 parts of a surfactant; and the balance water. According to the anti-diffusion agent, the contact angle of the solder resist ink on the copper surface can be increased on the basis of well ensuring the adhesion effect of the ink, the difficulty of forming an anti-diffusion layer on the copper surface can be reduced, and the influence of the formation of the anti-diffusion layer on a circuit board can be reduced.

The invention discloses a circuit board surface treatment method and a circuit board manufactured by adopting the circuit board surface treatment method. The method comprises the following steps: resistance welding treatment: carrying out resistance welding treatment on a circuit board so as to form a resistance welding protective film on the surface of the circuit board; nickel and gold immersion treatment: nickel and gold immersion treatment is carried out on the circuit board after resistance welding treatment; performing windowing treatment, performing windowing on the circuit board after nickel and gold immersion, and cutting off the solder mask protection film in a partial region so as to expose a first region needing OSP treatment; and OSP processing: carrying out OSP processing on the windowed circuit board so as to form a protection layer in the first area of the circuit board. According to the circuit board surface treatment method provided by the invention, the to-be-solder-resistant film is cut off in a cutting manner, so that the first region needing to be subjected to OSP treatment is directly exposed; according to the method, a traditional film pasting and stripping mode is abandoned, the production efficiency is effectively improved, meanwhile, energy consumption is reduced, and environmental pollution is reduced.

The invention discloses a manufacturing method of a gold finger PCB (Printed Circuit Board) without a gold guide lead. Adding a gold guide lead wire at the position of the golden finger; printing easy-to-wash selective solder mask ink: exposing the golden finger position needing gold plating to form a first selective area, and covering other positions which do not need gold plating with the easy-to-wash selective solder mask ink; gold plating is carried out on the first selective area, and after gold plating is completed, the selective solder mask ink covering the board is removed; the PCB is covered with a layer of selective dry film, the gold guide lead is exposed to form a second selective area, and other positions are all covered with a layer of selective dry film for protection; etching off the gold guide lead by using etching liquid medicine; after etching is completed, the selective dry film is washed away, the gold finger PCB without the gold guide lead is obtained, and the defect that in the prior art, wire residues exist in the gold finger manufacturing process is overcome.