836 results about "Solder mask" patented technology

The invention relates to a printed circuit board with a ceramic substrate embedded in a local area and a preparation method of the printed circuit board, and belongs to the technical field of semiconductor devices. The preparation method comprises the following steps: performing surface treatment on the upper surface and the lower surface of the core plate to form the L3 layer and the L4 layer; processing a through groove; sticking an adhesive tape; mounting the power chip module in the through groove; forming a first bonding layer and an L2 layer on the surface of the L3 layer; removing the adhesive tape; forming a second bonding layer and an L5 layer on the surface of the L4 layer; processing a blind hole and filling copper; processing a through hole and metalizing the inner wall; performing surface treatment on the L2 layer and the L5 layer; the ceramic substrate is bonded to the area, corresponding to the power chip module, of the surface of the L5 layer through silver paste and is baked and fixed; forming a third bonding layer and an L1 layer on the surface of the L2 layer; forming a fourth bonding layer and an L6 layer on the surface of the L5 layer; processing a blind hole and filling copper; performing surface treatment on the L1 layer; and resistance welding processing, anti-oxidation treatment and cutting forming are carried out. According to the preparation method, the heat dissipation performance and the voltage tolerance of the printed circuit board can be effectively improved.

The invention relates to the technical field of circuit board manufacturing, and discloses a PCB manufacturing method and a PCB.The PCB manufacturing method comprises the steps that a PCB is provided, the PCB comprises a base material, the base material is provided with a connecting face, the connecting face is provided with a circuit, an OSP bonding pad and a to-be-plated part, the PCB is provided with a solder mask layer, the solder mask layer is provided with a first window, a sunken part and a second window, the OSP bonding pad is exposed out of the first window, and the OSP bonding pad is exposed out of the sunken part; a first character is arranged in the concave part, and the second window exposes the to-be-plated part; a protective layer is arranged on the solder mask layer, the protective layer shields the first window and shields the sunken part, the protective layer and the first character are arranged at intervals in the direction perpendicular to the connecting face, the protective layer is provided with a third window, and the to-be-plated part is exposed out of the third window; performing electrogilding treatment on the to-be-plated part; and removing the protective layer. According to the PCB manufacturing method and the PCB provided by the invention, the problem that the OSP bonding pad is easily gilded after the gold finger and the like are subjected to electrogilding in the related technology can be improved.

The invention discloses an intelligent visual detection system for a high-precision printed circuit board, and relates to the technical field of precision optical detection.The intelligent visual detection system comprises the steps that based on a printed circuit board substrate with a quantum dot mark layer attached to the surface, confocal scanning is conducted through laser wavelength, and an original image data set is generated; performing multispectral feature analysis on the original image data set, capturing focus offset rules of light rays with different wavelengths, and generating a wavelength-focus mapping relation compensation instruction set; according to the compensation instruction set of the wavelength-focus mapping relation, an imaging light path is adjusted in real time, and a high-fidelity fusion image is generated; and analyzing optical signal feature changes in the high-fidelity fusion image, identifying an abnormal region, extracting microdefect features, and generating a detection report containing the defect features. According to the invention, through uniform dispersion of the quantum dot modified ink in the inert atmosphere and a plasma substrate activation process, molecular-level combination of the solder mask layer and the fluorescent marking material is realized.

The invention discloses a semiconductor packaging alignment mark manufacturing method and a semiconductor packaging alignment mark product. The semiconductor packaging alignment mark manufacturing method comprises the following steps that a cofferdam is manufactured at the position, corresponding to a TSV area, on light glass; the cofferdam is coated with bonding glue; bonding the wafer on the optical glass and grinding and thinning the wafer; performing etching to form a first-order groove and an alignment Mark; completing the etching of the silicon through hole; preparing a dielectric layer on the wafer; preparing a passivation layer on the dielectric layer; preparing an RDL (redistribution layer); pre-cutting a groove, and half-cutting to a cofferdam; preparing a solder mask layer; and planting or printing a solder ball, and then cutting into a final finished product. According to the invention, the alignment function of the photoetching process after pre-cutting can be realized, the overall process capability can be improved, the process steps are reduced, the product manufacturing period is shortened, the packaging cost is reduced, and the product competitiveness is improved; a special laser marking station is not needed, wafer surface pollution caused by laser marking is reduced, operators of the original laser marking station are saved, manpower and material resources are saved, one manufacturing process is saved, and the packaging cost is reduced.

A substrate unit includes an insulating substrate; a first pad provided on the insulating substrate; a second pad provided on the insulating substrate; a solder resist layer including a portion provided on the insulating substrate and an opening configured to expose the first pad and the second pad; a first insulating portion provided between the first pad and the second pad in the opening; and an electronic part having a first terminal connected to the first pad and a second terminal connected to the second pad. The solder resist layer includes a first insulating material. The first insulating portion includes a second insulating material. A length in a direction of the first insulating portion is greater than a length in the direction of the first pad, the direction extending from the first pad toward the insulating substrate.

A printed circuit board (PCB) includes a solder resist layer including at least one of an opening and a depression and a solder resist patch disposed in at least one of the opening and the depression to have an interface with the solder resist layer in at least one of the opening and the depression.

The invention discloses a Tenting process-based system-level vehicle-mounted packaging substrate and a processing method thereof. The processing method comprises the following steps of: providing a first PNL plate provided with an outer-layer copper foil and a through hole; a connecting copper layer is formed on the inner wall of the through hole, and the connecting copper layer extends to the outer copper foil and surrounds a preset area outside the two ports of the through hole to form a ring hole copper layer; performing resin hole plugging on the through hole; grinding two ports of the through hole, reducing copper of the ring hole copper layer and grinding the whole plate in sequence so as to form a micro step between the outer copper foil and the ring hole copper layer; a thickened copper layer is formed on the outer copper foil and the ring hole copper layer, an outer pattern is manufactured on the thickened copper layer, and a second PNL plate is obtained; and after solder mask treatment is carried out on the second PNL, gold plating treatment is carried out in the mode of arranging false gold plating fingers on the edge of the second PNL and between the SET and the SET by adopting the optimal control current density, and an outer layer pattern finished product with the thickness consistency is manufactured. According to the processing method, the size consistency of the outer-layer pattern finished product is remarkably improved, and the market requirement is met.

A high-precision impedance circuit board ink thickness uniformity control method relates to the circuit board processing field, and comprises the following steps: solder resist pretreatment: cleaning a circuit board, and roughening a copper surface; the circuit board is covered with the liquid photosensitive ink through extrusion type roller coating, the extrusion force is 2.5 + / -0.2 kg / cm < 2 >, and the speed is 1.2 + / -0.2 m / min; pre-baking: pre-curing and baking the ink; pressure is applied to the circuit board to flatten the ink on the surface of the circuit board, the applied pressure is 2 + / -0.2 kg / cm < 2 >, and the temperature is 82 + / -3 DEG C; exposure: protecting the ink at the position needing solder mask coverage through photocuring; developing: removing the unexposed ink, and exposing the electrical connection points needing surface treatment; and post-baking: further curing the ink at a high temperature to form a solder mask layer. According to the method, the ink range is reduced in an extrusion roll coating mode, the uniformity is improved through vertical coating, the requirement for the performance of the circuit board is guaranteed, and the method has high practicability.

A printed circuit board includes a substrate base, a plurality of substrate wiring patterns on an upper surface and a lower surface of the substrate base, the plurality of substrate wiring patterns including at least one equipotential plane, a plurality of equipotential plating lines, a plurality of signal plating lines, and a plurality of upper connection pads on the upper surface of the substrate base, the at least one equipotential plane including at least one main equipotential plane and a plurality of sub-equipotential planes, a plurality of upper pad layers covering at least portions of the plurality of upper connection pads, and an upper solder resist layer covering a portion of the upper surface of the substrate base and portions of the plurality of substrate wiring patterns, wherein the upper solder resist layer includes a plurality of etchback openings arranged in a column in a first lateral direction.

The invention relates to the technical field of PCB identification, in particular to an optical identification point manufacturing method of a PCB and an optical point structure, and the method comprises the following steps: S1, adding a process edge on a long edge of the PCB, and arranging the optical point structure on the process edge; s2, melting the tin bar in a tin cylinder through high temperature to form soldering tin alloy slurry of copper, tin and nickel in a proper proportion; and S3, the PCB is immersed in a tin furnace for a period of time, relevant parameters of a tin spraying machine and an air knife are adjusted to a proper range, and hot air leveling is conducted on the PCB. And S4, the PCB is taken out, whether the tin spraying thickness meets the requirement or not is checked, and if not, the air pressure of the tin spraying machine is adjusted. And S5, fixing the PCB which is processed and meets the requirement, and adjusting a lens to identify the PCB. Compared with the prior art, the copper optical points on the surface of the PCB are exposed through the solder resist windowing of the point A, the color of the base material below the point A is exposed, identification is convenient, the point B adopts the NPTH hole, the solder resist windowing is also used, and the point A and the point B control the tin thickness meeting the requirement through the tin spraying process.

According to the photoelectric system packaging structure and the preparation method thereof provided by the invention, in the packaging process, the first through hole is formed in the back surface of the image sensor chip, and the metal wiring layer and the solder mask layer are sequentially formed in the first through hole and the back surface of the image sensor chip, so that an electric signal of the image sensor chip is led to the back surface from the front surface; in this way, the distance between the image sensor chip and the grating coupling-out surface of the optical chip can be controlled within 10 [mu] m, so that the optical signal of the optical chip can be received in a close-range fit manner; in addition, electric signals of the image sensor chip can be led to the substrate through the metal wiring layer on the back face of the image sensor chip in the formed solder resist window, the signal transmission difficulty between the optical chip and the image sensor chip and between the optical chip and other devices is effectively reduced, in addition, the photoelectric system packaging structure is simple, the manufacturing cost is low, and the photoelectric system packaging structure is suitable for large-scale popularization and application. And the yield and the service life of a finished product of the photoelectric system packaging structure can be improved.

This invention proposes a micro / nano-scale imprinting FPC solder resist layer forming device, relating to the field of circuit board solder resist layer forming technology. It includes a forming base with a limiting base mounted on it. An imprinting head is positioned directly above the limiting base and driven by a servo electric cylinder. The limiting base has a groove, within which a rigid base is installed. A vacuum adsorption assembly is mounted inside the forming base, and a forming placement cavity is located inside the rigid base. From top to bottom, a PI thin film layer, a silicone layer, and a carbon fiber heating film layer are sequentially arranged at the bottom of the forming placement cavity. Micro / nano patterns are etched on the imprinting head, and a PDMS elastic layer is located at the lower end of the imprinting head. This invention, through the cooperation of the PI thin film layer, silicone layer, carbon fiber heating film layer, and microporous array, can adsorb, flatten, and preheat the FPC substrate before imprinting, fundamentally compensating for the deformation of the flexible substrate and providing a stable and flat reference plane for high-precision imprinting.

The invention relates to the technical field of electromagnetic shielding devices, and discloses an electromagnetic shielding structure for a keyboard chip, a manufacturing method of the electromagnetic shielding structure and a wireless keyboard applying the electromagnetic shielding structure, and the method comprises the following steps: a first circuit layer is provided with a signal wire and a grounding wire, and is connected to a second circuit layer provided with a welding pad and a false welding pad through a via hole; the chip is welded on the welding pad, and the false welding pad is electrically connected with the grounding wire; an insulating layer and a third circuit layer are formed outside the chip, and a coverage area is connected with the false welding pad through a via hole; the electromagnetic shielding layer is arranged on the solder mask layer, and the electromagnetic shielding layer is electrically connected with the grounding wire through the conductive adhesive layer, so that the chip is wrapped and shielded in all directions. The structure can effectively reduce electromagnetic interference and improve the stability of wireless keyboard signals, and is suitable for thin keyboard circuit design.

The invention relates to the technical field of semiconductor manufacturing, and provides a manufacturability analysis method and device for PCB design, electronic equipment and a storage medium. A manufacturing constraint matrix is generated according to PCB design rule data and PCB design data, geometric conflict detection is carried out in combination with layout data to generate a conflict topological graph, island copper sheet marking is carried out on a routing path according to the conflict topological graph and a three-dimensional morphological corrosion algorithm, and hole ring integrity verification is carried out in combination with drilling data. According to the method, an annular ring defect list is obtained, connectivity analysis is carried out on a solder mask according to the annular ring defect list, a solder mask bridge fracture report is generated, and finally character interference matrix calculation is carried out on silk-screen layer data according to the solder mask bridge fracture report to generate a manufacturability design report. According to the method, manufacturability analysis is carried out from design constraint to layout conflict, copper sheet integrity, hole ring verification, solder bridge resistance and character interference, potential problems in PCB design are detected and corrected, and the manufacturing reliability of the PCB design is improved.

The invention provides an anti-diffusion agent, a preparation method of the anti-diffusion agent, a circuit board and a solder mask processing method of the circuit board. The anti-diffusion agent comprises the following components in parts by mass: 0.2-5 parts of a sulfydryl nitrogen heterocyclic compound; 0.1 to 5 parts of 3-piperazinyl propyl methyl dimethoxy silane; 0.1 to 5 parts of organic acid; 0.1 to 20 parts of a surfactant; and the balance water. According to the anti-diffusion agent, the contact angle of the solder resist ink on the copper surface can be increased on the basis of well ensuring the adhesion effect of the ink, the difficulty of forming an anti-diffusion layer on the copper surface can be reduced, and the influence of the formation of the anti-diffusion layer on a circuit board can be reduced.

The invention discloses a circuit board surface treatment method and a circuit board manufactured by adopting the circuit board surface treatment method. The method comprises the following steps: resistance welding treatment: carrying out resistance welding treatment on a circuit board so as to form a resistance welding protective film on the surface of the circuit board; nickel and gold immersion treatment: nickel and gold immersion treatment is carried out on the circuit board after resistance welding treatment; performing windowing treatment, performing windowing on the circuit board after nickel and gold immersion, and cutting off the solder mask protection film in a partial region so as to expose a first region needing OSP treatment; and OSP processing: carrying out OSP processing on the windowed circuit board so as to form a protection layer in the first area of the circuit board. According to the circuit board surface treatment method provided by the invention, the to-be-solder-resistant film is cut off in a cutting manner, so that the first region needing to be subjected to OSP treatment is directly exposed; according to the method, a traditional film pasting and stripping mode is abandoned, the production efficiency is effectively improved, meanwhile, energy consumption is reduced, and environmental pollution is reduced.

The invention discloses an alkali-soluble flexible photosensitive resin and a photosensitive solder resist ink composition. The preparation method of the alkali-soluble flexible photosensitive resin comprises the following steps: in an organic solvent, carrying out ring-opening reaction on flexible epoxy resin and a hydroxyl linking agent to obtain an epoxy acrylate solution with hydroxyl; carrying out ring-opening reaction on the epoxy acrylate solution and rigid epoxy resin to obtain a flexible epoxy acrylate solution; carrying out ring-opening reaction on the flexible epoxy acrylate solution and unsaturated monocarboxylic acid in the presence of a polymerization inhibitor to obtain a photosensitive flexible epoxy acrylate solution; and reacting the photosensitive flexible epoxy acrylate solution with polybasic acid anhydride to obtain the alkali-soluble flexible photosensitive resin solution. The flexibility of the solder resist ink is improved by introducing the connecting agent with hydroxyl and the epoxy resin containing a rigid structure.

The invention belongs to the technical field of high-power electronic component base materials, and discloses an embedded high-thermal-conductivity ceramic packaging substrate for a high-power scene and a preparation method of the embedded high-thermal-conductivity ceramic packaging substrate. ABF composite layers are arranged above and below a ceramic core plate in the ceramic packaging substrate; a high-thermal-conductivity base material is fixed in the ceramic substrate; interconnection holes are formed in the ceramic substrate, and electroplating copper film layers are arranged on the upper surface and the lower surface of the ceramic substrate and in the interconnection holes; a copper-clad plate layer is arranged on the outer side of the ABF layer, a copper-clad plate groove is formed in the copper-clad plate layer, a blind hole is formed in the copper-clad plate groove, and a copper column is arranged in the blind hole; a solder mask layer is arranged on the surface of the ABF layer on the outermost side, a surface treatment layer is arranged on the outer side of the solder mask layer, and blind holes with built-in copper columns are formed in the surface treatment layer. The preparation method comprises the following steps: forming a substrate groove in the surface of the ceramic substrate; embedding a high-thermal-conductivity base material; arranging an electroplating copper film coating layer; an ABF composite layer is arranged; arranging a solder mask layer; and arranging a surface treatment layer. The LED lamp is good in heat dissipation effect.

The invention relates to the field of chip packaging, in particular to a packaging structure for restraining warping, a packaging method and a packaging mode determining method. Comprising the steps that a first groove is formed in a solder mask layer of a substrate, and the first groove penetrates through an electric connection layer of the substrate; the annular reinforcing ribs are connected to the edge area of the substrate and used for restraining buckling deformation of the substrate. The arrangement position of the first groove corresponds to the mounting position of the annular reinforcing rib; the connection welding layer is fixed between the annular reinforcing rib and the electric connection layer of the substrate through welding, and the Young modulus of the connection welding layer is larger than a first preset hardness value. According to the packaging structure, the substrate and the annular reinforcing rib are fixedly connected in a welding mode, and the Young modulus of the welding flux forming the connecting welding layer is larger than that of the connecting glue layer. According to the packaging structure, the Young modulus of the connecting welding layer is larger, so that the connecting layer has higher hardness. And the buckling deformation of the substrate can be better inhibited.

The utility model discloses a printed circuit board capable of preventing short circuit caused by carbon oil leakage, and the printed circuit board can better enable a circuit layer in a non-welding area on a substrate to maintain a good insulation effect and prevent short circuit through a first solder mask layer and a second solder mask layer which are stacked on the substrate, and also can improve the mechanical strength and moisture resistance. Besides, a first solder mask window and a second solder mask window are formed by the first solder mask layer and the second solder mask layer at the carbon oil key position, so that a stepped solder mask window is formed at the periphery of the conduction circuit at the carbon oil key position, and then a carbon oil layer formed at the solder mask window through silk screen can better cover and solidify on the conduction circuit. Moreover, in the process that the carbon oil of the carbon oil layer is screen-printed in the stepped solder resist window formed by the first solder resist window and the second solder resist window, due to the special structure of the stepped solder resist window, the carbon oil of the carbon oil layer can be better attached to the interior of the solder resist window and is not prone to diffusion, and short circuit between adjacent carbon oil lines is avoided.

A method for controlling the thickness uniformity of ink on a high-precision impedance circuit board relates to the field of circuit board processing, comprising the following steps: pre-solder mask treatment: cleaning the circuit board and roughening the copper surface; applying liquid photosensitive ink to the circuit board by extrusion roller coating with an extrusion force of 2.5±0.2kg / cm 2 The process involves pre-curing and drying the ink at a speed of 1.2±0.2m / min. Pre-baking involves pre-curing and drying the ink. Pressure leveling involves applying pressure to the circuit board to level the ink surface at a pressure of 2±0.2kg / cm² and a temperature of 82±3°C. Exposure involves light-curing the ink to protect areas requiring solder mask coverage. Development removes unexposed ink, exposing electrical connections requiring surface treatment. Post-baking involves further high-temperature curing of the ink to form a solder mask layer. This method utilizes an extrusion roller coating method to minimize ink variations and applies vertically to improve uniformity, ensuring the required circuit board performance and demonstrating strong practicality.

The application discloses a surface acoustic wave filter packaging structure and a packaging method thereof. The packaging structure comprises a substrate, solder resist layers arranged on the front surface of the substrate, filter chips and non-filter chips which are inverted on the front surface of the substrate and are arranged between the solder resist layers, and an injection molding layer covering the filter chips, the solder resist layers and the non-filter chips. The filter chips are uniformly provided with first protrusions on the side facing the substrate. The lower surface of the filter chip is overlapped with the upper surface of the adjacent solder resist layer, and a sealed cavity is formed between the filter chip, the solder resist layer and the substrate. The non-filter chips are uniformly provided with second protrusions on the side facing the substrate. A gap is left between the periphery of the non-filter chip and the adjacent solder resist layer, and the injection molding layer is filled below the non-filter chip. The application ensures the existence of the cavity at the bottom of the filter chip and protects the protrusions of the non-filter chip, thereby further improving the reliability of the product.

The utility model discloses an electromagnetic shielding packaging structure. The electromagnetic shielding packaging structure comprises a packaging substrate, a chip module, a plastic packaging body and an electromagnetic shielding layer, the packaging substrate is provided with a rewiring structure, the chip module and the plastic packaging body are arranged on the front surface of the packaging substrate, the chip module is connected with the rewiring structure, and the plastic packaging body wraps the chip module; the electromagnetic shielding layer covers the surface of the plastic package body and the side surface of the package substrate; the back surface of the packaging substrate is provided with a solder mask layer and a plurality of pins, the pins comprise a grounding pin and a conductive pin, the conductive pin and the electromagnetic shielding layer are separated through the solder mask layer, and the tail end of the grounding pin extends to the edge from the back surface of the packaging substrate and is connected with the electromagnetic shielding layer, so that a good conduction effect can be realized; the design of the inner layer metal lead of the packaging substrate is simplified, and the manufacturing cost of the packaging substrate is reduced.

The utility model discloses a monitor and a display assembly for the monitor, and belongs to the field of medical instruments. In order to solve the problem that a monitor display assembly shields magnetic interference, the monitor display assembly mainly comprises a display assembly body and a rotating assembly, an alarm lamp panel comprising a green oil area and a windowing area is arranged on the display assembly body, alarm lamps are arranged at the two ends of the green oil area, the windowing area is a non-magnetic metal layer, and the rotating assembly is arranged at the position corresponding to the position where the alarm lamp panel is installed. A part of the area of the rear shell on the display assembly body is emptied to install a light guide column. The display assembly body is further provided with a conductive shielding film, and the rotating assembly mainly comprises a non-magnetic metal cover plate, a rotating component, a first fixing metal plate and a second fixing metal plate. The display assembly is applied to the monitor, and the monitor with the display assembly can effectively shield magnetic interference in a magnetic resonance indoor environment.

The invention discloses an electromagnetic-thermal-stress collaborative optimization power module packaging device, which belongs to the technical field of electromagnetic compatibility and thermal management of power modules and comprises a cover plate and a five-surface metal shell. The cover plate is a PCB and is composed of a solder mask layer, a first insulating layer, a first shielding metal layer, a second insulating layer, a second shielding metal layer, a third insulating layer and a weldable metal layer which are sequentially stacked from top to bottom. The weldable metal layer is laid on the edge of the PCB. The weldable metal layer of the PCB is fixedly connected with the milling groove in the end face of the metal base through high-frequency induction tin soldering to form a totally-closed electromagnetic shielding cavity. The cover plate is a high-thermal-conductivity ceramic substrate, heat dissipation through holes are formed between the metal layers, the cover plate is in heat conduction connection with the end face of the five-face metal shell through the heat dissipation through holes, and efficient heat management is achieved. The invention has the advantages of excellent electromagnetic shielding performance, high heat dissipation efficiency, strong assembly reliability, compact structure and the like, and can be applied to the fields of communication base stations, aerospace and the like with strict requirements on electromagnetic environments.

This disclosure relates to lidar and printed circuit boards and transmitting assemblies used therein. The printed circuit board may include a multilayer structure, a thermally conductive layer, a top metal layer, blind vias, and a solder mask. A ceramic block is embedded within the multilayer structure. The thermally conductive layer is located on the multilayer structure and includes a prepreg layer or an adhesive film layer with a modulus less than or equal to 5 GPa. The top metal layer is located on the thermally conductive layer. Blind vias extend longitudinally through the top metal layer and the thermally conductive layer above the ceramic block, and these blind vias are used for electrical coupling with a laser. The solder mask covers the top metal layer, which includes exposed areas corresponding to the ceramic block.

This application relates to the field of semiconductor device technology and provides a method for fabricating a pressure sensor based on flip-chip bonding technology, as well as the pressure sensor itself. The method includes growing an oxide layer on a substrate; depositing a sensitive thin film layer on the oxide layer; depositing a piezoresistive resistor on the sensitive thin film layer; depositing a wiring layer on the sensitive thin film layer; depositing a silicon capping layer on the wiring layer; depositing stop structures of different heights and positions on the cavity of the silicon capping layer; the silicon capping layer, the sensitive thin film layer, and the wiring layer forming a closed cavity structure; the stop structures being enclosed within the closed cavity structure; etching through-silicon vias (TSVs) on the silicon capping layer and applying a redistribution layer process to connect the TSVs and the wiring layer; depositing a solder resist layer on the silicon capping layer; and etching the back side of the substrate to form a pressure-sensitive cavity. This application provides a protection method that effectively protects the component structure while maintaining or improving the response frequency and sensitivity to meet the requirements of high dynamic performance.

The application discloses an environment-friendly black liquid photosensitive ink without 907 and 369 photosensitizers, which is composed of the following components in parts by weight: epoxy propylene acid resin 30-50 parts, photosensitizer 205 3-4 parts, photosensitizer 360 6-7 parts, photoinitiator 184 2-4 parts, superfine silicon powder 5-10 parts, superfine barium sulfate 20-30 parts, liquid chelating agent 1-3 parts, modified bentonite 15-30 parts, and organic silicon defoaming agent 5-10 parts. The application introduces long-wave environment-friendly photosensitizers for the first time, changes the structural defects of the traditional black system using 369 and 907 high carcinogenic photosensitizers to only meet short-wave length and insufficient deep curing of the ink, strengthens the deep curing effect of the carbon black photosensitive ink, improves the solder mask bridge manufacturing capacity of the carbon black photosensitive ink from 4 mil to 2 mil, and realizes secondary development. The product is high in efficiency and environmental protection and high in economic benefits, fully meets the European Union standard, and is mainly supplied to the European Union market.

Systems and methods of the present disclosure are directed to an electronic substrate. The electronic substrate includes a base layer, first feature(s) formed from a first metal layer and a second metal layer, and second feature(s) formed from the first metal layer. The electronic substrate includes a polymerized photodielectric layer over the first feature(s) and the second feature(s). The polymerized photodielectric layer exposes a portion of the second metal layer of the first feature(s), and at least a portion of the first metal layer of the second feature(s).

Aspects of this disclosure configure a processor for detecting defects in the solder mask of a printed circuit board (PCB) using an optical waveguide. The processor directs an optical beam toward the input of one or more optical waveguides embedded in a protective coating layer of a PCB, the protective coating layer being adjacent to one or more conductive traces of the PCB. The processor measures a beam property of the optical beam emitted by the one or more optical waveguides. The processor detects a break in the optical beam emitted by the one or more optical waveguides based on this beam property.The processor detects a fault in the protective coating layer of the PCB based on detecting the interruption of the optical beam emitted by the one or more optical waveguides.