575 results about "Solder mask" patented technology

The invention discloses an intelligent visual detection system for a high-precision printed circuit board, and relates to the technical field of precision optical detection.The intelligent visual detection system comprises the steps that based on a printed circuit board substrate with a quantum dot mark layer attached to the surface, confocal scanning is conducted through laser wavelength, and an original image data set is generated; performing multispectral feature analysis on the original image data set, capturing focus offset rules of light rays with different wavelengths, and generating a wavelength-focus mapping relation compensation instruction set; according to the compensation instruction set of the wavelength-focus mapping relation, an imaging light path is adjusted in real time, and a high-fidelity fusion image is generated; and analyzing optical signal feature changes in the high-fidelity fusion image, identifying an abnormal region, extracting microdefect features, and generating a detection report containing the defect features. According to the invention, through uniform dispersion of the quantum dot modified ink in the inert atmosphere and a plasma substrate activation process, molecular-level combination of the solder mask layer and the fluorescent marking material is realized.

A printed circuit board (PCB) includes a solder resist layer including at least one of an opening and a depression and a solder resist patch disposed in at least one of the opening and the depression to have an interface with the solder resist layer in at least one of the opening and the depression.

The invention discloses a Tenting process-based system-level vehicle-mounted packaging substrate and a processing method thereof. The processing method comprises the following steps of: providing a first PNL plate provided with an outer-layer copper foil and a through hole; a connecting copper layer is formed on the inner wall of the through hole, and the connecting copper layer extends to the outer copper foil and surrounds a preset area outside the two ports of the through hole to form a ring hole copper layer; performing resin hole plugging on the through hole; grinding two ports of the through hole, reducing copper of the ring hole copper layer and grinding the whole plate in sequence so as to form a micro step between the outer copper foil and the ring hole copper layer; a thickened copper layer is formed on the outer copper foil and the ring hole copper layer, an outer pattern is manufactured on the thickened copper layer, and a second PNL plate is obtained; and after solder mask treatment is carried out on the second PNL, gold plating treatment is carried out in the mode of arranging false gold plating fingers on the edge of the second PNL and between the SET and the SET by adopting the optimal control current density, and an outer layer pattern finished product with the thickness consistency is manufactured. According to the processing method, the size consistency of the outer-layer pattern finished product is remarkably improved, and the market requirement is met.

This invention proposes a micro / nano-scale imprinting FPC solder resist layer forming device, relating to the field of circuit board solder resist layer forming technology. It includes a forming base with a limiting base mounted on it. An imprinting head is positioned directly above the limiting base and driven by a servo electric cylinder. The limiting base has a groove, within which a rigid base is installed. A vacuum adsorption assembly is mounted inside the forming base, and a forming placement cavity is located inside the rigid base. From top to bottom, a PI thin film layer, a silicone layer, and a carbon fiber heating film layer are sequentially arranged at the bottom of the forming placement cavity. Micro / nano patterns are etched on the imprinting head, and a PDMS elastic layer is located at the lower end of the imprinting head. This invention, through the cooperation of the PI thin film layer, silicone layer, carbon fiber heating film layer, and microporous array, can adsorb, flatten, and preheat the FPC substrate before imprinting, fundamentally compensating for the deformation of the flexible substrate and providing a stable and flat reference plane for high-precision imprinting.

The invention relates to the technical field of electromagnetic shielding devices, and discloses an electromagnetic shielding structure for a keyboard chip, a manufacturing method of the electromagnetic shielding structure and a wireless keyboard applying the electromagnetic shielding structure, and the method comprises the following steps: a first circuit layer is provided with a signal wire and a grounding wire, and is connected to a second circuit layer provided with a welding pad and a false welding pad through a via hole; the chip is welded on the welding pad, and the false welding pad is electrically connected with the grounding wire; an insulating layer and a third circuit layer are formed outside the chip, and a coverage area is connected with the false welding pad through a via hole; the electromagnetic shielding layer is arranged on the solder mask layer, and the electromagnetic shielding layer is electrically connected with the grounding wire through the conductive adhesive layer, so that the chip is wrapped and shielded in all directions. The structure can effectively reduce electromagnetic interference and improve the stability of wireless keyboard signals, and is suitable for thin keyboard circuit design.

The invention belongs to the technical field of high-power electronic component base materials, and discloses an embedded high-thermal-conductivity ceramic packaging substrate for a high-power scene and a preparation method of the embedded high-thermal-conductivity ceramic packaging substrate. ABF composite layers are arranged above and below a ceramic core plate in the ceramic packaging substrate; a high-thermal-conductivity base material is fixed in the ceramic substrate; interconnection holes are formed in the ceramic substrate, and electroplating copper film layers are arranged on the upper surface and the lower surface of the ceramic substrate and in the interconnection holes; a copper-clad plate layer is arranged on the outer side of the ABF layer, a copper-clad plate groove is formed in the copper-clad plate layer, a blind hole is formed in the copper-clad plate groove, and a copper column is arranged in the blind hole; a solder mask layer is arranged on the surface of the ABF layer on the outermost side, a surface treatment layer is arranged on the outer side of the solder mask layer, and blind holes with built-in copper columns are formed in the surface treatment layer. The preparation method comprises the following steps: forming a substrate groove in the surface of the ceramic substrate; embedding a high-thermal-conductivity base material; arranging an electroplating copper film coating layer; an ABF composite layer is arranged; arranging a solder mask layer; and arranging a surface treatment layer. The LED lamp is good in heat dissipation effect.

The application discloses a surface acoustic wave filter packaging structure and a packaging method thereof. The packaging structure comprises a substrate, solder resist layers arranged on the front surface of the substrate, filter chips and non-filter chips which are inverted on the front surface of the substrate and are arranged between the solder resist layers, and an injection molding layer covering the filter chips, the solder resist layers and the non-filter chips. The filter chips are uniformly provided with first protrusions on the side facing the substrate. The lower surface of the filter chip is overlapped with the upper surface of the adjacent solder resist layer, and a sealed cavity is formed between the filter chip, the solder resist layer and the substrate. The non-filter chips are uniformly provided with second protrusions on the side facing the substrate. A gap is left between the periphery of the non-filter chip and the adjacent solder resist layer, and the injection molding layer is filled below the non-filter chip. The application ensures the existence of the cavity at the bottom of the filter chip and protects the protrusions of the non-filter chip, thereby further improving the reliability of the product.

The utility model discloses an electromagnetic shielding packaging structure. The electromagnetic shielding packaging structure comprises a packaging substrate, a chip module, a plastic packaging body and an electromagnetic shielding layer, the packaging substrate is provided with a rewiring structure, the chip module and the plastic packaging body are arranged on the front surface of the packaging substrate, the chip module is connected with the rewiring structure, and the plastic packaging body wraps the chip module; the electromagnetic shielding layer covers the surface of the plastic package body and the side surface of the package substrate; the back surface of the packaging substrate is provided with a solder mask layer and a plurality of pins, the pins comprise a grounding pin and a conductive pin, the conductive pin and the electromagnetic shielding layer are separated through the solder mask layer, and the tail end of the grounding pin extends to the edge from the back surface of the packaging substrate and is connected with the electromagnetic shielding layer, so that a good conduction effect can be realized; the design of the inner layer metal lead of the packaging substrate is simplified, and the manufacturing cost of the packaging substrate is reduced.

This disclosure relates to lidar and printed circuit boards and transmitting assemblies used therein. The printed circuit board may include a multilayer structure, a thermally conductive layer, a top metal layer, blind vias, and a solder mask. A ceramic block is embedded within the multilayer structure. The thermally conductive layer is located on the multilayer structure and includes a prepreg layer or an adhesive film layer with a modulus less than or equal to 5 GPa. The top metal layer is located on the thermally conductive layer. Blind vias extend longitudinally through the top metal layer and the thermally conductive layer above the ceramic block, and these blind vias are used for electrical coupling with a laser. The solder mask covers the top metal layer, which includes exposed areas corresponding to the ceramic block.

This application relates to the field of semiconductor device technology and provides a method for fabricating a pressure sensor based on flip-chip bonding technology, as well as the pressure sensor itself. The method includes growing an oxide layer on a substrate; depositing a sensitive thin film layer on the oxide layer; depositing a piezoresistive resistor on the sensitive thin film layer; depositing a wiring layer on the sensitive thin film layer; depositing a silicon capping layer on the wiring layer; depositing stop structures of different heights and positions on the cavity of the silicon capping layer; the silicon capping layer, the sensitive thin film layer, and the wiring layer forming a closed cavity structure; the stop structures being enclosed within the closed cavity structure; etching through-silicon vias (TSVs) on the silicon capping layer and applying a redistribution layer process to connect the TSVs and the wiring layer; depositing a solder resist layer on the silicon capping layer; and etching the back side of the substrate to form a pressure-sensitive cavity. This application provides a protection method that effectively protects the component structure while maintaining or improving the response frequency and sensitivity to meet the requirements of high dynamic performance.

The application discloses an environment-friendly black liquid photosensitive ink without 907 and 369 photosensitizers, which is composed of the following components in parts by weight: epoxy propylene acid resin 30-50 parts, photosensitizer 205 3-4 parts, photosensitizer 360 6-7 parts, photoinitiator 184 2-4 parts, superfine silicon powder 5-10 parts, superfine barium sulfate 20-30 parts, liquid chelating agent 1-3 parts, modified bentonite 15-30 parts, and organic silicon defoaming agent 5-10 parts. The application introduces long-wave environment-friendly photosensitizers for the first time, changes the structural defects of the traditional black system using 369 and 907 high carcinogenic photosensitizers to only meet short-wave length and insufficient deep curing of the ink, strengthens the deep curing effect of the carbon black photosensitive ink, improves the solder mask bridge manufacturing capacity of the carbon black photosensitive ink from 4 mil to 2 mil, and realizes secondary development. The product is high in efficiency and environmental protection and high in economic benefits, fully meets the European Union standard, and is mainly supplied to the European Union market.

Systems and methods of the present disclosure are directed to an electronic substrate. The electronic substrate includes a base layer, first feature(s) formed from a first metal layer and a second metal layer, and second feature(s) formed from the first metal layer. The electronic substrate includes a polymerized photodielectric layer over the first feature(s) and the second feature(s). The polymerized photodielectric layer exposes a portion of the second metal layer of the first feature(s), and at least a portion of the first metal layer of the second feature(s).

Aspects of this disclosure configure a processor for detecting defects in the solder mask of a printed circuit board (PCB) using an optical waveguide. The processor directs an optical beam toward the input of one or more optical waveguides embedded in a protective coating layer of a PCB, the protective coating layer being adjacent to one or more conductive traces of the PCB. The processor measures a beam property of the optical beam emitted by the one or more optical waveguides. The processor detects a break in the optical beam emitted by the one or more optical waveguides based on this beam property.The processor detects a fault in the protective coating layer of the PCB based on detecting the interruption of the optical beam emitted by the one or more optical waveguides.

The invention provides a tin deposition agent, a preparation method and application. The tin depositing agent comprises the following components: 12-18 g / L of tin methanesulfonate; 120 to 160 g / L of methanesulfonic acid; 30-60 g / L of a complexing agent; the compound stabilizer is prepared from 1 g / L to 5 g / L of trimethylglycine, 0.05 g / L to 1 g / L of phosphonate and 0.5 g / L to 3 g / L of sodium hydrogen sulfite; 50 to 150 mg / L of a wetting agent; and 50 to 150 mg / L of an emulsifier. The tin immersion agent is high in tin immersion rate, has excellent deoiling resistance, can effectively avoid the problems of solder mask falling, local welding refusal or bare copper exposure and the like in the tin immersion process, and can meet the requirements of industrial large-scale production.

The utility model relates to the technical field of circuit boards, and discloses a circuit board solder mask developing device which comprises a supporting table, a plurality of sliding grooves are formed in the left side and the right side of the top of the supporting table, a machining table is slidably connected to the inner walls of the sliding grooves, and a machining box is fixedly connected to the top of the machining table. Pushing blocks are fixedly connected to the tops of the front side and the rear side of the inner wall of the machining box, a plurality of rollers are rotationally connected to the bottoms of the left side and the right side of the inner wall of the machining box, a fixing piece is fixedly connected to the rear portion of the left side of the machining table, and a servo motor is fixedly connected to the top of the right side of the fixing piece. According to the utility model, the chute allows the processing table to slide therein, the processing box is used for placing an undeveloped circuit board, the telescopic rod is controlled, the circuit board can be fed into the processing shell, and the servo motor is started to assist turnover through the gear transmission roller, the turnover circuit board and the push block, so that the developing uniformity and the processing quality are improved, and automatic operation is realized; and development requirements are met.

The utility model discloses a flexible circuit board with high strength and bending resistance, which comprises a flexible circuit substrate and a conductive copper layer, the thickness of the conductive copper layer in a circuit bending area is larger than that of the conductive copper layer in a conducting circuit area, and a plurality of equidistant grooves are formed in the conductive copper layer in the circuit bending area so as to improve the bending resistance. The thicker copper layer can better resist stress and deformation generated during bending, and the groove design can buffer stress concentration and line extrusion deformation. In addition, the metal coating is laid on the upper surface of the conductive copper layer, the overall strength and corrosion resistance of the circuit board are improved, the upper surface of the metal coating is brushed with ink, the groove can store more ink, a solder mask protection layer is formed, the thickness and strength of the bending area are further increased, the bending curvature is relieved, the circuit board is prevented from being damaged by welding heat, and components and lines are protected.

The application belongs to the technical field of circuit board printing, and particularly relates to a high-performance circuit board anti-soldering printing process. The high-performance circuit board anti-soldering printing process comprises the following steps: S1, pretreatment; S2, preparation of anti-soldering ink; S3, silk screen printing; and S4, curing. Through the pretreatment fine etching, preparation of anti-soldering ink, high-precision silk screen printing and segmented curing process, the adhesion, temperature resistance and thermal shock resistance of the anti-soldering layer are significantly improved, the dielectric loss and process defect rate are reduced, and the strict requirements of high-frequency and high-speed circuits on reliability and signal integrity are fully met.

The invention is applicable to the technical field of table-board printing, and particularly relates to a table-board printing method for improving oil sticking of a table-board of an IC (integrated circuit) support plate solder-resistant DI (direct-input) exposure machine, which comprises the following steps of: placing a PET (polyethylene terephthalate) support film on the table-board of the exposure machine, and fixing the PET support film above the exposure table-board; the Bot face of the plate faces downwards, the plate is placed above the PET carrier film, and vacuum adsorption is conducted on the plate; and performing alignment treatment, performing exposure operation after alignment is completed, turning over the plate after Bot surface exposure is completed, and performing exposure operation on the Top surface. The method solves the problem that oil adheres to a table board due to poor appearance of the carrier board after DI exposure of resistance welding, is suitable for products such as IC carrier boards, PCBs, HDI and FPCs, can effectively improve the qualified rate of factory products, and reduces the rejection rate in a factory; meanwhile, the problems of appearance suction marks, plate sticking and poor oil falling are effectively solved, the finished product quality of products can be improved, the replacement cost of the DI exposure table top is effectively saved, table top abrasion is effectively reduced, and the regular replacement frequency is reduced.

The embodiment of the invention relates to the technical field of PCB manufacturing, in particular to a device-embedded circuit board bonding pad manufacturing method and device.The device-embedded circuit board bonding pad manufacturing method comprises the steps that a multi-layer PCB is obtained, and a device-embedded area of the multi-layer PCB is uncovered to manufacture an embedded groove; performing solder mask pretreatment on the PCB multilayer board, performing low solder mask ink spraying treatment on the embedding groove of the PCB multilayer board, and forming ink layers on the surface of the PCB board and the surface of the embedding groove; and performing DI exposure processing, developing processing and curing processing on the PCB multilayer board in sequence to form a target bonding pad at the bottom of the embedded groove. According to the method, the target bonding pad is formed by forming the ink layer on the surface of the embedding groove of the PCB multilayer board and performing exposure, development and curing treatment, so that the stability of a protective layer of the inner bonding pad in the multilayer pressing process is improved, and the welding reliability and the product quality are ensured.

The invention belongs to the technical field of semiconductor packaging, and discloses a chip packaging method which comprises the steps that a substrate structure and a second chip are provided, the substrate structure comprises a base and a first chip arranged on the base, and a first bonding pad is arranged on the first chip; preparing a second bonding pad on the second chip, wherein the second bonding pad is made of tin; a solder mask layer is arranged on the first chip, the solder mask layer is provided with a windowing structure, and the windowing structure and the first bonding pad are correspondingly arranged; and mounting the second chip on the first chip by using chip mounting equipment, wherein the second bonding pad and the first bonding pad are correspondingly arranged. The second bonding pad is made of tin, the price of tin is low, a ball mounter does not need to be used, and the processing cost of the second bonding pad is effectively reduced; the chip mounting equipment is used for mounting the second chip on the first chip, the second bonding pad and the first bonding pad are correspondingly arranged, and compared with an existing mode that the second chip and the first chip are connected through an inverted mounting machine, the processing cost can be effectively reduced.

The invention discloses an embedded double-layer driving power module and a preparation method, and relates to the technical field of power devices, the power module comprises an upper half-bridge driving circuit layer, a first solder mask layer, a first copper layer, an insulating laminated board, a second copper layer, a second solder mask layer, a lower half-bridge driving circuit layer and a radiator in sequence from top to bottom; a power chip is embedded in the insulating laminated board, the power chip is electrically connected with the first copper layer through array type electroplating copper columns, and a heat dissipation window is arranged in the second solder mask layer area under the power chip. A power chip is embedded into an insulating laminated board, and an array type copper column electroplating process is adopted to replace a bonding wire to realize electrical connection, so that paths of a power main circuit and a follow current loop of an upper half-bridge drive circuit and a lower half-bridge drive circuit are shortened, and parasitic inductance is reduced.

This invention discloses a method for fabricating positioning points on a printed circuit board (PCB) and the PCB itself, belonging to the field of PCB fabrication technology. The method involves printing white ink onto the PCB, masking and exposing areas outside the positioning surface to allow the white ink covering the positioning surface to solidify into white ink blocks. The PCB is then immersed in a developing solution to remove the remaining white ink. The PCB is subsequently heated to solidify the white ink blocks into white positioning blocks. Next, green ink is printed onto the PCB, masking and exposing areas outside the solder mask surface to allow the green ink covering the solder mask to solidify into green ink blocks. The PCB is then immersed in a developing solution to remove the remaining green ink. The PCB is then heated to solidify the green ink blocks into solder mask bridges. This method improves the adhesion between the solder mask bridges and the white positioning blocks to the PCB, preventing the edges of the solder mask bridges and white positioning blocks from detaching and ensuring the positioning accuracy of the white positioning blocks.

An electrical connector comprising one or more aerosol structures deposited on one or more surfaces of the electrical connector; and a method of depositing one or more aerosol materials onto one or more conductors, comprising: providing one or more electrical conductors having one or more surfaces; ejecting one or more aerosol structures with aerosol on the one or more surfaces of the one or more electrical conductors; and at least one of masking, surrounding, and / or excluding one or more materials on the one or more surfaces of the one or more electrical conductors.

This invention discloses a circuit board processing method and circuit board processing equipment, comprising: processing a first through hole on a multilayer circuit board, the multilayer circuit board including a first solder mask layer and a second solder mask layer respectively disposed on two adjacent circuit boards, the first solder mask layer and the second solder mask layer being disposed opposite to each other, and the first through hole penetrating the first solder mask layer and the second solder mask layer; performing a desmearing process on the multilayer circuit board to form a first space on the first solder mask layer and a second space on the second solder mask layer; depositing a first metal layer on the inner wall of the first through hole, the first space and the second space; removing the first solder mask layer and the second solder mask layer, and electroplating a second metal layer on the first metal layer on the inner wall of the first through hole to obtain a target circuit board including a target metallized hole, so as to completely remove the low-density first metal layer deposited in the first solder mask layer and the second solder mask layer, so as to achieve complete electrical isolation between the two adjacent circuit boards with the first solder mask layer and the second solder mask layer, and achieve zero residual solder.

The invention discloses a manufacturing method of a Mini LED PCB solder mask layer. The manufacturing method comprises the following steps of performing pretreatment; first-time vertical low-pressure spraying: vertically hanging the pretreated PCB in a vertical low-pressure spraying machine, performing first-time solder resist ink spraying, and forming a completely covered basic coating on the surface of the PCB; pre-baking for the first time: feeding the PCB subjected to the spraying for the first time into a drying oven, and carrying out first-stage curing, so that the liquid basic coating is converted into a semi-cured anchoring layer; second-time vertical low-pressure spraying is conducted, specifically, the PCB subjected to first-time pre-baking is vertically hung in the vertical low-pressure spraying machine again, second-time solder resist ink spraying is conducted, and ink is evenly deposited on the surface of the anchoring layer till the thickness of the coating meets the design requirement; carrying out secondary pre-baking, feeding the PCB subjected to secondary spraying into the drying oven again, and carrying out second-stage curing to form a final solder mask layer; exposing and developing; and high-temperature curing. According to the manufacturing method of the Mini LED PCB solder mask layer, the thickness range of solder mask ink can be remarkably reduced, so that the PCB surface with ultrahigh flatness is obtained, and the manufactured Mini LED meets the optical requirement.

The utility model discloses a circuit board and a battery management system. The circuit board comprises a solder mask layer; the conductive layer is arranged on one side of the solder mask layer; the semi-cured layer is arranged on one side, opposite to the solder mask layer, of the conductive layer; the copper core layer is arranged on the side, opposite to the conductive layer, of the semi-cured layer, and the copper core layer comprises a containing groove; and the at least one common mode inductor is arranged in the accommodating groove, the common mode inductor comprises a signal input end and a signal output end, and the signal input end and the signal output end extend out of the accommodating groove to be connected with the component. According to the utility model, the creepage distance between a high-voltage signal and a low-voltage signal on the circuit board can be reduced, so that the area of the circuit board is reduced.

The present application relates to the technical field of chip packaging, and particularly relates to a BGA packaging solder joint form prediction method based on deep learning, which comprises the following steps: S1: taking the solder ball initial diameter, solder resist thickness and pad size as key parameters, replacing the volume of the solder ball after welding is completed with an equal-volume cylinder volume to simplify the establishment of a finite element model in finite element modeling, and simulating the height value and width value of the solder ball after welding is completed under the corresponding size; S2: training the simulated height value and width value by using a deep learning method, and training an optimal network model; and obtaining the final height value and width value of the solder joint under a certain solder ball initial diameter, solder resist thickness and pad size by using the optimal network model. In the present scheme, the simulated solder ball form has high consistency with the measured data, the finally trained model can rapidly and accurately predict the final size of the solder ball under certain parameters, and the work efficiency can be greatly improved.

The utility model discloses a waveguide antenna and a radar, and the waveguide antenna comprises a radiation layer which is provided with a first surface, a solder resist part is formed at a preset position of the first surface, and a welding area is formed in the solder resist part; the signal transmission layer and the radiation layer are arranged in a stacked mode in the first direction, the signal transmission layer is provided with a second surface, and a gap space is formed between the second surface and the first surface; the soldering tin layer is arranged in the gap space and provided with a first end and a second end in the first direction, the first end of the soldering tin layer is connected to the welding area, and the second end of the soldering tin layer is connected to the second surface. According to the utility model, the solder resist part is arranged on the radiation layer and is used as a reference mark, and the alignment between the radiation layer and the signal transmission layer can be ensured to be more accurate by accurately controlling the position and the shape of the solder resist part, so that the high-precision positioning requirement of the radiation layer and the signal transmission layer of the waveguide antenna is met.

Light-emitting plates and display devices are provided by the present application. The light-emitting plate includes a substrate, a driving layer disposed on the substrate and including a metal wire, a pad disposed on a side of the driving layer facing away from the substrate and connected to the driving layer, a light-emitting element disposed on a side of the pad facing away from the substrate and connected to the pad; and a solder resist layer disposed on the side of the driving layer facing away from the substrate. The solder resist layer is defined with an opening configured to expose the light-emitting element. One or more vias are defined in the metal wire and the solder resist layer extends into the one or more vias.