How to Stacked resist layers?

Novel LGA architecture to improve the reliability performance of metal definition pads,Methods and processes for forming electrical circuitries on three-dimensional geometries,Electronic device,Electronic device

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Novel LGA architecture to improve the reliability performance of metal definition pads

ActiveJP7882648B2Stacked resist layersPrinted circuit non-printed electric components association

To solve problems with the prior art.SOLUTION: Embodiments disclosed herein include electronic packages and methods of forming such electronic packages. In an embodiment, an electronic package comprises a package substrate with a die side and a land side. In an embodiment, a pad is on the land side. In an embodiment, a dielectric layer covers sidewalls of the pad, and a surface finish is over an exposed surface of the pad.SELECTED DRAWING: Figure 1A

Novel LGA architecture to improve the reliability performance of metal definition pads

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Owner:INTEL CORP

Methods and processes for forming electrical circuitries on three-dimensional geometries

ActiveEP4144192B1Additive manufacturing apparatusSecond resist pattern

Methods for forming electrical circuitries on three-dimensional (3D) structures and devices made using the methods. A method includes forming selectively shaped 3D structures using additive manufacturing. The method includes forming undercuts on upper-level pedestals of the 3D structures that effectively act as overhanging deposition masks for selectively preventing deposition of a selected material on a corresponding portions of lower levels. The method includes simultaneously forming and electrically isolating materials directionally deposited on the 3D structure.

Methods and processes for forming electrical circuitries on three-dimensional geometries

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Owner:DUJUD LLC

Electronic device

PendingUS20260143859A1Printed circuit aspectsStacked resist layersElectrical connectionElectronic component

An electronic device includes a substrate having a surface, a first conducting layer disposed on the surface of the substrate, a second conducting layer disposed on the first conducting layer, a first electronic component disposed on the first conducting layer and electrically connected to the first conducting layer, and a second electronic component disposed on the second conducting layer and electrically connected to the second conducting layer. The second conducting layer is disposed between the first conducting layer and the second electronic component. In a cross-section view, the first electronic component is overlapped with the second conducting layer along a direction parallel to the surface of the substrate.

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Owner:INNOLUX CORP

Electronic device

ActiveUS12557435B2Printed circuit aspectsSolid-state devicesElectronic componentEngineering physics

An electronic device with an active region comprising a substrate; a first conducting layer, disposed on the substrate, comprising a first pad in the active region; a second conducting layer, disposed on the first conducting layer, comprising a second pad in the active region; a first electronic component, disposed on the first pad, and electronically connected to the first pad; and a second electronic component, disposed on the second pad, and electronically connected to the second pad.

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Owner:INNOLUX CORP