The invention provides a manufacturing method of a Mini-
LED packaging BT substrate, and the method comprises the following steps: S1, carrying out the
processing of the surface of a BT carrier plate, and enabling the surface to form a compact light absorption film layer; s2, performing
laser grooving on the BT carrier plate subjected to surface treatment; s3,
electroplating and
copper deposition are carried out on the BT carrier plate after slotting; s4, a circuit pattern is manufactured on the BT carrier plate after
copper deposition is completed; s5, performing resistance
welding processing on the BT carrier plate on which the circuit pattern is manufactured; and S6, carrying out
nickel-
palladium-gold treatment on the BT carrier plate subjected to resistance
welding treatment, and then carrying out cleaning,
cutting, fragmentation and inspection to obtain the Mini-
LED packaging BT substrate. According to the manufacturing method of the Mini-
LED packaging BT substrate provided by the invention, the surface of a BT carrier plate is treated, so that a compact light absorption film layer is formed on the surface of the BT carrier plate; according to the method, the undemanded area is removed through the
laser, grooving of the LED packaging BT substrate is achieved, the width of the groove can be not larger than 0.1 mm, the
cutting quality is improved, the grooving precision is improved, the manufacturing cost is reduced, and therefore high-precision and low-cost grooving manufacturing is achieved.