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112 results about "Test stimulus" patented technology

The “test stimulus” (that is, the visual representation of the design) you use can be easily adapted to work with several different types of research studies. When conducting in-person visual-design evaluations, you can simply show people a static image, either printed on paper or displayed on a screen.

Location-based testing for wireless data communication networks

Apparatus and methods facilitating a distributed approach to performance and functionality testing of location-sensitive wireless data communication systems and equipment are described. A plurality of test units, geographically distributed at arbitrary points in a three-dimensional volume surround the system or equipment under test. Each test unit generates test stimuli and records responses from the device under test, and emulates the effects of changes in spatial location within an actual wireless network environment. A central controller co-ordinates the set of test units to ensure that they act as a logical whole, and enables testing to be performed in a repeatable manner in spite of the variations introduced by the location sensitive characteristics of wireless data communication networks. The central controller also maintains a user interface that provides a unified view of the complete test system, and a unified view of the behavior of the system or equipment under test. For diagnostic purposes, the recorded responses may be regenerated to view any defects as many times as necessary to correct them. Alternatively, each test unit may have either wired network interface units, instead of a wireless interface unit to test systems or equipment forming part of a wired network portion in the wireless data communication system.
Owner:KEYSIGHT TECH SINGAPORE (SALES) PTE LTD

Real-time decoder for scan test patterns

A method and apparatus for improving the efficiency of scan testing of integrated circuits is described. This efficiency is achieved by reducing the amount of required test stimulus source data and by increasing the effective bandwidth of the scan-load operation. The reduced test data volume and corresponding test time are achieved by integrating a real-time test data decoder or logic network into each integrated circuit chip. The apparatus, servicing a plurality of internal scan chains wherein the number of said internal scan chains exceeds the number of primary inputs available for loading data into the scan chains, includes: a) logic network positioned between the primary inputs and the inputs of the scan chains, the logic network expanding input data words having a width corresponding to the number of the primary inputs, and converting the input data words into expanded output data words having a width that corresponds to the number of the internal scan chains; and b) coupled to the internal scan chains, registers loaded with bit values provided by the expanded output data words while data previously loaded into the scan chains shifts forward within the scan chains by one bit position at a time; wherein a first plurality of the input data words supplied to the primary inputs produce a second plurality of expanded data words that are loaded into the internal scan chains to achieve an improved test coverage.
Owner:GOOGLE LLC

Testing integrated circuits

A method of testing integrated circuits is provided. The method includes establishing at least one first physical communication channel between a test equipment and a respective group of integrated circuits under test by having probes of the test equipment contacting at least one corresponding physical contact terminal of each integrated circuit of the respective group. The method further includes having the test equipment exchanging, over the at least one first physical communication channel, the same test stimuli with each integrated circuit of the group. The method still further includes having each integrated circuit of the group establishing a corresponding second physical communication channel with the test equipment by having at least one physical contact terminal of the integrated circuit contacted by a corresponding probe of the test equipment. The method further includes having each integrated circuit of the group exchanging, over the second physical communication channel, a corresponding test response signal based on the received test stimuli with the test equipment. The test stimuli are exchanged by modulating at least one first carrier wave based on the test stimuli; the at least one first carrier wave has at least one first frequency. The test response signals of each integrated circuit of the group are exchanged by modulating at least one respective second carrier wave based on the test response signals; each second carrier wave have at least one respective second frequency.
Owner:STMICROELECTRONICS SRL

Testing integrated circuits

A method of testing integrated circuits is provided. The method includes establishing at least one first physical communication channel between a test equipment and a respective group of integrated circuits under test by having probes of the test equipment contacting at least one corresponding physical contact terminal of each integrated circuit of the respective group. The method further includes having the test equipment exchanging, over the at least one first physical communication channel, the same test stimuli with each integrated circuit of the group. The method still further includes having each integrated circuit of the group establishing a corresponding second physical communication channel with the test equipment by having at least one physical contact terminal of the integrated circuit contacted by a corresponding probe of the test equipment. The method further includes having each integrated circuit of the group exchanging, over the second physical communication channel, a corresponding test response signal based on the received test stimuli with the test equipment. The test stimuli are exchanged by modulating at least one first carrier wave based on the test stimuli; the at least one first carrier wave has at least one first frequency. The test response signals of each integrated circuit of the group are exchanged by modulating at least one respective second carrier wave based on the test response signals; each second carrier wave have at least one respective second frequency.
Owner:STMICROELECTRONICS SRL

Production test technique for RF circuits using embedded test sensors

A single test stimulus and a simple test configuration with embedded envelope detectors are used to estimate all the specification values of interest for an RF circuit under test in an integrated circuit chip. Envelope detectors are deployed as sensors inside the circuit under test. Where more than one circuit is in an RF device in the integrated circuit, each RF circuit in the device may have its own envelope detector. A signal having, for example, time-varying envelopes is used as an optimized test stimulus. The test makes use of the time-varying and low frequency envelope of the test response. The response of the circuit under test to the optimized test stimulus has features highly correlated with the specifications of interest. The test stimulus is optimized for a set of training circuits, and each training circuit in the set is selected to provide one of a spectrum of test responses to the stimulus. Non-linear regression-based models are built from the set of specification values and set of envelopes derived from testing the training set of circuits. Thereafter when a circuit under test is tested by applying an optimized stimulus, the non-linear regression models are used to map an envelope from the test response of the circuit under test to specification values for the circuit.
Owner:GEORGIA TECH RES CORP

MBIST (Memory Built In Self Test) controller structure system based on IEEE (Institute of Electrical and Electronics Engineers) 1500 standard and compatible with SRAM/ROM (Static Random Access Memory/Read Only Memory)

The invention discloses a testing structure and a testing method based on an IEEE (Institute of Electrical and Electronics Engineers) 1500 standard and compatible with an SRAM/ROM (Static Random Access Memory/Read Only Memory) test. A testing structure is combined with a method of embedded type core testing standard IEEE1500 and a BIST; the testing structure supports to carry out the BIST on a plurality of embedded type SRAMs and ROMs with different types. The structure is formed by two parts, including a testing shell package of the embedded type SRAM and the ROM and an MBIST controller. The testing shell package solves the control problems of testing access, testing isolation and testing of the embedded type SRAM and the ROM. The MBIST controller generates testing stimulation data needed by an SRAM test according to a testing algorithm, controls a package shell Wrapper, carries out response analysis and outputs a testing result; an MISR (Multiple Input Shift Register) is used for finishing data compression operation on data in the ROM. With the adoption of the testing structure and the testing method, the faults of the embedded type SRAM and the ROM can be detected, so as to be good for test reuse of the embedded type SRAM and the ROM; the integration efficiency of an SoC (System on Chip) is effectively improved and the consumption of hardware of an MBIST system is also reduced.
Owner:GUILIN UNIV OF ELECTRONIC TECH
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