535results about "Overload protection arrangements" patented technology

A method is provided for design and programming of a probe card with an on-board programmable controller in a wafer test system. Consideration of introduction of the programmable controller is included in a CAD wafer layout and probe card design process. The CAD design is further loaded into the programmable controller, such as an FPGA to program it: (1) to control direction of signals to particular ICs, even during the test process (2) to generate test vector signals to provide to the ICs, and (3) to receive test signals and process test results from the received signals. In some embodiments, burn-in only testing is provided to limit test system circuitry needed so that with a programmable controller on the probe card, text equipment external to the probe card can be eliminated or significantly reduced from conventional test equipment.

An integrated circuit current sensor includes a lead frame having at least two leads coupled to provide a current conductor portion, and a substrate having a first surface in which is disposed one or more magnetic field sensing elements, with the first surface being proximate to the current conductor portion and a second surface distal from the current conductor portion. In one particular embodiment, the substrate is disposed having the first surface of the substrate above the current conductor portion and the second surface of the substrate above the first surface. In this particular embodiment, the substrate is oriented upside-down in the integrated circuit in a flip-chap arrangement. The integrated circuit includes an overcurrent circuit responsive to a voltage drop generated by a current.

An integrated circuit current sensor includes a lead frame having at least two leads coupled to provide a current conductor portion, and a substrate having a first surface in which is disposed one or more magnetic field sensing elements, with the first surface being proximate to the current conductor portion and a second surface distal from the current conductor portion. In one particular embodiment, the substrate is disposed having the first surface of the substrate above the current conductor portion and the second surface of the substrate above the first surface. In this particular embodiment, the substrate is oriented upside-down in the integrated circuit in a flip-chap arrangement. The lead frame also includes a shunt conductor portion formed as a coupling of the at least two leads.

A probe card for a wafer test system is provided with a number of on board features enabling fan out of a test system controller channel to test multiple DUTs on a wafer, while limiting undesirable effects of fan out on test results. On board features of the probe card include one or more of the following: (a) DUT signal isolation provided by placing resistors in series with each DUT input to isolate failed DUTs; (b) DUT power isolation provided by switches, current limiters, or regulators in series with each DUT power pin to isolate the power supply from failed DUTs; (c) self test provided using an on board micro-controller or FPGA; (d) stacked daughter cards provided as part of the probe card to accommodate the additional on board test circuitry; and (e) use of a interface bus between a base PCB and daughter cards of the probe card, or the test system controller to minimize the number of interface wires between the base PCB and daughter cards or between the base PCB and the test system controller.

An integrated circuit current sensor includes a lead frame having at least two leads coupled to provide a current conductor portion, and a substrate having a first surface in which is disposed one or more magnetic field sensing elements, with the first surface being proximate to the current conductor portion and a second surface distal from the current conductor portion. In one particular embodiment, the substrate is disposed having the first surface of the substrate above the current conductor portion and the second surface of the substrate above the first surface. In this particular embodiment, the substrate is oriented upside-down in the integrated circuit in a flip-chap arrangement. The lead frame also includes a shunt conductor portion formed as a coupling of the at least two leads.

A probe card for a wafer test system is provided with a number of on board features enabling fan out of a test system controller channel to test multiple DUTs on a wafer, while limiting undesirable effects of fan out on test results. On board features of the probe card include one or more of the following: (a) DUT signal isolation provided by placing resistors in series with each DUT input to isolate failed DUTs; (b) DUT power isolation provided by switches, current limiters, or regulators in series with each DUT power pin to isolate the power supply from failed DUTs; (c) self test provided using an on board micro-controller or FPGA; (d) stacked daughter cards provided as part of the probe card to accommodate the additional on board test circuitry; and (e) use of a interface bus between a base PCB and daughter cards of the probe card, or the test system controller to minimize the number of interface wires between the base PCB and daughter cards or between the base PCB and the test system controller.

Enhanced voltmeter leads includes load circuitry having a test load that can be switchably coupled between the leads to help identify faults in a circuit under test. In certain embodiments, the value of the test load can be any appropriate value set according to parameters or characteristics of the circuit under test. In these embodiments, the value of the test load can be set manually or automatically or both. The types of faults that can be identified include a short-to-ground, an open circuit, and a high (e.g., corrosive) resistance. The leads include a switch whose setting is adjustable to couple and decouple the test load between the leads. The switch can be located in the leads or in a lead handle of the leads for easy access by a user / technician. The leads can also include a fuse or circuit breaker for safety reasons. The leads can be used systematically to help identify the type and location of a fault from voltage readings. The voltage readings are obtained at various points in the circuit under test with the switch both closed and open. Conventional test leads or the leads that include the switch to couple / decouple the test load can be used if the load circuitry is integrated into the voltmeter or if the load circuitry has a separate coupling or connection to the voltmeter inputs.

A test system, apparatus and method for applying high current test stimuli to a semiconductor device in wafer or chip form includes a plurality of probes for electrically coupling to respective contact points on the semiconductor device, a plurality of current limiters electrically coupled to respective ones of the plurality of probes, and a current sensor electrically coupled to the plurality of probes. The current limiters are operative to limit current flow passing through a respective probe, and the current sensor is operative to provide a signal when detected current in any contact of the plurality of probes exceeds a threshold level.

The integrated circuit devices disclosed herein generally include two semiconductor dies. The first die generally has little or no I / O or ESD protection and includes a first plurality of exposed terminals (e.g., bump pads). The second die generally includes (i) a second plurality of exposed terminals, wherein at least one of the second plurality of terminals is in electrical communication with one or more of the first plurality of terminals, (ii) a plurality of input and / or output (I / O) circuits, wherein at least one of the I / O circuits is in electrical communication with one or more of the second plurality of terminals, and (iii) a plurality of I / O terminals, wherein at least one of the I / O terminals is in electrical communication with one or more of the I / O circuits. The present invention advantageously provides the ability to fabricate the second die using different (e.g., less expensive) manufacturing processes than those used to fabricate the first die.

The invention provides a control and protection system suitable for a composite type converter valve operating test device, belonging to the field of automation equipment of electrical power systems. The system comprises a man-machine interface unit, a synchronizing unit, a signal acquisition unit, a data summarization unit, a regulation unit, a protection unit, a waveform recording unit, a waveform monitoring unit, a discrete input (DI) unit, a discrete output (DO) unit, a valve base electronic (VBE) unit, a direct current (DC) heavy current power supply system controller, a high-voltage power supply system controller, an inrush current circuit controller, an impact circuit controller, a test valve water system controller and a test device water system controller, wherein the control and protection system can control a test valve and an auxiliary valve according to a trigger time sequence as required so as to generate voltage, current and heat intensity required by various operating tests to finish the operating tests of a converter valve. The system can also monitor the on-off state and important analog quantity parameters of a main circuit so as to take protection measures in time when abnormal conditions appear.

A current-diverting guide plate for use in a probe module is disclosed to include a plate body having a first surface, a second surface opposite to the first surface, and a plurality of through holes penetrating through the first and second surfaces. A conducting layer is provided at a periphery wall of each through hole of the plate body and electrically coupled to a probe slidably inserted through the through holes. A current-diverting circuit trace is disposed on the first surface of the plate body and electrically connected with the conducting layers for diverting the electric current flowing through probes. Thus, the current-diverting guide plate can be used to prevent the probes from possible damage due to an excessive instantaneous current.

To provide a measurement device which allows long-term accurate measurement of voltage without adversely affecting a device under test, by ensuring a predetermined level of resistance to ESD and reducing leakage current. A measurement device includes a probe needle for contacting a device under test, a first FET for detecting voltage of the device under test, and a protection circuit for protecting the first FET from static electricity. The protection circuit includes a second FET having an oxide semiconductor film as a channel formation region.

The embodiment of the invention discloses a relay protection device detection circuit, which is used for ensuring normal work of a circuit element in the detection circuit when voltage boosting is detected. The detection circuit of the embodiment of the invention comprises a constant current circuit and an optical coupler isolating output circuit, wherein an input end of the constant current circuit is connected with detection voltage; the input end of the optical coupler isolating output circuit is connected with the output end of the constant current circuit; the constant current circuit comprises a transient diode (D1) and a constant current diode (D2) which are connected in series; the transient diode (D1) is used for providing threshold voltage and allocating the input detection voltage; the constant current diode (D2) is used for providing stable current for the detection circuit; and the optical coupler isolating output circuit is used for transmitting a low-voltage control signal. In addition, the detection circuit can realize compatibility of input of alternating current detection voltage and direct current detection voltage by improvement.

Disclosed are apparatus and methodologies for providing improved functionality of a meter in a 2-way communications arrangement, such as an Advanced Metering System (AMS) or Infrastructure (AMI). More particularly, the present technology relates to methodologies and apparatus for providing load side voltage sensing for utility meters which preferably are operable with remote disconnect features in an Advanced Metering Infrastructure (AMI) open operational framework. The present subject matter provides enhanced capabilities resulting in improved functionality, increased safety, and greater economy vis-à-vis fraud detection for individual metrology components in an open operational framework. Meters per the present subject matter utilize a detection circuit, which is situated generally downstream of a remote disconnect functionality. Such detection circuit is able to sense whether voltage exists or doesn't exist at such relatively downstream, or load side location. Providing such functionality allows for: (a) verification that a remote disconnect switch did open subsequent to an instruction or command to do so, (b) identification of possible user fraud, as would possibly be reflected by the presence of voltage at a time when the remote disconnect switch is open, (c) verification that the remote disconnect switch did re-close after having been given an instruction or command to close, and (d) verification of lack of voltage present before re-closing such remote disconnect switch, which serves an important safety feature.

A differential measurement probe has spring loaded, double cushioned probe assemblies and a pressure sensors disposed in a housing. The pressure sensors forms an electrical switch having an electrical AND function for passing an activation signal to a EOS / ESD protection control module in response to axial movement of the housing relative to the probe assemblies. First compressive elements produces first pre-loaded compressive forces and increasing compressive forces on the probe assemblies and second compressive elements produces second pre-loaded compressive forces and increasing compressive forces on the probe assemblies subsequent to the first increasing compressive forces on the probe assemblies. An adjustment member allows variable spacing of the differential probing tips.

The invention discloses a voltage detection circuit and an operating method thereof. The device used in the method is composed of a fixed socket and a power-on plug, wherein the fixed socket includesa base, the base is internally provided with an inserting slot with the opening facing upwards, the lower end wall of the inserting slot is provided with left-right symmetrical power-on jacks with theopenings facing upwards in a communicated manner, the lower end walls of the power-on jacks are fixedly provided with a power-on device, the inserting slot is provided with lifting sliding slots withthe openings being opposite to each other in a communicated manner, the lower side of each lifting sliding slot is provided with an annular slot in a communicated manner at the periphery of the inserting slot, the annular slots are respectively provided with front-back symmetrical sliding slots in a communicated manner, each sliding slot is slidably provided with a locking rod, the left side of each sliding slot is provided with a limiting slot with the opening facing towards the right in a communicated manner. The device is simple in structure and convenient to operate, the power utilizationsafety is ensured by double locking such as rotation locking and pressing locking, the locking structure is simple and easy to operate, and the use is facilitated; and secondly, the power utilizationstability is guaranteed through an overload protection circuit.

The invention discloses an intelligent overcurrent protection circuit for an integrated circuit test system, which comprises a half-bridge inversion unit, an overcurrent detection unit, a timing unit and a load equivalent unit, wherein the half-bridge inversion unit is connected with the overcurrent detection unit, and the overcurrent detection unit is connected with the timing unit and samples current in the load equivalent unit. When the overcurrent detection unit detects that the continuous time of an overcurrent signal is longer than the time preset by the timing unit, the integrated circuit test system is locked; otherwise an overcurrent phenomenon is neglected, and the integrated circuit test system normally works. The Intelligent overcurrent protection circuit for the integrated circuit test system is applied in the integrated circuit test system, can improve interference resistance to false triggering and capacitance coupling, further improve the stable performance of a whole circuit and improve the integral reliability of the integrated circuit test system.

The invention provides a partial discharge work frequency synchronization signal sensing device which mainly solves the problems that existing work frequency synchronization signals are not easy to operate on field and poor in safety, and extraction of the work frequency synchronization signals needs access of a high pressure secondary circuit. The partial discharge work frequency synchronization signal sensing device comprises a sensor, an overvoltage protection circuit, a primary amplifying circuit, a narrow-band filtering frequency-selecting circuit, an automatic gain control circuit, a secondary amplifying circuit and a power conversion module. The whole partial discharge work frequency synchronization signal sensing device is fixed at a position outside a high-pressure device or line safe distance, and is used for obtaining work frequency signals, inputting the work frequency signals to the overvoltage protection circuit and other devices, filtering out high-frequency components, and carrying out frequency-selecting and gain controllable amplification on the signals through the primary amplifying circuit, the narrow-band filtering frequency-selecting circuit, the automatic gain control circuit and the secondary amplifying circuit in sequence. The partial discharge work frequency synchronization signal sensing device is capable of breaking away from the mains supply, and has the advantages of being safe, high in receiving sensitivity, small in phase errors with the work frequency signals, simple in operation, and capable of being used for providing reliable and stable synchronous trigger signals for partial discharge signal collection.

Methods for fabricating and testing integrated circuit devices and systems. The integrated circuit device generally includes two semiconductor dies. The first die has little or no I / O or ESD protection, and the second die includes at least one exposed terminal in electrical communication with one or more terminals on the first die, at least one I / O circuit in electrical communication with one or more terminals on the second die, and at least one I / O terminal in electrical communication with the I / O circuit(s). The method of forming an integrated circuit includes aligning at least one of the exposed terminals on the first die with at least one of the exposed terminals on the second die, and forming at least one electrical junction between them such that the exposed terminal(s) on the first die is / are in electrical communication with an I / O circuit and an I / O terminal on the second die. The method of testing a semiconductor die includes placing the semiconductor die into a predetermined position for testing, placing a tester probe tip in contact with a subset of the exposed terminals on the first die, the probe head having an ESD protection structure in electrical communication with the probe tip, and testing the die.

The invention discloses an automatic test system and method for interphase and phase-to-ground insulation PDIV of frequency-variable motors, including a control module, a frequency-variable power supply, a high-voltage probe, a high-voltage switch assembly, a signal conditioning circuit, a host computer, and an output The sensor connected to the signal conditioning circuit, the transformer connected to the output end of the variable frequency power supply, and the variable frequency motor connected to the output end of the transformer through the high voltage switch assembly; the input end of the high voltage probe is connected to the output end of the transformer; the One end of the high-voltage switch assembly is connected to the output end of the transformer, and the other end is connected to the grounding casing and three-phase winding of the variable frequency motor at the same time. The present invention realizes the test of PDIV between all insulations by controlling the opening and closing states of each high-voltage switch. Sudden insulation breakdown accidents occur and prolong the service life of the motor.

The invention relates to a protective device for the short current of alternating current circuit, and a detecting method thereof, wherein, the device comprises a current collecting unit, a voltage signal amplifying unit, a filtering unit, a comparator unit and a signal output unit which are sequentially connected. The detecting method comprises the following steps of: 1. collecting transient current generated by alternating current voltage source due to short circuit; 2. converting the transient current into a voltage signal, then amplifying the voltage signal and carrying out filtering processing to the voltage signal; 3. comparing the voltage signal after filtration with reference power supply; and 4. outputting an abnormal signal when the voltage signal is larger than the reference voltage of the reference power supply. In the technical proposal of the invention, when the protective device for the short current of voltage circuit is accessed into the voltage circuit with large power, the short circuit of voltage can be timely and accurately judged, time for manual fault point inspection can be saved, the aim of high efficiency and time-saving can be achieved, furthermore, the device has simple structure, convenient wiring and stable and reliable performance.

A differential measurement probe has spring loaded, double cushioned probe assemblies and a pressure sensors disposed in a housing. The pressure sensors forms an electrical switch having an electrical AND function for passing an activation signal to a EOS / ESD protection control module in response to axial movement of the housing relative to the probe assemblies. First compressive elements produces first pre-loaded compressive forces and increasing compressive forces on the probe assemblies and second compressive elements produces second pre-loaded compressive forces and increasing compressive forces on the probe assemblies subsequent to the first increasing compressive forces on the probe assemblies. An adjustment member allows variable spacing of the differential probing tips.

The present invention discloses a high-precision weak signal tester and a high-precision weak signal test method which are suitable for the signal analysis and processing, and belong to the signal detection and processing field. A weak signal is a current signal of which the frequency is 30 Hz or less, and the amplitude Ipp is 10 pA or less. The high-precision weak signal tester disclosed by the present invention comprises a prepositive current-voltage conversion circuit module, a first-stage amplification circuit module, a voltage follower circuit module, a second-stage amplification and low-pass filtering circuit module, a signal reverse amplification circuit module and a protection circuit module. The present invention also discloses the high-precision weak signal test method based on the tester. The high-precision weak signal tester and the high-precision weak signal test method provided by the present invention are high in precision, low in noise and cost and simple in operation, can detect the ultra-low frequency weak signals with the high precision to record the signals and process the data, thereby improving the signal detection and processing precision.

The invention belongs to the technical field of short-circuit over-current protection, and provides a mass production test device and a short-circuit current foldback circuit of the mass production test device. According to the mass production test device and the short-circuit current foldback circuit of the mass production test device, due to the fact that the short-circuit current foldback circuit which comprises a switch module, a microprocessor, a short-circuit protection module and a current detection module is adopted, when a tested unit is short-circuited, the short-circuit protection module correspondingly leads output current of the switch module to a ground terminal of a direct-current power source according to voltage of the loop output end of the current detection module; when over-current exists in a test loop of the tested unit, the current detection module correspondingly outputs an input end abnormity signal and / or a loop end abnormity signal to drive the microprocessor to give out a disconnection signal so as to control the switch module to rapidly disconnect a current path according to current of the input end and / or the loop end of the tested unit, rapid short-circuit over-current protection for the tested unit and a test circuit is achieved in the test process, the situation that the tested unit and the test circuit are not damaged is ensured, and production efficiency is further improved.

The invention provides an electrical signal frequency detection method and device. The detection method comprises that a zero crossing point of a detected electrical signal is detected; whether the interval, obtained by detection, of the zero crossing point is greater than a set threshold is determined, and if yes, the frequency of the detected electrical signal is determined according to the interval of the zero crossing point; and otherwise, the detected electrical signal is filtered, and the frequency of the filtered signal is determined. The method and device can rapidly detect the frequency of the detected signal when interference is not strong, and a filtering detection manner is automatically switched to when interference is relatively strong; and thus, the interference resistance is high.

The invention relates to a radiation-resistant 100-V high-precision current detection circuit comprising a precision resistor RS, a current detection chip U1 and a voltage differential amplifier U2. One end of the precision resistor RS is connected with a bus voltage and the other end is connected with a load. A power terminal of the current detection chip U1 is connected with a floating voltage Va and a floating voltage Vb, wherein the a floating voltage Va is higher than the floating voltage Vb. An input terminal of the current detection chip U1 is connected with the two ends of the precision resistor RS; a positive-phase input terminal of the voltage differential amplifier U2 is connected with an output terminal of the current detection chip U1, a negative-phase input terminal is connected with the floating voltage Vb, and an output terminal of the voltage differential amplifier U2 serves as an output terminal of the circuit to output a detection signal. On the basis of the floating design, a radiation-resistant current monitoring device and a high-common-mode differential amplifier are arranged in cascade connection; the precision resistor RS is arranged to carry out precise sampling on the voltage; targeted processing is carried out from the input terminal, the power supply terminal, and the processing terminal; and thus high-precision current detection is realized based on mutual cooperation.

The invention discloses a metering-type intelligent circuit breaker based on internet of things. The circuit breaker comprises a CPU (Central Processing Unit) module, a signal acquisition module, a metering module, a power module, a mechanical control module, a communication module and an input / output module, wherein the metering module comprises a metering chip; the power source module comprisesa self-generated power loop unit; the communication module comprises a wired 485 communication unit and a wireless internet of things communication module; the mechanical control module comprises a control signal output unit and an equipment signal feedback input unit; and the input / output module comprises a key unit and a display unit. The voltage signal in the circuit is converted by the power module into a signal that can be collected by the metering chip, and the signal is sent to the metering module; not only the requirements such as high precision metering, rapid protection action and reliable fault detection are implemented, but also the direct docking of data and the remote terminal is implemented, thereby greatly increasing the remote-controlled spatial distance, and improving thestatistical and deployment speed of the grid data.