The invention relates to the field of
chip packaging testing, in particular to a BGA
chip packaging testing method. The method comprises the following steps: carrying out full-flow thermal imaging scanning on a BGA
chip packaging process, carrying out space
temperature gradient diffusion distribution analysis, and constructing a temperature
diffusion distribution map of each region; according to the
probe array, acoustic scanning is carried out on the BGA chip
solder ball contact surface, abnormal
frequency detection is carried out, and abnormal acoustic nodes are marked; performing
transient temperature mutation detection and potential packaging defect positioning analysis on the temperature
diffusion distribution map based on abnormal acoustic nodes, and extracting a potential packaging defect area; and carrying out multi-threshold micro-vibration excitation on the potential packaging defect area, carrying out comprehensive evaluation on the reliability of the defect area structure, and generating a reliability evaluation report of the
solder ball contact
surface structure. According to the invention, accurate packaging
test failure prediction is realized, packaging process parameters are optimized, and chip packaging quality and stability are improved.