8568 results about "Manufacturing cost reduction" patented technology

A solar cell assembly including a plurality of solar cells is formed on a common substrate, and a DC/DC converter which converts the output from the solar cell is connected to each solar cell to constitute a solar power generation apparatus. The output from the solar power generation apparatus is converted into an AC power by an inverter and supplied to a load or commercial AC power system. Since the arrangement is simplified, the manufacturing cost can be reduced, and the influence of partial shade or a variation in characteristic decreases.

As a display device has a higher definition, the number of pixels, gate lines, and signal lines are increased. When the number of the gate lines and the signal lines are increased, a problem of higher manufacturing cost, because it is difficult to mount an IC chip including a driver circuit for driving of the gate and signal lines by bonding or the like. A pixel portion and a driver circuit for driving the pixel portion are provided over the same substrate, and at least part of the driver circuit includes a thin film transistor using an oxide semiconductor interposed between gate electrodes provided above and below the oxide semiconductor. Therefore, when the pixel portion and the driver portion are provided over the same substrate, manufacturing cost can be reduced.

Technology to reduce the manufacturing cost of a manufacturing process of a light emitting device is provided. The manufacturing cost of a device using a light emitting element can be reduced by using a multilayout process for forming a plurality of light emitting devices from a large-sized substrate. In particular, an existing line for manufacturing liquid crystal cells can be diverted to a process of encapsulating light emitting elements, which can greatly reduce the manufacturing cost including the investment in plant and equipment.

A device isolation film and an active region are formed on a semiconductor substrate, using a first mask pattern to expose only a formation region of the device isolation film. Only the device isolation film is selectively etched by using the first mask pattern and a second mask pattern as an etch mask, to form a fin only on a gate formation region, the second mask pattern to expose only a gate electrode formation region. A gate insulation layer is formed on both sidewalls of the fin and a gate electrode covering the first mask pattern and the gate insulation layer is formed. Source and drain regions are formed on the remaining portion of the active region where the gate electrode was not formed. Gate electrode separation becomes adequate and manufacturing costs can be reduced.

An integrated drive system assembly is provided that combines an electric motor, a power inverter assembly and a gearbox into a single, multi-piece enclosure. Combining these components into a single enclosure reduces weight, reduces drive system complexity, reduces system volume, simplifies assembly integration into an electric vehicle, reduces manufacturing cost, allows the flexible and lengthy electrical cables between the power inverter and the electric motor to be replaced with short, low loss, rigid bus bars, and simplifies component cooling by allowing the use of a common thermal management system. The common thermal management system includes a liquid coolant loop that is thermally coupled to the electric motor, the power inverter assembly and the gearbox.

The object of the present invention is to provide a blower including a bearing structure wherein the number of components is reduced, the cost for manufacturing can be reduced, and the diameter of the shaft can be increased. The bearing structure is good at its durability, eliminates or reduces the rotational run out, and provides superior quietness. The blower of the present invention having an impeller adapted to be rotated upon energizing the blower comprising; a bearing device for supporting a rotational center portion of the impeller, the bearing device including; a sleeve, a stepped shaft including a larger diameter portion and a reduced diameter portion provided at one end thereof, the first inner raceway groove formed at an appropriate position around the outer peripheral surface of the larger diameter portion, the first outer raceway groove formed on an inner peripheral surface of the sleeve so as to correspond with the first inner raceway groove, balls of the first row interposed between the first and second grooves, an inner ring slidably fit over the reduced diameter portion, the second inner raceway groove formed around an outer peripheral surface of the inner ring, the second outer raceway groove formed on the inner peripheral surface of the sleeve so as to correspond with the second inner raceway groove, balls of the second row interposed between the second inner and outer raceway grooves, a stop ring provided around the inner periphery of the distal end of the reduced diameter portion, and a pre-loading spring interposed between the stop ring and an end surface of the inner ring to provide a suitable amount of pre-loading force to the inner ring.

An intravascular ultrasound probe is disclosed, incorporating features for utilizing an advanced transducer technology on a rotating transducer shaft. In particular, the probe accommodates the transmission of the multitude of signals across the boundary between the rotary and stationary components of the probe required to support an advanced transducer technology. These advanced transducer technologies offer the potential for increased bandwidth, improved beam profiles, better signal to noise ratio, reduced manufacturing costs, advanced tissue characterization algorithms, and other desirable features. Furthermore, the inclusion of electronic components on the spinning side of the probe can be highly advantageous in terms of preserving maximum signal to noise ratio and signal fidelity, along with other performance benefits.

A charging apparatus used with a mobile robot has an improved charging structure so that a mobile robot is easily brought into electrical contact with a charging unit, thereby reducing manufacturing costs and preventing a charging failure. The charging unit is provided with a plurality of charging terminals which are brought into electrical contact with corresponding ones of contact terminals of the mobile robot. Each of the charging terminals includes a body and a head. A contact plate is mounted to a predetermined portion of the head to be brought into electrical contact with a corresponding one of the contact terminals.

The invention relates to an integrated optical sensor package. The integrated optical sensor package comprises a package substrate, an ambient light sensor, a proximity optical sensor, an image sensor and a package cover, wherein the package substrate is positioned at the bottom; the ambient light sensor, the proximity optical sensor and the image sensor are arranged on the package substrate; and the package cover is mutually sealed with the package substrate so that a package housing is formed. The integrated optical sensor package provided by the invention can reduce the package volume and reduce the manufacturing cost.

An organic light emitting display capable of reducing the manufacturing cost and displaying images with uniform brightness. The organic light emitting display includes: a data driver for supplying a plurality of data signals to a plurality of first data lines, respectively; an image display portion having a plurality of second data lines, a plurality of scan lines, and a plurality of pixels; and a demultiplexer having a plurality of data transistors arranged in the respective first data lines to supply the plurality of data signals supplied to the first data lines to the plurality of second data lines, and a plurality of capacitors connected between respective gate terminals of the plurality of data transistors and the second data lines.

This invention provides a semiconductor package and a method for fabricating the same. The method includes: forming a first resist layer on a metal carrier; forming a plurality of openings penetrating the first resist layer; forming a conductive metal layer in the openings; removing the first resist layer; covering the metal carrier having the conductive metal layer with a dielectric layer; forming blind vias in the dielectric layer to expose a portion of the conductive metal layer; forming conductive circuit on the dielectric layer and conductive posts in the blind vias, such that the conductive circuit is electrically connected to the conductive metal layer via the conductive posts; electrically connecting at least one chip to the conductive circuit; forming an encapsulant for encapsulating the chip and the conductive circuit; and removing the metal carrier, thereby allowing a semiconductor package to be formed without a chip carrier. Given the conductive posts, both the conductive circuit and conductive metal layer are efficiently coupled to the dielectric layer to prevent delamination. Further, downsizing the blind vias facilitates the fabrication process and cuts the fabrication cost.

Disclosed herewith an image display device capable of displaying high quality images and preferred for reducing the manufacturing cost. The image display device is provided with illuminating state controlling state for controlling the illuminating state or non-illuminating state and constant voltage supply for supplying a constant voltage to each pixel through a signal line when the illuminating state is selected for the pixel.

To provide an electro-optic apparatus which can directly control alternating current, output significantly high-frequency alternating current, stably output a large amount of power, and reduce manufacturing cost, as well as a TFT substrate for current control and the method for producing the same.

A dispersion-type inorganic EL display apparatus 1c as an electro-optic apparatus is provided with a data line-driving circuit 11, a scanning line-driving circuit 12, a power supply line-controlling circuit 13a, a current-measuring circuit 15 and a TFT substrate 100c.