Integrated optical sensor package

An integrated light and ambient light sensor technology, which is applied in the direction of electric solid-state devices, semiconductor devices, semiconductor/solid-state device components, etc., can solve the problems of high manufacturing cost and large sensor packaging volume, so as to reduce production cost and simplify the process Preparation, volume reduction effect

Active Publication Date: 2014-01-15
GALAXYCORE SHANGHAI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The technical problem to be solved by the present invention is to provide an integrated photosensor package, which can solve the problems of large volume and high manufacturing cost of existing sensor packages

Method used

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Embodiment Construction

[0032] The technical solutions adopted by the present invention in order to achieve the purpose are further described below in conjunction with the accompanying drawings and the embodiments of the present invention.

[0033] The present invention provides an integrated photosensor package, comprising:

[0034] The package substrate at the bottom;

[0035] An ambient light sensor, a proximity light sensor, and an image sensor located on the packaging substrate;

[0036] The package cover is sealed with the package substrate to form a package case.

[0037] In an embodiment of the present invention, the integrated photosensor package further includes an infrared light emitter located in the package housing. In addition, the infrared light transmitter includes an infrared LED and a driving circuit.

[0038] Further, there are lenses above the infrared light emitter, the ambient light sensor, the proximity light sensor and the image sensor respectively. In the manufacturing pr...

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Abstract

The invention relates to an integrated optical sensor package. The integrated optical sensor package comprises a package substrate, an ambient light sensor, a proximity optical sensor, an image sensor and a package cover, wherein the package substrate is positioned at the bottom; the ambient light sensor, the proximity optical sensor and the image sensor are arranged on the package substrate; and the package cover is mutually sealed with the package substrate so that a package housing is formed. The integrated optical sensor package provided by the invention can reduce the package volume and reduce the manufacturing cost.

Description

technical field [0001] The present invention relates to a sensor package, in particular to a package integrating an ambient light sensor, a proximity sensor and an image sensor. Background technique [0002] In recent years, with the popularity of notebooks and smart phones and the development of 3G, ambient light sensors, proximity sensors and image sensors have been rapidly promoted. The ambient light sensor can detect the brightness of the ambient light, and based on this, automatically adjust the brightness of the display backlight to reduce the power consumption of the product and achieve the purpose of green energy saving and product intelligence. The proximity sensor can detect that the user puts the mobile phone close to the ear and starts to make a call. At this time, the backlight of the mobile phone can be turned off to achieve the purpose of saving energy and preventing misuse. Image sensors in laptop cameras and smartphone front-facing cameras are used for thin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/16H01L23/31H01L23/552
Inventor 李翔赵立新
Owner GALAXYCORE SHANGHAI
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