The present invention relates to the field of
semiconductor technology, and particularly relates to an optoelectronic
chip packaging structure, comprising: a substrate, on the upper surface of which a
signal transmission layer is provided, and on the
signal transmission layer a
signal processing layer is provided; the signal transmission layer includes: a first electrical
chip, which has a first surface and a second surface, and the first surface faces the substrate, and the second surface faces the
signal processing layer; the
signal processing layer includes: a signal conversion area and a data
storage area; a
photonic chip is correspondingly arranged in the signal conversion area, and the
photonic chip includes: N*M
photon computing units, and each
photon computing unit includes: an optical
waveguide layer, and a modulation layer located on the optical
waveguide layer, and the modulation layer is a
phase change material layer or the modulation layer includes a
phase change material layer; a second electrical
chip is correspondingly arranged in the data
storage area, which is used for receiving and storing calculation data. The present invention solves the problems of high preparation difficulty and poor heat dissipation performance of the existing packaging structure.