The invention discloses a micro-channel type cooling method which is mainly applied to the field of cooling of packaging boards integrating with multiple high-power chips. According to the micro-channel type cooling method, heat sources integrated on a substrate are respectively provided with a temperature sensor, the temperature sensors are connected with an external controller, a cooling plate with liquid flow channels is arranged above the substrate integrated with the multiple heat sources in a covering mode, and the controller controls the starting and stopping of a turbine pump and fans according to data collected by the temperature sensors; if the power of the heat sources is stable, the number of micro-channels is set properly according to the power of the heat sources, a main flow channel is provided with a regulating valve which is controlled by the controller, and thus the flow of liquid is regulated; if the power of the heat sources is changeable, the flow channels are evenly distributed, a flow electromagnetic valve controlled by the controller is arranged at the bifurcation between the main cooling flow channel and each heat source micro-flow-channel, flow distribution of each power device is regulated according to actual working conditions, and thus the multiple heat sources can be cooled stably and efficiently, and the cooling capacity can be adjusted.