Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Micro-channel type cooling method

A heat dissipation method and micro-channel technology, applied in the field of heat transfer, can solve the problems of low heat dissipation efficiency, single heat source, fixed heat dissipation of the radiator, etc., and achieve the effect of adjustable heat dissipation

Inactive Publication Date: 2014-05-28
UNIV OF ELECTRONICS SCI & TECH OF CHINA
View PDF11 Cites 51 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to design a microchannel heat dissipation method for the deficiencies of the prior art, to overcome the defects of fixed heat dissipation, low heat dissipation efficiency, and only applicable to a single heat source in the current radiator, so as to achieve stable and efficient heat dissipation for multiple heat sources. tuned cooling purpose

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Micro-channel type cooling method
  • Micro-channel type cooling method
  • Micro-channel type cooling method

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0019] figure 2 and image 3 , is a preferred embodiment of the heat dissipation device of the present invention. Take this device working on a multi-chip circuit board as an example. The multi-chip board has 4 heat sources such as figure 1 As shown, the power of heat source 1 is 100W, the power of heat source 2 is 90W, the power of heat source 3 is 80W, the power of heat source 4 is 70W, and the area of ​​the four heat sources is 35mm×35mm, all of which are surface heat sources. The heat dissipation system includes a base, which is made of integral precision casting of aluminum, with a size of 140mm×140mm and a thickness of 2mm. A voltage-type temperature sensor is embedded in the base, the temperature detection range is 0-150°C, and it is connected with an external control unit. Prepared by mechanical processing methods on the substrate such as figure 2 For the multiple groups of micro-channels shown, the processing depth of the channels is 1 mm, and the width is 1 mm...

example 2

[0024] When the working condition of the heat source device may change, such as Figure 4 shown in the flow path instead of image 3 The structure of the heat dissipation channel shown in the figure, that is, the structure of the microchannel remains unchanged, and the thermal control method uses sensors to collect temperature and feed it back to the controller. The controller sends different signals to each flow control valve to control the flow rate according to the temperature. Such as Figure 4 As shown in , the size and number of parallel flow channels are consistent, which can adapt to various heat dissipation conditions. At the same time, in order to adjust the heat dissipation efficiency of each heat dissipation area to be consistent with the corresponding heat source. In order to adjust the heat dissipation efficiency of each heat dissipation area, this equipment is equipped with an adjustable flow solenoid valve at the position marked 16, which can control the flow...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a micro-channel type cooling method which is mainly applied to the field of cooling of packaging boards integrating with multiple high-power chips. According to the micro-channel type cooling method, heat sources integrated on a substrate are respectively provided with a temperature sensor, the temperature sensors are connected with an external controller, a cooling plate with liquid flow channels is arranged above the substrate integrated with the multiple heat sources in a covering mode, and the controller controls the starting and stopping of a turbine pump and fans according to data collected by the temperature sensors; if the power of the heat sources is stable, the number of micro-channels is set properly according to the power of the heat sources, a main flow channel is provided with a regulating valve which is controlled by the controller, and thus the flow of liquid is regulated; if the power of the heat sources is changeable, the flow channels are evenly distributed, a flow electromagnetic valve controlled by the controller is arranged at the bifurcation between the main cooling flow channel and each heat source micro-flow-channel, flow distribution of each power device is regulated according to actual working conditions, and thus the multiple heat sources can be cooled stably and efficiently, and the cooling capacity can be adjusted.

Description

Technical field: [0001] The invention relates to a heat dissipation method of a micro-flow channel, which belongs to the field of heat transfer and is applied to the field of heat dissipation integrated with a plurality of high-power chip packaging boards. Background technique: [0002] In recent years, with the development of microelectronics technology and electronic packaging technology, especially the continuous improvement of integrated circuits and device integration, the operating speed and output power of various electronic components have been continuously improved. Since high-power electronic components generate more heat, and high-density packaging distributes this heat on a smaller surface, it poses a great threat to the reliability of electronic components, and effective heat dissipation for electronic components is required. [0003] At the present stage, the liquid cooling method is aimed at a single heat source, and the use of microchannel heat sinks for high...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/473H01L23/367F28D15/04
Inventor 徐尚龙郭宗坤郭威
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com