6941results about "Thermometers using electric/magnetic elements" patented technology

A system and method for measuring thermal distributions of an electronic device during operation is disclosed. The system includes an electronic device, a heat sink adjacent to the electronic device and an electrical-insulating layer disposed on the electronic device so as to separate the electronic device and the heat sink. The system further includes a plurality of thermal sensors located on the electrical-insulating layer, each of the plurality of thermal sensors in a different location. The plurality of thermal sensors is located within one or more thin film circuit layers disposed adjacent to the electrical insulating layer. The system further includes a module for receiving thermal information from the plurality of thermal sensors during operation of the electronic device. The system further includes a processor coupled to the module for generating a thermal distribution of the electronic device based on the thermal information received from the plurality of thermal sensors.

Support structures for positioning sensors on a physiologic tunnel for measuring physical, chemical and biological parameters of the body and to produce an action according to the measured value of the parameters. The support structure includes a sensor fitted on the support structures using a special geometry for acquiring continuous and undisturbed data on the physiology of the body. Signals are transmitted to a remote station by wireless transmission such as by electromagnetic waves, radio waves, infrared, sound and the like or by being reported locally by audio or visual transmission. The physical and chemical parameters include brain function, metabolic function, hydrodynamic function, hydration status, levels of chemical compounds in the blood, and the like. The support structure includes patches, clips, eyeglasses, head mounted gear and the like, containing passive or active sensors positioned at the end of the tunnel with sensing systems positioned on and accessing a physiologic tunnel.

A temperature measuring device and a temperature measuring method are provided which are capable of obtaining precise measured temperature values with respect even to old persons, sucklings or infants, which device may be formed into a disposable type according to need, which method may be carried out using such a disposable type device according to need, and which enable precise temperature measurement in real time. An on-subject temperature measuring device 1, which is attached to a subject when a temperature of the subject is measured, receives a radio wave from a reader 2 as an external device and is thereby electrically powered. Using the electric power, temperature measurement is performed in the on-subject temperature measuring device 1. The results of the measurement are transmitted through radio waves to the reader 2 in the form of a temperature of the subject and ID data. The reader 2 is so constructed as to be connectable to a personal computer (not shown), and data processing by the personal computer is performed according to need.

A remotely programmable integrated sensor transmitter device for measuring and reporting a physical quantity of a given medium comprises a sensor for measuring a physical quantity of a medium and providing an electrical output as a function of the property measured, a scaler module for receiving the electrical output and for producing a scaled analog signal as a function of the physical quantity and a scale selection input, and a data interface for receiving programming data from an external computer and for providing the scale selection output to the scaler module.

A method for fabricating a thermocouple capable of long-term operation in high temperature, hostile environments without significant signal degradation or shortened thermocouple lifetime due to heat induced brittleness.

An apparatus for processing a substrate. The apparatus comprising a tubular member with a first end and a second end. The first end comprising an opening; and a temperature sensor disposed in the opening. The temperature sensor comprising a resilient member. The resilient member comprising a surface made of a ceramic material wherein the surface made of a ceramic material extends through the opening to provide a substrate contact surface.

A thermocouple for measuring temperature at a position adjacent to a substrate being processed in a chemical vapor deposition reactor is provided. The thermocouple includes a sheath having a measuring tip. The thermocouple also includes a support tube disposed within the sheath. The thermocouple further includes first and second wires supported by the support tube. The first and second wires are formed of different metals. A junction is formed between the first and second wires, wherein the junction is located adjacent to a distal end of the support tube. A spring is disposed about a portion of the support tube. The spring is compressed to exert a spring force on the support tube to bias the junction against the measuring tip to maintain the junction in continuous contact with the measuring tip. The spring force is small enough to prevent significant deformation of the junction as well as reducing variation of spring force or junction location from one thermocouple to another.

A thermocouple having a support tube configured to receive a pair of wires of dissimilar metals. The pair of wires of the thermocouple connected at a junction adjacent to one end of the support tube. The thermocouple further including a cap attached to the opposing end of the support tube, wherein the cap receives the free ends of the pair of wires. The cap allowing the pair of wires to translate freely therethrough to accommodate the difference in thermal expansion and contraction of the pair of wires relative to the thermal expansion and contraction of the support tube.

A thermocouple for use in a semiconductor processing reactor is described. The thermocouple includes a sheath having a measuring tip at one end and an opening at the other end. A support member having bores formed along the length is disposed within the sheath. A pair of wires formed of dissimilar metals are disposed within the bores, and one end of the wires is fused together to form a junction. The wires extend along the length of the bores. As the wires exit the bore, they are spatially or physically separated to prevent a short circuit therebetween. The ends of the wires exiting the bore are also free to thermally expand in the longitudinal manner, thereby reducing or eliminating the potential for the wires to fail due to grain slip.

A data storage system and method capable of reducing the operating temperature of the data storage system, removing any overheating storage devices from operation, reconstructing data, and evacuating data from the overheating storage devices before the devices and the data are damaged or lost.

A temperature sensor (10) includes: a temperature-sensing portion for measuring a temperature of an object (50) by contacting the object; and a supporting portion for supporting the temperature-sensing portion from a side opposite to a contact surface, the supporting portion having a space at a portion partially corresponding to the temperature-sensing portion. A temperature controller includes: a temperature control device; the temperature sensor (10) for measuring the temperature by contacting the object (50); and a controller for controlling the temperature control device. The controller includes: a mounting-state judging means for judging a mounting-state of the object (50); a switching means for switching a control gain and a target temperature of the temperature control device based on the judging result; and a control-command generating means for generating a control command based on the control gain, the target temperature and a measurement value of the temperature sensor (10).

A thermocouple for use in a semiconductor processing reaction is described. The thermocouple includes a sheath having a measuring tip and an opening at the opposing end. A support member that receives a portion of a first wire and a second wire is received within the sheath. The first and second wires form a junction that contacts the inner surface of the sheath at the measuring tip. A spacing member is secured at the opening of the sheath and receives the support member. The spacing member allows the support member, first wire, and second wire to freely thermally expand relative to each other without introducing compression or tension stresses therein.

Systems and methods are provided for determining data center cooling and power requirements and for monitoring performance of cooling and power systems in data centers. At least one aspect provides a system and method that enables a data center operator to determine available power and cooling at specific areas and enclosures in a data center to assist in locating new equipment in the data center.

Methods and systems for calibrating a temperature control system in a vapor deposition chamber. A temperature sensor senses temperature within a semiconductor processing chamber and generates an output signal. A temperature control system controls a chamber temperature by controlling a heating apparatus based on the output signal. A method includes instructing the control system to target a setpoint temperature, and depositing a layer of material onto a surface in the chamber by a vapor deposition process. A variation of a property of the layer is measured while depositing the layer, the property known to vary cyclically as a thickness of the layer increases. The measured property is allowed to vary cyclically for one or more cycles. If there is a difference between a time period of one or more of the cycles and an expected time period associated with the setpoint temperature, the temperature control system is adjusted based on the difference.

A radiant shield and a furnace employing a radiant shield for controlled heating and treatment of material using infrared radiation. The furnace is capable of improved temperature control where material treated by the furnace may interfere with the quality of a measured temperature signal and temperature control based on that signal.

Aspects of the invention are directed to systems and methods for designing and analyzing data centers. One aspect is directed to a method of determining cooling characteristics of a data center. The method includes receiving data related to a configuration of equipment in the data center, identifying rack clusters in the configuration of equipment, and determining a capture index for at least one equipment rack of at least one rack cluster.

Temperature gauge, and ceramic susceptors and semiconductor manufacturing equipment utilizing the temperature gauge, in which the thermocouple may be easily replaced even if damaged, and in which heat from the temperature-gauging site is readily transmitted to the temperature-gauging contact, shortening time until the measurement temperature stabilizes. A temperature-gauging contact (12) in the tip of the thermocouple contacts, in an exposed-as-it-is state, a temperature-gauging site on a ceramic susceptor (1), and by means of a circular cylindrical-shaped retaining member (11) screwed into female threads in the ceramic susceptor (1) is detachably pressed upon and retained against the ceramic susceptor. Thermocouple lead lines (13), passing through a through-hole (14) in the retaining member (11), stretch from one end face to the other end face thereof. The retaining member may be provided with a flange having threaded holes and screwlocked into female screws in the ceramic susceptor.

Systems and methods for reducing the number of temperature measurement wires in multiple temperature sensor ablation systems are described. In a preferred embodiment, temperature sensors capable of measuring the temperature of body tissue and transmitting the temperature data digitally are incorporated in a catheter or probe ablation system that also includes electrodes in operative contact with the sensors. The sensors are connected in parallel to a common electrical bus, thereby allowing the system to operate using a reduced number of electrical paths as compared to conventional ablation systems. The present invention is also directed to ablation systems that incorporate analog sensors rather than digital sensors. In this embodiment, the system utilizes digital switching, filtering circuits, or oscillators to reduce the number of wires required to operate the sensors.

A medical diagnostic instrument includes at least one blood oxygen saturation sensor and at least one temperature sensor. The sensors are being capable of measuring blood oxygen saturation and temperature simultaneously after insertion of a probe portion of the instrument relative to a defined body site, such as the axilla, rectum, or sublingual pocket of a patient. At least a portion of the probe portion of the instrument is disposable.

An integrated circuit system has a reference data table for holding information that is used to control at least one circuit block in the system and also has a power supply circuit, a body bias control circuit, a clock delivery circuit, a temperature monitor circuit, and/or a configuration control circuit. The performance of the system is improved by obtaining system performance data by testing the system at different supply voltages, different body-bias voltages, different clock speeds, and/or different temperatures. Values based on the data are entered into the reference data table. The power supply circuit, the body bias control circuit, the clock delivery circuit, and/or the temperature monitor circuit data is adjusted using the entered values.

The present invention provides a device and method which enables the identification of a change in a predetermined condition. The device comprises a fabric material to which is coupled a transitional substance. The transitional substance is configured in order that a change in a predetermined condition, results in an identifiable change in the transitional substance.

A method is provided for facilitating installation of one or more electronics racks within a data center. The method includes: placing a plurality of thermal simulators in the data center in a data center layout to establish a thermally simulated data center, each thermal simulator simulating at least one of airflow intake or heated airflow exhaust of a respective electronics rack of a plurality of electronics racks to be installed in the data center; monitoring temperature within the thermally simulated data center at multiple locations, and verifying the data center layout if measured temperatures are within respective acceptable temperature ranges for the data center when containing the plurality of electronics racks; and establishing the plurality of electronics racks within the data center using the verified data center layout, the establishing including at least one of reconfiguring or replacing each thermal simulator with a respective electronics rack.

A thermocouple measuring circuit for sensing a temperature at a measuring point is provided. The thermocouple measurement circuit (12) includes a thermocouple input for sensing a temperature at a measuring point, a compensation circuit (14) for compensating thermocouple effects of junctions of the thermocouple, and an instrumentation amplifier (16) for summing an output of the thermocouple and an output of the compensation circuit and outputting a voltage indicative of the temperature sensed, wherein the output of the compensation circuit is a reference voltage for the output of the instrumentation amplifier. Various embodiments of the thermocouple measurement circuit may be employed in electrosurgical generators for controlling output power dependent on temperature conditions.

A double temperature sensor is provided for measuring a near-surface temperature of the ambient air and the temperature of the skin surface (9). A heat flux insulation block (4) is made of an insulation material in one piece as a housing. Two temperature sensor elements (2, 3) with respective electric connections (6) belonging to them are arranged in the heat flux insulation block (4) one on top of another at spaced locations from one another and near the surface.

An electricity generating based on the difference in temperature electronic pan with a semiconductor refrigeration slice is provided. The electronic pan comprises a pan body, a handle, an electricity generating based on the difference in temperature unit and a temperature measuring unit. The electricity generating based on the difference in temperature unit is composed of a semiconductor refrigeration slice, a voltage increased and regulated electronic module and an energy storage unit. The temperature measuring unit is composed of a temperature sensor, a microprocessor, a circuit board and a liquid crystal display for displaying temperature. The temperature sensor is provided under the pan body directly. The circuit board is provided inside the chamber of the handle. The semiconductor refrigeration slice connected to the pan body is provided inside the chamber at the connection of the handle and the pan body. The other surface of the semiconductor refrigeration slice is contacted with metal heat exchange slices firmly. The electricity generating based on the difference in temperature unit, the temperature measuring unit and the liquid crystal display are connected to the circuit board, respectively.

A programmable system-on-a-chip integrated circuit device comprises a programmable logic block, a non-volatile memory block, an analog sub-system, an analog input/output circuit block, and a digital input/output circuit block. A programmable interconnect architecture includes programmable elements and interconnect conductors. Ones of the programmable elements are coupled to the programmable logic block, the non-volatile memory block, the analog sub-system, the analog input/output circuit block, the digital input/output circuit block, and to the interconnect conductors, such that inputs and outputs of the programmable logic block, the non-volatile memory block, the analog sub-system, the analog input/output circuit block, and the digital input/output circuit block can be programmably coupled to one another.

A method and system for identifying a trend in data of heat maps. An initial set of comparison heat maps included in the repository is determined and displayed based on how closely initial comparison area(s) of each comparison heat map match initial target area(s) of a first heat map. A review of the initial set of comparison heat maps determines additional comparison area(s) corresponding to additional target area(s) of the first heat map. In an iterative process, an additional set of comparison heat maps is determined and displayed based on how closely initial and additional comparison areas match respective initial and additional target areas of the first heat map. A trend relating initial and additional target areas is identified based on the displayed additional set of comparison heat maps and based on how closely comparison areas match their respective target areas.

There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a compensated microelectromechanical oscillator, having a microelectromechanical resonator that generates an output signal and frequency adjustment circuitry, coupled to the microelectromechanical resonator to receive the output signal of the microelectromechanical resonator and, in response to a set of values, to generate an output signal having second frequency. In one embodiment, the values may be determined using the frequency of the output signal of the microelectromechanical resonator, which depends on the operating temperature of the microelectromechanical resonator and/or manufacturing variations of the microelectromechanical resonator. In one embodiment, the frequency adjustment circuitry may include frequency multiplier circuitry, for example, PLLs, DLLs, digital/frequency synthesizers and/or FLLs, as well as any combinations and permutations thereof. The frequency adjustment circuitry, in addition or in lieu thereof, may include frequency divider circuitry, for example, DLLS, digital/frequency synthesizers (for example, DDS) and/or FLLs, as well as any combinations and permutations thereof.

Sensor for detecting a physical or chemical quantity, comprising a defect controlled nanotube. The sensor can be produced by post treating a nanotube with sufficient energy to modify at least one of density and type of defects in the nanotube, and associating the nanotube with a circuit capable of providing an output signal based upon change of electrical characteristic of the nanotube in response to stimulus of the nanotube.

A monitoring system particularly useful for monitoring food located at one or a plurality of food serving or storage location includes a sensing subsystem and a processing subsystem. The sensing subsystem may include at least one sensing device and the processing subsystem may include a personal computer. The processing subsystem may be adapted to encrypt received data to the end that data stored in memory is substantially impervious to data tampering.