16282results about "Thermometers using electric/magnetic elements" patented technology

A system and method for measuring thermal distributions of an electronic device during operation is disclosed. The system includes an electronic device, a heat sink adjacent to the electronic device and an electrical-insulating layer disposed on the electronic device so as to separate the electronic device and the heat sink. The system further includes a plurality of thermal sensors located on the electrical-insulating layer, each of the plurality of thermal sensors in a different location. The plurality of thermal sensors is located within one or more thin film circuit layers disposed adjacent to the electrical insulating layer. The system further includes a module for receiving thermal information from the plurality of thermal sensors during operation of the electronic device. The system further includes a processor coupled to the module for generating a thermal distribution of the electronic device based on the thermal information received from the plurality of thermal sensors.

A thermal energy controller system useful in medical procedures includes a controller coupled to a probe, and a thermal element to vary probe temperature. The controller includes memory storing a non-continuous algorithm that permits user-selectable settings for various probe types such that controller operation is self-modifying in response to the selected probe setting. Probe output power Pout is constant in one mode to rapidly enable probe temperature to come within a threshold of a target temperature. The controller can then vary Pout dynamically using a proportional-integral-derivative (PID) algorithm Pout=Kp·P+Ki·I+Kd·D, where feedback loop coefficients Kp, Ki, Kd can vary dynamically depending upon magnitude of an error function e(t) representing the difference between a user-set desired target temperature and sensed probe temperature. Advantageously, target temperature can be rapidly attained without overshoot, allowing the probe system to be especially effective in arthroscopic tissue treatment.

Support structures for positioning sensors on a physiologic tunnel for measuring physical, chemical and biological parameters of the body and to produce an action according to the measured value of the parameters. The support structure includes a sensor fitted on the support structures using a special geometry for acquiring continuous and undisturbed data on the physiology of the body. Signals are transmitted to a remote station by wireless transmission such as by electromagnetic waves, radio waves, infrared, sound and the like or by being reported locally by audio or visual transmission. The physical and chemical parameters include brain function, metabolic function, hydrodynamic function, hydration status, levels of chemical compounds in the blood, and the like. The support structure includes patches, clips, eyeglasses, head mounted gear and the like, containing passive or active sensors positioned at the end of the tunnel with sensing systems positioned on and accessing a physiologic tunnel.

This ceramic sheath type thermocouple has a long service life, an improved temperature measuring responsibility and an improved temperature measuring precision, and enables repetitive use. The ceramic sheath type thermocouple has its protective tube 1 formed of a heat resisting ceramics selected from silicon nitride, sialon and silicon carbide. In the protective tube 1 are installed a pair of W-Re wires that are connected to form a joint portion constituting a temperature measuring point 5. A filler made of Si3N4 reaction-sintered ceramics is loaded into the front end portion of the protective tube to enclose the W-Re wires. Another filler made of SiC whisker with a heat conductivity smaller than that of the filler of the front end portion is loaded into the rear portion of the protective tube. An inert gas is sealed in the protective tube. Alternatively, the temperature measuring portion may be formed by exposing from the front end portion of the protective tube the joint portion where the ends of the W-Re wires are connected. The temperature measuring portion is coated with a cover film that is made of silicon carbide, silicon nitride or a composite of these, all having excellent heat resisting and corrosion resisting properties.

A temperature measuring device and a temperature measuring method are provided which are capable of obtaining precise measured temperature values with respect even to old persons, sucklings or infants, which device may be formed into a disposable type according to need, which method may be carried out using such a disposable type device according to need, and which enable precise temperature measurement in real time. An on-subject temperature measuring device 1, which is attached to a subject when a temperature of the subject is measured, receives a radio wave from a reader 2 as an external device and is thereby electrically powered. Using the electric power, temperature measurement is performed in the on-subject temperature measuring device 1. The results of the measurement are transmitted through radio waves to the reader 2 in the form of a temperature of the subject and ID data. The reader 2 is so constructed as to be connectable to a personal computer (not shown), and data processing by the personal computer is performed according to need.

Systems are provided for measuring temperature in a semiconductor processing chamber. Embodiments provide a multi-junction thermocouple comprising a first junction and a second junction positioned to measure temperature at substantially the same portion of a substrate. A controller may detect failures in the first junction, the second junction, a first wire pair extending from the first junction, or a second wire pair extending from the second junction. The controller desirably responds to a detected failure of the first junction or first wire pair by selecting the second junction and second wire pair. Conversely, the controller desirably responds to a detected failure of the second junction or second wire pair by selecting the first junction and first wire pair. Systems taught herein may permit accurate and substantially uninterrupted temperature measurement despite failure of a junction or wire pair in a thermocouple.

A remotely programmable integrated sensor transmitter device for measuring and reporting a physical quantity of a given medium comprises a sensor for measuring a physical quantity of a medium and providing an electrical output as a function of the property measured, a scaler module for receiving the electrical output and for producing a scaled analog signal as a function of the physical quantity and a scale selection input, and a data interface for receiving programming data from an external computer and for providing the scale selection output to the scaler module.

A thermocouple for use in a semiconductor processing reactor is described. The thermocouple includes a sheath having a measuring tip at one end and an opening at the other end. A support member having bores formed along the length is disposed within the sheath. A pair of wires formed of dissimilar metals are disposed within the bores, and one end of the wires is fused together to form a junction. The wires extend along the length of the bores. As the wires exit the bore, they are spatially or physically separated to prevent a short circuit therebetween. The ends of the wires exiting the bore are also free to thermally expand in the longitudinal manner, thereby reducing or eliminating the potential for the wires to fail due to grain slip.

A thermocouple having a support tube configured to receive a pair of wires of dissimilar metals. The pair of wires of the thermocouple connected at a junction adjacent to one end of the support tube. The thermocouple further including a cap attached to the opposing end of the support tube, wherein the cap receives the free ends of the pair of wires. The cap allowing the pair of wires to translate freely therethrough to accommodate the difference in thermal expansion and contraction of the pair of wires relative to the thermal expansion and contraction of the support tube.

A temperature sensor has a sensor tip and a front for measuring the temperature of the inner walls of tools, particularly inner walls of injection molding tools. The tip of the temperature sensor has two thermocouple wires of a thermocouple. Each thermocouple wire of the thermocouple guided to the front is welded to the sensor tip up to a depth which is larger than the total processing depth behind the front. The sensor tip is processable by removing of material at the front up to that processing depth.

A system and method for determining the temperature of a semiconductor wafer at the time of thermal contact of the semiconductor wafer with a temperature sensing element. According to the invention, a temperature profile of the temperature sensing element is recorded from the time of thermal contact up to the time of thermal equilibrium between the semiconductor wafer and the temperature sensing element and the temperature of the semiconductor wafer at the time of thermal contact is determined on the basis of a time period between the time of thermal contact and the time of thermal equilibrium and the temperature TG of the semiconductor wafer reached at the time tG of thermal equilibrium is determined by back calculation with the aid of an equation derived from Newton's law of cooling.

A method for fabricating a thermocouple capable of long-term operation in high temperature, hostile environments without significant signal degradation or shortened thermocouple lifetime due to heat induced brittleness.

A method of producing an electronic clinical thermometer is disclosed, the electronic clinical thermometer including a temperature-sensitive element, lead wire that is connected to the temperature-sensitive element, a body case having a probe part in which an insertion path for the lead wire to be inserted is formed, and a sensor cap having a cavity one end of which is opened and the other end is closed, both the lead wire projecting from the insertion path and the temperature-sensitive element being stored within the sensor cap, and the method includes a step for mounting the sensor cap on the probe part, in a state where the lead wire having the temperature-sensitive element mounted on the tip thereof projects from the insertion path of the probe part.

A probe of an ear-type clinical thermometer 20 comprises a first heat insulation member 210 made of a resin material and a second high heat insulation member 220 made of a resin material that is connected to a distal end of the first heat insulation member 210 by conventional coupling means. The second high heat insulation member 220 is tapered forwardly and is provided on the distal end with a concave surface 221. A protection cover 230 sheathes the first heat insulation member 210 and second high heat insulation member 220. A thermistor fine lead wire 240 is embedded in the first heat insulation member 210 and second high heat insulation member 220 so that a turning end portion 241 of the wire 240 is bridged over the concave surface 221 of the second high heat insulation member 220 to be exposed above the concave surface 221. An ultrafast responsivity thermistor 250 is mounted substantially on a center of the turning end portion 241 of the thermistor fine lead wire 240.

An apparatus for processing a substrate. The apparatus comprising a tubular member with a first end and a second end. The first end comprising an opening; and a temperature sensor disposed in the opening. The temperature sensor comprising a resilient member. The resilient member comprising a surface made of a ceramic material wherein the surface made of a ceramic material extends through the opening to provide a substrate contact surface.

A thermocouple for measuring temperature at a position adjacent to a substrate being processed in a chemical vapor deposition reactor is provided. The thermocouple includes a sheath having a measuring tip. The thermocouple also includes a support tube disposed within the sheath. The thermocouple further includes first and second wires supported by the support tube. The first and second wires are formed of different metals. A junction is formed between the first and second wires, wherein the junction is located adjacent to a distal end of the support tube. A spring is disposed about a portion of the support tube. The spring is compressed to exert a spring force on the support tube to bias the junction against the measuring tip to maintain the junction in continuous contact with the measuring tip. The spring force is small enough to prevent significant deformation of the junction as well as reducing variation of spring force or junction location from one thermocouple to another.

Apparatus for dynamic surface annealing of a semiconductor wafer includes a source of laser radiation emitting at a laser wavelength and comprising an array of lasers arranged in rows and columns, the optical power of each the laser being individual adjustable and optics for focusing the radiation from the array of lasers into a narrow line beam in a workpiece plane corresponding to a workpiece surface, whereby the optics images respective columns of the laser array onto respective sections of the narrow line beam. A pyrometer sensor is provided that is sensitive to a pyrometer wavelength. An optical element in an optical path of the optics is tuned to divert radiation emanating from the workpiece plane to the pyrometry sensor. As a result, the optics images each of the respective section of the narrow line beam onto a corresponding portion of the pyrometer sensor. The apparatus further includes a controller responsive to the pyrometry sensor and coupled to adjust individual optical outputs of respective columns of the laser array in accordance with outputs of corresponding portions of the pyrometry sensor.

A system and method for determining the temperature of a semiconductor wafer at the time of thermal contact of the semiconductor wafer with a temperature sensing element. According to the invention, a temperature profile of the temperature sensing element is recorded from the time of thermal contact up to the time of thermal equilibrium between the semiconductor wafer and the temperature sensing element and the temperature of the semiconductor wafer at the time of thermal contact is determined on the basis of a time period between the time of thermal contact and the time of thermal equilibrium and the temperature TG of the semiconductor wafer reached at the time tG of thermal equilibrium is determined by back calculation with the aid of an equation derived from Newton's law of cooling.

A thermocouple having a support tube configured to receive a pair of wires of dissimilar metals. The pair of wires of the thermocouple connected at a junction adjacent to one end of the support tube. The thermocouple further including a cap attached to the opposing end of the support tube, wherein the cap receives the free ends of the pair of wires. The cap allowing the pair of wires to translate freely therethrough to accommodate the difference in thermal expansion and contraction of the pair of wires relative to the thermal expansion and contraction of the support tube.

A thermocouple for use in a semiconductor processing reactor is described. The thermocouple includes a sheath having a measuring tip at one end and an opening at the other end. A support member having bores formed along the length is disposed within the sheath. A pair of wires formed of dissimilar metals are disposed within the bores, and one end of the wires is fused together to form a junction. The wires extend along the length of the bores. As the wires exit the bore, they are spatially or physically separated to prevent a short circuit therebetween. The ends of the wires exiting the bore are also free to thermally expand in the longitudinal manner, thereby reducing or eliminating the potential for the wires to fail due to grain slip.

A data storage system and method capable of reducing the operating temperature of the data storage system, removing any overheating storage devices from operation, reconstructing data, and evacuating data from the overheating storage devices before the devices and the data are damaged or lost.

A temperature sensor (10) includes: a temperature-sensing portion for measuring a temperature of an object (50) by contacting the object; and a supporting portion for supporting the temperature-sensing portion from a side opposite to a contact surface, the supporting portion having a space at a portion partially corresponding to the temperature-sensing portion. A temperature controller includes: a temperature control device; the temperature sensor (10) for measuring the temperature by contacting the object (50); and a controller for controlling the temperature control device. The controller includes: a mounting-state judging means for judging a mounting-state of the object (50); a switching means for switching a control gain and a target temperature of the temperature control device based on the judging result; and a control-command generating means for generating a control command based on the control gain, the target temperature and a measurement value of the temperature sensor (10).

A thermocouple for use in a semiconductor processing reaction is described. The thermocouple includes a sheath having a measuring tip and an opening at the opposing end. A support member that receives a portion of a first wire and a second wire is received within the sheath. The first and second wires form a junction that contacts the inner surface of the sheath at the measuring tip. A spacing member is secured at the opening of the sheath and receives the support member. The spacing member allows the support member, first wire, and second wire to freely thermally expand relative to each other without introducing compression or tension stresses therein.

Systems and methods are provided for determining data center cooling and power requirements and for monitoring performance of cooling and power systems in data centers. At least one aspect provides a system and method that enables a data center operator to determine available power and cooling at specific areas and enclosures in a data center to assist in locating new equipment in the data center.