203 results about "Lead lines" patented technology

This invention is directed to a lattice touch-sensing system for detecting a position of a touch on a touch-sensitive surface. The lattice touch-sensing system may include two capacitive sensing layers, separated by an insulating material, where each layer consists of substantially parallel conducting elements, and the conducting elements of the two sensing layers are substantially orthogonal to each other. Each element may comprise a series of diamond shaped patches that are connected together with narrow conductive rectangular strips. Each conducting element of a given sensing layer is electrically connected at one or both ends to a lead line of a corresponding set of lead lines. A control circuit may also be included to provide an excitation signal to both sets of conducting elements through the corresponding sets of lead lines, to receive sensing signals generated by sensor elements when a touch on the surface occurs, and to determine a position of the touch based on the position of the affected bars in each layer.

Temperature gauge, and ceramic susceptors and semiconductor manufacturing equipment utilizing the temperature gauge, in which the thermocouple may be easily replaced even if damaged, and in which heat from the temperature-gauging site is readily transmitted to the temperature-gauging contact, shortening time until the measurement temperature stabilizes. A temperature-gauging contact (12) in the tip of the thermocouple contacts, in an exposed-as-it-is state, a temperature-gauging site on a ceramic susceptor (1), and by means of a circular cylindrical-shaped retaining member (11) screwed into female threads in the ceramic susceptor (1) is detachably pressed upon and retained against the ceramic susceptor. Thermocouple lead lines (13), passing through a through-hole (14) in the retaining member (11), stretch from one end face to the other end face thereof. The retaining member may be provided with a flange having threaded holes and screwlocked into female screws in the ceramic susceptor.

A memory module preferably includes a printed circuit board (PCB) panel having multiple memory chip pad groups arranged on both sides thereof. Each memory chip pad group preferably includes multiple pads that correspond to lead lines of multiple memory chips arranged on the PCB panel. Connectors are preferably formed along an edge of the PCB panel to electrically connect the memory chip pad groups to an external device. Multiple damping chip pad groups preferably include built-in damping chips. One or more of the damping chip pad groups are preferably arranged adjacent to a lateral edge of one or more of the memory chips. The damping chip pad groups can electrically connect the connectors to the memory chip pad groups and dampen the signal noises.

A solar cell module connector includes an insulating box (2). The insulating box includes a solar cell module lead line connection zone (8) and an output cable connection zone (12) disposed on opposite sides of an diode zone (10), with partitions (4, 6) disposed therebetween, respectively. Heat sinks (14) are disposed in the diode zone, with their first ends located in said solar cell module lead line connection zone and with their second ends located in said output cable connection zone. Connection terminals (26) are connected to the respective ones of the first ends of the heat sinks and extend through the partition (4) into the solar cell module lead line connection zone. Connection terminals (30) are connected to the second ends of the heat sinks disposed at the opposite, first and second outermost locations and extend through the partition (6) into the output cable connection zone. Anodes of chip-type diodes (18) are connected to the respective heat sinks expect one of the two outermost heat sinks, with their cathodes connected to the respective ones of the heat sinks adjacent on the first outermost location side.

Provided is an electrostatic capacitance type touch panel in which lead lines are alternately connected to one end portions of a plurality of Y electrodes, the respective lead lines are formed outside an effective touch region, and are connected to terminals which are formed corresponding to the respective lead lines, inspection pads which are connected with the Y electrodes respectively are formed over end portions of the respective Y electrodes on a side where the lead lines are not connected to the respective Y electrodes, the plurality of inspection pads are formed in a region where the lead lines are formed outside the effective touch region, a shield electrode is provided between the lead lines and the respective inspection pads, and a voltage equal to a drive voltage supplied to the Y electrodes is supplied to the shield electrode.

A rotating rattle attachment for a fishing bait rig includes a generally conical hollow body member, a lead line tube axially disposed within the body member, and one or more chambers defined by the body member and the lead line tube. Each chamber contains one or more balls, and the rattle has exterior fins to promote rotation as the rig is drawn through the water. The rattle produces an audible sound that will attract a target fish or will stress a bait fish into secreting hormones attractive to the target fish.

A method for manufacturing a stator includes preparing a stator core having a plurality of teeth, a plurality of coils having a plurality of lead lines, a substrate having a plurality of connecting portions, and a plurality of positioning jigs having restraining portions. The method includes positioning the substrate and the lead lines so that distal portions of the lead lines are separated from the connecting portions in at least one of a radial direction and a circumferential direction. The method further includes inserting the lead lines in the restraining portions, aligning the distal portions of the lead lines with the corresponding connecting portions using the positioning jigs, inserting the lead lines into the corresponding connecting portions, and electrically connecting the lead lines inserted in the connecting portions to the corresponding connecting portions.

A drain layer lead line connecting an image signal line and a terminal of an IC driver is interrupted in the middle, and the gap is bridged by bridging ITO that is formed at the same time as pixel ITO. Thus, the difference in the length of the lead lines is adjusted such that the length of the bridging ITO in the lead line connected to the terminal in the center of the IC driver is longer than the length of the bridging ITO in the lead line connected to the terminal in the end of the IC driver to reduce the difference in the wiring resistance of the lead lines due to the difference in the length of the lead lines depending on the location.

The invention discloses an array substrate and a liquid crystal display device comprising the same. The array substrate comprises a display area and a non-display area, wherein the display area comprises a plurality of pixel units, a plurality of grid lines, data lines and grid lead wires; two adjacent data lines and two adjacent grid lines are in a circle to form one pixel unit; each pixel unit comprises a thin film transistor and a pixel electrode; each grid lead wire is positioned between two corresponding adjacent pixel units; each grid line is connected with the corresponding grid lead line; the grid lead line in the i line is connected with the grid line in the j line, and the grid of the thin film transistor, connected with the data line in the i line, on the two sides of the grid line in the j line is connected with the grid line in the (j-1) line or the (j+1) line; i is an integer larger than 1; j is an integer larger than 1. According to the array substrate, the influence of the coupling of the grid lead lines and the data lines on the display pixels is reduced.

The invention relates to a method and a device for controlling the thickness of a steel wire hot-plating layer. The control method comprises an inert gas swabbing process, a cooling process and a cutting-off process which are carried out in sequence and is characterized in that: the hot-plating steel wire after the inert gas swabbing process is vertically leaded out for continuously performing electromagnetic swabbing process and then performing cooling and cutting-off processes; the magnetic field acted in the electromagnetic swabbing process is a single-phase and alternative uniform magneticfield, wherein the acted magnetic field force ranges from 20A to 1000A. The control device comprises a gas swabbing device used in the inert gas swabbing process and is characterized by being suitable for the control method in the invention. The control device further comprises an electromagnetic swabbing device which is vertically mounted above the gas swabbing device and ensures that the leading line of the hot-plating steel wire from the electromagnetic swabbing device maintains vertical; the electromagnetic swabbing device comprises an electromagnetic swabbing device, a magnetic field generator and an automatic electric cabinet electrically connected with the electromagnetic swabbing device in sequence; the automatic electric cabinet comprises a magnetic field generator master controller and a gas swabbing automatic electric cabinet; and the electromagnetic swabbing device and the magnetic field generator are provided with a set of constant-temperature cooling systems.

[Object] An object of the present invention is to provide a surface pressure distribution sensor capable of maintaining high reliability of lines in a configuration having a folded portion, precisely and stably detecting a surface pressure distribution, and being manufactured with a simple configuration and at low cost. [Solving Means] In the present invention, a first lead line group is placed adjacent to a first line group on a first substrate, a second lead line group connected to a second line group is placed on a second substrate, the second lead line group extends over a boundary portion and connects to the first lead line group on the first substrate, the width of conductors of the first lead line group is smaller than the width of conductors of the first line group and the width of conductors of the second line group, and the width of conductors of the second lead line group positioned in a folded portion of the boundary portion is larger than the width of the conductors of the first lead lined group.

A wiring board includes conductive wirings, terminals and interconnecting lines connecting between them. First terminals establish a one-to-one correspondence with the interconnecting lines. The interconnecting lines terminate at the first terminals except at least one of the interconnecting lines. The interconnecting line which does not terminate at the first terminals terminates at the second terminal. The first terminal at which the interconnecting lines do not terminate is connected to the third terminal. The first terminals are connected to outputs of a driver IC mounted on a tape carrier package. The second and third terminal are connected to a switch via a through lead line of tape carrier package. When the second and third terminals are short-circuited by the switch, all the outputs of the driver IC is connected to the conductive wiring of the wiring board. When the second terminal is connected to the detection circuit by the switch, a signal on the wiring board is detected to determine a position of a pen.

A multiple electrode includes a plurality of micro-electrodes provided on a substrate, and a wiring portion for providing an electrical signal to the micro-electrodes or extracting an electrical signal from the micro-electrodes. Each micro-electrode has porous conductive material on its surface, and the impedance of the micro-electrode is 50 kΩ or less. Preferably, the porous conductive material is gold, and formed by the passage of current at a current density of 1.0 to 5.0 A / dm2 for 10 to 360 sec. The multiple electrode may include micro-electrodes provided on a substrate in the form of a matrix, a lead line connected to the micro-electrodes, and an electrical junction connected to an end of the lead line.

A mobile terminal capable of measuring a biological signal is provided. The terminal comprises a terminal body; an electrode for human body earth or system reference, placed on an outer surface of the terminal body so as to be contactable with the skin of a user of the mobile terminal; and differential electrodes. The measured biological signals include an electromyography signal and an electroencephalogram signal. The differential electrodes can be external to the terminal body and be connected via lead lines to the terminal body.

An active device array substrate including a substrate, a plurality of active devices, a plurality of the first lead lines, a plurality of the second lead lines and a first floating light-shielding layer is provided. The substrate has a display region and a peripheral circuit region and the active devices are arranged within the peripheral circuit region on the substrate to form an array. Besides, the first lead lines and the second lead lines are disposed within the peripheral circuit region on the substrate. The first floating light-shielding layer is disposed between the first lead lines and covers the part of the first lead lines. Furthermore, the floating light-shielding layer is not connected with any voltage sources completely. Therefore, the active devices array substrate can prevent the light leakage from been resulted between the first lead lines and the power consumption of the active devices array substrate is reduced.

An ink jet recording element substrate includes a substrate; an ejection outlet array for ejecting ink; a heat generating element array comprising a plurality of heat generating elements for generating ejection energy for ejecting the ink from the ejection outlet array; a protecting film, comprising protecting portions, for protecting the heat generating element array; a common line, disposed along a side of the heat generating element array, for supplying electric power for driving the heat generating elements, and being divided into at least two portions by a line perpendicular to the heat generating element array; a testing electrode for testing a function of the protecting film; and an externally connecting electrode, disposed at an end of the substrate, for externally supplying electric power to the common line; wherein the ink jet recording element substrate further includes, in an area between the portions of the common line, a connecting line for electrically connecting the protecting portions of the protecting film disposed to sandwich the common line and a lead line for electrically connecting the protective film and the testing electrode.

An organic electroluminescence device including a plurality of electrodes formed on a substrate, and a plurality of lead lines are coupled to the plurality of electrodes. At least two or more lead lines among the plurality of lead lines have different widths, and a width of a longer lead line among the plural lead lines is greater than a width of a shorter lead line.

The invention relates to a battery protection-used chip cascade structure. The battery protection-used chip cascade structure includes a first chip and at least one second chip; the first chip includes a first tube core and a first encapsulation tube shell; the first tube core includes a load current detection circuit unit and a charging state detection circuit unit; the input of the load current detection circuit unit is connected with a current detection tube pin of the first encapsulation tube shell through an encapsulation lead line; the input of the charging state detection circuit unit is connected with a charging detection tube pin of the first encapsulation tube shell through an encapsulation lead line; the second chip includes a first tube core and a second encapsulation tube shell; the input of the load current detection circuit unit and the input of the charging state detection circuit unit are connected with a grounding tube pin of the second encapsulation tube shell through encapsulation lead lines; the first chip and the at least one second chip are connected in series with each other so as to respectively detect the voltage of series-connected battery cores of batteries; and the first chip detects the output current of the batteries.

A power metal oxide semiconductor transistor layout is disclosed. The power metal oxide semiconductor transistor layout uses network of conductive lead line as a connection or a network connection to connect source and drain regions thereby achieves advantages of a high uniformity of current, low Rds_on, much less power loss, an actual line density two times larger than that of conventional layouts and a strengthened resistance to electron migration.

Devices and methods are provided for wireless communication with a target, such as an optical disc or an electronic device. The devices include an integrated processor and an antenna that are connected to the target, which enable a wireless communication with an associated reader or scanning system. The integrated circuit may be embedded in the target attached to the surface of the target, or in a label attached to the target. In a similar manner, the antenna may be embedded in the target, attached to the surface of the target, or in a label attached to the target. Interconnection lines may be used connect the integrated processor to the antenna, and may include a feedthrough arrangement for passing electrical signals between the surface and the interior of the target. A demodulator may also be positioned adjacent or on the antenna, allowing a long lead line to pass demodulated data to the integrated circuit. In one example, the antenna is positioned in or on a case that holds the target, with lead lines connecting the antenna to the target's integrated circuit. One, two, or three antennas may be used, with the multi-antenna arrangements preferably arranging the antennas orthogonally.

A temperature sensor has lead lines made of an elastic material each attached to a corresponding one of electrodes on a temperature sensing element such as an NTC thermistor element. The lead lines may each have a non-straight part where they are bent or deformed into a semi-circular shape such that, when these lead lines are inserted into throughholes prepared through a circuit board, the non-straight parts are hooked at the throughholes and the portions of the lead lines above the circuit board will stand up obliquely. Instead of lead lines, a pair of elongated planar lead terminals each with a twisted top end part may be connected to the electrodes such that the top end parts of the pair of lead terminals face each other and can support the temperature sensing element more securely in between.

A thin film transistor array substrate and manufacturing method thereof are provided. A shielding layer is formed between lead lines in a peripheral region of the substrate. The shielding layer and a gate layer may be formed simultaneously so that the light leakage between lead lines connected to a source / drain layer is reduced. Alternatively, the shielding layer and the source / drain layer may be formed simultaneously so that the light leakage between lead lines connected to a gate layer is reduced. Furthermore, a common voltage may be applied to the shielding layer so that signal interference between lead lines is reduced. Moreover, in an electrical inspection of the thin film transistor array, any short circuit between the lead lines and the shielding layer can be determined.

A hermetic compressor capable of insulating connectors (43), to which a plurality of lead lines (42) connected to a terminal block (41) and a plurality of stator coils (31a) used in a stator (31) are connected, without using a separate insulator, and capable of preventing defective insulation of the connectors due to vibration or friction during operation of the compressor. The hermetic compressor comprises a compression device (20) to compress a refrigerant, the stator constituting a drive device (30) to drive the compression device, the plurality of lead lines to apply electric power to the stator, the plurality of stator coils used in the stator, the plurality of connectors, one of the lead lines and one of the stator coils being connected to each connector, and an insulation member (50) having a plurality of seating recesses (52), in which the connectors are seated, respectively, and a plurality of fixing grooves (55), in which the lead lines are fixed, respectively.

The invention provides a cutter shaft control method of a leading line yielding track in a blade helical milling process, comprising the following steps of: firstly, configuring a blade cylinder auxiliary face; secondly, taking a containing cylindrical face as an auxiliary face and constructing a leading line yielding curve; and finally, taking an outer normal vector of the cylindrical face as auxiliary information of vector interpolation of a cutter shaft of a leading line yielding track line, so as to obtain the cutter shaft vector of the leading line yielding track. The method disclosed by the invention has commonality and is suitable for spiral machining of a blade body of any blade; and the leading line yielding curve and the cutter shaft vector of a cutter site on the yielding curve can be effectively generated. Actual production verifies that the cutter shaft vector generated by the method is stable and smooth, the machining quality and the machining efficiency of the blade are improved and the service life of a machine tool and a tool is prolonged.