822 results about "Leading line" patented technology

This invention is directed to a lattice touch-sensing system for detecting a position of a touch on a touch-sensitive surface. The lattice touch-sensing system may include two capacitive sensing layers, separated by an insulating material, where each layer consists of substantially parallel conducting elements, and the conducting elements of the two sensing layers are substantially orthogonal to each other. Each element may comprise a series of diamond shaped patches that are connected together with narrow conductive rectangular strips. Each conducting element of a given sensing layer is electrically connected at one or both ends to a lead line of a corresponding set of lead lines. A control circuit may also be included to provide an excitation signal to both sets of conducting elements through the corresponding sets of lead lines, to receive sensing signals generated by sensor elements when a touch on the surface occurs, and to determine a position of the touch based on the position of the affected bars in each layer.

Temperature gauge, and ceramic susceptors and semiconductor manufacturing equipment utilizing the temperature gauge, in which the thermocouple may be easily replaced even if damaged, and in which heat from the temperature-gauging site is readily transmitted to the temperature-gauging contact, shortening time until the measurement temperature stabilizes. A temperature-gauging contact (12) in the tip of the thermocouple contacts, in an exposed-as-it-is state, a temperature-gauging site on a ceramic susceptor (1), and by means of a circular cylindrical-shaped retaining member (11) screwed into female threads in the ceramic susceptor (1) is detachably pressed upon and retained against the ceramic susceptor. Thermocouple lead lines (13), passing through a through-hole (14) in the retaining member (11), stretch from one end face to the other end face thereof. The retaining member may be provided with a flange having threaded holes and screwlocked into female screws in the ceramic susceptor.

An electrically powered hydraulic fracturing system includes pumps for pressurizing fracturing fluid, piping for carrying fracturing fluid, and field connections in obliquely oriented segments of the piping. The connections are between lead lines that couple directly to the pumps and lines carrying fluid to and from the pump; and are assembled and disassembled in the field. Operations personnel can more easily manipulate connections that are obliquely oriented than those that are horizontal or vertical.

A display method and apparatus for navigation system enables a user to easily see crowded POI icons and their positions in a small area on the map image by shifting the positions of POI icons in radial directions. The display method includes the steps of specifying POI icons on a map image within a region of a predefined region mark, forming a position rim which is a circle with a center of the region mark, displacing the POI icons within the region mark in radial directions to the position rim, displaying position marks at positions where the POI icons are located before the displacement within the region mark, and displaying lead lines each connecting the POI icon displaced to the position rim and the corresponding position mark.

An implanted electric pulse system for stimulating nerve to treat Parkinson's disease, epilepsy, pain, strain and spasm is composed of a pulse generator implanted in human body, leading lines, electrodes, external program controller, PDA and external control magnet. The working state of pulse generator and the pulse parameters can be remotely controlled and regulated by said external magnet, program controller and PDA. The software update can also be performed through PDA and program controller.

A pipe-inspection system (100) is provided. The system (100) is made up of a transmission cluster (104) incorporating a transmission unit (800) between first and second wheeled guidance units (400), and a reception cluster (104″) incorporating a reception unit (1400) between third and fourth wheeled guidance units (400). Each wheeled guidance unit (400) contains a plurality of wheels (416) radially disposed in each of a plurality of planes (420, 426, 432). Transmission unit (800) contains a transmission device (1004). Reception unit (1400) contains a reception device (1604). The system (100) is compatible with RFEC inspection techniques to inspect a pipeline (102), where transmission and reception devices (1004, 1604) are an RFEC transmitter and receiver, respectively. A lead line (106) is attached to the first guidance unit (400) to move the system (100) in a forward direction (108). Similarly, a trail line (110) is attached to the fourth guidance unit (400″) to move the system (100) in a reverse direction (112).

A route comprises interconnected road segments that can be traveled to get from a location to a destination. Previously, routes are represented by display of the spatial arrangement of such road segments (e.g., a map). Here, a route is depicted as a linear shape, and portions of the linear shape represent portions of the route, regardless of their spatial arrangement. A scale is applied between a characteristic of the route and the linear shape. Information elements can be depicted at points on the linear shape that correspond, based on the scale, to locations on the route where such information applies. Portions of the linear shape can be colored or cross-hatched according to traffic congestion conditions. Incident reports can be represented by indicators along the linear shape. Alternate routes (detours) can be represented by respective separate linear shapes; lead lines can connect such linear shapes to points of the route linear shape where each such detour would be taken.

A memory module preferably includes a printed circuit board (PCB) panel having multiple memory chip pad groups arranged on both sides thereof. Each memory chip pad group preferably includes multiple pads that correspond to lead lines of multiple memory chips arranged on the PCB panel. Connectors are preferably formed along an edge of the PCB panel to electrically connect the memory chip pad groups to an external device. Multiple damping chip pad groups preferably include built-in damping chips. One or more of the damping chip pad groups are preferably arranged adjacent to a lateral edge of one or more of the memory chips. The damping chip pad groups can electrically connect the connectors to the memory chip pad groups and dampen the signal noises.

A partial discharge detection apparatus of an electrical rotating machine includes a metal frame connected to a stator frame of the electrical rotating machine, a power line connected to one of a stator winding corresponding to one phase of three phases in the metal frame and a neutral point lead line connected to a neutral point of three-phase stator windings and arranged in the metal frame to propagate a partial discharge signal generated by degradation of the stator winding, a sensor including a rod antenna which is installed around the power line or neutral point lead line in the metal frame to electrostatically and magnetically induce the partial discharge signal propagated to the power line or neutral point lead line, and a detector which receives, via a signal lead line, a signal generated in the sensor and detects partial discharge by signal processing.

A method and apparatus that solve the problem of accurate measurement of gas flow so that the delivery of gases in semiconductor processing may be performed with greater confidence and accuracy by performing real-time characterization of a lead-line for mass flow controller (MFC) flow verification are provided. In one embodiment a mass flow verifier (MFV) provides rate of rise information to a controller via a digital interface without correcting for lead-line influences. After receiving the rate of rise data from the tool host computer computes a gas mass correction factor in real-time based on at least one of the following: MFC temperature sensor data, lead-line temperature sensor data, lead-line pressure transducer data, and lead-line volume. The rate of rise data and gas mass correction factor are used to compute accurate mass flow. The accurate mass flow information may be used to calibrate the MFC.

A thin film transistor array plate, a liquid crystal display panel and a method of preventing electrostatic discharge thereof are provided. The thin film transistor array comprises a substrate, pixel structures, switching devices, lead lines and electrostatic discharge (ESD) protecting circuits. The substrate has a display region and a peripheral circuit region. The pixel structures are disposed within the display region and the switching devices are disposed within the peripheral circuit region. The lead lines are disposed on the substrate to electrically connect the pixel structures and the switching devices. The ESD protecting circuits are disposed within the peripheral circuit region such that each ESD protecting circuit is electrically connected to the corresponding switching devices. The ESD protecting circuits prevent electrostatic discharge, simplify the circuit layout and improve production efficiency of the plate and the panel.

In a corner portion outside a display region of a face substrate which constitutes a face panel of a display device, an opening is formed. In the opening, a stem glass structural body, which is configured by integrally forming an exhaust pipe on a center portion of a stem glass and by forming conductive leads in a peripheral portion thereof in an embedded manner, is fixed by welding using curing by heating. The exhaust pipe is evacuated and, thereafter, tipped off, thus realizing vacuum sealing of the inside thereof. A lead line is connected to a distal end of one conductive lead by welding and another end of the lead line is electrically connected with one end portion of the anode formed on an inner surface of the face substrate using a conductive adhesive agent. Further, a getter is mounted and fixed to another conductive lead line by welding.

Provided is an electrostatic capacitance type touch panel in which lead lines are alternately connected to one end portions of a plurality of Y electrodes, the respective lead lines are formed outside an effective touch region, and are connected to terminals which are formed corresponding to the respective lead lines, inspection pads which are connected with the Y electrodes respectively are formed over end portions of the respective Y electrodes on a side where the lead lines are not connected to the respective Y electrodes, the plurality of inspection pads are formed in a region where the lead lines are formed outside the effective touch region, a shield electrode is provided between the lead lines and the respective inspection pads, and a voltage equal to a drive voltage supplied to the Y electrodes is supplied to the shield electrode.

The invention provides a layout structure for integration of a train depot and a junction station of an urban rail. The layout structure is composed of the junction station, a main line, a turn line, a release line, a lead line, a testing line, a train washing workshop, a parking train examination shop, a plant un-wheeling repair shop, an internal combustion adjustment engine shop, an engineering garage, related lines and turnout junctions, a comprehensive office building, a hazardous material storage and a guardroom erected on the ground. In the structure, the junction station, the turn line, the release line, a train washing line and the parking train examination shop are arranged in a tandem feed-through manner, a return section train starts from a station and enters the train washing workshop for washing through an entry line, and after washing, the return section train can directly enter the parking train examination for storage or enter the plant un-wheeling repair shop for inspection and repair. The lead line, the internal combustion adjustment engine shop, the engineering garage and the train washing workshop are parallel to each other, and the front and the rear of the line are connected with the entry line. The layout structure has the benefits of compactness and high production and operation efficiency. The testing line departs from a main plant area, and passes through the junction station. The door of the main plant area can be directly opened outwards. The layout structure occupies less space, and achieves high land and space utilization.

A rotating rattle attachment for a fishing bait rig includes a generally conical hollow body member, a lead line tube axially disposed within the body member, and one or more chambers defined by the body member and the lead line tube. Each chamber contains one or more balls, and the rattle has exterior fins to promote rotation as the rig is drawn through the water. The rattle produces an audible sound that will attract a target fish or will stress a bait fish into secreting hormones attractive to the target fish.

A method for manufacturing a stator includes preparing a stator core having a plurality of teeth, a plurality of coils having a plurality of lead lines, a substrate having a plurality of connecting portions, and a plurality of positioning jigs having restraining portions. The method includes positioning the substrate and the lead lines so that distal portions of the lead lines are separated from the connecting portions in at least one of a radial direction and a circumferential direction. The method further includes inserting the lead lines in the restraining portions, aligning the distal portions of the lead lines with the corresponding connecting portions using the positioning jigs, inserting the lead lines into the corresponding connecting portions, and electrically connecting the lead lines inserted in the connecting portions to the corresponding connecting portions.

A lead line structure and a display panel having the same are provided. The display panel includes a pixel array, at least one driving device, first and second lead lines, and first and second insulating layers. The first lead lines are electrically connected to the pixel array and the driving device. The first insulating layer covers the first lead lines and has trenches. The second lead lines are electrically connected to the pixel array and the driving device, and located in the trenches of the first insulating layer. The first and second lead lines are alternately arranged. The second insulating layer covers the first insulating layer and the second lead lines. The height of the second insulating layer above the second lead lines is smaller than the height of the second insulating layer above the first lead lines.

A drain layer lead line connecting an image signal line and a terminal of an IC driver is interrupted in the middle, and the gap is bridged by bridging ITO that is formed at the same time as pixel ITO. Thus, the difference in the length of the lead lines is adjusted such that the length of the bridging ITO in the lead line connected to the terminal in the center of the IC driver is longer than the length of the bridging ITO in the lead line connected to the terminal in the end of the IC driver to reduce the difference in the wiring resistance of the lead lines due to the difference in the length of the lead lines depending on the location.

A package-on-package (POP) package in which semiconductor packages are stacked using lead lines rather than conventional solder balls, and a fabricating method thereof are provided. According to the POP package and the fabricating method thereof of the present invention, the POP package is prevented from being short-circuited even when an underlying semiconductor package gets thicker and the POP package can sufficiently withstand deformation caused by post-fabrication warpage.

Provided are a lens driving motor and an elastic member of the lens driving motor. The elastic member of a lens driving motor, the elastic member includes a first spring and a second spring. The second spring is different from the first spring and disposed together with the first spring on one side of a carrier to support the carrier. A first lead line of a coil and a first external power source are connected to the first spring, and a second lead line of the coil and a second external power source are connected to the second spring to supply power to the coil. Since the carrier can be assembled to other part after a (+) lead line and a (−) lead line of the coil are connected to the first and second springs, respectively, using solder, a process is simple and convenient.

The present invention provides a rechargeable electric tool in which a battery pack detachably mounted to a mounting part, which is formed lower than an opening provided at a housing, wherein a seal member is held in the housing to seal between the opening and the battery pack mounted to the mounting part. A projection projecting toward the opening side is provided at the seal member, and a passing hole that penetrates the projection and the seal member and allows a lead line connecting an electric component accommodated on the opening side in the housing to the battery pack to pass therethrough is formed.

Disclosed is a package substrate for electrolytic leadless plating, characterized in that a wire bonding pad onto which a semiconductor chip is mounted is subjected to electrolytic leadless Au plating, and a solder ball pad is subjected to OSP metal finishing or electroless Au plating without use of plating lead lines, upon preparation thereof. A method of manufacturing the package substrate is also disclosed. The method includes Cu plating a whole surface of a base substrate having through-holes, developing a first dry film laminated onto the through-holes, removing a copper foil not covered with the first dry film, stripping the first dry film, exposing and developing a second dry film on the substrate so that only an upper portion to be subjected to electrolytic Au plating is exposed, grounding an electrolytic Au plating terminal to a solder ball pad, Ni-Au plating the wire bonding pad, removing the second dry film by a stripping solution, exposing and developing a third dry film, removing the exposed copper foil by an etching solution, removing the third dry film by a stripping solution, performing a series of processes of coating, exposing, developing and drying a solder resist, and subjecting the solder ball pad to OSP metal finishing.