This invention discloses an automated hot
air separation and
desoldering device and process for electronic components, relating to the field of
electronic component recycling and repair technology. It includes a frame, a
control system, a conveying mechanism, a vision
positioning system, a multi-axis motion mechanism, a hot air
desoldering head
assembly, and a component
pickup mechanism. The conveying mechanism, located on the frame, transports the circuit board to be processed to the target
station. The vision
positioning system, located above the conveying mechanism and electrically connected to the
control system, identifies the location and
package type of the target component. The multi-axis motion platform is on the frame and above the conveying mechanism. The hot air
desoldering head
assembly is mounted on the output end of the multi-axis motion mechanism, which moves it to the corresponding position of the target component to be desoldered, heating the solder joint to melt the solder and complete the desoldering. The component
pickup mechanism, mounted on the output end of the multi-axis motion mechanism and linked to the hot air desoldering head
assembly, separates and picks up the desoldered target component, improving desoldering efficiency, recycling yield, and enhancing the
automation of the desoldering process.