119 results about "Wire bonding" patented technology

This utility model discloses a single female connector structure with a wire bonding method, relating to the field of connector technology. It includes: a housing, an assembly assembly, a protective tube, an inner protective sleeve, and an inner sleeve. The protective tube is installed outside the inner sleeve, and the inner protective sleeve is installed on the outer wall of the protective tube. The inner protective sleeve is installed inside the housing. An assembly assembly for limiting the inner protective sleeve is installed on the side wall of the housing. An assembly opening is provided on the inner wall of the housing, and limit slots are provided on the outer walls at both the upper and lower ends of the housing. The assembly assembly includes an assembly block installed within the assembly opening. Limit extension brackets are provided at both the upper and lower ends of the assembly block, and limit blocks are provided on the outer walls of the limit extension brackets. This design solves the problems of existing female connectors having many integral components, complex and inconvenient assembly, high replacement costs, and poor stability due to the lack of limit components.

A wire bonding apparatus includes: a welding head unit having a welding head with a fixture insertion hole; a fixture for releasing the welding head from gripping a welding needle; a camera unit; and a robotic arm for exchanging welding needles. The welding head unit moves the welding head to an insertion position where the fixture aligns with the fixture insertion hole, and releases the welding needle from gripping by the fixture. With the welding needle released from gripping, the robotic arm exchanges welding needles in the insertion position.

The utility model relates to the technical field of LED packaging, in particular to a side-emitting multi-color integrated LED packaging structure, which comprises a ceramic substrate provided with a common-anode RGBW chip group. The RGBW chip set is directly welded on the ceramic substrate by adopting a flip chip design, the overall thickness of the packaging structure is less than or equal to 1.2 mm, the RGBW chip set is matched with preset solder paste below the RGBW chip set to be mounted on a bonding pad, the RGBW chip set is directly welded on the ceramic substrate by adopting the flip chip design, technologies such as gold wire bonding and matching with a film pasting technology are abandoned, and the packaging structure is simple in structure, convenient to manufacture and high in packaging efficiency. The overall thickness of the packaging structure is smaller than or equal to 1.2 mm, the packaging thickness is greatly reduced, the packaging structure can perfectly adapt to ultrathin application scenes such as side-entry backlight, the problem in the aspect of ultra-thinness in the traditional technology is effectively solved, the number of bonding pads is reduced to five by adopting the design that RGBW four-in-one chips share the anode / cathode, the anodes of the RGBW chips are connected in parallel, and the thickness of the packaging structure is greatly reduced. Only one common bonding pad and four independent bonding pads are needed, and the problem that bonding pad wiring is complex in the prior art is solved.

This utility model discloses an optocoupler chip processing system, including a material conveying module, which is equipped with a control unit, a conveying unit, and a chip placement unit. The control unit is connected to both the conveying unit and the chip placement unit. The conveying unit is used to convey the chip to be processed. A wire bonding module is connected to the chip placement unit and is used to electrically connect the chip to be processed to a substrate to obtain an optocoupler chip. A dispensing module is connected to the wire bonding module and is used to dispense adhesive onto the optocoupler chip. According to the technical solution of this embodiment, the efficiency of the optocoupler chip processing system can be improved while ensuring the consistency of adhesive dispensing for the optocoupler chip.

This invention relates to the field of LED packaging technology, specifically to an LED packaging structure with same-side die bonding. Multiple first and second chips are respectively disposed in a first mounting area and a second mounting area on opposite sides of a substrate, and electrical connections are achieved using a circuit layer. This avoids the limitation on the size of the first chip that can be mounted when the first and second chips are arranged on the same side of the substrate, as is the case with traditional methods. By concentrating multiple first chips used for light mixing in the first mounting area on the same side of the substrate, the light-emitting area is more concentrated. Simultaneously, the wire bonding distance is significantly shortened, the number of wires is reduced, and sufficient space is freed up to install larger-sized light-emitting chips, thereby effectively improving the overall brightness. It also avoids the light dispersion phenomenon caused by the mixing of chips and ICs in traditional solutions. Combined with short-pitch circuit connections, it improves the mixing consistency of different colors of light, further enhancing the electrical reliability and optical performance of the packaging structure.

An ultrasonic transducer configured to selectively operate at a first resonant frequency or a second resonant frequency during a wire bonding operation, comprising: an elongated transducer body having an aperture thereon for mounting a piezoelectric driver stack to drive the ultrasonic transducer to operate at the first or second resonant frequency; and a mounting flange connected to the transducer body at a first nodal vibration region of the transducer body when the ultrasonic transducer is operating at the first resonant frequency. The length of the elongated transducer body is substantially equal to two wavelengths of a first oscillatory wave transmitted along the length of the transducer body when the transducer is operating at the first resonant frequency, and substantially equal to one-half wavelength of a second oscillatory wave transmitted along the length of the transducer body when the transducer is operating at the second resonant frequency.

Silicon photonics technologies adds integrated optics functionality to CMOS integrated circuits thereby leveraging high volume manufacturing. Independent of geometry or technology these silicon photonic devices require packaging with single mode optical fibers to interface to the optical network and / or co-packaging with active semiconductor devices, discrete microoptoelectromechanical systems (MOEMS)s or monolithically integrated MOEMS. Stringent performance constraints and minimizing manufacturing costs / times are consistent demands on such photonic circuits. Accordingly, there is a demand for low-cost and low-loss optical coupling technologies for packaging that can easily be scaled for mass production that overcome limitations in the prior art. The inventors have established design methodologies, packaging schemes and component designs that leverage automated passive assembly techniques for speed / cost in combination with directly written optical interconnects that allow for offsetting the losses that would arise from the manufacturing tolerances of these passive assembly techniques.

The utility model provides a kind of clamping jaw assembly, pressing mechanism and wire bonding machine, in the clamping jaw assembly, the mounting hole is equipped on the clamping seat, the pressure ball is placed in the mounting hole;The clamping block is rotatably installed on the clamping seat by first pivot, the first end of the clamping block is used to be connected with the pressure ball, the second end of the clamping block is connected with the clamping seat by the elastic member;The position corresponding to the mounting hole of the first end of the clamping block is equipped with limiting structure, and the limiting structure is used to limit the pressure ball.When clamping segment is connected with pressure ball by moving downward, limiting structure will move to between mounting hole and pressure ball with clamping segment, will give pressure ball a lateral force, so that pressure ball is always positioned, realize limiting pressure ball, so as to limit the position of pressure ball, so that pressure ball does not move in mounting hole, prevent pressure ball to drive the workpiece to be pressed to move, solve the problem of die wafer partial welding.

The application relates to the technical field of LED, in particular to a positive LED chip with improved moisture resistance and a preparation method thereof. The positive LED chip comprises a substrate, an epitaxial layer, a P-type electrode, an N-type electrode and a passivation layer. The P-type electrode and the N-type electrode each have an electrode wire bonding area for wire bonding. The passivation layer covers part of the surface of the chip except the electrode wire bonding area. The height of the electrode wire bonding area in the direction perpendicular to the substrate is higher than the upper surface of the surrounding passivation layer. The application has the beneficial effect that the electrode wire bonding area of the electrode is physically lifted to be higher than the surrounding passivation layer. This fundamentally changes the stress interface of the solder ball during packaging and wire bonding, so that the force of the solder ball is completely borne by the solid electrode metal, thereby completely avoiding the problem of crushing and shearing the brittle passivation layer due to the offset or oversize of the solder ball, guaranteeing the integrity of the passivation layer from the source of structure and improving the moisture resistance and reliability of the chip.

This invention belongs to the field of aluminum wire bonding production technology, specifically relating to an automated drawing system for aluminum wire bonding production. The system includes a wire feeding device, a wire threading and drawing device, an intelligent wire storage device, a wire expansion and drawing device, and a wire take-up device arranged sequentially. The wire threading and drawing device performs initial diameter reduction and surface smoothing of the aluminum wire, and its internal oil supply structure effectively reduces friction damage during drawing. The intelligent wire storage device enables slow storage and release of the aluminum wire and automatic tension adjustment, ensuring that the operation of upstream and downstream processes does not interfere with each other. The wire expansion and drawing device uses a frustum-shaped expansion and drawing cylinder to perform secondary precise drawing and fine-tuning of the aluminum wire. The expansion strength detection component on the cylinder automatically adjusts the detection counterweight and rotational impact angle to perform real-time strength testing of the aluminum wire after drawing. This invention is rationally designed and can complete product quality sampling inspection of bonded aluminum wire without interrupting upstream production, thus improving the production efficiency of bonded aluminum wire.

The present application relates to the technical fields of acoustic electronic components processing, in particular to a kind of loudspeaker wire bonding machine, including processing platform, the top wall of processing platform is fixed with carousel, mounting plate and feeding clamp, the side wall of mounting plate is equipped with wire feeding motor, wire stripping blade motor, wire stripping blade assembly and wire clamp jaw, the top surface of processing platform is equipped with tin box and detection camera, wire feeding assembly is slidably connected in the top of feeding clamp, wire feeding assembly is connected with wire clamp assembly, the top wall of carousel is provided with installation slot.The present application completes wire pretreatment by wire clamp jaw cooperates with wire stripping blade assembly and tin box, captures workpiece solder joint position using detection camera and drives workpiece to lift and rotate alignment by lift cylinder cooperates with double rotary motor, solve the problem of poor precision, high labor intensity and low consistency in prior art, reach the effect of improving welding yield, realizing multi-station synchronous operation and full-process automation.

The utility model belongs to the microwave device technical field discloses a kind of microwave multilayer board intervertical interconnection circuit structure, including cavity, microwave multilayer board and radio frequency glass insulator;Microwave multilayer board is fixed in the two sides of cavity, glass insulator is set on the extension structure parallel to microwave multilayer board in cavity geometric center, and microwave multilayer board forms air coaxial structure, for being connected with microstrip circuit by bonding mode and realizing the matching transmission of microwave signal, the vertical interconnection of microwave multilayer board radio frequency circuit is completed.The utility model forms air coaxial structure between radio frequency glass insulator and microwave multilayer board to realize circuit matching, more simple than prior art using circuit mode matching.And gold wire bonding mode can realize automation assembly and improve assembly efficiency.

This invention discloses an implantable photoelectric sensor for luminescence response, relating to the field of biomedical photoelectric detection technology. By employing a lateral silicon photodetector with a coplanar electrode structure, the device can be directly integrated onto a circuit substrate via surface mounting, thus avoiding the wire bonding process required for traditional photodiodes and significantly simplifying device packaging and integration. The fabrication process of this photodetector does not require complex micro-nano lithography, multilayer alignment, or structure transfer processes; it can be achieved using only conventional semiconductor processes, offering advantages such as simple fabrication, low cost, and ease of large-scale manufacturing. Through integration with a micro-light source and wireless signal processing module, it can record luminescence signals within the body in real time during free biological activity. Furthermore, the luminescence response mechanism has good versatility and can be extended to the detection of various physiological or chemical signals such as oxygen concentration, ion changes, and metabolic processes.

This invention discloses a MOS for battery protection and its manufacturing method. The MOS for battery protection does not use wire bonding or copper clip structures, and the gate, source and drain of each chip are directly soldered to the base island. This makes the size of the molding compound close to the size of the MOS main chip, reducing parasitic resistance, parasitic inductance and thermal resistance of the package, thereby reducing the area and volume of the finished product, saving molding compound and PCB area, and making it more suitable for use in small spaces such as mobile phone batteries and Bluetooth headset batteries.

The capillary exchange unit includes: a supply module that moves the exchange capillary from the capillary accommodating portion to the capillary supply port in the supply direction; a replacement module that performs an operation of taking out the exchange capillary from the capillary supply port by moving the exchange capillary located at the capillary supply port along the axis line, and an operation of moving the taken-out exchange capillary along the axis line; and a transfer module that performs an operation of receiving the exchange capillary tube moved by the movement operation of the replacement module, and a transfer operation of linearly moving the received exchange capillary tube at a predetermined distance and rotating the exchange capillary tube at a predetermined angle.

This application provides a leadframe package structure with electromagnetic shielding, including a leadframe with a base island, ground pins, and non-ground pins; a chip structure disposed on the upper surface of the base island; a molding compound layer on the surface of the leadframe, wherein a first stepped groove is formed on the sidewall of the molding compound away from the upper surface of the leadframe; a ground connection layer located on the bottom wall of the first stepped groove; an electromagnetic shielding layer located on the surface of the molding compound; an electromagnetic shielding connector and a ground wire located within the molding compound, wherein both ends of the electromagnetic shielding connector are electrically connected to the ground connection layer and the electromagnetic shielding layer, respectively; and both ends of the ground wire are electrically connected to the ground connection layer and the ground pin, respectively, so that the electromagnetic shielding layer and the electromagnetic shielding connector are grounded. This structural design allows the leadframe package structure to form an electromagnetic shielding structure by setting a ground connection layer, an electromagnetic shielding layer, and an electromagnetic shielding connector, without requiring a complex wire bonding process.

This invention discloses a chip wire bonding inspection method, apparatus, electronic device, and storage medium, relating to the field of wire bonding inspection technology. It includes employing a hardware-triggered synchronization mechanism to connect a high-resolution optical microscope, X-ray computed tomography, and ultrasonic imaging system to acquire multimodal images, and integrating a high-precision vibration sensor to collect environmental vibration data, dynamically correcting the blur of the multimodal images; using a convolutional neural network and attention mechanism to extract multi-scale features from each modality of data, employing a cross-modal Transformer architecture for feature fusion, dynamically weighting the feature contributions of different modalities through a self-attention mechanism to highlight defect-related signals, introducing a graph neural network to model the wire bonding topology, capturing the spatial relationships between wire bondings, and generating a unified defect feature map; constructing an integrated model based on a gradient boosting decision tree and an online learning mechanism, and introducing an incremental learning algorithm.

This invention relates to the field of automated processing technology, and in particular to a buzzer wire bonding machine, comprising a circulation mechanism and a wire bonding mechanism. The circulation mechanism includes a turntable, on the top surface of which multiple positioning fixtures are arranged in a circular array around its center. A support plate is located above the turntable and does not rotate with it. There are two wire bonding mechanisms, arranged sequentially along the circumference of the turntable. Each wire bonding mechanism includes a wire clamping device and a welding device. The wire clamping device is located on the outer side of the turntable, and the welding device is located on the top surface of the support plate, with the clamping device and welding device positioned opposite each other. This invention enables automated wire bonding of buzzer coils, requiring no manual operation throughout the entire process. It achieves a high degree of automation and significantly improves welding efficiency compared to manual operation. Furthermore, during the welding process, workers can stay away from the welding machine, thus avoiding the safety hazards of injury from the welding machine.

This invention provides a packaging structure for an optoelectronic module, including a rigid-flex board (1) and a housing (2). The rigid-flex board (1) includes a DC flexible board (12) with a DC interface, an RF flexible board (14) with an RF interface, and a rigid board (16). The tails of the DC flexible board (12) and the RF flexible board (14) are connected by pressing together with the rigid board (16). The rigid-flex board bonding area at the tail of the rigid-flex board (1) is welded and fixed to the housing (2). The tail of the rigid-flex board (1) enters the interior of the housing (2). A gold wire bonding area (19) is provided on the rigid-flex board (1) inside the housing (2). This invention also provides an optoelectronic module assembly using the above-mentioned packaging structure and an optoelectronic module. This invention designs a rigid-flex board for signal transmission and directly connects the rigid-flex board to the housing to participate in gold wire bonding, which not only meets the multi-channel, small-size requirements of the optoelectronic module assembly but also solves the problem of poor isolation between channels in the original transition substrate.

The application provides a high-voltage electrostatic protection structure and a forming method thereof and a d-TOF device. The high-voltage electrostatic protection structure comprises a logic wafer, a first diode structure is arranged in the logic wafer, and the first diode structure is electrically connected at a first threshold voltage; a pixel wafer, a second diode structure is arranged in the pixel wafer, the second diode structure is connected in series with the first diode structure, and the second diode structure is electrically connected at a second threshold voltage; wherein a first end of the second diode structure is electrically connected to a high-voltage power supply end of the d-TOF device, a second end of the second diode structure is electrically connected to a first end of the first diode structure, and a second end of the first diode structure is electrically connected to a ground end of the d-TOF device. The high-voltage electrostatic protection structure can protect the d-TOF device from being damaged in a packaging or wire bonding process and in a power-on process of a high-voltage power supply or in a voltage unstable condition.

The application discloses a kind of power device aging state in situ monitoring system based on shell temperature, the shell temperature measurement system is connected with power device aging test module, the power device aging test module includes current source I d , measured power device Q1 and driving voltage source V GS ; the one end of the current source I d is connected with the drain of measured power device Q1, the other end of the current source I d is connected with the cathode of driving voltage source V GS And the source of measured power device Q1 are connected and grounded;The gate of measured power device Q1 is connected with the anode of driving voltage source V GS ;The shell temperature measurement system includes thermal resistance R T And shell temperature measurement and data acquisition system.The application can not only utilize shell temperature in situ online characterization power device aging trend, but also can be characterized in situ online power device wire bonding and solder layer serious aging state under the premise of not affecting power device work.

This utility model discloses a flip-chip integrated RGB LED chip, relating to the field of LED lighting technology. It includes a substrate, an RGB IC chip, at least three flip-chip LEDs, and a packaging structure. Both the RGB IC chip and the flip-chip LEDs are soldered to the surface of the substrate using a flip-chip eutectic process, and the RGB IC chip and the flip-chip LEDs are electrically connected. The packaging structure covers the RGB IC chip and the flip-chip LEDs, forming an integrated package. The flip-chip LEDs include at least three different luminous colors, with 1-6 chips of each color. The flip-chip LEDs are connected in series or parallel. The push-pull force of the flip-chip eutectic process in this invention is more than 50 times higher than that of gold wire bonding, completely avoiding the problem of dead LEDs caused by gold wire breakage.

This invention discloses a MEMS inertial device based on a BGA ceramic substrate. Using a BGA ceramic circuit substrate as a carrier, a bare MEMS inertial information processing integrated circuit chip, a bare MEMS inertial sensing structure chip, and several passive devices are integrated in a three-dimensional high-density hybrid manner. The bare MEMS inertial information processing integrated circuit chip and the bare MEMS inertial sensing structure chip are integrated on the upper surface of the BGA ceramic circuit substrate by gold wire bonding, forming a three-dimensional stacked structure. Resistors and capacitors are integrated on the lower surface of the BGA ceramic circuit substrate by reflow soldering. This invention achieves a small-volume, lightweight MEMS inertial device through the three-dimensional stacking integration of bare chips and passive devices.

This invention relates to the field of welding processing equipment technology, and discloses a processing device for wire bonding of metal spring sheets. The device includes a first support block, a blocking mechanism, a limiting mechanism, two U-shaped blocks, a top block connected to the top of the U-shaped blocks via a support member, a first groove opened at the upper end of the top block, a solder column feeding groove communicating with the first groove, a first limiting block, a second limiting block, a pressure sensor, a solder column feeding and cutting mechanism, a wire limiting assembly, a solder column guiding mechanism, and a welding mechanism. The top block is inverted U-shaped, with its concave surface fitting against the U-shaped spring sheet body. The welding feet of the U-shaped spring sheet body are slidably disposed in the concave part of the U-shaped block. The blocking mechanism and the limiting mechanism respectively abut against both ends of the U-shaped spring sheet body. This invention has the advantages of high automation, precise welding positioning, fixed-length solder column feeding and cutting, and stable welding quality, solving the problems of low efficiency and poor consistency in manual welding.

The application provides a CMOS-MEMS integrated pressure sensor and a preparation process thereof. The pressure sensor comprises a bonded MEMS wafer and a CMOS wafer; a bonding sealing area and a PAD vertical interconnection structure in the bonding sealing area are arranged between the MEMS wafer and the CMOS wafer; the bonding sealing structure is formed by eutectic bonding of a metallization layer and a metal solder ball formed in corresponding bonding areas of the two wafers, and the bonding sealing structure surrounds a sensitive element to form a sealed cavity; the PAD vertical interconnection structure comprises conductive bumps respectively formed on the two wafers, the two conductive bumps are aligned with each other and bonded, and electrical interconnection between the MEMS wafer and the CMOS wafer is realized. The electrical interconnection of the pressure sensor realizes monolithic integration, not only improves the problems of increased signal transmission loss, reduced detection precision caused by additional parasitic resistance, capacitance and inductance introduced by wire bonding, and external noise interference, but also improves the service life and reliability, and reduces the size of the chip.

This disclosure provides an optical module, including a circuit board and an optical emitting component. An electrical signal output by a driver chip on the circuit board is converted into signal light by the optical emitting component. The optical emitting component includes a substrate, a first differential signal region, a first filter capacitor, and an EML laser. The circuit board has a first signal pin connection, and the first filter capacitor is connected across the first signal pin and the first differential signal region, replacing wire bonding connections, reducing impedance discontinuities between the driver chip and the first differential signal region, and improving signal integrity.