85results about How to "Reduce electrical impedance" patented technology

The present invention relates to methods and devices for formation of microconduits in tissue, particularly using an impedance sensing drill to form microconduits. One embodiment of the invention is an impedance sensing drill comprising a drilling assembly, a control module, mechanically connected to the drilling assembly for controlling the depth of drilling by the drilling assembly; and a sensor, electrically connected to the drilling assembly and control module for detecting a change in an electrical impedance of a material being drilled. Another embodiment is a method of forming a microconduit in a material, which comprises the steps of drilling into the material, monitoring an electrical impedance of the material, and stopping the drilling into the material when a change in the impedance is detected, thereby forming microconduit.

A leadless plastic chip carrier is fabricated by selectively etching a leadframe strip to reduce a thickness of the strip at a portion thereof. Selectively masking the surface of the leadframe strip using a mask, follows selectively etching, to provide exposed areas of the surface at the portion and contact pad areas on leadframe the strip. At least one layer of metal is deposited on the exposed areas to define a die attach pad on the portion of the leadframe strip with reduced thickness and to define contact pads on the surface of the strip. At least one semiconductor die is mounted to the die attach pad, followed by wire bonding the at least one semiconductor die to ones of the contact pads. The at least one semiconductor die, the wire bonds, and the contact pads are covered with an overmold material and the leadframe strip is etched to thereby remove the leadframe strip. The leadless plastic chip carrier is singulated from the leadframe strip.

The present invention relates to inter-chip electrostatic discharge (ESD) protection structures for high speed, and high frequency devices that contain one or more direct, inter-chip signal transmission paths. Specifically, the present invention relates to a structure that contains: (1) a first chip including a first circuit, (2) a second chip including a second circuit, (3) an intermediate insulator layer located between the first and second chips, wherein the first and second circuits form a signal transmission path for transmitting signals through the intermediate insulator layer. An electrostatic discharge (ESD) protection path is provided in the structure between the first and the second chip through the intermediate insulator layer, to protect the signal transmission path from ESD damages.

A ceramic microporous polyolefin battery separator membrane, high in air permeability, low in shrinkage and improved temperature resistance addresses the safety requirements of lithium ion batteries. The separators made by the current invention consists of one or more polyolefin polymers and kaolin fillers comprised of aluminum oxide and silicon oxide. The membranes of current invention have a thickness of 5-200 microns, air permeability of 1-200 sec/10 cc (Gurley seconds), and average pore diameter of less than 1 micron.

A flexible printed circuit board has an insulation layer, a first signal wiring layer including a microstrip line, a second signal wiring layer including a signal connection terminal for allowing the microstrip line to connect the exterior connector electrically, and a ground conductive section having a ground connection terminal for connecting the exterior connector. The microstrip line and the signal connection terminal are connected to each other by a wiring via hole. The wiring via hole passes through the insulation layer, the first signal wiring layer, and the second signal wiring layer. The microstrip line has a taper section which gradually enlarges a width of the microstrip line toward the wiring via hole in the vicinity of the wiring via hole. The ground conductive section that corresponds to the microstrip line has a taper section with a shape matching the taper section of the microstrip line.

A high-frequency BGA device (500) with the chip (501) assembled by metal bumps (503) on an insulating substrate (502) with conductive vias (505) and metal traces (504). Chip bumps which serve the high frequency signal terminals are attached directly to the lands (510) on the vias in order to minimize parasitic electrical parameters such as inductance, resistance, and IR drops, thus achieving the required 0.1 nH inductance for each chip terminal. Chip bumps which serve the remaining chip terminals are attached to pads on certain substrate traces. In both cases, the bumps can be attached reliably because the lands on the vias and the pads on the traces are plated with additional metal layers (511, 512), which provide extra thickness as well as a metallurgically suitable surface.

A method for manufacturing a multi-layer acoustic transducer with reduced total electrical impedance. The method is based on the bonding of two piezoelectric ceramic layers with confronting metallized surfaces to a thin electrical conductor, then electrically connecting the top and bottom surfaces to form a wrap-around electrode while a center conductor forms a second electrode. The total electrical impedance of a two-layer ceramic stack comprised of piezoelectric layers connected in this manner is one-fourth that of a solid ceramic element of the same size. This provides for better matching of the acoustic stack impedance to that of the electrical cable, increased penetration depth for imaging within the body, and improved acoustic element sensitivity.

The invention provides a convenient and non-invasive means to prepare cells, tissues, and organs for electrical transmission and reception. In an embodiment of the invention, a control method comprises the use of at least one skin electrode, as a reference electrode, and an electrical sensor to measure periodically or continuously the skin's electrical conductance at the site of preparation. The dynamic change in the conductance through the skin is measured while the ultrasound is applied. Signal processing is performed on the measurement and the level of skin impedance change is controlled by performing a mathematical analysis and using the results of such analysis to control the application of ultrasonic energy. A desired level of skin impedance can be set at a predetermined value or based on a chosen level of skin integrity, subject's sensation of discomfort, or duration of the ultrasound application.

A method for producing transducers having a 1-3 composite structure. The transducer element includes a plurality of thin piezoceramic wafers which are electroded on opposing major surfaces. The spaced wafers are separated by a passive polymer layer in a composite structure and the electrodes on the opposing major surfaces are connected to different ones of top and bottom electrode surfaces.

According to one embodiment, a docking station is provided with a support surface configured for supporting a back surface of a portable electronic device, a rotating cradle configured for receiving a base of the portable electronic device, and a floating docking connector that extends out of a recess of the rotating cradle for connecting to a docking connector of the portable electronic device. According to one embodiment, the support surface of the docking station may include one or more magnetic structures, which are positioned to align with one or more magnetic structures on the back surface of the portable electronic device and configured to provide a magnetic force to retain the portable electronic device on the support surface.

Methods for preparing a multi-layer acoustic transducer with reduced total electrical impedance. The methods are based on the stacking of individual piezoelectric layers with metallized surfaces to form a plate in which the metal layers are electrically connected to form interdigitated electrodes. The total electrical impedance of a multi-layer stack comprised of piezoelectric layers connected in this manner is inversely related to the square of the number of layers in the stack. This provides for better matching of the acoustic stack impedance to that of the electrical cable and improved acoustic element sensitivity.

Microfluidic devices having an electrowetting configuration and an optimized droplet actuation surface are provided. The devices include a conductive substrate having a dielectric layer, a hydrophobic layer covalently bonded to the dielectric layer, and a first electrode electrically coupled to the dielectric layer and configured to be connected to a voltage source. The microfluidic devices also include a second electrode, optionally included in a cover, configured to be connected to the voltage source. The hydrophobic layer features self-associating molecules covalently bonded to a surface of the dielectric layer in a manner that produces a densely-packed monolayer that resists intercalation and or penetration by polar molecules or species. Also provided are microfluidic devices having an electrowetting configuration that further include a section or module having a dielectrophoresis configuration; systems that include any of the microfluidic devices in combination with an aqueous droplet and a fluidic medium immiscible with the medium of the aqueous droplet; related kits; and methods of manipulating droplets, optionally containing micro-objects such as biological cells, within the microfluidic devices.

A system for assessing occlusion of a region to blood flow includes a catheter with an inflatable member, a first electrode configured for placement upstream of the inflatable member and the second electrodes configured for placement downstream of the inflatable member, the inflatable member configured for inflation to occlude the blood flow through the region. The system further includes a current/voltage source, a resistor and a voltmeter, wherein these components along with the first and second electrodes are configured to form an impedance measuring circuit configured to detect a change in impedance for indicating occlusion of the region to the blood flow.

An apparatus for locating a fault within an optical fiber is disclosed. The apparatus, which can be formed as a part of a fiber-optic transmitter or as a stand-alone instrument, utilizes a vertical-cavity surface-emitting laser (VCSEL) to generate a test pulse of light which is coupled into an optical fiber under test. The VCSEL is subsequently reconfigured by changing a bias voltage thereto and is used as a resonant-cavity photodetector (RCPD) to detect a portion of the test light pulse which is reflected or scattered from any fault within the optical fiber. A time interval Δt between an instant in time when the test light pulse is generated and the time the reflected or scattered portion is detected can then be used to determine the location of the fault within the optical fiber.

The invention discloses an oxide semiconductor thin film transistor and a preparing method thereof, the thin film transistor comprises a substrate, a gate electrode disposed on the substrate, a semiconductor insulation layer disposed on the substrate and the gate electrode, an oxide semiconductor layer disposed on the semiconductor insulation layer, a pattern semiconductor layer disposed on the oxide semiconductor layer, a source electrode and a drain electrode respectively disposed on the pattern semiconductor layer and be a metal layer. The oxide semiconductor thin film transistor and a preparing method thereof are characterized in that, the pattern semiconductor layer is added between the oxide semiconductor layer and the metal layer, thereby protecting the oxide semiconductor layer from damage of etching liquid, obtaining lower electrical impedance to form ohmic contact and to obtain optimum electricity. Additionally, the number of photographic masks required by the technique is reduced, and effect of reducing production cost can be reached via matching of a wet etching technique and a dry etching technique.

The present invention is directed to a physiological recording device and, more particularly, to a physiological recording device that can be used without skin preparation or the use of electrolytic gels. The invention is further directed to an encouragement ring which stabilizes and helps situate the physiological recording device on a subject's skin to help provide a better electrical signal, increase surface area, and reduce and minimize noise and artifacts during the process of recording or monitoring a physiological signal. The invention is still further directed to surface features on a surface of the physiological recording device with a size and shape that will not substantially bend or break, which limits the depth of application of the recording device, and/or anchors the recording device during normal application. The invention is even further directed to a method for manufacturing a physiological recording device, and minimizing cost of manufacture.

The invention proposes an interposer assembly architecture for noise suppression circuits on the package of a CPU or high power, high frequency VLSI device. In this architecture, charge is stored on dedicated capacitors at a voltage substantially higher than the operating voltage of the VLSI device. These capacitors are mounted upon active circuits that are packaged to match the size and form factor of the capacitors and this assembly is then attached to the package substrate. Charge is conveyed from the capacitor terminals on the backside of the packaged active circuits chip. Depending upon the capacitor construction, these terminals may either be double-sided contact terminals along the edge of the active device's package, or may be feed-through contacts. The active device attaches to the package substrate through both edge terminals and terminals built-up on the surface of the chip, increasing it's number of electrical pathways into the package substrate, matching the package substrate interconnect and reducing the electrical impedance of the charge flow path. The circuits within the active device may be any combination of semiconductor switches and/or voltage regulators, and may also contain voltage and current sensing circuitry.