530 results about "Lead bonding" patented technology

The invention provides a bonding wire defect detection method based on deep learning, which can be used for identifying the defect type of a bonding wire and automatically detecting the bonding quality problem of the wire in an integrated circuit product, and aims to solve the problems of high labor intensity, low detection efficiency and the like. The process comprises the following steps: establishing a bonding wire acquisition physical platform, acquiring a depth image of a bonding wire through a stereo camera, preprocessing the acquired depth image to enhance the image quality, generating a normal diagram corresponding to the depth image through geometric transformation, and stacking the normal diagram and the depth diagram to obtain a final bonding wire data set. Performing data enhancement on the bonding wire data set to expand the data scale; a Depth-YOLO network model is provided, an input layer of an original YOLO model is reconstructed, and an input feature enhancement module is designed; and finally, training a Depth-YOLO model by using the self-built data set, and carrying out end-to-end bonding wire defect detection by using the model.

The invention relates to the technical field of chip packaging, and discloses a method and system for packaging a storage chip based on lead bonding, and the method comprises the steps: carrying out the front-end processing of the storage chip, and obtaining a target storage chip; evaluating expected application performance corresponding to the target memory chip, calculating a bonding adaptation coefficient between the target memory chip and the lead bonding material, and screening out a corresponding optimal bonding material from the lead bonding material; collecting a chip initial image corresponding to the target storage chip, identifying a lead bonding original point, a lead bonding end point and a middle welding point in the chip welding points, and calculating the welding point circularity corresponding to the middle welding point; determining optimal welding spots from the middle welding spots, planning a lead bonding path corresponding to the target storage chip, and analyzing a physical representation attribute corresponding to each welding spot in the optimal welding spots; and performing bonding packaging processing on the target storage chip to obtain a packaged storage chip. The invention mainly aims to solve the problem that the packaging quality of the storage chip is reduced.

The invention discloses a lead bonding method and device based on dynamic self-adaption, equipment and a storage medium. The method comprises the following steps: based on position information of a first bonding point, position information of a second bonding point and parameter information of a lead, performing path planning on lead bonding through a multi-objective optimization algorithm, and generating an initial bonding path in a preset line arc shape; bonding a lead to a first bonding point of the chip bonding pad and applying energy, pulling the lead to the substrate bonding pad according to the generated initial bonding path, and monitoring bonding path information of the lead in real time in the pulling process; and when the monitored bonding path information of the lead exceeds a preset threshold range, dynamically adjusting the initial bonding path, pulling the lead to a second bonding point of the substrate bonding pad based on the adjusted bonding path, and applying energy to the second bonding point to obtain a chip after lead bonding. According to the invention, the problem of short circuit or poor contact caused by lead overlapping can be avoided, and the lead bonding efficiency is effectively improved.

A wire bonding apparatus (100) comprises: a supply (108) of bond wire (102); a first motor (114) to advance the bond wire (102) from the supply (108); a wedge (110) to perform wire bonding by forming a first bond and a second bond, the second bond separated by a distance from the first bond; a wire guide (104) adjacent the wedge (110) for guiding the bond wire (102) toward the wedge (110); and a second motor (118) to advance the bond wire (102) into the wire guide (104), the second motor (118) configured to feed a length of the bond wire (102) after formation of the first bond and before formation of the second bond, the length greater than the distance between the first and second bonds.

According to one embodiment, a controller of a wire bonding apparatus is configured to calculate a height of a bump based on a diameter of a ball-shaped portion detected by a diameter detecting part, a first position of a bonding tool detected by a position detecting part when a load sensor detects a load at a bonding point, and a second position of the bonding tool when the bonding tool is lowered most at the bonding point, and to bond a wire based on the calculated height of the bump. The controller is further configured to acquire a plurality of the first positions of a plurality of the bumps formed on a chip, and to calculate a relative positional relationship of the plurality of first positions.

The invention discloses a packaging structure and a packaging method of a SiP module based on a ceramic material, the packaging structure takes the ceramic material as a packaging shell, the position of a substrate part of the shell is designed to be a concave staggered layer structure, so that the assembly of chips and passive devices with different sizes and different heights is facilitated, and because the internal circuit of the SiP module is complicated and the number of interface pins is large, the packaging cost is low. Therefore, a ball grid array pin mode is adopted outside the shell, a metallization layout design is carried out on the ceramic substrate to realize chip assembly bonding pad and partial circuit wiring, and meanwhile, through hole metallization slurry filling is designed between substrates to realize connection of an internal metallization bonding pad and an external ball grid array pin. And a specific chip and a passive device are assembled at different positions, and lead bonding interconnection is assisted, so that a complete packaging process of a specific circuit SiP module is realized. The power distribution cabinet has the advantages of being good in insulation performance, ultrahigh in integration level, ultra-light in weight, fast in heat dissipation, high in reliability and the like, and has very high popularization value.

The invention provides a packaging method for a double-color-temperature COB light source, and relates to the technical field of LED light source packaging. The packaging method of the double-color-temperature COB light source comprises the following steps of (1) substrate pretreatment, (2) chip die bonding, (3) lead bonding, (4) fluorescent powder layer preparation, (5) packaging glue filling and (6) curing treatment. The substrate is subjected to special pretreatment, so that the adhesive force between the substrate and the packaging material is improved, and the reliability of the light source is enhanced. Through high-precision chip die bonding and an optimized lead bonding process, the chip position precision and the electrical connection reliability are ensured, and the optical performance consistency of the light source is improved. Through precise fluorescent powder proportion regulation and control and an ink-jet printing coating technology, precise regulation and control of double color temperatures are achieved, and the lighting requirements of different scenes are met. Through precise fluorescent powder proportion regulation and control and an ink-jet printing coating technology, precise regulation and control of double color temperatures are achieved, and the lighting requirements of different scenes are met.

The invention discloses a stacked chip lead bonding packaging structure and a preparation method. The preparation method comprises the following steps: preparing a temporary bonding adhesive film layer on the surface of a glass slide; preparing a metal anti-reflection layer on the surface of the temporary bonding adhesive film layer; preparing a rewiring layer on the metal anti-reflection layer; mounting and stacking a chip group on the surface of the rewiring layer; performing plastic packaging; removing the glass slide, and exposing the temporary bonding adhesive film layer; removing the temporary bonding glue layer to expose the metal anti-reflection layer; removing the metal anti-reflection layer to expose the metal bonding pad; solder balls are arranged on the metal bonding pads; and grinding and cutting to obtain the packaging body. According to the invention, the rewiring layer is used for replacing an organic substrate, a plurality of chips are mounted on the rewiring layer, interconnection among the chips is carried out through lead bonding, and signals are connected to the rewiring layer through lead bonding, so that the organic substrate is omitted, the risk of material breakage caused by imbalance of supply and demand is avoided, and the packaging cost is reduced; the method is suitable for industrial popularization.

A method of forming a wire bond assembly includes wire bonding a first end of a first bond wire to a first conductive bonding surface arranged on a first substrate to form a first conductive bond formation; wire bonding a second end of the first bond wire to a second conductive bonding surface arranged on a second substrate to form a second conductive bond formation, wherein the second substrate; forming a conductive structure on top of the first conductive bond formation; wire bonding a first end of a second bond wire to a top of the conductive structure to form a third conductive bond formation; and wire bonding a second end of the second bond wire to the second conductive bonding surface to form a fourth conductive bond formation, wherein the fourth conductive bond formation is laterally separated from the second conductive bond formation on the second conductive bonding surface.

The invention discloses a composite sheet for chip bonding and a preparation method thereof, and belongs to the technical field of electronic packaging, the product is compounded by a copper sheet and a silver-containing pre-sintered layer which are arranged in a specific size and composition, the heat conductivity and the electric conductivity of the material are high, and lead bonding only needs to be directly realized on the surface of the copper sheet during use, so that the production cost is reduced, and the production efficiency is improved. Chip bonding can be completed by connecting the silver-containing pre-sintered layer with the chip, additional operation is not needed, use is convenient, and it is guaranteed that the chip cannot be damaged.

The invention discloses a discrete device packaging structure based on direct lead bonding, which belongs to the technical field of semiconductor device packaging and comprises a power semiconductor chip, a drain metal substrate, a grid lead terminal, a drain lead terminal, a bonding wire and a supporting shell. The drain electrode metal substrate is connected with the lower surface of the power semiconductor chip through solder. The gate metal electrode on the upper surface of the power semiconductor chip is connected with the gate lead terminal through a bonding wire, and the source metal electrode on the upper surface of the power semiconductor chip is connected with the source lead terminal through solder. The interior of the supporting shell is filled with silica gel or an injection molding process, and the supporting shell covers the power semiconductor chip to serve as an insulating medium. The power density of the device is improved, the parasitic parameter of the whole device is reduced, and the reliability of the interconnection structure is improved.

The invention discloses a Z-direction positioning system for a welding area of a lead bonding machine and a force position switching method. The system comprises a point cloud processing module and a visual module, the visual module is used for positioning and extracting welding spots in a welding area through image shooting; and the point cloud processing module obtains point cloud data of the welding area through visual identification and carries out fusion processing on the obtained point cloud data and the welding spot position data extracted by the visual module so as to calculate Z-direction position information of each welding spot in the welding area. The method performs force position switching control according to a calculation result of the system. The beneficial effects are that compared with traditional two-dimensional positioning data, the three-dimensional point cloud processing module is combined with the traditional two-dimensional positioning data to realize target identification and positioning of the chip and the substrate, and the precision and accuracy are higher. By measuring the heights of the chip and the substrate and using the position deviation as a force position switching condition, more stable force position switching operation can be realized, and the precision and consistency of lead bonding are improved.

The invention discloses a lead bonding method for a vacuum solid hybrid device similar to 3D laminated packaging, and the method comprises the following steps: S1, dividing all leads with the same height difference between a chip bonding pad and a pin bonding pad into the same group of leads according to the definition of electrical connection; s2, the high point position of each group of lead bonding is defined as a chip bonding pad and is a first lead bonding point, and the low point position of each group of lead bonding is defined as a pin bonding pad and is a second lead bonding point; and S3, the bonding mode of each lead is as follows: after a convex section is arranged from the first welding point, a first folding point (K1) is formed, then the convex section is connected with the concave section and is connected with a reverse section, the reverse section is connected with a second folding point (K2), and a platform section opposite to the first welding point is arranged behind the second folding point (K2). According to the method, the bonding efficiency can be improved, the reliability of the bonding wire is ensured, and the performance stability of the device is improved.

A wire bonding array is provided. The wire bonding array includes a plurality of wire bonding systems, each of the plurality of wire bonding systems including (i) an input workpiece handling system and (ii) a bond head assembly configured to carry a wire bonding tool. The wire bonding array also includes a robot configured to provide workpieces to the input workpiece handling system of each of the plurality of wire bonding systems, the robot including a carriage for moving with respect to the plurality of wire bonding systems, the carriage being positioned above a receiving portion of the input workpiece handling system.

The utility model discloses a work fixture for lead bonding of a polyhedral three-dimensional structure device, which is structurally characterized in that a large U-shaped groove and a small U-shaped groove are formed in the center of a base, a U-shaped plate is arranged in the large U-shaped groove, two connecting rods I symmetrically penetrate through connecting rod mounting holes in the side wall of the U-shaped plate and the side wall of the adjacent large U-shaped groove, and a first handle is arranged at the end part of one connecting rod I; first sliding blocks are symmetrically arranged on the two side walls of the U-shaped plate, and ball screws are installed in the screw installation holes. The middle of a connecting rod II penetrates through the center of the bottom of the U-shaped plate, a supporting block is arranged at the upper end of the connecting rod II, a polyhedral three-dimensional structure device is arranged on the supporting block, and a second handle is installed at the lower end of the connecting rod II and located in the small U-shaped groove; a sliding block base protrudes out of the side wall of the supporting block, and a second sliding block is installed in the sliding block base. And four groups of bead screws are uniformly mounted around the center of the bottom of the U-shaped plate at intervals. The multi-surface three-dimensional structure device lead bonding tool has strong practicability, the device is convenient to clamp and overturn, and the multi-surface three-dimensional structure device lead bonding efficiency can be effectively improved.

The invention belongs to the technical field of chip packaging, and particularly discloses a wire bonding method for continuous welding, which adopts a continuous welding method and an alloy wire bonding and gold wire ball filling method, avoids adverse effects of a heat affected zone of a wire on welding strength through a continuous welding mode, and improves welding quality. A heat affected zone generated during ball making of a first welding point is avoided in an alloy wire bonding and gold wire ball supplementing mode, the defect that the hardness of an alloy wire ball is large is overcome, the vibration strength of an effective lead part is enhanced, connection between a lead and a lead column is more reliable, transition is smoother, high-reliability connection between a chip assembly and a metal Dewar device is achieved, and the service life of the chip assembly and the metal Dewar device is prolonged. The signal output stability and accuracy of the detector are improved, and the assembly yield of the refrigeration type infrared detector is improved.

The invention discloses a wire bonding machine force position control method based on force estimation. The method comprises the following steps: measuring the current of a voice coil motor for driving bonding based on a designed force estimator so as to estimate the value of contact force; setting a force estimation threshold value F0 and a speed threshold value v0, and designing a force / position control strategy according to the estimated contact force Fcontact and the bonding motion speed v measured by the grating ruler; the force / position control strategy obtained through design is as follows: when Fcontact is less than F0, position control is performed on the bonding head; when Fcontact is larger than or equal to F0 and v / vref is smaller than v0, force control is adopted for the bonding head; and when Fcontact is greater than or equal to F0 and v / vref is greater than or equal to v0, performing position control on the bonding head. The method has the advantages that a force sensor does not need to be installed on the bonding head, the data information of the position sensor is accurately utilized, force estimation is achieved through an estimation algorithm, and therefore the design cost of a system is reduced while the bonding precision of the bonding head is improved.

The invention discloses a wire arc parameter compensation method and device of a wire bonding machine, computer equipment and a medium, and the method comprises the steps: determining a wire arc shape and a wire arc parameter based on the packaging demand of a target chip; based on the line arc shape and the line arc parameter, welding the target chip to form an initial line arc; whether the initial line arc meets a preset welding requirement or not is determined; if the initial line arc does not meet the preset welding requirement, compensation parameters are determined, and the compensation parameters comprise at least one of angle compensation and line length compensation; and compensating the wire arc parameter based on the compensation parameter, and welding the target chip based on the compensated wire arc parameter and the wire arc shape to form a qualified wire arc meeting the preset welding requirement. In the embodiment of the invention, the line arcs of different angles and different line lengths of the device are compensated to adjust the height and the pay-off deviation of the line arcs, so that a relatively good height compensation effect is obtained.

A wire guide configured for use with a wire bonding system is provided. The wire guide includes a body portion configured to receive a wire. The body portion includes a tip portion at an end of the body portion. The tip portion defines an opening through which the wire exits the wire guide. The tip portion includes a protrusion adjacent the opening.

A semiconductor device module for use in high-power applications incorporates a lead frame and a wire bonding scheme designed to improve reliability and reduce cost. A combination of aluminum wire bonds and gold wire bonds can be used to connect dies of different sizes, formed on different substrates, or that use different bonding materials to a shared underlying structure. Instead of making direct connections between the dies, the different types of wire bonds can be coupled to an intermediate floating pad.

A wire bonding system is provided. The wire bonding system includes a bond head assembly configured to carry a wire bonding tool. The wire bonding system also includes a support structure configured to support a workpiece. The workpiece is configured for wire bonding. The wire bonding system also includes a movable stage assembly including a movable stage configured to move with respect to the wire bonding tool. The wire bonding tool is configured to press a wire engaged with the wire bonding tool against the movable stage to create a deformed portion of the wire.

The invention relates to the technical field of semiconductor packaging, and discloses a packaging method and equipment for a strong exhaust chip, and the packaging method comprises the steps: carrying out the thin film deposition of the surface of a chip body, carrying out the micromachining of a porous ceramic substrate, forming an installation groove and an air flow channel, fixing a pretreatment body in the installation groove based on a preset adhesive, and carrying out the packaging of a strong exhaust chip. Carrying out lead bonding on the conductive layer and the conductive path, coating the electric connection assembly with multiple layers of preset polymers, carrying out enhanced filling on the pre-packaged assembly based on a preset filler, and carrying out surface smoothing treatment on the pre-packaged assembly after enhanced filling to obtain a strong exhaust chip; after the pretreatment body is fixed, the cofferdam structure is dispensed with the silicone-based adhesive and is dynamically cured, the cofferdam structure effectively prevents external pollutants from entering, and the conductivity of the electric connection assembly is optimized due to the combination of lead bonding and the silicone-based adhesive; and the stable working state of the chip in the high-efficiency heat dissipation and gas emission process is further ensured.

The invention provides a lead bonding and packaging device and a lead bonding and packaging method for a key process for packaging a deep cavity lead of an immersion type miniature liquid pressure sensor. The lead bonding packaging equipment comprises a rack, a movement mechanism mounting plate, an X-axis movement mechanism, a Y-axis movement mechanism, a first Z-axis movement mechanism and a second Z-axis movement mechanism, the movement mechanism mounting plate, the X-axis movement mechanism, the Y-axis movement mechanism, the first Z-axis movement mechanism and the second Z-axis movement mechanism are all mounted on the rack, a clamping mechanism is mounted on the X-axis movement mechanism or the Y-axis movement mechanism, and a visual microscopic mechanism is mounted on the first Z-axis movement mechanism. And a chopper positioning mechanism is mounted on the second Z-axis movement mechanism. According to the technical scheme provided by the invention, the alignment accuracy and stability in the wire leading process can be ensured, the yield and consistency of deep cavity bonding are improved, manual intervention and operation errors are reduced, automation of the wire bonding process is realized, the bonding precision and stability are improved, and the method has relatively high practicability and popularization value.

The invention belongs to the technical field of chip packaging, and particularly relates to a microchip packaging structure with mixed lead bonding and a packaging method.The microchip packaging structure comprises a carrier plate, a plurality of chips are stacked on the upper surface of the carrier plate in a staggered mode, the carrier plate is in bonding connection with the chips attached to the carrier plate through first leads, and every two adjacent odd-number chips are in bonding connection through second leads; every two adjacent chips in the even number position are in bonding connection through a third lead, every two adjacent chips on the uppermost layer are in bonding connection through a fourth lead, the multiple chips are stacked in a staggered mode, lead bonding between every two chips is facilitated, meanwhile, the structure is stable, occupied transverse space is reduced, and the chip packaging structure is a micro chip packaging structure and is suitable for installation and use of micro equipment.

The present invention refers to a hybrid integrated silicon drift detector (HiSDD) for X-ray detection, particularly to a HiSDD combining a silicon drift detector (SDD) with a low-noise preamplifier on a SDD sensor chip to improve the electrical and structural properties of the detector assembly. The invention further refers to a corresponding method for the fabrication of a HiSDD. A HiSDD according to the invention hybridly integrates a silicon drift detector, SDD, sensor chip and a preamplifier module; wherein electrically conductive paths are formed on a surface of the SDD sensor chip, having first ends configured for flip chip bonding and second ends configured for wire bonding; wherein the preamplifier module having contacts disposed on a surface of the preamplifier module, and wherein the first ends of the electrically conductive paths are flip chip bonded to the contacts of the preamplifier module.

Purpose is to realize a flexible electronic device of high reliability. The present invention takes a following structure to realize the purpose. An electronic device including: a plurality of element areas, famed from a first organic insulating film, and formed in island shape arranged in a first direction with a first space and arranged in a second direction with a second space, in which an element, a first wiring extending in the first direction and a second wiring extending in the second direction are formed in each of the plurality of element areas, the first wirings famed in the plurality of the element areas are connected with each other by a first wire bonding in the first direction, and the second wirings famed in the plurality of the element areas are connected with each other by a second wire bonding in the second direction.

The invention relates to the technical field of semiconductor packaging, and discloses a semiconductor packaging method and system, and the method comprises the steps: obtaining the demand parameters of a to-be-packaged chip, and the demand parameters comprise the demand chip specification and the demand pin number; cutting a wafer according to the required chip specification to obtain a required chip; a substrate is processed according to the required chip specification, the substrate is divided into a chip mounting area, a limiting area, a bonding pad area and a non-bonding pad area, and the limiting area is arranged at the edge of the chip mounting area; coating a bonding agent on the chip mounting area to form a bonding layer; mounting the required chip on the bonding layer, and curing the bonding agent; and carrying out lead bonding in the bonding pad area, and carrying out plastic packaging on the bonded chip. According to the semiconductor packaging method provided by the invention, the inside and the outside of the limiting area can be effectively protected, the adhesive is prevented from overflowing to the bonding pad area on the substrate, and the manufacturing process and the yield of products are improved.

Described herein are isolator devices designed to reduce cracking and mechanical stress despite the use of wire bonds made of hard materials (e.g., copper-based). The isolators employ thin film dielectric materials with high dielectric strength and permittivity underneath the top coil (electrode) to enhance the isolation of the device. However, these materials are susceptible to cracking. Described herein are designs in which the dielectric material is partially removed from the isolator. A dielectric layer may be kept in the region(s) where its large dielectric permittivity is particularly beneficial (e.g., near the edge of a coil) but may be removed from the region immediately underneath the bonding pad, where a large amount of pressure is applied during the bonding process. Optionally, a cushion layer is employed to absorb some of the energy produced during the bonding process.

The invention relates to the technical field of bonding equipment displacement compensation, in particular to a high-speed lead bonding equipment motion platform displacement error dynamic compensation method and device, and the method comprises the steps: carrying out the real-time collection of state parameters of a motion platform, and obtaining multi-dimensional real-time monitoring data; based on the multi-dimensional real-time monitoring data, independently estimating real-time characteristic parameters of the platform through a plurality of preset identification algorithms executed in parallel; inputting the real-time characteristic parameters of the platform into a preset multi-error-source coupling prediction algorithm, and calculating to obtain a predicted displacement deviation of the motion platform in a future preset time window; determining a corresponding position precision tolerance interval according to the requirement of the current bonding process step on the positioning precision; establishing a multi-objective optimization problem; and performing rolling time domain solution on the multi-objective optimization problem, generating a collaborative compensation instruction in real time, and executing the collaborative compensation instruction. According to the invention, accurate prediction and collaborative dynamic compensation can be carried out on various time-varying coupling errors under the condition of high-speed motion.

The invention provides a multi-chip stacked double-sided heat dissipation silicon carbide power module, and relates to the technical field of chip packaging, and the power module comprises a first DBC substrate, a second DBC substrate, a negative direct current terminal, an alternating current terminal and a positive direct current terminal, and the first DBC substrate and the second DBC substrate are sequentially provided with an upper copper pattern layer, an aluminum nitride ceramic layer and a lower conductive copper layer. Wherein the upper copper pattern layers of the first DBC substrate and the second DBC substrate are oppositely arranged, and a plurality of SiC chips are arranged on the upper copper pattern layers. An upper DBC substrate and a lower DBC substrate are integrated, the DBC substrates adopt chip stacking, the number of chips connected in parallel is increased, double-face heat dissipation is achieved, more chips can be connected in parallel, and the power density of the power module is improved. The terminals are adopted to replace most of lead bonding to reduce parasitic inductance, the terminals are designed according to circuit topology to realize interconnection between chips and interconnection between the chips and the terminals, the proposed structure can effectively realize similarity of stray inductance between the chips and between the upper sides and the lower sides of the chips, and the stray inductance of the module is reduced.