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663results about How to "Raise count" patented technology

Diagnosing Fetal Chromosomal Aneuploidy Using Genomic Sequencing With Enrichment

Embodiments of this invention provide methods, systems, and apparatus for determining whether a fetal chromosomal aneuploidy exists from a biological sample obtained from a pregnant female. Nucleic acid molecules of the biological sample are sequenced, such that a fraction of the genome is sequenced. Respective amounts of a clinically-relevant chromosome and of background chromosomes are determined from results of the sequencing. The determination of the relative amounts may count sequences of only certain length. A parameter derived from these amounts (e.g. a ratio) is compared to one or more cutoff values, thereby determining a classification of whether a fetal chromosomal aneuploidy exists. Prior to sequencing, the biological sample may be enriched for DNA fragments of a particular sizes.
Owner:THE CHINESE UNIVERSITY OF HONG KONG

Image sensor with microcrystalline germanium photodiode layer

A microcrystalline germanium image sensor array. The array includes a number of pixel circuits fabricated in or on a substrate. Each pixel circuit comprises a charge collecting electrode for collecting electrical charges and a readout means for reading out the charges collected by the charge collecting electrode. A photodiode layer of charge generating material located above the pixel circuits convert electromagnetic radiation into electrical charges. This photodiode layer includes microcrystalline germanium and defines at least an n-layer, and i-layer and a p-layer. The sensor array also includes and a surface electrode in the form of a grid or thin transparent layer located above the layer of charge generating material. The sensor is especially useful for imaging in visible and near infrared spectral regions of the electromagnetic spectrum and provides imaging with starlight illumination.
Owner:E PHOCUS

Apparatus and Method for Displaying Records Responsive to a Database Query

An apparatus and method for simultaneously displaying both record names and the associated files responsive to a user's search over a database. A user conducts a routine search query over a database or group of databases of records containing, for example, text documents, or alphabetical concordances thereof. The search engine returns a list of records responsive to the user's query. In contrast to the standard list of record identifiers, the apparatus displays both the identifiers and selected portions of those records or other useful information, as defined by the user, facilitating quick review. The user is able to sort the list of these responsive records in a variety of ways, either before the search, or within the list of results, to expedite review. The apparatus identifies records that have been reviewed previously by marking them as “viewed” links. Finally, when reviewing any responsive record in full, the complete list of records is displayed in a side panel, in a way that still allows resorting by the user. This side panel display may be re-sorted “on the fly.” It also allows the user to see the identifiers of records anywhere in the list, and to easily jump, such as with a single mouse click, to any record in the list.
Owner:WALTERS EDWARD J +1

Partially patterned lead frames and methods of making and using the same in semiconductor packaging

A method of making a lead frame and a partially patterned lead frame package with near-chip scale packaging lead-count, wherein the method lends itself to better automation of the manufacturing line and improved quality and reliability of the packages produced therefrom. A major portion of the manufacturing process steps is performed with a partially patterned strip of metal formed into a web-like lead frame on one side so that the web-like lead frame is also rigid mechanically and robust thermally to perform without distortion or deformation during the chip-attach and wire bond processes, both at the chip level and the package level. The bottom side of the metal lead frame is patterned to isolate the chip-pad and the wire bond contacts only after the front side, including the chip and wires, is hermetically sealed with an encapsulant. The resultant package being electrically isolated enables strip testing and reliable singulation.
Owner:UNISEM M BERHAD

Array-processed stacked semiconductor packages

One embodiment of the invention is a semiconductor system (1400) of arrays (1401, 1402, etc.) of packaged devices. Each array includes a sheet-like substrate (1411, 1412, etc.) made of insulating material integral with conductive horizontal lines and vertical vias, and terminals on the surfaces. Semiconductor components, which may include more than one active or passive chips, or chips of different sizes, are attached to the substrate; the electrical connections may include flip-chip, wire bond, or combination techniques. Encapsulation compound (1412, 1422, etc.), which adheres to the substrate, embeds the connected components. Metal posts (1431, 1432, etc.) traverse the encapsulation compound vertically, connecting the substrate vias with pads on the encapsulation surface. The pads are covered with solder bodies used to connect to the next-level device array so that a 3-dimensional system of packaged devices is formed.
Owner:TEXAS INSTR INC

Apparatus and method for displaying records responsive to a database query

An apparatus and method for simultaneously displaying both record names and the associated files responsive to a user's search over a database. A user conducts a routine search query over a database or group of databases of records containing, for example, text documents, or alphabetical concordances thereof. The search engine returns a list of records responsive to the user's query. In contrast to the standard list of record identifiers, the apparatus displays both the identifiers and selected portions of those records or other useful information, as defined by the user, facilitating quick review. The user is able to sort the list of these responsive records in a variety of ways, either before the search, or within the list of results, to expedite review. The apparatus identifies records that have been reviewed previously by marking them as “viewed” links. Finally, when reviewing any responsive record in full, the complete list of records is displayed in a side panel, in a way that still allows resorting by the user. This side panel display may be re-sorted “on the fly.” It also allows the user to see the identifiers of records anywhere in the list, and to easily jump, such as with a single mouse click, to any record in the list.
Owner:FASTCASE

Radial airgap, transverse flux machine

A radial gap, transverse flux dynamoelectric machine comprises stator and rotor assemblies. The rotor assembly comprises at least two axially spaced, planar rotor layers having equal numbers of magnetic poles of alternating polarity disposed equiangularly about the rotor peripheral circumference. A magnetically permeable member optionally links adjacent rotor magnets. The stator assembly comprises a plurality of amorphous metal stator cores terminating in first and second polefaces. The cores are disposed equiangularly about the peripheral circumference of the stator assembly with their polefaces axially aligned. Respective first and second polefaces are in layers radially adjacent corresponding rotor layers. Stator windings encircle the stator cores. The device is operable at a high commutating frequency and may have a high pole count, providing high efficiency, torque, and power density, along with flexibility of design, ease of manufacture, and efficient use of magnetic materials.
Owner:HIRZEL ANDREW D

Array-Processed Stacked Semiconductor Packages

One embodiment of the invention is a semiconductor system (1400) of arrays (1401, 1402, etc.) of packaged devices. Each array includes a sheet-like substrate (1411, 1412, etc.) made of insulating material integral with conductive horizontal lines and vertical vias, and terminals on the surfaces. Semiconductor components, which may include more than one active or passive chips, or chips of different sizes, are attached to the substrate; the electrical connections may include flip-chip, wire bond, or combination techniques. Encapsulation compound (1412, 1422, etc.), which adheres to the substrate, embeds the connected components. Metal posts (1431, 1432, etc.) traverse the encapsulation compound vertically, connecting the substrate vias with pads on the encapsulation surface. The pads are covered with solder bodies used to connect to the next-level device array so that a 3-dimensional system of packaged devices is formed.
Owner:TEXAS INSTR INC

Aneurysm cover device for embolic delivery and retention

An implant for treating brain aneurysms, especially terminal aneurysms, comprises a neck cover and elongate shaft removably secured to an embolic delivery catheter. As such, the shaft aids in directing and placing the cover at the aneurysm neck, protecting the delivery catheter from adhesion with the embolic material, and securing the cover in place with connection or adhesion of the shaft to the embolic material delivered through the catheter. The implant can be anchored at the aneurysm either by interface and / or adhesion of the shaft or shaft and cover with the resident embolic materials.
Owner:TYCO HEALTHCARE GRP LP

High-Fiber-Density Optical Fiber Cable

Disclosed is a fiber-optic cable that possesses a high cable filling coefficient (and / or a high cable fiber density) yet ensures that its enclosed optical fibers demonstrate improved attenuation performance when subjected to temperature variations between about −40° C. and 70° C. The fiber-optic cable is suitable for efficient installation into ducts, such as via blowing.
Owner:DRAKA COMTEQ BV

Partially patterned lead frames and methods of making and using the same in semiconductor packaging

A method of making a lead frame and a partially patterned lead frame package with near-chip scale packaging (CSP) lead-counts is disclosed, wherein the method lends itself to better automation of the manufacturing line as well as to improving the quality and reliability of the packages produced therefrom. This is accomplished by performing a major portion of the manufacturing process steps with a partially patterned strip of metal formed into a web-like lead frame on one side, in contrast with the conventional fully etched stencil-like lead frames, so that the web-like lead frame, which is solid and flat on the other side is also rigid mechanically and robust thermally to perform without distortion or deformation during the chip-attach and wire bond processes. The bottom side of the metal lead frame is patterned to isolate the chip-pad and the wire bond contacts only after the front side, including the chip and wires, is hermetically sealed with an encapsulant. The resultant package being electrically isolated enables strip testing and reliable singulation without having to cut into any additional metal. The use of the instant partially patterned lead frame in making ELP, ELPF and ELGA-type CSPs is also disclosed.
Owner:UNISEM M BERHAD

Distributed synchronization and timing system

A method and apparatus for controlling the phase and frequency of the local clock of a USB device, the apparatus comprising circuitry for observing USB traffic and decoding from the USB traffic a periodic data structure containing information about the frequency and phase of a distributed clock frequency, and phase and circuitry for receiving the periodic data structure and generating from at least the periodic data structure a local clock signal locked in both frequency and phase to the periodic data structure. The circuitry for receiving the periodic data structure and generating the local clock signal can generate the local clock signal with a frequency that is a non-integral multiple of a frequency of the periodic data structure.
Owner:CHRONOLOGIC PTY LTD
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