441results about "Printed circuits stress/warp reduction" patented technology

The invention relates to the technical field of printed circuit boards, and discloses a circuit board structure and a preparation method thereof, and the circuit board structure comprises a copper seat, the top of which is provided with a first groove; a chip, wherein the chip is arranged in the first groove; the ceramic substrate layer is arranged at the bottom of the copper seat, and the shape of the cross section of the ceramic substrate layer is the same as that of the bottom surface of the copper seat; the copper plate layer is arranged at the bottom of the ceramic substrate layer, and the shape of the cross section of the copper plate layer is the same as that of the cross section of the ceramic substrate layer. The ceramic substrate layer and the copper plate layer are sequentially arranged at the bottom of the copper base, the thermal resistance of the chip during working can be remarkably reduced, the overall heat dissipation performance can be improved, the cross sections of the ceramic substrate layer and the copper plate layer are consistent with the bottom surfaces of the copper base and the copper plate layer in shape, and the layers are high in structural fitting degree, uniform in stress distribution and good in plate thickness consistency after lamination; and the warping problem of the copper seat caused by thermal expansion is effectively reduced.

To provide a laminated substrate capable of ensuring a long-term reliability by preventing stress from being applied to a conductive paste for electrical connection when the laminated substrate is manufactured by laminating a plurality of multilayer substrates.SOLUTION: In a laminated substrate 100 formed by laminating a plurality of multilayer substrates 10, in each multilayer substrate 10, a through hole 30 penetrating through each multilayer substrate 10 and having an inner wall surface plated and filled with a resin 32 therein, and bonding lands 34 electrically connected to the through hole 30 are formed on an upper surface and a lower surface of the through hole 30. An insulating adhesive layer 40 and a conductive paste via 50 for electrically connecting the bonding lands 34 of the opposed multilayer substrates to each other by a conductive paste filled in a through hole 46 formed in the insulating adhesive layer 40 are provided between the multilayer substrates 10, and the conductive paste via 50 is provided at a position different from the position where the through hole 30 is formed.SELECTED DRAWING: Figure 1

The invention relates to the technical field of PCB heat dissipation, and discloses a distributed heat dissipation structure and a distributed heat dissipation method for a PCB under a high-temperature working condition, the distributed heat dissipation structure comprises a PCB base material, an electronic component is mounted on the A surface of the PCB base material, and active thermal control units are mounted on the B surface of the PCB base material corresponding to the electronic component needing to be cooled in a distributed manner; according to the distributed heat dissipation structure for the PCB under the high-temperature working condition, the active thermal control units are installed in the area, corresponding to the heating element, of the B face of the PCB base material in a distributed mode, active refrigeration can be conducted on electronic components (such as a microprocessor and a storage) with the large heating value in a targeted mode, the highest working temperature of a system is increased, and the heat dissipation efficiency is improved. Normal operation of the system is guaranteed, meanwhile, energy waste caused by cooling of the whole plate is avoided, and the heat dissipation efficiency and the energy utilization rate are remarkably improved.

A method of making an interconnect substrate includes forming a first insulating layer containing a filler and covering a first interconnect layer, forming a via hole in the first insulating layer by laser processing, the via hole exposing the first interconnect layer, performing a heat treatment, plasma processing, and a desmear process in this order with respect to the first insulating layer, and forming, after the desmear process, a second interconnect layer including both an interconnect pattern formed on an upper surface of the first insulating layer and a via interconnect formed in the via hole.

An impact-resistant reinforced carrier includes a substrate, a rigid insulated carrier sheet, metal pillars, a resin layer, and first and second circuit layers. The substrate has first through holes penetrating through upper and lower surfaces of the substrate. The rigid insulated carrier sheet has second through holes penetrating through first and second surfaces of the rigid insulated carrier sheet. The metal pillars are respectively in the second through holes. The resin layer covers the rigid insulated carrier sheet and the upper surface and has openings. The first circuit layer is on a portion of a surface of the resin layer, in the openings, and connected to the metal pillars. The second circuit layer is on a portion of the lower surface, in the first through holes, and connected to the metal pillars.

According to the special-shaped FPC and the manufacturing method thereof, the pre-formed special-shaped flexible base material layer is arranged, the shape of the pre-formed special-shaped flexible base material layer is directly matched with the special-shaped surface of a target installation space, and a circuit layer, an insulation covering layer and a special-shaped supporting layer are all attached to the special-shaped surface of the special-shaped flexible base material layer, so that the FPC does not need to be forcibly bent, twisted or stretched subsequently, and the production efficiency is improved. The problems of circuit breakage and delamination caused by stress concentration are fundamentally avoided, the structural stability of the FPC is improved, and the service life of the FPC is prolonged. The flexible circuit board is used for solving the technical problem that in order to achieve special-shaped layout, the plane of an existing flexible circuit board generally needs to be forcibly bent, twisted or stretched.

A package, the package comprising: an integrated device; and a substrate coupled to the integrated device through at least a plurality of solder interconnects. The substrate includes: at least one dielectric layer; a frame at least partially located in the at least one dielectric layer; and a plurality of interconnects at least partially located in the at least one dielectric layer. The frame may be an embedded frame.

In order to obtain a high-frequency module with less warping, small size, and high connection reliability, a wiring substrate is provided, which has: a core material made of glass, having a first surface, a second surface opposite to the first surface, and a through-hole passing through the first surface to the second surface; a first adhesion layer formed so as to adhere to the first surface and an inner wall of the through-hole, and further block a bottom of the through-hole on the second surface side; a second adhesion layer adhering to the second surface and the first adhesion layer blocking the bottom of the through-hole on the second surface side; a first wiring layer laminated on the first adhesion layer; and a second wiring layer laminated on the second adhesion layer, wherein in a case where a total area of the first wiring layer is set as A, and an area occupied by copper in the first wiring layer is set as B, a residual copper rate C of the first wiring layer is represented by C=B / A (%), C=70-100%, and a Young's modulus of a material of the first adhesion layer is 0.1-0.85 times a Young's modulus of a material of the first wiring layer.

To secure insulation reliability in a wiring board having a NSMD structure.SOLUTION: A wiring board includes: a first insulation layer; a pad that is formed on one surface of the first insulation layer; a second insulation layer that is formed on one surface of the first insulation layer and including an open part to expose the pad; and a reinforcement metal layer that is formed so as to be contacted to the first insulation layer, and is provided to a circumference of the pad so as to be separated from the pad in a plan view. The pad is arranged into the open part without being contacted to the second insulation layer, and an end part on the first insulation layer side of one part of an inner side surface of the open part of the second insulation layer is contacted to the reinforcement metal layer and the end part of the first insulation layer side of the other one part of the inner side surface of the open part of the second insulation layer is contacted to one surface of the first insulation layer.SELECTED DRAWING: Figure 1

Damage to a joint part of a terminal of an electronic component mounted on a substrate is detected. The substrate includes a base material unit, a land, and a light detection unit. The land included in the substrate is arranged with a stress light emitting body configured to emit light in accordance with stress, includes a transparent member, and is joined with a terminal of an element arranged in the base material unit included in the substrate. The light detection unit included in the substrate is arranged between the base material unit and the land included in the substrate, and detects light from the stress light emitting body.

A circuit board according to an embodiment includes: an insulating layer including first to third regions; an outer layer circuit pattern disposed on upper surfaces of the first to third regions of the insulating layer; and a solder resist including a first portion disposed in the first region of the insulating layer, a second portion disposed in the second region, and a third portion disposed in the third region, wherein the outer layer circuit pattern has a first height, the third portion of the solder resist is disposed on an upper surface of the outer layer circuit pattern to have a second height, the first region includes a first sub-region and a second sub-region, the first portion includes a first sub-portion disposed in the first sub-region and a second sub-portion disposed in the second sub-region, an upper surface of the first sub-portion is positioned higher than the upper surface of the outer layer circuit pattern and lower than an upper surface of the third portion, an upper surface of the second sub-portion is positioned lower than the upper surface of the outer layer circuit pattern, and a surface roughness of the third portion of the solder resist is different from a surface roughness of the first portion of the solder resist.

A ceramic circuit board according to an embodiment includes a ceramic substrate and a metal circuit. The metal circuit is bonded to a first surface of the ceramic substrate via an active metal brazing material layer. A thickness of the metal circuit is not less than 1 mm. The metal circuit has a through-hole extending through the metal circuit along a first direction perpendicular to the first surface. A portion of the first surface overlaps the through-hole in the first direction. The active metal brazing material layer is present at the portion of the first surface.

A laminated substrate includes multilayer substrates stacked, wherein the multilayer substrates are each provided with a through hole which penetrates the multilayer substrates, an inner wall surface of which is plated, and which is filled with resin, and bonding lands formed on upper and lower surfaces of the through hole and electrically coupled to the through hole, an insulating adhesive layer and a conductive paste via for electrically coupling the bonding lands of the multilayer substrates opposed to each other with a conductive paste with which a through hole formed in the insulating adhesive layer is filled are disposed between the multilayer substrates, and the conductive paste via is disposed at a position different from a position at which the through hole is formed.

The invention relates to a camera system (1) with an athermalized focus of the optical path comprising a lens element (2), a printed circuit board (7), an image sensor (4) mounted on the printed circuit board (7), a housing (3) in which the printed circuit board (7) with the image sensor (4) and a part of the lens element (2) is arranged, wherein the printed circuit board (7) is connected to the housing (3) by at least one fastening means (6), wherein at least one spacer (5) is arranged between the printed circuit board (7) and the housing (3), wherein the at least one fastening means (6) fixes the printed circuit board (7) and the spacer (5) in the housing (3), and wherein the spacer (5) is made of a material having a variable coefficient of thermal expansion.

A multilayer substrate includes a stacked body and a first conductor layer. The stacked body includes insulator layers stacked in a stacking direction. The first conductor layer is provided in the stacked body. In the stacked body, interior spaces that are not connected to a space outside the stacked body are provided. The first conductor layer includes a first principal surface and a second principal surface including an exposed portion exposed to the interior spaces. A surface roughness of the exposed portion is greater than a surface roughness of the first principal surface.

A circuit board according to one embodiment includes: a core layer; an upper stack layer disposed on the core layer and including a cavity; a connecting member disposed in the cavity of the upper stack layer; and a filling member disposed in the cavity so as to surround a side surface of the connecting member, wherein an upper surface of the filling member includes at least one of a concave surface recessed toward the core layer and a convex surface protruding relative to the core layer.

The invention relates to the technical field of multi-layer metal substrate production, in particular to a high-thermal-stability low-warpage PCB aluminum base layer and a preparation method thereof.The preparation method comprises the following steps that 1, an adhesive and a curing agent are mixed and dispersed for 20-40 min, then stirring is conducted for 20-30 min at the speed of 600-700 r / min, standing and exhaust treatment are conducted, and a glue solution is obtained; and (3) pretreating the surface of an aluminum plate, drying the aluminum plate, laminating the dried aluminum plate and the semi-cured adhesive film obtained in the step (2) on a roller press, laminating a copper foil on one side of the semi-cured adhesive film, and finally laminating the copper foil on a plate vulcameter to obtain the PCB aluminum base layer. The PCB aluminum base layer provided by the invention has better heat-conducting property, warping resistance and lower thermal expansion coefficient.

An embodiment of the present disclosure relates to a thermoformed structural electronic module 1 with an integrated electronic device 10 and a method for making the same. The module can be made by a method including providing a thermoformed stack including a thermoplastic carrier substrate 3 and an electronic device 10 with wiring and a buffer layer therebetween, and thermoforming (103) the stack at a plasticizing condition of the carrier substrate 3 and the buffer layer 2, the thermomechanical buffer layer 2 comprising a thermoplastic composition having a storage modulus within the range of 0.005%-25%, preferably 0.01-10%, most preferably 0.02-2.5% of the storage modulus of the thermoplastic carrier substrate 3 during thermoforming.

The present invention provides a printed circuit board that allows for easy formation of fine circuits, improved transmission characteristics, reduced warping, and miniaturization of via diameters when forming embedded circuits. [Solution] This disclosure relates to a printed circuit board 100A comprising: a first insulating material 111a having a first opening v1; an insulating layer 111 laminated on one surface of the first insulating material 111a, filling at least a portion of the first opening v1, and comprising a second insulating material 111b made of a different material from the first insulating material 111a; a wiring pattern 112 arranged on one surface of the first insulating material 111a and embedded in the second insulating material 111b such that one surface is exposed from one surface of the second insulating material 111b; and a via pattern 113 spaced apart from the first insulating material 111a within the first opening v1 and embedded in the second insulating material 111b such that one surface is exposed from one surface of the second insulating material 111b.

Provided are an assistant elastic part for signal connection and a substrate assembly including the same. The assistant elastic part for signal connection includes an elastic pressing part that, of a substrate assembly including a first substrate member and a second substrate member that is stacked so that one surface thereof is in surface-contact with the first substrate member, applies an elastic force to the second substrate member and maintains electrical signal connection between mutually facing surfaces of the first substrate member and the second substrate member, and the elastic pressing part includes an elastic rib that is provided to press the second substrate member by an elastic force of a material of the elastic rib, thereby reducing the product manufacturing cost and providing the advantage of maintaining RF characteristics with only low-cost components.

A semifinished product (100) which comprises a sacrificial structure (102) and two component carriers (104) releasably formed on opposing main surfaces of the sacrificial structure (102), wherein each of the component carriers (104) comprises at least one electrically insulating layer structure (114), and at least one electrically conductive layer structure (116), and wherein the two electrically insulating layer structures (114), each of which relating to a respective one of the component carriers (104), located closest to the sacrificial structure (102) are pure or unprocessed electrically insulating layers without electrically conductive material therein.

A flexible circuit board according to an embodiment includes a substrate including a first surface and a second surface opposite to the first surface; a first circuit pattern disposed on the first surface; a second circuit pattern disposed on the first surface and the second surface; a third circuit pattern disposed on the first surface and the second surface; a first protective layer disposed on the first surface; and a second protective layer disposed on the second surface, wherein a chip mounting region is defined on the first surface, wherein the first circuit pattern includes a first pad part connected to a chip on the chip mounting region; a second pad part connected to an external printed circuit board; and a first wiring part connected to the first pad part and the second pad part, wherein the second circuit pattern includes a third pad part connected to the chip; a fourth pad part connected to an external display panel; and a second wiring part connected to the third pad part and the fourth pad part, wherein the third circuit pattern includes a fifth pad part connected to the chip; a sixth pad part connected to the display panel; and a third wiring part connected to the fifth pad part and the sixth pad part, wherein the second circuit pattern includes a first via connecting a second wiring part on the first surface and a second wiring part on the second surface, wherein the second wiring part is defined by a first length which is a distance from an end of the fourth pad part to a first via closest to the fourth pad part; and a second length which is a length of the fourth pad part, and wherein the first length is longer than the second length.

The copper base substrate of the present invention is a copper base substrate in which a copper substrate, an insulating layer, and a circuit layer are sequentially stacked, the ratio of the thickness (unit: μm) of the insulating layer to the elastic modulus (unit: GPa) of the insulating layer at 100°C is 50 or more, and the elastic modulus of the circuit layer at 100°C is 100 GPa or less.

The invention provides a packaging structure. The package structure includes a first carrier, a second carrier, and a first component. The first carrier includes a first pad and a second pad disposed at a first surface of the first carrier. The second carrier is disposed above the first carrier. The first component connects the first carrier to the second carrier and includes a first terminal connected to the first pad and a second terminal connected to the second pad. A first distance between the first pad and the second pad is substantially equal to or greater than a second distance between the first terminal and the second terminal.

A circuit board according to an embodiment includes: a first circuit layer; a first insulating layer disposed on the first circuit layer; a second circuit layer disposed on the first insulating layer; and a second insulating layer disposed on the second circuit layer, wherein the first circuit layer includes a first circuit pattern disposed along a peripheral direction of an outer side surface of the first insulating layer at a position closest to the outer side surface of the first insulating layer, wherein the second circuit layer includes a second circuit pattern disposed along a peripheral direction of an outer side surface of the second insulating layer at a position closest to the outer side surface of the second insulating layer, and wherein a first separation distance in a horizontal direction from the outer side surface of the first insulating layer to the first circuit pattern is different from a second separation distance in the horizontal direction from the outer side surface of the second insulating layer to the second circuit pattern.

An apparatus may reinforce solder joints by bracing corners of integrated circuit substrates. To do so, an exemplary apparatus may include (1) a substrate of an integrated circuit coupled to a circuit board and (2) at least one corner reinforcement brace coupled to the circuit board and at least one corner of the substrate. Various other apparatuses, systems, and methods are also disclosed.

A printed circuit board assembly includes a printed circuit board including a plurality of support holes, a metal frame on which the printed circuit board is supported, and a plurality of bonding portions between the metal frame and the printed circuit board that bond the metal frame and the printed circuit board. The metal frame includes a plate portion opposite the printed circuit board, and a plurality of supports integral with the plate portion, bent and protruding from the plate portion and extending to the printed circuit board, each of the plurality of supports being inserted into each of the plurality of support holes and supporting the printed circuit board.