430results about "Laminating printed circuit boards" patented technology

The invention discloses a method for manufacturing a circuit board embedded with a carbon oil resistor, which comprises the following steps of: taking a double-sided copper-clad plate, manufacturing a circuit pattern comprising a carbon oil connecting pattern which comprises a wire end and a connecting end, adhering a dry film to two sides, a dry film windowing pattern is manufactured in the area, corresponding to the carbon oil pattern, of the surface where the carbon oil connection pattern is located, plasma treatment is conducted, then film stripping is conducted, a carbon oil layer is manufactured in the area of the carbon oil pattern, a bonding layer prepreg is taken, core plates of other layers are taken and stacked and pressed together with the carbon oil plate, and the circuit board embedded with the carbon oil resistor is formed through subsequent procedure manufacturing; by designing the connecting end, the carbon oil layer has a larger bonding area, the bonding force of the carbon oil layer is increased, prepregs are laminated and bonded to the surface of the carbon oil layer, the interlayer bonding force of the carbon oil layer is improved, and the problems of falling, layering of a multi-layer board and even board explosion of the multi-layer board caused by poor bonding of the carbon oil layer are solved.

The invention provides a preparation method of a charging pile circuit board and the charging pile circuit board. The method comprises the following steps: obtaining a to-be-embedded copper block required by a charging pile circuit board; embedding the copper block to be embedded into a core plate to obtain the core plate with the copper block; laminating the copper foil, the cured sheet and the core plate with the copper block to obtain a laminated plate; performing circuit manufacturing on the laminated plate to obtain a first charging pile circuit board; obtaining a heat parameter of the first charging pile circuit board under a heat simulation model; inputting the heat parameter into a preset heat dissipation evaluation model for evaluating the heat dissipation effect of the circuit board to obtain an evaluation result; according to the evaluation result, manufacturing parameters of a target charging pile circuit board are determined; and obtaining the target charging pile circuit board according to the manufacturing parameters of the target charging pile circuit board, the target to-be-embedded copper block, the target core board, the target copper foil and the target cured sheet. The heat dissipation performance of the charging pile circuit board can be improved.

The invention discloses a stiffening plate fitting, positioning and dust removing mechanism which comprises a fixed plate fixed to a workbench, a positioning frame which is hollow in the middle and is of a square structure is arranged at the top of the fixed plate, the four side faces of the inner side of the positioning frame are inclined faces, and moving grooves are formed in the front side edge and the rear side edge, opposite to each other, of the positioning frame. Placing grooves are formed in the left and right opposite side edges of the positioning frame, connecting rods are arranged at the two ends of the electrostatic dust collection rod, and the two ends of the electrostatic dust collection rod are in sliding insertion connection with the two moving grooves of the positioning frame correspondingly. The device is used for reinforcing and attaching the plate, automatic positioning and position adjusting are achieved when the plate moves to the bearing plate, the attaching accuracy is improved, reinforcing and attaching of various reinforcing plates at different positions of the same plate are achieved at the same time, the dust collection paste can adsorb and collect dust falling after an electrostatic dust collection rod stops working, and the device is simple and practical.

The invention belongs to the field of FPCs (Flexible Printed Circuit), and particularly discloses a reinforcing method of an FPC. According to the method, the boundary dimension of an FR4 reinforcing plate is designed to be 1.2 mm larger than the boundary dimension of a to-be-reinforced area on an FPC, then the FR4 reinforcing plate and the to-be-reinforced area on the FPC are sequentially attached and solidified to obtain a stacked plate, finally the stacked plate is sequentially subjected to rough punching and fine punching with the single-side allowance being 0.05-0.2 mm, and the FR4 reinforcing plate and the to-be-reinforced area on the FPC are sequentially subjected to rough punching and fine punching with the single-side allowance being 0.05-0.2 mm. And an FPC reinforcing product with the FR4 reinforcing plate having the same boundary dimension as the to-be-reinforced area on the FPC is obtained. According to the method, the defects of scraps and burrs generated in a conventional punching method can be overcome, the size precision and the qualified rate of products are improved, and the yield of the products and the machining quality stability of the products are improved.

A wiring board with a stiffener includes a wiring board, a mounting region located on an upper surface of the wiring board, and a stiffener located on the upper surface of the wiring board to surround the mounting region and including a first surface facing the wiring board and a second surface located opposite to the first surface. The wiring board has a first thermal expansion coefficient. The stiffener includes a first region facing the wiring board, including the first surface, and a second thermal expansion coefficient, and a second region located on a surface side opposite to the first region, including the second surface, and has a third thermal expansion coefficient. An absolute value of a difference between the first and second thermal expansion coefficients is smaller than an absolute value of a difference between the first thermal expansion coefficient and the third thermal expansion coefficient.

The invention discloses an upper plate pressing device for DBC copper-clad plate production, and relates to the technical field of DBC copper-clad plate production, the upper plate pressing device comprises a bottom plate, fixing rods are fixedly connected to the periphery of the top of the bottom plate, a top plate is fixedly connected to the tops of the fixing rods, a movable plate is slidably connected to the fixing rods, and a pressing plate matched with a lower mold is arranged at the bottom of the movable plate; the periphery of the bottom of the fixing rod is provided with downward pressing assemblies used for driving the movable plate and the pressing plate to move downwards to press the copper-clad plate in the lower mold, and the top of the movable plate is provided with a knocking assembly. According to the upper plate pressing device for DBC copper-clad plate production, the sliding plate and the pressing rod are pushed to intermittently move and press downwards through vertical movement of the poke rod, it is ensured that the copper-clad plate is subjected to uniform and stable pressure in the pressing process through the intermittent step-by-step pressure applying mode, bubbles and gaps generated in the pressing process can be reduced, and therefore the production efficiency of the copper-clad plate is improved. Therefore, the pressing quality and the product reliability are improved.

The capillary transfer technology presented here represents a powerful approach to transfer soft films from surface of liquid onto a solid substrate in a fast and defect-free manner. The fundamental theoretical model and transfer criteria validated with comprehensive experiments and finite element analyses, for the first time provides a quantitative guide and optimization for the choice of material systems, operating conditions and environments for scalable on-demand transfers with high yield. The intrinsically moderate capillary transfer force and externally selectable transfer direction offer robust capabilities for achieving deterministic assembly and surface properties of structures with complex layouts and patterns for potentially broad applications in the fabrication of flexible / stretchable electronics, surface wetting structures and optical devices. Integration of this technology with other advanced manufacturing technologies associated with material self-assembly, growth and layout alignment represents promising future topics and would help create emerging new manufacturing technologies that leverage unique fluidity of liquid environments.

The present invention relates to the technical field of FPC line board reinforcement plate processing equipment, and specifically to an FPC line board reinforcement plate bonding machine. The positioning part includes a double-track slide arranged horizontally on the top of the machine frame, a movable frame is arranged between the sliders of the double-track slide, a mounting frame is arranged on the movable frame, a displacement group is arranged on the movable frame, and a distribution frame with at least two sets of winding parts built in is provided on the movable part of the displacement group. By designing the stamping part, the conveying part and the attachment part as independent modules respectively, product defects caused by uneven or excessive pressure are effectively avoided, and the consistency and yield rate of the product are significantly improved; at the same time, the device is also equipped with multiple sets of independently operated winding parts, which cooperate with the flexible positioning function of the moving part and the positioning part to enable different types of reinforcement plate films to be continuously switched and used, thereby meeting the attachment requirements of different types of FPC boards, further improving the production continuity, process level and adaptability of the device, and more flexibly responding to diversified production needs.

The invention relates to the technical field of FPC (flexible printed circuit) board stiffening plate processing equipment, in particular to an FPC board stiffening plate laminating machine. The position adjusting part comprises a double-rail sliding table transversely arranged at the top in the machine frame, a moving frame is arranged between sliding blocks of the double-rail sliding table, a mounting frame is arranged on the moving frame, a displacement set is arranged on the moving frame, and a distribution frame internally provided with at least two winding parts is arranged on a moving piece of the displacement set. The stamping part, the conveying part and the attaching part are respectively designed into independent modules, so that product defects caused by uneven or overlarge pressure are effectively avoided, and the consistency and the yield of products are remarkably improved; meanwhile, the device is further provided with a plurality of groups of winding parts which operate independently, and the flexible positioning function of the moving part and the position adjusting part is matched, so that different types of reinforcing plate films can be continuously switched and used, the attachment requirements of different types of FPC boards are met, the production continuity, the process degree and the adaptive capacity of the device are further improved, and the production cost is reduced. And diversified production requirements can be met more flexibly.

The invention discloses a circuit board preparation method. The circuit board preparation method comprises the following steps: respectively processing through holes in positions, corresponding to copper bosses or embedded parts, in a copper-clad core plate and a prepreg; laminating and hot-pressing the copper-clad core plate, the prepreg and the metal radiating plate or the embedded part provided with the copper boss, wherein one part of the prepreg is hot-pressed to form a bonding part for connecting the side wall of the copper boss or the embedded part with the copper-clad core plate; grinding the plate to reduce the concave depth of the bonding part relative to the plate surface; plating copper on the whole board to manufacture a surface copper foil layer on the surface of the circuit board; grinding the plate so as to further improve the surface flatness of the surface copper foil layer; wherein the copper-clad core plate located on the outermost side during laminated plate hot pressing comprises an outer-layer copper foil and an inner-layer copper foil, and the thickness of the outer-layer copper foil is smaller than that of the inner-layer copper foil, so that the initial concave depth of the bonding part is reduced. According to the preparation method, the surface flatness of the copper foil layer on the surface of the circuit board can be improved, and the product yield is improved.

The invention provides a rigid-flex board 3D steel sheet reinforced press-fit structure. The rigid-flex board 3D steel sheet reinforced press-fit structure comprises a first press-fit auxiliary material, a second press-fit auxiliary material, a lower alignment jig, a laminated structure, an upper alignment jig, a second press-fit auxiliary material and a first press-fit auxiliary material which are sequentially arranged from bottom to top. The laminated structure comprises a windowed lower press-fit auxiliary material, a rigid-flex board and a windowed upper press-fit auxiliary material, and the 3D steel sheet comprises a substrate and a lug boss arranged on the substrate; the position, corresponding to the protruding part, of the rigid-flex board is windowed, the substrate is arranged on the lower side of the lower press-fit auxiliary material, and the protruding part penetrates through the windowed lower press-fit auxiliary material, the rigid-flex board and the windowed upper press-fit auxiliary material; and the lower alignment jig and the upper alignment jig are provided with mutually matched grooves corresponding to the bulge positions of the laminated structure. Through pretreatment of the rigid-flex board and the steel sheet, the surface activity is enhanced, the cohesiveness is improved, and the bonding strength of the 3D steel sheet and the rigid-flex board is remarkably improved in cooperation with a gradient pressing process.

Aspects of the subject disclosure may include, for example, a flexible printed circuit (FPC) for interconnecting an optical device and an application specific integrated circuit (ASIC), wherein the FPC includes a first section that is configured with a first plurality of electrically conductive traces and a second section over which one or more components are disposed, and wherein the second section is configured with a second plurality of electrically conductive traces that extend from the first plurality of electrically conductive traces to the one or more components. Other embodiments are disclosed.

The present invention relates to the field of flexible circuit board production, and particularly relates to a production device and process for die cutting and wire laminating of a double-sided combined flexible circuit board. The production device comprises a frame, and a die cutting head on the frame, used for die cutting a flexible circuit board to be processed. A wire laminating unit used for laminating wires on the flexible circuit board is provided on the side of the frame away from the die cutting head, and the die cutting head and the wire laminating unit work in conjunction with each other to achieve the effects of die cutting the front side of the flexible circuit board and laminating the wires on the back surface of the flexible circuit board. By implementing die cutting and wire laminating of a flexible circuit board on a single machine, the present invention effectively avoids the problems that materials need to be moved multiple times during use, and after the materials are moved multiple times, the relative position between the materials and the machine and the relative position of the materials need to be adjusted multiple times to ensure alignment, which affects the accuracy and consistency of a final circuit board.

The invention discloses an application method of a component embedded packaging unit in a PCB, and belongs to the technical field of printed circuit boards, the method comprises the steps that a second PCB substrate is processed according to design requirements, a scooping groove is generated, and the surface of the second PCB substrate after the scooping groove is formed is provided with a second copper layer; vertically embedding a component embedding and packaging unit into the fishing groove; and sequentially laying a prepreg and a copper foil on the surface of the second copper layer, carrying out lamination, processing a laser hole for external conduction at the pin position of the component, and carrying out electroplating copper plating on the laser hole so as to realize circuit conduction in the PCB. The application mode has flexibility; and compared with the traditional horizontal structure, the vertical embedding structure can reduce the plane occupied space and increase the through-flow density.

The invention discloses a ceramic substrate, a low-temperature co-fired ceramic device and a preparation method of the low-temperature co-fired ceramic device, and belongs to the technical field of low-temperature co-fired ceramics. The ceramic substrate comprises a first ceramic dielectric layer and a first electrode layer; one side of the first ceramic dielectric layer is provided with a slotted hole, and the slotted hole is filled with a first auxiliary electrode; the first electrode layer is arranged on one side, provided with the slotted hole, of the first ceramic dielectric layer; the first electrode layer comprises a first electrode, and the first electrode is connected with the first auxiliary electrode. According to the embodiment of the invention, the adhesive force of the electrode in the ceramic substrate can be improved, and the reliability of a low-temperature co-fired ceramic device can be improved.

According to the printed circuit board and the manufacturing method for the same-layer local multiple-copper-thickness circuit pattern of the printed circuit board, the same-layer high-frequency signal circuit on the printed circuit board is patterned step by step, and the multiple-copper-thickness circuit is accurately constructed in the same circuit layer in combination with the two-time pattern electroplating process and the voltage conversion process. Specifically, a layer of surface copper foil is additionally covered on the surface of the copper foil of the copper-clad substrate to form a voltage-transferring substrate, the surface copper foil is used as a connecting layer between a first circuit layer and a second circuit layer, and two surfaces of the surface copper foil are independently electroplated twice, so that the copper thickness distribution of different circuit areas is accurately controlled, and the voltage-transferring effect is improved. And finally, a plurality of signal circuit patterns with coexisting copper thicknesses are constructed in the surface copper layer on the inner-layer voltage conversion substrate, so that the fineness and reliability of the signal circuit are ensured to meet the high-frequency signal transmission requirement, the layout flexibility of the signal circuit on the printed circuit board is improved, the impedance matching of the signal circuit is ensured, and the signal loss is reduced at the same time.

The invention discloses a circuit board and a preparation method thereof. The preparation method of the circuit board comprises the following steps: providing a dielectric layer, a first metal layer and a circuit board body; the dielectric layer comprises at least one through hole; the circuit board body comprises at least two metal layers and an insulating layer located between the two adjacent metal layers; the dielectric layer comprises a prepreg; sequentially laminating the circuit board body, the dielectric layer and the first metal layer; performing laser drilling at the position of the through hole to form a blind hole penetrating through the first metal layer and the dielectric layer; and electroplating a conductive layer in the blind hole to form the circuit board. According to the technical scheme, the conductive layer formed in the blind hole can have good conductive reliability, and the working performance of the circuit board is improved.

The present invention provides a flexible LED vehicle-mounted display screen and a production process thereof. The production process includes the following steps: adopting an FPC as a basic material of the display screen main body, fixing the flexible screen on a mold, mixing a PU glue, degassing treatment, glue dripping, automatic degassing, curing, and collecting. The flexible screen is fixed on a mold tray by magnetic suction or vacuum, and an air pressure sensor, a camera, a solenoid valve and the like are used to intelligently process the glue dripping and degassing processes. A plurality of Bluetooth BLE is installed on an FPC for communication, an MCU with a DMA function is adopted, and data are compressed to 50% of original data by an LZSS coding algorithm, which greatly reduces the time for the flexible screen to send data and improves the user experience.

The invention belongs to the field of PCBs (printed circuit boards), and provides a PCB material with high heat dissipation performance and a preparation method thereof.The PCB material adopts a multi-layer composite structure design and comprises a circuit board layer, a heat conduction insulating layer, a metal bottom layer, a silica gel-based heat conduction glue layer, a heat dissipation layer and heat dissipation fins, wherein the heat conduction insulating layer is a polyimide composite material in which hexagonal boron nitride nanosheets are oriented in parallel, and the heat dissipation layer is formed by coating an aluminum nitride reinforced aluminum-based composite material with a titanium nitride transition layer and is integrally die-cast with the heat dissipation fins. Through key technologies such as surface modified boron nitride nanosheet suction filtration orientation, polyamide acid dipping curing, heat dissipation assembly preparation through a coating-in-situ nitriding-die casting process and overall hot pressing assembly, the excellent heat conduction performance of the heat conduction insulating layer in the plane direction is achieved; the problems of low heat dissipation efficiency, poor device reliability and the like caused by insufficient heat-conducting property and insulating property of a traditional PCB material are solved, and the material has wide application value.

The invention discloses an FPC flexible circuit board automatic bending device and a bending method thereof, and relates to the technical field of FPC bending, the FPC flexible circuit board automatic bending device comprises a bending box, a curing mechanism is arranged in the middle of the upper end of the bending box, an air pipe frame is arranged on one side of the upper end of the bending box, and four FPC substrate mechanisms distributed in an annular array are arranged in the curing mechanism; and one side of the upper end of the bending box is provided with a film covering mechanism which is matched with the curing mechanism to carry out dispensing pre-pressing treatment on the FPC in the FPC substrate mechanism. The air guide sheet extracts air above the substrate plate, so that the thin sheet film can be tightly attached to the surface of the FPC circuit board, glue is helped to be quickly diffused on the surface of the FPC circuit board, flowing and diffusion of the glue are accelerated through the negative pressure effect, it is ensured that the glue can uniformly cover an area needing to be bonded, and the bonding efficiency is improved. And particularly, line connection points in complex shapes or narrow spaces are provided.

The invention belongs to the technical field of FPC circuit board manufacturing. The composite structure for manufacturing the FPC circuit board sequentially comprises a wiring base material layer, a thermal viscosity reduction adhesive film layer, a circuit diagram layer, a substrate adhesive film layer and a substrate base material layer from top to bottom, and the thermal viscosity reduction adhesive film layer and the substrate adhesive film layer are opposite in viscosity change along with temperature change. The composite structure used for manufacturing the FPC circuit board is subjected to transfer hot pressing, the circuit diagram layer is bonded with the substrate base material layer and is stripped from the wiring base material layer, and transfer of the circuit is completed; and covering the surface of the circuit pattern layer with a layer of covering film, and sealing the circuit through sealing and hot pressing to obtain the FPC circuit board. According to the technical scheme, circuit printing is carried out in a printing mode, no three wastes are discharged in the printing process, compared with the original industry, power consumption is greatly reduced, the usage amount of production materials, especially copper, is greatly reduced, and the raw material cost is greatly reduced.

The invention discloses a head pasting device and method capable of adjusting pressure through pneumatic control, and belongs to the technical field of head pasting, an upper rotating shaft and a lower rotating shaft are mounted on a rotating shaft mounting seat through rotating bearings, a power device used for driving the upper rotating shaft to rotate is arranged on the rotating shaft mounting seat, and the lower rotating shaft is connected with the upper rotating shaft through a bolt; a closed cavity is formed in the connecting position of the upper rotating shaft and the lower rotating shaft, an air bag diaphragm and a piston are arranged in the closed cavity, a hollow guide shaft is coaxially arranged on the piston, the hollow guide shaft is installed in the lower rotating shaft through a guide shaft sleeve and connected with the suction nozzle assembly, and the pneumatic control pressure assembly is communicated with the closed cavity and the hollow guide shaft. According to the scheme, an air control pressure assembly is adopted, air pressure input is dynamically adjusted through an electric proportional valve, flexible transmission of an air bag diaphragm and a piston is combined, air pressure is accurately converted into linear displacement, and suction nozzle contact pressure is driven to follow a set value in real time.

The invention discloses a flexible circuit board and a display device. The flexible circuit board comprises a component area which is arranged to be connected with a plurality of components; the connection area comprises a plurality of wires, and the wires are arranged to connect the component with an external device; in the direction perpendicular to the flexible circuit board, the thickness of the component area is larger than that of the connecting area; the transition region is arranged to connect the connection region and the component region; wherein a reinforcing part is arranged in the transition area, and the reinforcing part is arranged to reinforce the strength of the flexible circuit board.

The invention relates to the technical field of PCBs (Printed Circuit Board), and discloses a novel manufacturing method of an embedded copper block, which comprises the following steps: S1, preparing materials; s2, lamination and groove milling treatment; s3, pre-burying a copper block; s4, performing vacuum resin hole plugging for the first time; s5, performing vacuum resin hole plugging for the second time; and S6, plate grinding treatment. The method is not influenced by the stacking structure, and the copper-embedded block can also be manufactured by using the stacking structure laminated by the copper foil; according to the technology for manufacturing the embedded copper block through the vacuum plug hole, only one-time shape milling is needed, the cost of the vacuum plug hole is slightly lower than that of the embedded copper block manufactured through lamination, the price of the embedded copper block manufactured through lamination is related to the number of used core plates and the number of PP, and along with increasing of layers, the price advantage of the embedded copper block manufactured through the vacuum plug hole is larger; the convex groove design is added in the milling groove design, so that the requirement of partial embedded copper blocks on the alignment degree can be met; when the embedded copper block is manufactured through vacuum resin hole plugging, the copper block is fixed through the adhesive tape, the copper block deviation problem is avoided, and the finished product qualification rate can be improved to a certain degree.

The invention discloses chip mounting equipment for computer mainboard production, and relates to the technical field of chip mounting equipment.The chip mounting equipment comprises a rack, a conveying mechanism, a moving mechanism, a displacement frame and a chip mounting mechanism, the conveying mechanism is arranged on the rack and used for conveying a mainboard, the moving mechanism is arranged on the rack and used for driving the displacement frame on the moving mechanism to move, and the chip mounting mechanism is arranged on the rack and used for driving the displacement frame to move; and the chip mounting mechanism is arranged on the displacement frame and is used for carrying out chip mounting on the cooling fins on the main board. The position of the chip mounting mechanism is adjusted through the moving mechanism, a mainboard is positioned and finely adjusted through a conveying plate of the conveying mechanism, and meanwhile, the chip mounting mechanism rotates and resets a vacuum chuck and a cooling fin on the vacuum chuck under the action of a torsional spring on a rotating rod, so that glue at the bottom of the cooling fin and the mainboard are twisted, and the chip mounting efficiency is improved. According to the equipment, the to-be-pasted position of the mainboard can be cleaned, and meanwhile, the smearing uniformity of the glue at the bottom of the cooling fin is improved.

The invention discloses a manufacturing method of a large-size flexible circuit board capable of replacing a wire harness. The manufacturing method comprises the following steps: manufacturing a covering film core board through previous procedures; manufacturing a punching die, performing alignment punching on the covering film core plate to form a groove body, forming a flexible plate connecting bridge in the groove body, forming a punching plate on the whole plate, windowing a reinforcing sheet corresponding to the groove body to form a reinforcing groove body, arranging a plurality of reinforcing connecting bridges on the reinforcing groove body, and forming a reinforcing plate on the whole plate; the reinforcing connecting bridges and the flexible plate connecting bridges are distributed in a staggered manner; attaching a reinforcing plate to the punching plate, and forming the circuit board; the cover film is attached in a jointed board structure mode, and a punching grinding tool is matched for punching, so that the problems that cover films attached in batches are easy to scatter and difficult to attach are solved; through the staggered design of the flexible plate connecting bridge and the reinforcing plate connecting bridge, selective machining can be carried out during final forming, and the problems that materials are prone to being rolled in during milling, chips are difficult to discharge smoothly, milling burrs and wiredrawing are generated and the like are solved; effective cooperation is formed before and after the whole processing flow.

The invention relates to the technical field of pressure maintaining procedures after an FPC board and a thermosensitive film are attached, in particular to a pressure maintaining machine for an FPC. Comprising a rack, an upper die assembly, a lower die assembly, a lifting mechanism and a conveying assembly. The upper die assembly comprises a mounting plate and a plurality of pressure maintaining assemblies. Each pressure maintaining assembly comprises a fixing piece, a pressure sensor and a pressure head part, the fixing piece is arranged on the mounting plate, the pressure sensor is connected with the fixing piece, the pressure head part comprises a metal plate and a high-temperature-resistant piece, the metal plate is in sliding connection with the fixing piece, and the high-temperature-resistant piece is connected with the metal plate and protrudes out of the bottom surface of the metal plate; the lower die assembly comprises a lower die plate, the lower die plate comprises a plurality of lower convex columns, and after the upper die assembly and the lower die assembly are assembled, one pressure sensor is used for sensing the pressure between one high-temperature-resistant piece and one lower convex column; the controllability of pressure in unit area in the pressure maintaining process is improved, and the stability of production and machining quality is improved.

The present invention discloses a vacuum hot pressing forming device for copper-clad substrates, which is applied in the technical field of vacuum hot pressing forming of copper-clad substrates. By setting a vacuum limiting mechanism, the limiting component can reinforce the adsorption component, and the adsorption component can evacuate itself to a vacuum. The vacuum environment will enhance the direct heat transfer effect. The connection component can limit the adsorption component to increase the tightness of the internal vacuum environment. The bearing component can limit the copper-clad substrate to increase the stability of the copper-clad substrate being limited. The clamping component can clamp the raw material plate of the copper-clad substrate, making the layers of the raw material plates of the copper-clad substrate distinct and easy to distinguish. The reset component can reset the clamping component to facilitate clamping a new batch of raw material plates of the copper-clad substrate.

The invention relates to a circuit board processing method, in particular to a circuit board pressure transmission method, which comprises the following steps of: providing a film, arranging the film on a substrate, performing vacuum pressurization film pasting, and keeping a first electric heating temperature and a first electric heating duration in the process, so that the film is pasted on the substrate; carrying out first-stage baking on the substrate pasted with the film, and keeping a first baking temperature and a first baking duration in the process; carrying out second-stage baking on the substrate pasted with the film, and keeping a second baking temperature and a second baking duration in the process; wherein the second baking temperature is higher than the first baking temperature, and the second baking duration is longer than the first baking duration; the film comprises a resin functional layer and a carrier layer, and when the film is arranged on the substrate, one side of the resin functional layer of the film faces the substrate. By means of the structure, the film can be efficiently attached to the substrate in a high-quality mode through the arrangement of the carrier layer and the method that electric heating is matched with multi-section baking.

The invention provides a printed circuit board and a preparation method thereof, the printed circuit board comprises a core board, a first bonding insulating layer and a high-speed line layer, the first bonding insulating layer is located on the surface of the core board, the first bonding insulating layer is provided with a high-speed wiring area, and the high-speed wiring area is located on the surface of the core board. A line groove is formed in the face, away from the core plate, of the first bonding insulation layer in the high-speed wiring area, and the high-speed line layer is embedded in the line groove. According to the printed circuit board provided by the invention, after the high-speed line layer is embedded into the line groove, the relative position of the high-speed line layer and the surrounding medium is fixed and uniform, further, due to the existence of the line groove, the distance between the high-speed line layer and the first bonding insulating layer is kept stable, and the medium distribution is uniform; impedance fluctuation caused by factors such as electroplating in operation is reduced, consistency of wiring characteristic impedance can be better maintained, and high-speed signal transmission quality is guaranteed.