132results about "Laminating printed circuit boards" patented technology

The present invention relates to the field of flexible circuit board production, and particularly relates to a production device and process for die cutting and wire laminating of a double-sided combined flexible circuit board. The production device comprises a frame, and a die cutting head on the frame, used for die cutting a flexible circuit board to be processed. A wire laminating unit used for laminating wires on the flexible circuit board is provided on the side of the frame away from the die cutting head, and the die cutting head and the wire laminating unit work in conjunction with each other to achieve the effects of die cutting the front side of the flexible circuit board and laminating the wires on the back surface of the flexible circuit board. By implementing die cutting and wire laminating of a flexible circuit board on a single machine, the present invention effectively avoids the problems that materials need to be moved multiple times during use, and after the materials are moved multiple times, the relative position between the materials and the machine and the relative position of the materials need to be adjusted multiple times to ensure alignment, which affects the accuracy and consistency of a final circuit board.

This application discloses an electronic device. The electronic device provided in this application includes a frame, a circuit board, and a radio frequency component. The frame includes a metal member used as an antenna. The circuit board includes a board body and a reinforcement member, the board body has a peripheral region close to the frame, and the reinforcement member is available for radio frequency transmission. The radio frequency component is electrically connected to the circuit board, and is electrically connected to the metal member of the frame. A projection of the radio frequency component on a plane on which the board body is located is a first projection, a projection of the reinforcement member on the plane on which the board body is located is a second projection, and at least a part of the first projection is located in a range of a projection region of the second projection. According to the electronic device provided in this application, the reinforcement member is disposed on a periphery that is of the circuit board and that is close to the frame, and the reinforcement member is available for radio frequency transmission, and does not affect electrical performance of the radio frequency component disposed on a periphery of the circuit board, so that the antenna has good radiation performance, and the electronic device has good communication performance.

An electronic device and a method of manufacturing the electronic device are provided. The method of manufacturing the electronic device includes the following steps: providing a circuit board; performing a first pre-bending step on the circuit board so that the circuit board is bent to have a first radius of curvature; providing a back frame having a second radius of curvature; attaching the circuit board having the first radius of curvature to the back frame through an adhesive. A difference between the first radius of curvature and the second radius of curvature is within 10%.

The utility model provides a kind of FPC rubberized paper auxiliary material reinforcing machine with heating function, including base, longitudinal slide rail being arranged at the both ends of base, transverse slide rail being arranged on longitudinal slide rail, adsorption assembly being arranged on transverse slide rail and being able to do transverse motion on transverse slide rail;The front end of feeding assembly is equipped with first transverse groove and second transverse groove;Image camera for identifying sticker is equipped in first transverse groove;Second transverse groove is equipped with heating element, and the top of heating element, the both sides of second transverse groove are equipped with conveying chain;Adsorption assembly includes vertical support plate slidingly arranged on the transverse slide rail and towards the feeding assembly;The side of vertical support plate towards feeding assembly is equipped with left vertical telescopic cylinder and right vertical telescopic cylinder at both ends;The lower end of left vertical telescopic cylinder and right vertical telescopic cylinder is connected with connecting plate;The bottom of connecting plate is equipped with multiple vacuum suction nozzles, and the side of vertical support plate is fixedly connected with positioning camera.

The embodiment of the application discloses a method for improving the thickness uniformity of a PCB (Printed Circuit Board), which comprises the following steps: preparing a substrate and a prepreg to be fused, alternately and overlappingly placing the substrate and the prepreg to obtain a PCB to be fused, arranging a hot-melt block between the substrate and the prepreg of the PCB to be fused, the hot-melt block having a copper grid structure, placing the PCB to be fused with the hot-melt block arranged thereon on a processing platform of a hot-melt machine, starting the hot-melt machine, heating the hot-melt block, and pressing the PCB to be fused to obtain a fused PCB. The hot-melt block with the copper grid structure is arranged between the substrate and the prepreg of the PCB to be fused, and then the PCB to be fused is heated and pressed, so that the hot-melt block area is uniformly heated, and then the thickness of the produced PCB is uniform, and it is not easy to form wrinkles, and the probability of the PCB being scrapped is reduced.

A display device includes a display panel, which includes a plurality of panel pads arranged along a first direction, and a flexible printed circuit board. The flexible printed circuit board includes a base portion, a first protrusion protruding in a second direction intersecting a first direction from one side of the base portion extending in the first direction, a second protrusion protruding in the second direction from the one side of the base portion and spaced apart from the first protrusion in the first direction, first connection pads disposed on the first protrusion, and second connection pads disposed on the second protrusion. At least some of the first connection pads extend in a direction inclined with respect to the first direction and the second direction, and at least some of the second connection pads extend in a direction inclined with respect to the first direction and the second direction.

The application discloses a flexible circuit board, which comprises a first dielectric layer, a second dielectric layer, a glue layer, a circuit layer and a reinforcing sheet, the glue layer is arranged between the first dielectric layer and the second dielectric layer, the circuit layer is embedded in the glue layer, and the reinforcing sheet is embedded in the glue layer and is arranged in a spaced mode with the circuit layer. The application further provides a terminal device and a manufacturing method of the flexible circuit board. The flexible circuit board provided by the application is beneficial to reducing the rebound of the reinforcing sheet, avoiding the cracking of the reinforcing sheet and the flexible circuit board and preventing interference and the like.

A camera module comprising: a lens holder in which lenses are disposed; a bracket disposed under the lens holder; a printed circuit board disposed at the lower portion of the bracket; and a stiffener disposed under the printed circuit board, wherein the lower surface of the bracket has a leg portion which protrudes further down than other areas so as to be coupled to the upper surface of the stiffener.

The application discloses a reinforcing plate attaching and positioning dust removing mechanism, which comprises a fixed plate fixed on a workbench, a positioning frame with a hollow middle part and a square structure arranged on the top of the fixed plate, four side surfaces of the inner side of the positioning frame are all arranged in an inclined surface mode, and two side edges of the positioning frame opposite to each other are provided with moving grooves, two side edges of the positioning frame opposite to each other are provided with placing grooves, and the dust removing mechanism further comprises an electrostatic dust removing rod, two ends of the electrostatic dust removing rod are provided with connecting rods respectively corresponding to the two moving grooves of the positioning frame and are slidably inserted into the two moving grooves. The application realizes reinforcing plate attachment, automatically positions and adjusts the position when the plate is moved to the receiving plate, improves the attachment accuracy, realizes reinforcing plate attachment of different reinforcing plates on different positions of the same plate at the same time, and the dust suction and attachment can be performed on the dust falling after the electrostatic dust removing rod stops working, and the application is simple and practical.

An electronic circuit on a textile support comprises circuit lines having conductor tracks lying over the surface of the textile support and a contacting module having a socket integrally bonded to the textile support for mechanically detachably receiving an electronic module. The contacting module comprises electrically conductive contact surfaces and is designed to receive an electronic module, which is provided with electrical contacts, at a specified position relative to the socket such that a plurality of the electrical contacts of the electronic module are electrically connected to a plurality of contact surfaces of the contacting module. The socket has an inner socket base portion and the lower side thereof is integrally bonded face-to-face to a socket cover portion of a lower cover (2800), the integrally bonded face-to-face connection containing one or more intermediate layers, each of which is connected, on both sides, to adjacent surfaces face-to-face and in which electrically conductive conductor track portions are located. The conductor track portions are electrically connected to the contact surfaces of the contacting module through the inner socket base portion, or the sides of the conductor track portions facing the specified position serve as contact surfaces of the contacting module through openings in the inner socket base.

A reinforcing plate to be bonded to a flexible printed circuit board, the reinforcing plate having heat resistance sufficient to withstand a reflow soldering process and configured to include a molded article made of a thermoplastic resin. An electrical component includes the reinforcing plate and the flexible printed circuit board to which the reinforcing plate is bonded.

The application discloses a film covering method and device of a flexible circuit board, electronic equipment and a storage medium, relates to the technical field of battery energy sources, and first controls a welding module to weld a nickel sheet to a flexible circuit board; controls a film pasting module to paste a protective film to an end surface of the flexible circuit board; controls a conveying module to convey a first auxiliary material, a backing plate, the flexible circuit board, oil absorption paper and a second auxiliary material to a lower mold plate in sequence to form a composite, and the flexible circuit board is pressed and heated through an upper mold plate and the lower mold plate, so that the flux in the end surface of the flexible circuit board melts and overflows to flow to the oil absorption paper; the oil absorption paper absorbs the flux, and meanwhile, the connection between the protective film and the end surface of the flexible circuit board can be reinforced. The film covering of the flexible circuit board is automatically completed, the flux is absorbed through the oil absorption paper in the pressing process, ultrasonic cleaning and manual wiping are not needed, and the production efficiency can be improved.

The invention discloses thermal grease dispensing and cooling fin pasting integrated equipment, and relates to the technical field of PCBA board processing, the thermal grease dispensing and cooling fin pasting integrated equipment comprises a thermal grease dispensing mechanism and a cooling fin pasting mechanism, the cooling fin pasting mechanism comprises a vibration disc used for conveying cooling fins, and the thermal grease dispensing and cooling fin pasting integrated equipment further comprises a jacking mechanism and a reverse conveying mechanism; the jacking mechanism is used for jacking the cooling fins at the tail end of the vibration disc. And when the jacking mechanism jacks the radiating fin at the tail end, the reverse conveying mechanism operates to force the radiating fin adjacent to the radiating fin at the tail end to be away from the jacking mechanism. According to the integrated equipment for dispensing the thermal grease and pasting the cooling fins, when the cooling fins at the tail end of the vibration disc are jacked up through the jacking mechanism, the cooling fins adjacent to the cooling fins at the tail end can be forced to be away from the jacking mechanism through the reverse conveying mechanism, and the other cooling fins are prevented from moving into the ascending stroke of the jacking mechanism as much as possible; and the situation that the cooling fins are influenced by the jacking mechanism to turn over is avoided as much as possible.

A reinforcing plate to be bonded to a flexible printed circuit board, the reinforcing plate having heat resistance sufficient to withstand a reflow soldering process and configured to include a molded article made of a thermoplastic resin. An electrical component includes the reinforcing plate and the flexible printed circuit board to which the reinforcing plate is bonded.

The application discloses a circuit board manufacturing method of embedding carbon oil resistance, comprising the following steps: taking a double-sided copper-clad plate, manufacturing a circuit pattern including a carbon oil connecting pattern, the carbon oil connecting pattern including a wire end and a connecting end, the width of the connecting end being greater than that of the wire end, pasting dry films to both sides, manufacturing a dry film window pattern in the area corresponding to the carbon oil pattern on the side where the carbon oil connecting pattern is located, performing plasma treatment, then removing the film, manufacturing a carbon oil layer in the carbon oil pattern area, taking a bonding layer prepreg, taking other layer core plates, stacking and pressing the carbon oil plate together, and performing post-process manufacturing to form the circuit board of embedding carbon oil resistance; by designing the connecting end, the carbon oil layer has a larger bonding area, the bonding force of the carbon oil layer is increased, the prepreg is stacked on the surface of the carbon oil layer, the interlayer bonding force of the carbon oil layer is improved, and the problems of falling off, multilayer board delamination and even multilayer board explosion caused by poor bonding of the carbon oil layer are solved.

The invention discloses an electromagnetic pulse auxiliary rapid hot pressing system for an ultrathin multi-layer FPC, and the system comprises a processing table which is provided with a circulating conveying mechanism, the processing table is provided with a support beam, the lower part of the support beam is symmetrically provided with connecting frames at the rear side of the processing table through a pressing cylinder, the lower parts of the connecting frames are provided with sealing covers, and the circulating conveying mechanism is provided with an adaptive tool. A partition plate is arranged in the sealing cover, an electromagnetic hot-pressing array is arranged on the lower side of the partition plate, a detection mechanism is arranged on the partition plate, an air exchange mechanism is further arranged on the sealing cover, feeding and discharging mechanisms are symmetrically arranged on the front side of the support beam, and a main controller is arranged above the support beam; the ACF is directly heated through electromagnetic pulses, the heating rate is increased, the process time is shortened, single-block regulation and control can be achieved through an array type hot-pressing structure, the applicability is good, meanwhile, bonding bubbles can be reduced through vacuum pumping in the initial stage of hot-pressing, inert gas is filled in the high-temperature stage, FPC copper foil oxidation or ACF conductive particle oxidation failure is restrained, and the FPC hot-pressing quality is improved.

Disclosed are processes and materials for adhesive circuit patterning which strengthen and protect printed circuit traces and adhesive bonded joints of surface mounted devices in flexible or stretchable electronics in a single process. A method for adhesive circuit pattering include deposing a circuit pattern directly on a single thermal adhesive film, placing one or more surface mounted devices on a cured deposed circuit of the deposed circuit pattern, curing the one or more surface mounted devices and the cured deposed circuit together to form an assembled deposed circuit, placing the assembled deposed circuit on a stretchable substrate, and melting the single thermal adhesive film directly onto the assembled deposed circuit and the stretchable substrate to reinforce joint bonds of the assembled deposed circuit and to attach the assembled deposed circuit to the stretchable substrate.

The application discloses a preparation method of a PCB (Printed Circuit Board) with a stepped groove, which comprises the following steps: pressing a plurality of core plates with inner layer patterns and a plurality of base layer sheets according to a preset stacking sequence to form a laminated plate, wherein the laminated plate comprises a laser window layer, a signal layer and a power supply layer arranged in sequence; a first groove is formed above the laser window layer by milling; the base layer sheet remaining above the laser window layer is removed by laser, and a part of the copper layer of the signal layer and a part of the copper layer of the power supply layer are exposed through each laser window of the laser window layer to form a stepped groove; the inner wall of the stepped groove is plated with copper to obtain a copper wall; the connection between the copper layer and the copper wall between the signal layer and the power supply layer is disconnected to avoid the electrical connection between the signal layer and the power supply layer; after the holes and grooves of the laminated plate are filled with resin, the outer surface of the laminated plate is plated with copper, and outer layer circuit etching is performed to obtain the PCB with the stepped groove. The application can obtain the PCB with the stepped groove.

A common conveyance jig that is a conveyance jig employed to manufacture a circuit board including a board formed from a metal material, an insulation layer fixed on the board, and a circuit part formed from an electroconductive material and fixed on the insulation layer. The common conveyance jig includes a base part that supports the board from below, and a plurality of movement-restricting units that detachably engage with the base part and restrict displacement, in a horizontal direction, of the board supported from below by the base part.

Some embodiments of the present disclosure relate to a system. In some embodiments, the system includes a photovoltaic module and a module-level power electronics device electrically connected to the photovoltaic module. In some embodiments, the module-level power electronics device comprises a laminated potted printed circuit board. In some embodiments, the laminated potted printed circuit board comprises a potted printed circuit board and an encapsulant covering the potted printed circuit board. In some embodiments, the potted printed circuit board comprises: a printed circuit board having a top surface, and a pottant covering the top surface of the printed circuit board. In some embodiments, the laminated potted printed circuit board is substantially void-free.

An electronic apparatus includes: an electronic component; a substrate including a first layer at which the electronic component and a first ground pattern are disposed, and a second layer at which a second ground pattern is disposed; and a case which is in contact with the first ground pattern, covers the electronic component, reduces magnetic noise, and is fixed to the substrate, and plural conductors connecting the first ground pattern and the second ground pattern are disposed along a portion of the first ground pattern, the portion being in contact with the case.

The application provides a laminating hot melting all-in-one machine, and relates to the technical field of PCB production equipment. The laminating hot melting all-in-one machine comprises: a feeding module, which is used for combining PP and a core plate to form a CPC pre-lamination structure; a transfer module, which is used for transferring the CPC pre-lamination structure and a CPC unit; a hot melting module, which is used for performing hot melting treatment on the CPC pre-lamination structure transferred by the transfer module to form a CPC unit to be transferred by the transfer module; and a discharging module, which is used for stacking the PP on the CPC unit transferred by the transfer module to form a PCPCP structure for discharging. The embodiment of the application can realize the automation of the pre-lamination process, thereby avoiding the problem of manual taking, effectively eliminating the manual feeding and discharging errors and solving the stacking error problem, improving the overall process stability, being high in production efficiency and fast in speed, greatly reducing the labor cost, and effectively meeting the production demand.

A manufacturing device for a circuit board including a board, an insulation layer, and a circuit part. The circuit board manufacturing device includes plural thermopress sections each including a reception jig on which the board is set, a lower mold to which the reception jig is fixed, an upper mold that engages with the lower mold to press the insulation layer or the circuit part toward the side of the board, and heaters that respectively heat the upper mold and the lower mold. The circuit board manufacturing device also includes a thermopress section conveyance unit that moves the plural thermopress sections in sequence between a pressure application position at which the upper mold can apply pressure toward the lower mold, and a setup position at which a board can be removed from the reception jig and a board can be set on the reception jig.

The invention relates to the technical field of printed circuit boards, and discloses a printed circuit board with a heat dissipation substrate and a manufacturing method thereof, and the method comprises the steps: providing a processing plate which comprises the heat dissipation substrate, is provided with a connecting surface, is provided with a connecting hole, penetrates through the heat dissipation substrate, and is internally provided with an annular blocking part, the axis of the blocking piece is parallel to the axis of the connecting hole, and the blocking piece protrudes out of the connecting face. A connecting layer and a daughter board are sequentially arranged on the connecting surface, the connecting layer is provided with a window, a barrier piece protruding out of the connecting surface is located in the window, the daughter board is provided with a conduction part, and the conduction part is arranged corresponding to the internal space of the barrier piece; and pressing the processing plate material, the connecting layer and the daughter board. The printed circuit board with the heat dissipation substrate and the manufacturing method of the printed circuit board are used for solving the problem that in the prior art, an inner layer circuit is prone to being damaged when a protective film is engraved through laser before pressing and when controlled depth milling is conducted after pressing, and the risk of open circuit is caused.

The invention relates to the technical field of flexible circuit boards, and discloses a control method and system for a three-dimensional curved surface attaching jig of a flexible circuit board, and the method comprises the steps: carrying out the surface scanning of a substrate, obtaining the curvature radius data, arranging a plurality of electromagnetic clamping points, dividing the electromagnetic clamping points into a plurality of sectors, meanwhile, calculating a target pressure value of a driving actuator; the release time interval between the adjacent electromagnetic clamping points is calculated, and a boundary time sequence control program is generated; all electromagnetic clamping points are kept in a locked state and the flexible circuit board is positioned in the pre-lamination stage, a flat area, a transition area and a high-curvature area are processed in sequence in the partition lamination stage, the electromagnetic clamping points in corresponding sectors are released according to a boundary time sequence control program, and corresponding target pressure values are applied. And in the pressure maintaining and curing stage, all the electromagnetic clamping points are switched to the locking state again, and partition heating is started. According to the method, the pressure distribution uniformity is ensured, and the quality defect caused by the too large stress gradient is effectively restrained.

The application provides a packaging substrate, a preparation method thereof, and a packaging substrate heat dissipation detection system and method. The preparation method of the packaging substrate comprises the following steps: S11, providing a support plate attached with a detachable film; S12, preparing a first metal block on the detachable film by using a dry process; S13, forming a first dielectric layer on the detachable film and the first metal block to encapsulate the first metal block, so that a packaging substrate structure is obtained; S14, forming a first metal seed layer on the surface of the packaging substrate structure; S15, forming a first metal disc and a first circuit on the first metal seed layer; S16, removing the support plate through the detachable film, and reversing the packaging substrate structure; and S17, sequentially forming a second metal seed layer, a second metal disc and a second circuit on the surface of the packaging substrate structure. Compared with a traditional manual copper block embedding process, the application can effectively avoid the problems of low alignment accuracy, substrate delamination, board explosion and yield reduction, and the process method is environmentally friendly and low in cost, so that the application is conducive to popularization.

An inlay for a component carrier includes a gas-permeable porous layer structure, an upper layer structure, arranged on the gas-permeable porous layer structure, the upper layer structure defining a cavity such that a portion of the gas-permeable porous layer structure is exposed and an upper metal layer structure arranged on the upper layer structure. A component carrier with the inlay and manufacturing methods of the inlay and the component carrier are described.

The application belongs to the technical field of circuit board manufacturing, and particularly relates to a buried magnetic circuit board manufacturing method and an electronic component. The buried magnetic circuit board manufacturing method comprises the following steps: preparing a substrate, the substrate is prepared with two plates, and the two plates are oppositely arranged; burying a magnetic body, a pressure bearing plate with a predetermined strength is arranged between the two plates, a containing through slot is formed on the pressure bearing plate, and an adhesive layer is arranged on both sides of the pressure bearing plate, a first magnetic body is accommodated in the containing through slot, and the two plates are respectively pressed and adhered by the two sides of the pressure bearing plate under a predetermined temperature and a predetermined pressure; filling, a containing hole is formed on one of the plates, the containing hole penetrates to the first magnetic body, the cross-sectional area of the first magnetic body parallel to the pressure bearing plate is greater than the cross-sectional area of the containing hole parallel to the pressure bearing plate, and a magnetic conductive glue is filled in the containing hole; and solidifying, the magnetic conductive glue is solidified. The application improves the total inductance of the circuit board, and does not need to enlarge the size of the circuit board, which is beneficial to the miniaturization of the circuit board.

A manufacturing device for a circuit board including a board that is formed from a metal material and includes a heat dissipation section formed with a protruding profile, an insulation layer that is formed in a sheet shape from an insulating material and that is fixed to a face on the board at an opposite side from the heat dissipation section, and a circuit part that is formed from an electroconductive material and that is fixed on the insulation layer. The circuit board manufacturing device includes a reception jig that includes an insertion hole for insertion of the heat dissipation section, and on which the board is set in a state in which the heat dissipation section has been inserted into the insertion hole; a lower mold to which the reception jig is fixed; and an upper mold that is disposed at an upper side with respect to the lower mold and that, when engaged with the lower mold, presses the insulation layer or the circuit part toward a side of the board.