251results about "Laminating printed circuit boards" patented technology

The invention discloses a stiffening plate fitting, positioning and dust removing mechanism which comprises a fixed plate fixed to a workbench, a positioning frame which is hollow in the middle and is of a square structure is arranged at the top of the fixed plate, the four side faces of the inner side of the positioning frame are inclined faces, and moving grooves are formed in the front side edge and the rear side edge, opposite to each other, of the positioning frame. Placing grooves are formed in the left and right opposite side edges of the positioning frame, connecting rods are arranged at the two ends of the electrostatic dust collection rod, and the two ends of the electrostatic dust collection rod are in sliding insertion connection with the two moving grooves of the positioning frame correspondingly. The device is used for reinforcing and attaching the plate, automatic positioning and position adjusting are achieved when the plate moves to the bearing plate, the attaching accuracy is improved, reinforcing and attaching of various reinforcing plates at different positions of the same plate are achieved at the same time, the dust collection paste can adsorb and collect dust falling after an electrostatic dust collection rod stops working, and the device is simple and practical.

The present invention relates to the technical field of FPC line board reinforcement plate processing equipment, and specifically to an FPC line board reinforcement plate bonding machine. The positioning part includes a double-track slide arranged horizontally on the top of the machine frame, a movable frame is arranged between the sliders of the double-track slide, a mounting frame is arranged on the movable frame, a displacement group is arranged on the movable frame, and a distribution frame with at least two sets of winding parts built in is provided on the movable part of the displacement group. By designing the stamping part, the conveying part and the attachment part as independent modules respectively, product defects caused by uneven or excessive pressure are effectively avoided, and the consistency and yield rate of the product are significantly improved; at the same time, the device is also equipped with multiple sets of independently operated winding parts, which cooperate with the flexible positioning function of the moving part and the positioning part to enable different types of reinforcement plate films to be continuously switched and used, thereby meeting the attachment requirements of different types of FPC boards, further improving the production continuity, process level and adaptability of the device, and more flexibly responding to diversified production needs.

The invention relates to the technical field of FPC (flexible printed circuit) board stiffening plate processing equipment, in particular to an FPC board stiffening plate laminating machine. The position adjusting part comprises a double-rail sliding table transversely arranged at the top in the machine frame, a moving frame is arranged between sliding blocks of the double-rail sliding table, a mounting frame is arranged on the moving frame, a displacement set is arranged on the moving frame, and a distribution frame internally provided with at least two winding parts is arranged on a moving piece of the displacement set. The stamping part, the conveying part and the attaching part are respectively designed into independent modules, so that product defects caused by uneven or overlarge pressure are effectively avoided, and the consistency and the yield of products are remarkably improved; meanwhile, the device is further provided with a plurality of groups of winding parts which operate independently, and the flexible positioning function of the moving part and the position adjusting part is matched, so that different types of reinforcing plate films can be continuously switched and used, the attachment requirements of different types of FPC boards are met, the production continuity, the process degree and the adaptive capacity of the device are further improved, and the production cost is reduced. And diversified production requirements can be met more flexibly.

The invention provides a rigid-flex board 3D steel sheet reinforced press-fit structure. The rigid-flex board 3D steel sheet reinforced press-fit structure comprises a first press-fit auxiliary material, a second press-fit auxiliary material, a lower alignment jig, a laminated structure, an upper alignment jig, a second press-fit auxiliary material and a first press-fit auxiliary material which are sequentially arranged from bottom to top. The laminated structure comprises a windowed lower press-fit auxiliary material, a rigid-flex board and a windowed upper press-fit auxiliary material, and the 3D steel sheet comprises a substrate and a lug boss arranged on the substrate; the position, corresponding to the protruding part, of the rigid-flex board is windowed, the substrate is arranged on the lower side of the lower press-fit auxiliary material, and the protruding part penetrates through the windowed lower press-fit auxiliary material, the rigid-flex board and the windowed upper press-fit auxiliary material; and the lower alignment jig and the upper alignment jig are provided with mutually matched grooves corresponding to the bulge positions of the laminated structure. Through pretreatment of the rigid-flex board and the steel sheet, the surface activity is enhanced, the cohesiveness is improved, and the bonding strength of the 3D steel sheet and the rigid-flex board is remarkably improved in cooperation with a gradient pressing process.

The present invention relates to the field of flexible circuit board production, and particularly relates to a production device and process for die cutting and wire laminating of a double-sided combined flexible circuit board. The production device comprises a frame, and a die cutting head on the frame, used for die cutting a flexible circuit board to be processed. A wire laminating unit used for laminating wires on the flexible circuit board is provided on the side of the frame away from the die cutting head, and the die cutting head and the wire laminating unit work in conjunction with each other to achieve the effects of die cutting the front side of the flexible circuit board and laminating the wires on the back surface of the flexible circuit board. By implementing die cutting and wire laminating of a flexible circuit board on a single machine, the present invention effectively avoids the problems that materials need to be moved multiple times during use, and after the materials are moved multiple times, the relative position between the materials and the machine and the relative position of the materials need to be adjusted multiple times to ensure alignment, which affects the accuracy and consistency of a final circuit board.

According to the printed circuit board and the manufacturing method for the same-layer local multiple-copper-thickness circuit pattern of the printed circuit board, the same-layer high-frequency signal circuit on the printed circuit board is patterned step by step, and the multiple-copper-thickness circuit is accurately constructed in the same circuit layer in combination with the two-time pattern electroplating process and the voltage conversion process. Specifically, a layer of surface copper foil is additionally covered on the surface of the copper foil of the copper-clad substrate to form a voltage-transferring substrate, the surface copper foil is used as a connecting layer between a first circuit layer and a second circuit layer, and two surfaces of the surface copper foil are independently electroplated twice, so that the copper thickness distribution of different circuit areas is accurately controlled, and the voltage-transferring effect is improved. And finally, a plurality of signal circuit patterns with coexisting copper thicknesses are constructed in the surface copper layer on the inner-layer voltage conversion substrate, so that the fineness and reliability of the signal circuit are ensured to meet the high-frequency signal transmission requirement, the layout flexibility of the signal circuit on the printed circuit board is improved, the impedance matching of the signal circuit is ensured, and the signal loss is reduced at the same time.

The present invention provides a flexible LED vehicle-mounted display screen and a production process thereof. The production process includes the following steps: adopting an FPC as a basic material of the display screen main body, fixing the flexible screen on a mold, mixing a PU glue, degassing treatment, glue dripping, automatic degassing, curing, and collecting. The flexible screen is fixed on a mold tray by magnetic suction or vacuum, and an air pressure sensor, a camera, a solenoid valve and the like are used to intelligently process the glue dripping and degassing processes. A plurality of Bluetooth BLE is installed on an FPC for communication, an MCU with a DMA function is adopted, and data are compressed to 50% of original data by an LZSS coding algorithm, which greatly reduces the time for the flexible screen to send data and improves the user experience.

The invention belongs to the field of PCBs (printed circuit boards), and provides a PCB material with high heat dissipation performance and a preparation method thereof.The PCB material adopts a multi-layer composite structure design and comprises a circuit board layer, a heat conduction insulating layer, a metal bottom layer, a silica gel-based heat conduction glue layer, a heat dissipation layer and heat dissipation fins, wherein the heat conduction insulating layer is a polyimide composite material in which hexagonal boron nitride nanosheets are oriented in parallel, and the heat dissipation layer is formed by coating an aluminum nitride reinforced aluminum-based composite material with a titanium nitride transition layer and is integrally die-cast with the heat dissipation fins. Through key technologies such as surface modified boron nitride nanosheet suction filtration orientation, polyamide acid dipping curing, heat dissipation assembly preparation through a coating-in-situ nitriding-die casting process and overall hot pressing assembly, the excellent heat conduction performance of the heat conduction insulating layer in the plane direction is achieved; the problems of low heat dissipation efficiency, poor device reliability and the like caused by insufficient heat-conducting property and insulating property of a traditional PCB material are solved, and the material has wide application value.

The invention discloses an FPC flexible circuit board automatic bending device and a bending method thereof, and relates to the technical field of FPC bending, the FPC flexible circuit board automatic bending device comprises a bending box, a curing mechanism is arranged in the middle of the upper end of the bending box, an air pipe frame is arranged on one side of the upper end of the bending box, and four FPC substrate mechanisms distributed in an annular array are arranged in the curing mechanism; and one side of the upper end of the bending box is provided with a film covering mechanism which is matched with the curing mechanism to carry out dispensing pre-pressing treatment on the FPC in the FPC substrate mechanism. The air guide sheet extracts air above the substrate plate, so that the thin sheet film can be tightly attached to the surface of the FPC circuit board, glue is helped to be quickly diffused on the surface of the FPC circuit board, flowing and diffusion of the glue are accelerated through the negative pressure effect, it is ensured that the glue can uniformly cover an area needing to be bonded, and the bonding efficiency is improved. And particularly, line connection points in complex shapes or narrow spaces are provided.

The invention discloses a head pasting device and method capable of adjusting pressure through pneumatic control, and belongs to the technical field of head pasting, an upper rotating shaft and a lower rotating shaft are mounted on a rotating shaft mounting seat through rotating bearings, a power device used for driving the upper rotating shaft to rotate is arranged on the rotating shaft mounting seat, and the lower rotating shaft is connected with the upper rotating shaft through a bolt; a closed cavity is formed in the connecting position of the upper rotating shaft and the lower rotating shaft, an air bag diaphragm and a piston are arranged in the closed cavity, a hollow guide shaft is coaxially arranged on the piston, the hollow guide shaft is installed in the lower rotating shaft through a guide shaft sleeve and connected with the suction nozzle assembly, and the pneumatic control pressure assembly is communicated with the closed cavity and the hollow guide shaft. According to the scheme, an air control pressure assembly is adopted, air pressure input is dynamically adjusted through an electric proportional valve, flexible transmission of an air bag diaphragm and a piston is combined, air pressure is accurately converted into linear displacement, and suction nozzle contact pressure is driven to follow a set value in real time.

The present invention discloses a vacuum hot pressing forming device for copper-clad substrates, which is applied in the technical field of vacuum hot pressing forming of copper-clad substrates. By setting a vacuum limiting mechanism, the limiting component can reinforce the adsorption component, and the adsorption component can evacuate itself to a vacuum. The vacuum environment will enhance the direct heat transfer effect. The connection component can limit the adsorption component to increase the tightness of the internal vacuum environment. The bearing component can limit the copper-clad substrate to increase the stability of the copper-clad substrate being limited. The clamping component can clamp the raw material plate of the copper-clad substrate, making the layers of the raw material plates of the copper-clad substrate distinct and easy to distinguish. The reset component can reset the clamping component to facilitate clamping a new batch of raw material plates of the copper-clad substrate.

The invention provides a printed circuit board and a preparation method thereof, the printed circuit board comprises a core board, a first bonding insulating layer and a high-speed line layer, the first bonding insulating layer is located on the surface of the core board, the first bonding insulating layer is provided with a high-speed wiring area, and the high-speed wiring area is located on the surface of the core board. A line groove is formed in the face, away from the core plate, of the first bonding insulation layer in the high-speed wiring area, and the high-speed line layer is embedded in the line groove. According to the printed circuit board provided by the invention, after the high-speed line layer is embedded into the line groove, the relative position of the high-speed line layer and the surrounding medium is fixed and uniform, further, due to the existence of the line groove, the distance between the high-speed line layer and the first bonding insulating layer is kept stable, and the medium distribution is uniform; impedance fluctuation caused by factors such as electroplating in operation is reduced, consistency of wiring characteristic impedance can be better maintained, and high-speed signal transmission quality is guaranteed.

This application discloses an electronic device. The electronic device provided in this application includes a frame, a circuit board, and a radio frequency component. The frame includes a metal member used as an antenna. The circuit board includes a board body and a reinforcement member, the board body has a peripheral region close to the frame, and the reinforcement member is available for radio frequency transmission. The radio frequency component is electrically connected to the circuit board, and is electrically connected to the metal member of the frame. A projection of the radio frequency component on a plane on which the board body is located is a first projection, a projection of the reinforcement member on the plane on which the board body is located is a second projection, and at least a part of the first projection is located in a range of a projection region of the second projection. According to the electronic device provided in this application, the reinforcement member is disposed on a periphery that is of the circuit board and that is close to the frame, and the reinforcement member is available for radio frequency transmission, and does not affect electrical performance of the radio frequency component disposed on a periphery of the circuit board, so that the antenna has good radiation performance, and the electronic device has good communication performance.

An electronic device and a method of manufacturing the electronic device are provided. The method of manufacturing the electronic device includes the following steps: providing a circuit board; performing a first pre-bending step on the circuit board so that the circuit board is bent to have a first radius of curvature; providing a back frame having a second radius of curvature; attaching the circuit board having the first radius of curvature to the back frame through an adhesive. A difference between the first radius of curvature and the second radius of curvature is within 10%.

The utility model provides a kind of FPC rubberized paper auxiliary material reinforcing machine with heating function, including base, longitudinal slide rail being arranged at the both ends of base, transverse slide rail being arranged on longitudinal slide rail, adsorption assembly being arranged on transverse slide rail and being able to do transverse motion on transverse slide rail;The front end of feeding assembly is equipped with first transverse groove and second transverse groove;Image camera for identifying sticker is equipped in first transverse groove;Second transverse groove is equipped with heating element, and the top of heating element, the both sides of second transverse groove are equipped with conveying chain;Adsorption assembly includes vertical support plate slidingly arranged on the transverse slide rail and towards the feeding assembly;The side of vertical support plate towards feeding assembly is equipped with left vertical telescopic cylinder and right vertical telescopic cylinder at both ends;The lower end of left vertical telescopic cylinder and right vertical telescopic cylinder is connected with connecting plate;The bottom of connecting plate is equipped with multiple vacuum suction nozzles, and the side of vertical support plate is fixedly connected with positioning camera.

The embodiment of the application discloses a method for improving the thickness uniformity of a PCB (Printed Circuit Board), which comprises the following steps: preparing a substrate and a prepreg to be fused, alternately and overlappingly placing the substrate and the prepreg to obtain a PCB to be fused, arranging a hot-melt block between the substrate and the prepreg of the PCB to be fused, the hot-melt block having a copper grid structure, placing the PCB to be fused with the hot-melt block arranged thereon on a processing platform of a hot-melt machine, starting the hot-melt machine, heating the hot-melt block, and pressing the PCB to be fused to obtain a fused PCB. The hot-melt block with the copper grid structure is arranged between the substrate and the prepreg of the PCB to be fused, and then the PCB to be fused is heated and pressed, so that the hot-melt block area is uniformly heated, and then the thickness of the produced PCB is uniform, and it is not easy to form wrinkles, and the probability of the PCB being scrapped is reduced.

A display device includes a display panel, which includes a plurality of panel pads arranged along a first direction, and a flexible printed circuit board. The flexible printed circuit board includes a base portion, a first protrusion protruding in a second direction intersecting a first direction from one side of the base portion extending in the first direction, a second protrusion protruding in the second direction from the one side of the base portion and spaced apart from the first protrusion in the first direction, first connection pads disposed on the first protrusion, and second connection pads disposed on the second protrusion. At least some of the first connection pads extend in a direction inclined with respect to the first direction and the second direction, and at least some of the second connection pads extend in a direction inclined with respect to the first direction and the second direction.

The application discloses a flexible circuit board, which comprises a first dielectric layer, a second dielectric layer, a glue layer, a circuit layer and a reinforcing sheet, the glue layer is arranged between the first dielectric layer and the second dielectric layer, the circuit layer is embedded in the glue layer, and the reinforcing sheet is embedded in the glue layer and is arranged in a spaced mode with the circuit layer. The application further provides a terminal device and a manufacturing method of the flexible circuit board. The flexible circuit board provided by the application is beneficial to reducing the rebound of the reinforcing sheet, avoiding the cracking of the reinforcing sheet and the flexible circuit board and preventing interference and the like.

A camera module comprising: a lens holder in which lenses are disposed; a bracket disposed under the lens holder; a printed circuit board disposed at the lower portion of the bracket; and a stiffener disposed under the printed circuit board, wherein the lower surface of the bracket has a leg portion which protrudes further down than other areas so as to be coupled to the upper surface of the stiffener.

The application discloses a reinforcing plate attaching and positioning dust removing mechanism, which comprises a fixed plate fixed on a workbench, a positioning frame with a hollow middle part and a square structure arranged on the top of the fixed plate, four side surfaces of the inner side of the positioning frame are all arranged in an inclined surface mode, and two side edges of the positioning frame opposite to each other are provided with moving grooves, two side edges of the positioning frame opposite to each other are provided with placing grooves, and the dust removing mechanism further comprises an electrostatic dust removing rod, two ends of the electrostatic dust removing rod are provided with connecting rods respectively corresponding to the two moving grooves of the positioning frame and are slidably inserted into the two moving grooves. The application realizes reinforcing plate attachment, automatically positions and adjusts the position when the plate is moved to the receiving plate, improves the attachment accuracy, realizes reinforcing plate attachment of different reinforcing plates on different positions of the same plate at the same time, and the dust suction and attachment can be performed on the dust falling after the electrostatic dust removing rod stops working, and the application is simple and practical.

An electronic circuit on a textile support comprises circuit lines having conductor tracks lying over the surface of the textile support and a contacting module having a socket integrally bonded to the textile support for mechanically detachably receiving an electronic module. The contacting module comprises electrically conductive contact surfaces and is designed to receive an electronic module, which is provided with electrical contacts, at a specified position relative to the socket such that a plurality of the electrical contacts of the electronic module are electrically connected to a plurality of contact surfaces of the contacting module. The socket has an inner socket base portion and the lower side thereof is integrally bonded face-to-face to a socket cover portion of a lower cover (2800), the integrally bonded face-to-face connection containing one or more intermediate layers, each of which is connected, on both sides, to adjacent surfaces face-to-face and in which electrically conductive conductor track portions are located. The conductor track portions are electrically connected to the contact surfaces of the contacting module through the inner socket base portion, or the sides of the conductor track portions facing the specified position serve as contact surfaces of the contacting module through openings in the inner socket base.

A reinforcing plate to be bonded to a flexible printed circuit board, the reinforcing plate having heat resistance sufficient to withstand a reflow soldering process and configured to include a molded article made of a thermoplastic resin. An electrical component includes the reinforcing plate and the flexible printed circuit board to which the reinforcing plate is bonded.

The application discloses a film covering method and device of a flexible circuit board, electronic equipment and a storage medium, relates to the technical field of battery energy sources, and first controls a welding module to weld a nickel sheet to a flexible circuit board; controls a film pasting module to paste a protective film to an end surface of the flexible circuit board; controls a conveying module to convey a first auxiliary material, a backing plate, the flexible circuit board, oil absorption paper and a second auxiliary material to a lower mold plate in sequence to form a composite, and the flexible circuit board is pressed and heated through an upper mold plate and the lower mold plate, so that the flux in the end surface of the flexible circuit board melts and overflows to flow to the oil absorption paper; the oil absorption paper absorbs the flux, and meanwhile, the connection between the protective film and the end surface of the flexible circuit board can be reinforced. The film covering of the flexible circuit board is automatically completed, the flux is absorbed through the oil absorption paper in the pressing process, ultrasonic cleaning and manual wiping are not needed, and the production efficiency can be improved.

The invention discloses thermal grease dispensing and cooling fin pasting integrated equipment, and relates to the technical field of PCBA board processing, the thermal grease dispensing and cooling fin pasting integrated equipment comprises a thermal grease dispensing mechanism and a cooling fin pasting mechanism, the cooling fin pasting mechanism comprises a vibration disc used for conveying cooling fins, and the thermal grease dispensing and cooling fin pasting integrated equipment further comprises a jacking mechanism and a reverse conveying mechanism; the jacking mechanism is used for jacking the cooling fins at the tail end of the vibration disc. And when the jacking mechanism jacks the radiating fin at the tail end, the reverse conveying mechanism operates to force the radiating fin adjacent to the radiating fin at the tail end to be away from the jacking mechanism. According to the integrated equipment for dispensing the thermal grease and pasting the cooling fins, when the cooling fins at the tail end of the vibration disc are jacked up through the jacking mechanism, the cooling fins adjacent to the cooling fins at the tail end can be forced to be away from the jacking mechanism through the reverse conveying mechanism, and the other cooling fins are prevented from moving into the ascending stroke of the jacking mechanism as much as possible; and the situation that the cooling fins are influenced by the jacking mechanism to turn over is avoided as much as possible.

A reinforcing plate to be bonded to a flexible printed circuit board, the reinforcing plate having heat resistance sufficient to withstand a reflow soldering process and configured to include a molded article made of a thermoplastic resin. An electrical component includes the reinforcing plate and the flexible printed circuit board to which the reinforcing plate is bonded.

The application discloses a circuit board manufacturing method of embedding carbon oil resistance, comprising the following steps: taking a double-sided copper-clad plate, manufacturing a circuit pattern including a carbon oil connecting pattern, the carbon oil connecting pattern including a wire end and a connecting end, the width of the connecting end being greater than that of the wire end, pasting dry films to both sides, manufacturing a dry film window pattern in the area corresponding to the carbon oil pattern on the side where the carbon oil connecting pattern is located, performing plasma treatment, then removing the film, manufacturing a carbon oil layer in the carbon oil pattern area, taking a bonding layer prepreg, taking other layer core plates, stacking and pressing the carbon oil plate together, and performing post-process manufacturing to form the circuit board of embedding carbon oil resistance; by designing the connecting end, the carbon oil layer has a larger bonding area, the bonding force of the carbon oil layer is increased, the prepreg is stacked on the surface of the carbon oil layer, the interlayer bonding force of the carbon oil layer is improved, and the problems of falling off, multilayer board delamination and even multilayer board explosion caused by poor bonding of the carbon oil layer are solved.

The invention discloses an electromagnetic pulse auxiliary rapid hot pressing system for an ultrathin multi-layer FPC, and the system comprises a processing table which is provided with a circulating conveying mechanism, the processing table is provided with a support beam, the lower part of the support beam is symmetrically provided with connecting frames at the rear side of the processing table through a pressing cylinder, the lower parts of the connecting frames are provided with sealing covers, and the circulating conveying mechanism is provided with an adaptive tool. A partition plate is arranged in the sealing cover, an electromagnetic hot-pressing array is arranged on the lower side of the partition plate, a detection mechanism is arranged on the partition plate, an air exchange mechanism is further arranged on the sealing cover, feeding and discharging mechanisms are symmetrically arranged on the front side of the support beam, and a main controller is arranged above the support beam; the ACF is directly heated through electromagnetic pulses, the heating rate is increased, the process time is shortened, single-block regulation and control can be achieved through an array type hot-pressing structure, the applicability is good, meanwhile, bonding bubbles can be reduced through vacuum pumping in the initial stage of hot-pressing, inert gas is filled in the high-temperature stage, FPC copper foil oxidation or ACF conductive particle oxidation failure is restrained, and the FPC hot-pressing quality is improved.

A display device includes: a display panel; a panel cover disposed on a back surface of the display panel and including one or more alignment marks located on a back surface of the panel cover; a printed circuit board disposed on the back surface of the panel cover and including a ground area located around the one or more the alignment marks; and a protective member disposed on the printed circuit board and including a transparent portion at least partially overlapping the ground area in a plan view.