Double-side thermally conductive adhesive tape for plastic-packaged electronic components

a technology of thermally conductive adhesive and electronic components, which is applied in the direction of transportation and packaging, laminating printed circuit boards, and improving the adhesion of metals to insulating substrates, etc., can solve the problems of increasing the complexity of circuit designs of modem electronic devices such as televisions, radios, and communications equipment, and the size of devices has continued to shrink and increase the complexity of designs

a technology of thermally conductive adhesive and electronic components, which is applied in the direction of transportation and packaging, laminating printed circuit boards, and improving the adhesion of metals to insulating substrates, etc., can solve the problems of increasing the complexity of circuit designs of modem electronic devices such as televisions, radios, and communications equipment, and the size of devices has continued to shrink and increase the complexity of designs

US20020012762A1Inactive Publication Date: 2002-01-31PARKER INTANGIBLES LLC
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  • Double-side thermally conductive adhesive tape for plastic-packaged electronic components
  • Double-side thermally conductive adhesive tape for plastic-packaged electronic components

Examples

Experimental program
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Effect test

example 1

[0064] A thermally-conductive interface laminate was prepared according to the presented invention for characterization by cold nipping a 2-3 mil (0.05-0.075 mm) layer of an acrylic PSA component (H&N Chemicals Polytack.TM. 100 LV) blended with about 50% by weight of tabular aluminum oxide (Alcoa, Pittsburgh, Pa.) onto a first side of a 0.002 in (0.050 mm) thick aluminum foil carrier. Onto the second side of the carrier was cold nipped a 2-3 mil (0.05-0.075 mm) layer of a silicone PSA component (Adhesives Research 8026) to form a double-sided PSA tape. Such tape was observed to exhibit the following physical properties:

1TABLE 1 Thermal and Mechanical Properties of a Representative Interface Tape Lamination Property Test Method Units Result Thermal Conductivity ASTM D5470 W / m-.degree. K. 0.37 Thermal Impedance ASTM D5470 .degree. C.-in.sup.2 / watt 0.54 90.degree. Peel ASTM D1000 PPI 3.0 Lap Shear Adhesion ASTM D1002 psi (MPa) 170 (1.172) Die Shear Adhesion Chomerics No. 54.sup.1 psi A...

example 2

[0066] Comparative double-sided, thermally-conductive interface tape systems were prepared to confirm the precepts of the present invention. In each of the systems, a 2.5-3 mil (0.056-0.075 mm) thick layer of an acrylic-based PSA component (H&N Chemicals Polytack.TM. 100 LV) blended with about 50% by weight of alumina was nipped onto a first side of a 0.002 in (0.050 mm) thick aluminum foil carrier. In a first system identified as "Sample A" in Table 2 which follows, a 1 mil (0.025 mm) layer of an unfilled, first silicone-based PSA component (Adhesives Research 8026) was nipped onto the second side of one of the carriers. Similarly, in a second system identified as "Sample B" in Table 2, a 1 mil (0.025 mm) layer of an unfilled, second silicone-based PSA component (Flexcon 1078) was nipped onto the second side of the other one of the carriers. The physical properties, namely 90.degree. peel (ASTM D1000), lap shear (ASTM D1002) under different bond pressures, creep adhesion (PSTC #7),...

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Abstract

A thermally conductive interface, which may be in the form of a double-sided, pressure sensitive adhesive tape, disposable intermediate a heat-generating source having a first heat transfer surface formed of a first material having a low surface energy, and a thermal dissipation member having a second heat transfer surface which is formed of a second material having a surface energy substantially higher than the surface energy of the first material, and which is disposable opposite the first heat transfer surface of the heat-generating source in a spaced-apart, heat transfer adjacency therewith. The interface includes a first pressure sensitive adhesive (PSA) surface which is bondable under pressure to at least a portion of the first heat transfer surface of the heat-generating source, and an opposing second pressure sensitive adhesive (PSA) surface bondable under pressure to at least a portion of the second heat transfer surface of the heat-generating source. The first PSA surface is presented from a layer of a thermally-conductive, first pressure sensitive adhesive composition, preferably silicone-based, having an affinity to the first heat transfer surface of the heat generating source. In turn, the second PSA surface is presented from a layer of a second pressure sensitive adhesive composition, preferably acrylic-based, different from the first composition and having an affinity to the second heat transfer surface of the thermal dissipation member. The interface is particularly adapted for bonding a plastic packaged electronic component to a metal heat sink.

Description

RELATED CASES[0001] The present application claims priority to U.S. Provisional Application Serial No.60 / 053,974; filed Jul. 28, 1997.[0002] The present invention relates broadly to a thermal management material which is interposable as an interface between, for example, the heat transfer surfaces of a heat-generating, electronic component, such as an integrated circuit (IC) chip, and a thermal dissipation member, such as a heat sink or circuit board, for the conductive cooling of the electronic component. More particularly, the invention relates to a double-side, pressure sensitive adhesive tape adapted for attaching a metal heat sink to a plastic-encapsulated or "packaged," heat-generating electronic component.[0003] Circuit designs for modem electronic devices such as televisions, radios, computers, medical instruments, business machines, communications equipment, and the like have become increasingly complex. For example, integrated circuits have been manufactured for these and ...

Claims

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Application Information

Patent Timeline
31 Jan 2002
Publication
US20020012762A1
IPC
H01L23/36; H01L23/373; H05K1/05; H05K3/00; H05K3/38
CPC
H01L23/36; Y10T428/24273; H01L2924/3011; H05K1/05; H05K3/0058; H05K3/386; H01L2924/0002; H01L23/3737
Inventors
BUNYAN, MICHAEL H.