Double-side thermally conductive adhesive tape for plastic-packaged electronic components

a technology of thermally conductive adhesive and electronic components, which is applied in the direction of transportation and packaging, laminating printed circuit boards, and improving the adhesion of metals to insulating substrates, etc., can solve the problems of increasing the complexity of circuit designs of modem electronic devices such as televisions, radios, and communications equipment, and the size of devices has continued to shrink and increase the complexity of designs
US20020012762A1Inactive Publication Date: 2002-01-31PARKER INTANGIBLES LLC
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Patent Information

Authority / Receiving Office
US · United States
Patent Type
Applications(United States)
Current Assignee / Owner
PARKER INTANGIBLES LLC
Publication Date
2002-01-31
Estimated Expiration
Not applicable · inactive patent

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Abstract

A thermally conductive interface, which may be in the form of a double-sided, pressure sensitive adhesive tape, disposable intermediate a heat-generating source having a first heat transfer surface formed of a first material having a low surface energy, and a thermal dissipation member having a second heat transfer surface which is formed of a second material having a surface energy substantially higher than the surface energy of the first material, and which is disposable opposite the first heat transfer surface of the heat-generating source in a spaced-apart, heat transfer adjacency therewith. The interface includes a first pressure sensitive adhesive (PSA) surface which is bondable under pressure to at least a portion of the first heat transfer surface of the heat-generating source, and an opposing second pressure sensitive adhesive (PSA) surface bondable under pressure to at least a portion of the second heat transfer surface of the heat-generating source. The first PSA surface is presented from a layer of a thermally-conductive, first pressure sensitive adhesive composition, preferably silicone-based, having an affinity to the first heat transfer surface of the heat generating source. In turn, the second PSA surface is presented from a layer of a second pressure sensitive adhesive composition, preferably acrylic-based, different from the first composition and having an affinity to the second heat transfer surface of the thermal dissipation member. The interface is particularly adapted for bonding a plastic packaged electronic component to a metal heat sink.
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Description

RELATED CASES

[0001] The present application claims priority to U.S. Provisional Application Serial No.60 / 053,974; filed Jul. 28, 1997.

[0002] The present invention relates broadly to a thermal management material which is interposable as an interface between, for example, the heat transfer surfaces of a heat-generating, electronic component, such as an integrated circuit (IC) chip, and a thermal dissipation member, such as a heat sink or circuit board, for the conductive cooling of the electronic component. More particularly, the invention relates to a double-side, pressure sensitive adhesive tape adapted for attaching a metal heat sink to a plastic-encapsulated or "packaged," heat-generating electronic component.

[0003] Circuit designs for modem electronic devices such as televisions, radios, computers, medical instruments, business machines, communications equipment, and the like have become increasingly complex. For example, integrated circuits have been manufactured for these and ...

Claims

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