The invention discloses a high-temperature-resistant high-stripping organic
silicon pressure-sensitive
adhesive and a preparation method thereof, and relates to a pressure-sensitive
adhesive and a preparation method thereof. The invention aims to solve the problems of insufficient
temperature resistance, low peel strength and poor
binding force with a base material of the existing organic
silicon pressure-sensitive
adhesive. According to the invention, phenyl
siloxane rubber, hydroxyl-terminated polysiloxane and methyl vinyl MQ
silicon resin are used as basic raw materials, and
polysilazane is used as a heat-resistant modifier to carry out heat-resistant modification on the
chemical structure of the pressure-sensitive adhesive; a trifunctional allyl
silane monomer is added in the film preparation process, so that the crosslinking density of the
system is improved, and the
heat resistance of the pressure-sensitive adhesive is further improved; the bonding force between the pressure-sensitive adhesive and a
polyimide substrate is improved by adding the peroxysilane
coupling agent, and the use of a primer in the
coating process is omitted; by adding the hydroxyl MQ silicon resin and the
phosphate adhesion
promoter, the
bonding strength of the pressure-sensitive adhesive is improved, and the high-temperature-resistant and high-stripping organic silicon pressure-sensitive adhesive is prepared. According to the invention, the high-temperature-resistant and high-stripping organic silicon pressure-sensitive adhesive can be obtained.