Patents
Literature
Patsnap Copilot is an intelligent assistant for R&D personnel, combined with Patent DNA, to facilitate innovative research.
Patsnap Copilot

3063 results about "Reactive diluent" patented technology

Reactive diluents are substances which reduce the viscosity of a lacquer for processing and become part of the lacquer during its subsequent curing via copolymerization. Diluents (or thinners) are usually added to lacquers to reduce their viscosity (they are used to adjust the rheology). In thermal cured lacquers, such diluents added are volatile substances which evaporate from the lacquer during drying. In the case of radiation-curing lacquers (for example UV lacquers), those diluents should be avoided. The addition of reactive diluents facilitates the processing of the lacquers, allows the addition of more fillers and improves the wetting behavior on the substrate. If volatile diluents are replaced by reactive diluents, flammability, smell, skin irritation and environmental compatibility (by lower or no VOC emissions) can be improved.

High pressure high non-reactive diluent gas content high plasma ion density plasma oxide etch process

The invention is embodied in a method of processing a semiconductor workpiece in a plasma reactor chamber, including supplying a polymer and etchant precursor gas containing at least carbon and fluorine into the chamber at a first flow rate sufficient of itself to maintain a gas pressure in the chamber in a low pressure range below about 20 mT, supplying a relatively non-reactive gas into the chamber at second flow rate sufficient about one half or more of the total gas flow rate into the chamber, in combination with the first flow rate of the precursor gas, to maintain the gas pressure in the chamber in a high pressure range above 20 mT, and applying plasma source power into the chamber to form a high ion density plasma having an ion density in excess of 1010 ions per cubic centimeter. In one application of the invention, the workpiece includes an oxygen-containing overlayer to be etched by the process and a non-oxygen-containing underlayer to be protected from etching, the precursor gas dissociating in the plasma into fluorine-containing etchant species which etch the oxygen-containing layer and carbon-containing polymer species which accumulate on the non-oxygen-containing underlayer. Alternatively, the high pressure range may be defined as a pressure at which the skin depth of the inductive field exceeds {fraction (1 / 10)} of the gap between the inductive antenna and the workpiece.
Owner:APPLIED MATERIALS INC

Ceramic material for 3D light curing formation printing and preparation method of ceramic element

The invention relates to a ceramic material for 3D light curing formation printing and a preparation method of a ceramic element. The ceramic material is prepared from 30 to 70 vol percent of ceramicpowder and 30 to 70 vol percent of photosensitive resin premixed liquid, wherein the photosensitive resin premixed liquid is prepared from 37 to 50 weight percent of oligomers, 30 to 60 weight percentof reactive diluents, 0.1 to 5 weight percent of photoinitiators, 1 to 5 weight percent of dispersing agents, 0.1 to 0.6 weight percent of ultraviolet blocking agents, 0 to 0.05 weight percent of polymerization inhibitors, 1 to 4 weight percent of anti-foaming agents, 0.5 to 2.35 weight percent of anti-settling agents and 0.3 to 3 weight percent of leveling agents. In the degreasing and sinteringpost-treatment work procedures, specific parameters are used, so that a sintering element can reach good sintering density and mechanical performance. By optimizing the composition and the proportionof light curing ceramic resin, and selecting the excellent dispersing agent combination and the reasonable consumption, the ceramic powder can be better dispersed in the resin; the problems that theexisting light curing ceramic resin has poor flowability and low formation precision, and that a finally prepared ceramic product can easily generate cracks or deformation, and the like are solved.
Owner:西安点云生物科技有限公司

Environment-friendly epoxy intumescent fire-retardant coating and preparing method thereof

The invention relates to an environment-friendly epoxy intumescent fire-retardant coating and a preparing method thereof, and belongs to the field of functional coatings. The environment-friendly epoxy intumescent fire-retardant coating is prepared from a component A and a component B, wherein the component A uses epoxy resin as a main film forming matter and is added with a reactive diluent, a catalyst, a carbon-forming agent, a foaming agent, fire retardant, auxiliaries and solvent, and the component B is composed of a curing agent, a curing accelerator, pigment filler, auxiliaries, refractory fibers and solvent. In the component A, the ratio of the epoxy resin to the reactive diluent is 1:1-5:1. In the component B, the ratio of the curing agent to the curing accelerator is 1:1-5:1, and the usage quantity of the refractory fibers accounts for 5-50% of the total mass. The environment-friendly epoxy intumescent fire-retardant coating is free of alkylphenol, or halogen compounds, or boron compounds or sulfocompounds. The prepared environment-friendly epoxy intumescent fire-retardant coating is good in acid resistance, alkali resistance, water resistance, ageing resistance and salt mist resistance and is particularly suitable for fire-retardant protection for maritime and severe outdoor environments, the petrochemical industry and places with hydrocarbon fire potential hazards.
Owner:MARINE CHEM RES INST

Benzimidazole diamine curing type epoxy adhesive and preparation method thereof

InactiveCN102031082AHigh tensile and shear strength at room temperatureConvenient sourceNon-macromolecular adhesive additivesCarboxyl rubber adhesivesViscous liquidElectronics
The invention relates to a benzimidazole diamine curing type epoxy adhesive and a preparation method thereof. The adhesive is prepared from the following raw materials: a component A, namely a benzimidazole diamine curing agent and a component B, wherein the component B is prepared from terminal carboxyl group butadiene-nitrile rubber, epoxy resin and a reactive diluent. The preparation method comprises the following steps of: (1) adding the terminal carboxyl group butadiene-nitrile rubber and the epoxy resin into a reaction kettle, reacting at the temperature of 90 DEG C with stirring, cooling to the temperature of 50 DEG C, adding the reactive diluent, and stirring at the temperature of 80 DEG C to obtain homogeneous and transparent viscous liquid, namely the component B; and (2) mixingthe components A and B, and stirring uniformly to obtain the adhesive. The tensile shear strength of the adhesive is 33.5MPa at the room temperature, and the adhesive has wide application prospect infields of electronics and microelectronics, rigid copper-clad laminates, motors, aerospace and the like; and the preparation process is simple, is low in cost and is convenient to operate, the resources of reaction raw materials are wide, and the adhesive can be conveniently industrially produced.
Owner:DONGHUA UNIV +1
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products