672 results about "Reactive diluent" patented technology

The invention discloses a preparation method of a natural fiber prepreg with an improved impregnation effect, and relates to the technical field of composite material preparation, the method comprises the following steps: carrying out synergistic modification through fiber surface plasma activation and silane grafting, and combining a gradient pressure-temperature coupling impregnation system and ultrasonic-assisted permeation to prepare the natural fiber prepreg with the improved impregnation effect. And gradient filling and interface chemical bonding strengthening of the resin in the fiber bundle are realized. The core process comprises the following steps: pretreating fibers to improve surface energy and roughness, introducing a reactive diluent and a block copolymer into a resin system to regulate and control viscosity and transport capacity, constructing a pressure gradient by a multi-stage compression roller to drive resin to permeate into a bundle core, promoting uniform impregnation by infrared temperature control and ultrasonic cavitation, and finally obtaining uniform resin distribution and porosity lt. The interlayer shear strength is gt; and the high-performance prepreg is stable in batch under the pressure of 45 MPa. Reliable technical support and process guarantee are provided for large-scale engineering application of the high-performance natural fiber composite material.

The invention relates to the field of quantum dot ink, and discloses diffusion plate printing quantum dot ink and a preparation method thereof.The diffusion plate printing quantum dot ink comprises acrylic resin, hyperbranched polyester resin, a quantum dot material, modified boron nitride, a reactive diluent, a photoinitiator, a wetting agent and a defoaming agent; the hyperbranched polyester resin is prepared by reacting hyperbranched polyester acrylate and a sulfydryl-terminated silicon-containing reaction monomer, wherein the hyperbranched polyester acrylate is prepared by reacting pentaerythritol with 2, 2-dimethylolpropionic acid and then carrying out esterification reaction with acrylic acid; the sulfydryl-terminated silicon-containing reaction monomer is prepared by reacting eugenol with 1, 1, 3, 3-tetramethyldisiloxane and then carrying out esterification reaction with 3-mercaptopropionic acid; the modified boron nitride is prepared by modifying a cationic polymer which is prepared by carrying out a Mannich reaction on triethylene tetramine, formaldehyde and acetone and then carrying out a condensation polymerization reaction with formaldehyde. After the ink prepared by the invention is cured, a coating film is high in hardness, adhesive force and heat conductivity coefficient, and good in flexibility, heat resistance and migration barrier property.

The embodiment of the invention provides a UV (ultraviolet) thermal dual-curing adhesive and a preparation method thereof. The UV thermal dual-curing adhesive comprises the following components in percentage by mass: 30-55% of a photocuring prepolymer; 5%-25% of an active diluent monomer; 1%-10% of a photoinitiator; 1%-20% of a thermal initiator; 10%-40% of a filler; 0.5%-5% of a coupling agent; 1%-10% of a thixotropic agent; 1%-10% of pigment; 2%-8% of an auxiliary agent; wherein the photocuring prepolymer comprises epoxy resin. According to the UV thermal dual-curing adhesive and the preparation method thereof provided by the embodiment of the invention, the dual-curing adhesive with low shrinkage and low thermal expansion coefficient is obtained by optimizing the structure of the photocuring prepolymer and matching the components, and the prepared adhesive can be rapidly cured under the irradiation of LED 365nm ultraviolet light, or can be thermally cured under the low-temperature condition of 80 DEG C, so that the UV thermal dual-curing adhesive can be widely applied to the field of ultraviolet curing. The product can resist high and low temperature cycle impact of-50 DEG C to 140 DEG C, and has a good application prospect.

The invention discloses a high-toughness conductive and thermal-conductive epoxy adhesive, a preparation method thereof and a conductive film, and belongs to the technical field of conductive materials. Comprising the following raw material components in parts by weight: 100 parts of epoxy resin, 4-25 parts of a latent curing agent, 0.5-5 parts of an accelerant, 200-600 parts of conductive filler, 5-15 parts of an epoxy-terminated polyurethane flexibilizer, 5-20 parts of a core-shell flexibilizer, 5-10 parts of a nitrile rubber flexibilizer, 2-10 parts of a reactive diluent, 0.5-2 parts of a coupling agent and 20-50 parts of a solvent. Through compounding of the over-end epoxy type polyurethane flexibilizer, the core-shell flexibilizer and the nitrile rubber flexibilizer, the prepared conductive adhesive has excellent toughness and bonding characteristics, and meanwhile, the shrinkage stress and thermal stress in the curing process can be reduced.

The invention belongs to the technical field of silicon nitride ceramic preparation, and particularly relates to a method for preparing silicon nitride ceramic through lifting type LCD photocuring technology 3D printing, and the method comprises the following steps: carrying out oxidation pretreatment on silicon nitride powder; mixing a sintering aid silicon nitride powder to obtain mixed powder; mixing the mixed resin, a reactive diluent, a photoinitiator and a coloring agent to obtain photosensitive resin; mixing and ball-milling a dispersing agent, the mixed powder and photosensitive resin to obtain light-cured ceramic slurry; 3D printing is conducted on the photocuring ceramic slurry through a lifting type LCD photocuring technology, and a ceramic green body is obtained; dumping the ceramic body to obtain a ceramic green body; sintering the ceramic green body to obtain the silicon nitride ceramic. Compared with the prior art, the problems of low curing depth, curing efficiency and precision of the silicon nitride ceramic slurry formed by photocuring in the prior art are solved. According to the scheme, the silicon nitride ceramic is formed by using the lifting type LCD printing technology, so that the performance of the ceramic is ensured, the production efficiency is improved, and the production cost is reduced.

The invention provides an epoxy resin packaging bonding material with high bonding stability and a preparation method thereof. The packaging bonding material is prepared from the following raw material components: 8 to 18 percent of graphene oxide modified epoxy resin, 0.8 to 4.0 percent of a curing agent, 0 to 1 percent of a curing accelerator, 0.4 to 2.0 percent of a silane coupling agent, 2 to 7 percent of nano carbon black, 2 to 7 percent of carbon fiber, 40 to 60 percent of flaky silver powder, 4 to 8 percent of spherical silver powder, 4.4 to 13.6 percent of a surface treating agent, 4 to 6 percent of a reactive diluent, 0.5 to 1.5 percent of a toughening agent, 0.5 to 1.5 percent of a dispersing agent, 0.1 to 0.5 percent of a lubricating agent and the balance of a non-reactive diluent. Graphene oxide is utilized to modify epoxy resin, the dispersion stability of the filler is improved, modified carbon black is adopted as a short-range conductive additive, carbon fibers are adopted as a long-range conductive additive, the modified carbon black and the carbon fibers synergistically improve the conductivity, and the reinforcing effect is achieved. The packaging bonding material disclosed by the invention has the characteristics of low volume resistivity, high tensile strength and bending strength, high bonding stability and the like, and has wide application prospects in the fields of automotive electronics, wind power photovoltaics, LEDs (Light Emitting Diode), LCDs (Liquid Crystal Display) and the like.

The invention provides a toughened curing-controllable prepreg and a preparation method thereof, and belongs to the technical field of high-performance composite materials. Comprising the following components in parts by mass: 100 parts of epoxy resin, 100 parts of a thermoplastic resin toughening agent, 100 parts of an inorganic nanoparticle toughening agent, 100 parts of a latent curing agent, 100 parts of an organic urea accelerant, 100 parts of an imidazole accelerant and 100 parts of a reactive diluent, correspondingly, 1-5 parts by mass of a thermoplastic resin flexibilizer, 0-3 parts by mass of an inorganic nanoparticle flexibilizer, 4-8 parts by mass of a latent curing agent, 1-4 parts by mass of an organic urea accelerator, 0.1-0.5 part by mass of an imidazole accelerator and 5-20 parts by mass of an active diluent are added. The prepreg provided by the invention not only is endowed with fast curing and controllable curing time, but also is endowed with relatively long room-temperature storage period, high toughness and good impact resistance, and is especially suitable for the fields of low-altitude aircrafts, automobiles, ships and the like.

The invention relates to the field of copper-clad plates, and discloses a high-performance flame-retardant low-dielectric-loss copper-clad plate and a preparation method thereof.The copper-clad plate comprises epoxy resin, benzoxazine resin, composite filler, carboxyl-terminated nitrile rubber, an active diluent, a curing agent and the like; the composite filler is prepared by compounding flame-retardant modifier grafted graphene oxide and epoxy silane modified silicon dioxide hollow spheres; according to the flame-retardant modifier, boric acid and pentaerythritol are used for preparing a double-terminal hydroxyl boron-containing intermediate, then dichlorodiphenyl silane and phenylphosphonic dichloride react with hydroxyl groups at the two ends of the intermediate to prepare a flame-retardant intermediate, and amino silane and vanillic aldehyde react with chlorine atoms at the two ends of the intermediate to prepare an aldehyde modified flame-retardant intermediate; the copper-clad plate prepared by the preparation method disclosed by the invention is low in dielectric constant and dielectric loss, high in heat conductivity coefficient and good in flexibility, and also has excellent heat resistance and flame retardance.

The invention discloses a mobile phone narrow frame low-pressure injection molding sealing adhesive and a preparation method thereof, and belongs to the technical field of adhesives. According to the technical scheme, the adhesive is characterized by being prepared from, by weight, 35-46 parts of aliphatic epoxy resin, 10-20 parts of polyether polyol, 16-25 parts of reactive diluent, 15-20 parts of toughened resin, 1.4-2.0 parts of initiator, 0.8-1.2 parts of coupling agent and 1.5-2.0 parts of fumed silica, and an adhesive layer obtained after the adhesive is subjected to UV curing is low in shrinkage rate, high in modulus and good in adhesion property. The width of the mobile phone frame can be well controlled, compared with a plastic piece, the screen-to-body ratio of a mobile phone screen can be further improved, and meanwhile the requirements for bonding and reliability of a client side can be met.

The invention provides a bio-based light-cured heat-conducting and insulating composite material, a preparation method and application, and relates to the technical field of radiation curing, and the bio-based light-cured heat-conducting and insulating composite material comprises a bio-based oligomer, a reactive diluent, a modified heat-conducting filler, a free radical photoinitiator and an organic silicon defoaming agent. The bio-based oligomer is selected as a main component of the photocuring coating, and compared with a coating prepared from petroleum-based acrylic resin in the prior art, the coating has the green and environment-friendly functions, and meanwhile, the harm to the environment caused by exploitation and processing of petrochemical products can be reduced.

The invention relates to the technical field of paint, in particular to buried pipeline outer coating paint and a preparation method thereof. The coating comprises a component A and a component B, and the mass ratio of the component A to the component B is (2.12-2.39): 1; the component A comprises the following components in parts by weight: 40-50 parts of epoxy resin, 0-5 parts of a reactive diluent, 2-3 parts of an epoxy resin toughening agent, 2-3 parts of aluminum paste, 0-20 parts of mica powder, 5-20 parts of talcum powder, 5-10 parts of pigment, 5-20 parts of glass flakes, 1-2 parts of organic bentonite, 1-2 parts of a silane coupling agent, 0.1-0.5 part of a dispersing agent, 0.1-0.5 part of a defoaming agent and 0.1-0.5 part of a flatting agent; the component B is a cardanol modified phenolic aldehyde amine curing agent; the hyperbranched modified epoxy resin cooperates with the cardanol modified phenolic aldehyde amine curing agent and the epoxy resin flexibilizer to improve the comprehensive performance of the coating; the cathodic disbonding resistance of the coating is improved through the aluminum paste; therefore, the paint which has good comprehensive performance and can meet various corrosive environments is obtained.

The invention discloses a low-temperature fast-curing two-component resin adhesive and a preparation method thereof, and belongs to the technical field of high polymer materials. The resin adhesive is formed by mixing a component A and a component B, the component A comprises epoxy-acrylate hybrid resin, a reactive diluent, a nano reinforcing filler and the like, and the component B comprises a modified aliphatic amine curing agent, a microcapsule low-temperature efficient accelerant, a Mannich base curing agent and the like. Through the synergistic effect of a quaternary curing system and in combination with the rigid-flexible balance design of the hybrid resin, rapid curing at low temperature is achieved, and high strength, high toughness and good storage stability are achieved. The resin adhesive is suitable for the fields of bonding of automobile parts, packaging of electronic elements, repairing of wind power blades, sealing of building structures and the like, and particularly solves the problems that a traditional resin adhesive is slow in low-temperature curing and insufficient in performance.

The invention provides carbon fiber directionally-distributed high-thermal-conductivity airtight paste and a preparation method thereof, and belongs to the technical field of airtight paste. According to the invention, a high-efficiency heat-conducting network is constructed through the synergistic effect of various heat-conducting fillers, and the heat-conducting property, the mechanical property and the long-term stability of the composite material are remarkably improved; the potassium titanate whiskers are coated by silica sol and modified by a silane coupling agent to improve the interfacial compatibility and dispersity, and are uniformly distributed in a matrix to reduce interface defects; trimethyl hydroxyl phosphate and an epoxy reactive diluent are subjected to a synergistic reaction to prepare a functional auxiliary agent, so that the interface bonding force is enhanced, and the dispersity of the filler is optimized; metal salt and ethylenediamine tetraacetic acid are chelated, and polyethylene glycol 400 is introduced to form a flexible complex, so that the interface stability and the filler dispersion efficiency are improved; and the uniformity and continuity of the thermal conductivity network are optimized through the synergistic effect of the long and short carbon fibers and a directional arrangement strategy. The heat conduction efficiency, the mechanical property and the processing adaptability of the composite material are remarkably improved through the synergistic effect of various fillers and modification means.

The invention relates to the technical field of high-molecular compounds, and discloses an epoxy resin material for a high-pressure conduit and a preparation method of the epoxy resin material. The preparation method comprises the following steps: preparing the following raw materials in parts by mass: 65-70 parts of bisphenol A epoxy resin; 55-60 parts of a curing agent; 0.1 to 0.2 part of an imidazole accelerant; 10 to 15 parts of a reactive diluent; and 8 to 15 parts of epoxy silicon dioxide. The diluent is prepared from N, N, N ', N'-tetraepoxypropyl-4, 4 '-diaminodiphenylmethane and ethylene glycol diglycidyl ether according to the mass ratio of 1 to (4 to 5); the curing agent comprises a polybenzimidazole curing agent, a polyethylene glycol curing agent and methyl tetrahydrophthalic anhydride in a mass ratio of (2-3): (2-3): (5-6). The epoxy resin material prepared by the invention has excellent electrical properties and mechanical properties.

The invention relates to the technical field of coatings, and particularly discloses a high-wear-resistance and high-toughness polyurethane floor coating and a preparation method thereof. According to the technical key points, the high-wear-resistance and high-toughness polyurethane floor coating is prepared from the following components in parts by weight: 100 parts of cross-linked polyurethane matrix resin, 1 to 3 parts of nano ZnO (at) MCM-41 catalyst, 10 to 15 parts of core-shell microsphere powder filler, 5 to 10 parts of fiber filler, 15 to 20 parts of reactive diluent and 1 to 3 parts of photoinitiator, the cross-linked polyurethane matrix resin is composed of a disulfide bond-containing polyurethane prepolymer and an ultraviolet curing acrylate end group; the core-shell microsphere powder filler is prepared by taking a polyurethane-acrylate copolymer as a shell layer and diamond and silicon carbide composite particles as a core layer, and the particle size of the core-shell microsphere powder filler is 200-500nm. The polyurethane floor coating prepared in the invention has excellent performance, and the coating has high wear resistance and high toughness.

The invention belongs to the technical field of coatings, and particularly relates to an epoxy heavy-duty coating as well as a preparation method and application thereof. The coating comprises a component A and a component B, the component A comprises epoxy resin, a reactive diluent, a reactive flexibilizer and an auxiliary agent; the component B comprises epoxidized soybean oil, alicyclic amine and organic phenol; the reactive flexibilizer contains an epoxy group. The epoxy curing agent with good flexibility and corrosion resistance can be obtained by carrying out graft modification on alicyclic amine by adopting the epoxidized soybean oil, and then the epoxy curing agent reacts with the epoxy resin and the reactive toughening agent at the same time for curing, so that the epoxy coating is modified by the epoxidized soybean oil. And the reaction type flexibilizer and the epoxidized soybean oil with the flexible long chain participate in the reaction, so that the flexibility of the coating is improved while the chemical resistance and the mechanical property of the coating are not reduced, the brittle failure of the coating in the use process is better avoided, and the anti-corrosion life of the coating is prolonged.

The invention discloses a quick-curing high-temperature-resistant anticorrosive coating for two-component packaging and a preparation method of the quick-curing high-temperature-resistant anticorrosive coating. The component A of the coating is composed of novolac epoxy resin, epoxy resin, a reactive diluent, an auxiliary agent, an anti-rust pigment, a filler, aluminum powder and a solvent; and the component B consists of phenolic aldehyde amine, alicyclic amine and a solvent. Compared with a traditional phenolic epoxy coating, the product has the advantages of being high in single-time film forming thickness, rapid in curing, resistant to abrasion, high in thermal stability, resistant to cold and hot impact, resistant to corrosion and the like.

Disclosed in the present application are a 3D printing photo-curable resin and a preparation therefor. The preparation method comprises: under the constant-temperature and constant-humidity conditions of a preset temperature and a preset humidity, weighing 50-80 parts of an acrylate oligomer, 10-40 parts of a reactive diluent, 0.05-0.1 parts of an ultraviolet light absorber, and 0.01-0.05 parts of p-hydroxyanisole, adding the weighed substances into a container, and stirring the materials in the container at a first preset rotation speed; and after stirring for a first preset time, adding the weighed 5-10 parts of a cross-linking agent and 1-3 parts of a photoinitiator into the container while stirring, and stirring same for a second preset time at a second preset rotation speed under dark conditions, so as to obtain the 3D printing photo-curable resin. In this way, the resin has an extremely high strength and toughness, without a filler being added, and can avoid the problems of unstable material performance and poor printing precision.

Provided is a photosensitive resin composition having excellent low-temperature curability and capable of providing a cured resin film having sufficient solvent resistance or sufficient hardness. Also, provided are a color filter having excellent solvent resistance or excellent hardness, and an image display element having same. A photosensitive resin composition according to the present invention contains a copolymer (A), a reactive diluent (B), a photopolymerization initiator (C), and a solvent (D).　The copolymer (A) contains a structural unit (a), a structural unit (b), and a structural unit (c). The structural unit (a) has at least one selected from among an active methylene group having an alkoxycarbonyl group attached thereto, and an active methine group having an alkoxycarbonyl group attached thereto. The structural unit (c) has an acid group.

The invention relates to a heat-conducting epoxy composition capable of eliminating corner cracks of a packaged chip and a preparation method of the heat-conducting epoxy composition, the heat-conducting epoxy composition comprises the following components in percentage by weight: 17-25% of epoxy resin, and the epoxy resin comprises epoxy resin containing polar groups and flexible resin; 48-62% of a modified heat-conducting filler; 0.1 to 0.95 percent of a coupling agent; 0.5%-4.8% of a flatting agent; 1.0 to 4.0% of an adhesion promoter; 1.3%-3.5% of a reactive diluent; 6-12% of a curing agent; 0.2%-0.8% of a curing accelerator; 1.5%-2.0% of a toughening agent; the invention has the advantages that the combination of the epoxy resin containing polar groups and the flexible resin is matched with the modified heat-conducting filler to construct a uniform and stable resin network structure, so that the stress can be buffered and dispersed, the stress is prevented from being concentrated on weak parts such as the edge of a chip and the like, and cracks are eliminated.

The invention discloses a heavy anti-corrosion coating applied to the outer wall of a wind power generation tower drum and a preparation method of the heavy anti-corrosion coating, and belongs to the technical field of heavy anti-corrosion coatings. The paint comprises a primer, an intermediate paint and a finish paint in parts by weight, and the primer comprises the following components in parts by weight: 18-22 parts of bisphenol A epoxy resin, 60-70 parts of zinc powder, 4-8 parts of zinc phosphate, 3-6 parts of a reactive diluent, 3-6 parts of self-made modified montmorillonite, 0.3-0.5 part of fumed silica, 2-5 parts of titanium dioxide, 0.1-0.3 part of carbon black, 0.2-0.5 part of polyamide wax and 0.1-0.3 part of a defoaming agent; 8-12 parts of a modified phenolic aldehyde amine curing agent and 0.1-0.5 part of an accelerant. According to the heavy anti-corrosion coating disclosed by the invention, interlayer combination is promoted through modification of the filler, more efficient and more lasting protection is realized under the synergistic effect of multilayer and multi-mechanism barrier superposition, the damp-heat aging resistance and corrosion resistance of a paint film of the heavy anti-corrosion coating are improved, and longer protection on the outer wall of a power generation tower drum is realized.

The invention relates to the technical field of protective films, in particular to a high-light-transmittance label protective film and a preparation method thereof.A multi-layer protective film formed by compounding a release film layer, an adhesive layer, a PET film and a protective layer is constructed; composite vinyl ester resin constructed by taking epoxy resin and acrylic acid as raw materials is subjected to toughening modification, and then a linear reactive diluent is compounded to construct a high-toughness protective layer which is resistant to high temperature and aging and can be photo-cured; long-chain alkane modified nano silicon dioxide is introduced into the protective coating, nano silicon dioxide is aminated by 3-aminopropyltriethoxysilane, and then 17-carbon monoisocyanate prepared by taking acetone, stearic acid, triphenylphosphine, sodium azide and N-chlorosuccinimide as raw materials is grafted to form the long-chain alkane modified nano silicon dioxide. Vinyl butadiene styrene rubber, composite vinyl ester resin, tackifying resin, a softening agent and a photoinitiator are mixed to prepare the adhesive layer.

The invention provides a notebook keyboard composite skin-touch paint film and a preparation process thereof. The notebook keyboard composite skin-touch paint film comprises a primer layer, a middle paint layer and a UV skin-touch finish paint layer which are sequentially arranged on the surface of a notebook keyboard base material, the primer layer is prepared from the following components in percentage by weight: 20 to 30 percent of hydroxy acrylic resin, 15 to 25 percent of modified epoxy acrylate, 5 to 10 percent of vinyl modified fumed silica, 5 to 10 percent of fluorosilicone resin, 5 to 10 percent of epoxy phosphate, 5 to 10 percent of filler, 15 to 25 percent of solvent A, 2 to 4 percent of curing agent, 0.1 to 0.3 percent of flatting agent and 0.1 to 0.3 percent of defoaming agent; the middle paint layer is prepared from the following components: 40 to 50 percent of acrylic polyurethane resin, 12 to 16 percent of filler, 1 to 3 percent of cerium oxide, 7 to 12 percent of laser carving toner, 1 to 3 percent of dispersing agent, 20 to 30 percent of solvent B, 0.1 to 0.3 percent of plasticizer, 0.1 to 0.3 percent of flatting agent and 0.1 to 0.3 percent of defoaming agent; the UV skin-touch finish paint layer is prepared from the following components: 52 to 55 percent of polyurethane acrylate resin, 15 to 25 percent of reactive diluent, 2 to 4 percent of photoinitiator, 10 to 15 percent of skin-touch additive, 5 to 10 percent of filler, 0.1 to 0.3 percent of flatting agent and 0.1 to 0.3 percent of antioxidant. The paint film provided by the invention has the advantages of favorable wear resistance, favorable adhesive force and favorable hand feeling.

The environment-friendly UV-curable conformal coating comprises the following components in percentage by mass: 25%-50% of environment-friendly resin, 15%-35% of a reactive diluent, 3%-8% of a photoinitiator, 5%-15% of a functional aid, 0.5%-3% of a mildew-proof salt-fog-resistant additive, 1%-5% of a flame retardant, 2%-8% of a flexibilizer and 0.1%-2% of an ultraviolet light absorber, the UV-curable conformal coating has good functional characteristics, and realizes zero emission of volatile organic compounds; and the curing efficiency is extremely high, surface drying can be achieved under specific UV energy only in 5-30 seconds, and the production rhythm is greatly accelerated. The three-proofing performance is excellent, the waterproof, moisture-proof and salt mist-proof effects are outstanding, and a base material can be protected from being eroded in a severe environment for a long time; and the paint also has wide applicability, and can be uniformly coated on various base materials in various modes.

The invention discloses a two-component epoxy pouring sealant as well as a preparation method and application thereof, and belongs to the technical field of high polymer materials. The bi-component epoxy pouring sealant comprises a component A and a component B. The component A comprises the following raw materials: 60-100 parts of modified epoxy resin; 5-25 parts of a reactive diluent; 1 to 10 parts of nano silicon dioxide; the component B comprises the following raw materials in parts by mass: 50-60 parts of an alicyclic amine curing agent; 20-30 parts of a polyether amine curing agent; 10 to 15 parts of methyl tetrahydrophthalic anhydride; 3-5 parts of a silane modifier; 0.1 to 0.5 part of a defoaming agent; the modified epoxy resin is prepared by carrying out esterification reaction on bisphenol A type epoxy resin and long-chain fatty acid for modification and then carrying out graft modification with polypropylene glycol diglycidyl ether. In addition, the invention also provides a preparation method of the two-component epoxy pouring sealant. The epoxy pouring sealant provided by the invention has excellent bonding performance on non-polar plastics such as PP / PE and the like.

According to the cationic UV-LED and moisture dual-curing three-proofing adhesive provided by the invention, on the basis of original UV-LED curing, moisture curing is introduced as a synergistic curing mechanism, a UV-LED moisture dual-curing three-proofing adhesive system is jointly formed by combining modified dual-curing resin, an epoxy active diluent, a cationic photoinitiator, an auxiliary agent and the like, an oxygen inhibition effect does not exist, and the moisture dual-curing three-proofing adhesive has the advantages that the moisture dual-curing three-proofing adhesive has a good curing effect; under the adhesive film thickness of 50-200 microns, the cured surface is dry and comfortable and does not adhere to dust or other impurities, the defect that the surface of a traditional mercury lamp curing type UV three-proofing adhesive adheres to hands when an LED lamp is cured is overcome, the curing process is low in energy consumption, electricity is saved, the three-proofing adhesive can be used instantly after being opened, damage to heat-sensitive devices is effectively avoided, no ozone is generated in the whole process, and the three-proofing adhesive is environmentally friendly and safe.

The invention relates to the technical field of coatings, in particular to a graphene modified epoxy anticorrosive coating and a preparation method thereof. The coating is prepared from epoxy resin, graphene-hyperbranched epoxy resin, a reactive diluent and an auxiliary agent, wherein the graphene-hyperbranched epoxy resin is prepared by a three-step method comprising the following steps: firstly, performing dual modification on graphene oxide by adopting 11-aminoundecyltriethoxysilane and 3-aminopropyltriethoxysilane; then reacting with 2-formyl-5-phenylphenol, and finally carrying out condensation polymerization with trimethylolpropane triglycidyl ether to form a hyperbranched structure. According to the invention, collaborative optimization of mechanical strength and corrosion resistance is realized, and the coating has excellent adhesive force, hardness and long-acting corrosion resistance, and is suitable for severe corrosion environments such as ocean engineering and the like.

The invention discloses a near-infrared light cured conductive adhesive and a preparation method thereof, and belongs to the field of micro-nano electronic packaging and semiconductor materials. The problems that an existing conductive adhesive is high in curing temperature, long in curing time and poor in curing effect are solved. Silver-coated copper powder and silver nanowires serve as conductive filler and are mixed with epoxy acrylate resin, a reactive diluent, a photoinitiator, a thermal initiator, a defoaming agent and a flatting agent, grinding, defoaming and near-infrared light curing are conducted, and the conductive adhesive is obtained. The thermal initiator and the photoinitiator are combined, the near-infrared light is adopted for irradiation, the high-energy density of the near-infrared light directly permeates into the conductive adhesive film layer, the conductive adhesive film layer is heated at the same time and is not absorbed by the substrate, rapid curing of the conductive adhesive can be achieved, and when the radiation power is 120-300 W, the radiation time is 30-600 s and the irradiation frequency is 1-10 times, the conductive adhesive can be rapidly cured. And the cured conductive adhesive is low in volume resistance and high in bonding strength.

The invention discloses an ultraviolet curing organic silicon conductive adhesive and a preparation method thereof, and relates to the technical field of conductive materials, the ultraviolet curing organic silicon conductive adhesive comprises the specific components of organic silicon matrix resin, a photosensitive curing agent, a conductive filler, a reactive diluent, a coupling agent and a thixotropic agent; the photosensitizer further comprises carborane cluster particles, a phosphazene silane nanocage, a sulfur-doped tungstate nanosheet, a potassium fluoride modified hollow graphene ball and an additive of a germanoxane photosensitizer. The material is prepared based on the materials. According to the preparation method, multiple functional additives are introduced into a traditional ultraviolet curing organic silicon conductive adhesive system, a multi-dimensional conductive path is constructed on the molecular and nanoscale, and the photocuring initiation efficiency and the interface stability are optimized, so that the prepared conductive adhesive not only realizes low resistivity, but also can be rapidly and deeply cured in an adhesive layer with relatively high thickness; and meanwhile, excellent damp-heat resistance and corrosion resistance are achieved.

The invention belongs to the field of coatings, and discloses a broad-spectrum ultraviolet absorbent with a sandwich structure as well as a preparation method and application of the broad-spectrum ultraviolet absorbent. An ultraviolet absorbent is adsorbed on the upper surface and the lower surface of graphene oxide through the action of a hydrogen bond and a pi-pi bond to form a compact ultraviolet absorbent layer, then the surface of graphene oxide is chemically modified through a diamine compound, amino is grafted, and the wide-spectrum ultraviolet absorbent of a'discrete point / surface / discrete point 'sandwich structure is obtained. The ultraviolet absorbent filler, the cardanol-based reactive diluent and the epoxy resin are compounded, so that the ultraviolet aging resistance, the barrier corrosion resistance and the hydrophobicity of the prepared composite coating are synergistically enhanced and exceed those of an anti-ultraviolet epoxy coating material reported at present.