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Fixed abrasive grinding polishing pad and method of manufacturing the same

A technology of bonding abrasives and polishing pads, applied in grinding/polishing equipment, abrasives, grinding devices, etc., can solve problems affecting processing efficiency and accuracy, pollution, etc., achieve high processing efficiency, good workpiece flatness, improve Effect of Surface Quality and Machining Efficiency

Inactive Publication Date: 2009-05-13
NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to solve the problem that most of the grinding and polishing in the current precision ultra-precision machining adopts free grinding and polishing liquid for serious pollution, and the surface shape of the existing consolidated abrasive cannot meet the requirements of use, which affects the processing efficiency and accuracy. A consolidated abrasive grinding and polishing pad suitable for precision ultra-precision machining with stable grinding and polishing performance, high processing efficiency, and high surface quality of processed workpieces, and a preparation method thereof

Method used

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  • Fixed abrasive grinding polishing pad and method of manufacturing the same
  • Fixed abrasive grinding polishing pad and method of manufacturing the same

Examples

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Effect test

Embodiment 1

[0044] Such as figure 1 shown.

[0045] A kind of fixed abrasive polishing pad, is made up of abrasive material layer 1, rigid layer 2 and elastic layer 3, and it is made by following method:

[0046] 1. First, take the following components fully and evenly for later use:

[0047] (1) Diamond (or silicon dioxide, ceria, aluminum oxide, silicon carbide, boron carbide, zirconia, or any two or more of them with a particle size of 1 nanometer to 40 microns, when combined, each The components can be prepared in equal parts, or can be prepared according to the performance of the workpiece) 20 grams;

[0048] (2) Bisphenol A epoxy acrylate (or novolac epoxy acrylate and amine-modified epoxy acrylate, chain-modified long aliphatic epoxy acrylate with oleic acid and linoleic acid, polyurethane acrylate, polyester One or several combinations of ester acrylate, polyether acrylate, and acrylated polyacrylate. When combining, each component can be prepared in equal parts, or it can be p...

Embodiment 2

[0060] A kind of fixed abrasive polishing pad, is made up of abrasive material layer 1, rigid layer 2 and elastic layer 3, and it is made by following method:

[0061] 1. First, take the following components fully and evenly for later use:

[0062] (1) Diamond (or silicon dioxide, ceria, aluminum oxide, silicon carbide, boron carbide, zirconia, or any two or more of them with a particle size of 1 nanometer to 40 microns, when combined, each The components can be prepared in equal parts, or can be prepared according to the performance of the workpiece) 40 grams;

[0063] (2) Bisphenol A epoxy acrylate (or novolac epoxy acrylate and amine-modified epoxy acrylate, chain-modified long aliphatic epoxy acrylate with oleic acid and linoleic acid, polyurethane acrylate, polyester One or several combinations of ester acrylate, polyether acrylate, and acrylated polyacrylate, each component can be prepared in equal parts, or it can be prepared as appropriate according to the performance...

Embodiment 3

[0075] A kind of fixed abrasive polishing pad, is made up of abrasive material layer 1, rigid layer 2 and elastic layer 3, and it is made by following method:

[0076] 1. First, take the following components fully and evenly for later use:

[0077] (1) Diamond (or silicon dioxide, ceria, aluminum oxide, silicon carbide, boron carbide, zirconia, or any two or more of them with a particle size of 1 nanometer to 40 microns, when combined, each The components can be prepared in equal parts, or can be prepared according to the performance of the workpiece) 40 grams;

[0078] (2) Bisphenol A epoxy acrylate (or novolac epoxy acrylate and amine-modified epoxy acrylate, chain-modified long aliphatic epoxy acrylate with oleic acid and linoleic acid, polyurethane acrylate, polyester One or several combinations of ester acrylate, polyether acrylate, and acrylated polyacrylate, each component can be prepared in equal parts, or it can be prepared as appropriate according to the performance...

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Abstract

The invention provides a solidified abrading agent polishing pad and the preparation method thereof. The solidified abrading agent polishing pad comprises at least three layers, including an elastic layer (3), a rigid layer (2) and an abrading agent layer (1) sequentially arranged from the bottom layer to the top layer. The solidified abrading agent polishing pad is characterized in that the abrading agent layer (1) comprises the following components by the weight percentage: 1% to 40% of an abrading agent with the particle size being 1 nm to 40 Mum, 20% to 80% of polyacrylate prepolymer, 0.05% to 3% of free radical photoinitiator, 0% to 2% of poly-dimethylsiloxane / acrylic polymer, 0% to 20% of a performance adjusting addition agent, and 5% to 40% of esterified acrylic acid reactive diluent. The solidified abrading agent polishing pad which is prepared by the figure-transfer method has a series of advantages of stable grinding and polishing performance, high polishing efficiency, high surface texture of processed workpieces, and the like.

Description

technical field [0001] The invention relates to an ultra-precision grinding and polishing technology, in particular to a grinding and polishing pad and a preparation method thereof, in particular to a consolidated abrasive grinding and polishing pad and a preparation method thereof. Background technique [0002] Due to the popularization of standards such as TD-SCDMA and the demands of the digital home appliance and network markets, China's semiconductor market will reach a scale of US$68.6 billion in 2008. LED is an ideal choice for color display and decorative lighting of portable electronic devices (mobile phones, etc.) due to its high efficiency, easy driving, small size, thinness, durability, low noise and low cost. Therefore, its substrate materials Sapphire (Al 2 o 3 ) soared in demand. With the rapid development of high-tech such as the Internet and mobile communications, laser crystals (such as ruby, titanium sapphire, YVO 4 Crystals, etc.), nonlinear optical cr...

Claims

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Application Information

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IPC IPC(8): B24D11/00B24D3/32B24D18/00
Inventor 李军朱永伟左敦稳林魁李茂孙玉利
Owner NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
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