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5217results about "Grinding devices" patented technology

Doubled-sided and multi-layered PCD and PCBN abrasive articles

A doubled-sided PCD or PCBN compact as well as a new multi-layered PCD and PCBN can be produced using high pressure high temperature processes allowing for increased effective thickness of abrasive tools. A polycrystalline compact can include a substrate having a first surface and a second surface which are non-contiguous. Additionally, a first polycrystalline layer can be attached to the first surface of the substrate and a second polycrystalline layer attached to the second surface of the substrate. The first and second polycrystalline layers can include superabrasive particles bonded together by sintering or chemical bonding with an additional metal. Such double-sided PCD and PCBN compacts as well as a new multiple layered PCD and PCBN allow for increased effective thickness of a tool without suffering from non-homogenous results typical of standard PCD and PCBN compacts, regardless of superabrasive particle size. Each polycrystalline layer can include superabrasive particles of varying particle sizes such that the final tool is tailored for specific abrading characteristics. Such doubled-sided and / or multiple layered PCD and PCBN compacts can be incorporated into a wide variety of abrasive tools for use in cutting, milling, grinding, polishing, drilling and other similar abrasive applications.
Owner:CHO HYUN SAM +2

Polishing pad, method of manufacturing the polishing pad, and cushion layer for polishing pad

The polishing pad of this invention is a polishing pad effecting stable planarizing processing, at high polishing rate, materials requiring surface flatness at high level, such as a silicon wafer for semiconductor devices, a magnetic disk, an optical lens etc. This invention provides a polishing pad which can be subjected to surface processing to form a sheet or grooves, is excellent in thickness accuracy, attains a high polishing rate, achieves a uniform polishing rate, and also provides a polishing pad which is free of quality variations resulting from an individual variation, easily enables a change the surface patterns, enables fine surface pattern, is compatible with various materials to be polished, is free of burrs upon forming the pattern. This invention provides a polishing pad which can have abrasive grains mixed at very high density without using slurry, and generates few scratches by preventing aggregation of abrasive grains dispersed therein. The polishing pad of this invention has a polishing layer formed from a curing composition to be cured with energy rays, the polishing layer being formed surface pattern thereon by photolithography. The polishing pad of this invention comprises a polishing layer resin having abrasive grains dispersed therein, the resin containing ionic groups in the range of 20 to 1500 eq / ton.
Owner:ROHM & HAAS ELECTRONICS MATERIALS CMP HLDG INC
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