1856results about "Grinding devices" patented technology

The invention provides a high-porosity ceramic bond diamond micro-powder grinding tool and a preparation method and application thereof. The preparation method comprises the following steps: preparing ceramic bond diamond micro-powder composite powder by adopting a sol-gel method; the preparation method comprises the following steps: preparing porous agglomerated diamond microspheres by taking ceramic bond diamond micro-powder composite powder and an organic pore-forming agent as raw materials and adopting an atomization granulation method; the preparation method comprises the following steps: taking sodium alginate and calcium salt as raw materials, and preparing a calcium alginate water ball solution by adopting a multiple emulsion method and an atomization granulation method; the porous agglomerated diamond microspheres and the calcium alginate water balls are used as main raw materials, and a gel casting method is adopted for preparing the ceramic bond diamond micro-powder grinding tool. According to the diamond micro-powder grinding tool, the organic pore forming agent and the sodium alginate water balls are used as the pore forming agents, so that the particle size and proportion of pores in the prepared diamond micro-powder grinding tool can be accurately controlled, and the diamond micro-powder grinding tool has the characteristics of high porosity, good self-sharpening performance, low grinding resistance and the like and can be used for efficient and high-quality machining of semiconductor materials.

The invention provides a method for preparing a ceramic bond through solution heat preservation and a superhard grinding tool. The ceramic bonding agent prepared through a solution heat preservation method is fine in powder granularity and low in sintering temperature and contains a certain amount of crystals, the bonding agent has high impact resistance and self-sharpening performance due to existence of the crystals, and the prepared superhard ceramic grinding tool has the performance of high strength and good sharpness. The method has the advantages of short binding agent preparation period, low equipment investment cost, simplicity in operation and the like. The preparation method of the ceramic bond provided by the invention is not reported.

The invention provides an ultrasonic vibration auxiliary brazing device for a superhard abrasive formed grinding wheel and an operation method of the ultrasonic vibration auxiliary brazing device, the device comprises a motion control system, an ultrasonic vibration system, a high-frequency induction brazing system and a formed grinding wheel fixing device, and the formed grinding wheel to be brazed is fixed on the fixing device through a spring chuck. The motion control system is composed of a sliding block arranged on the movable guide rail and a motor controlling the sliding block to move and can control the vertical moving speed and direction of the sliding block on the guide rail. The ultrasonic vibration system comprises two ultrasonic vibration amplitude-change poles, a piezoelectric ceramic transducer and an external ultrasonic power supply, each piezoelectric ceramic ultrasonic amplitude-change pole can provide longitudinal vibration, and two-dimensional oval ultrasonic vibration in the brazing process is achieved through synthesis of the longitudinal vibration in the two vertical directions; the motion control system drives the brazing head to move up and down according to the brazing progress, and cooling water circulates in an induction coil of the brazing head. The problems that in the brazing process of the formed grinding tool, brazing filler metal distribution is not uniform, the machining quality is low, the brazing temperature is too concentrated, and the metallurgical reaction is serious in the process are solved.

The invention discloses a mechanical polishing pad with a CMP composite groove and a preparation method of the mechanical polishing pad, and belongs to the technical field of polishing pads. The mechanical polishing pad comprises a polishing layer, a bonding layer and a substrate layer, and the polishing layer is bonded to the surface of the substrate layer through the bonding layer; the bonding layer is prepared from the following raw materials in parts by mass: 47 to 50 parts of EVA resin, 35 to 36 parts of tackifier, 8 to 12 parts of paraffin, 3 to 7 parts of filler and 0.5 to 2 parts of antioxidant. The mechanical polishing pad solves the problem that when an existing mechanical polishing pad is used, a groove of the mechanical polishing pad cannot well convey polishing liquid, the mechanical polishing pad cannot be well supported, and the mechanical polishing effect is poor. The polishing liquid conveying performance of the mechanical polishing pad can be improved, the mechanical polishing pad is prevented from deforming during polishing, it can be guaranteed that polishing pressure is evenly transmitted, the size stability and the compression permanent deformation resistance of the mechanical polishing pad can be improved, and the mechanical polishing effect can be effectively improved.

The utility model relates to the technical field of blade polishing wheels, and discloses a welding type seamless metal screen cloth polishing wheel which comprises a wheel core, an elastic base body is arranged on the outer layer of the wheel core, and a grinding material shell covers the outer layer of the elastic base body. The grinding material shell comprises metal screen cloth, a group plating layer is arranged on the lower layer of the metal screen cloth, a film structure is arranged on the surface of the metal screen cloth, a plurality of grinding material seats are arranged on the film structure, nickel electroplating layers are arranged on the grinding material seats, and grinding materials are arranged on the nickel electroplating layers. According to the welding type seamless metal mesh polishing wheel, the seamless polishing wheel can be prepared through the rubber bag forming technology, the service life of the polishing wheel is further prolonged, meanwhile, through the electroplating method and the like, the abrasive base in the abrasive shell is formed after forming, the consistency of the shape of the abrasive base and the overall theoretical appearance of the polishing wheel is better, and the polishing effect is better. And the polishing wheel with higher precision can be further prepared through forming and grinding.

The invention relates to a modeling method for predicting surface roughness of silicon modified silicon carbide processed by a small grinding head, which relates to the technical field of optical manufacturing and comprises the following steps of: i, analyzing pressure intensity distribution between a grinding disc and a workpiece; step ii, calculating the press-in depth of the grinding material according to the maximum value of the pressure intensity distribution; and iii, establishing a surface roughness physical model by combining the motion trail length of the grinding material and the press-in depth of the grinding material. The modeling method for predicting the surface roughness of the silicon modified silicon carbide processed by the small grinding head is not limited to prediction of a roughness physical model of a silicon modified silicon carbide material polished by the small grinding head of a robot; and the method is also suitable for predicting the roughness physical model of metal or hard and brittle materials processed by equipment such as other numerical control processing machine tools and guiding actual processing.

The invention belongs to the technical field of grinding, and particularly relates to a metallic bond diamond grinding wheel, a preparation method of the metallic bond diamond grinding wheel and a thinning method. The diamond grinding block comprises a porous diamond grinding material, a metal binding agent and a pore forming agent. The porous diamond abrasive is prepared by carrying out a thermochemical corrosion method on diamond; the metal bonding agent comprises copper-tin alloy powder, graphite powder, nano Al2O3, cadmium powder and polyimide resin. Compared with the prior art, the problem that in the prior art, the thinning technological parameters of the grinding wheel are not suitable for the novel grinding wheel with the fine granularity is solved. According to the scheme, the novel grinding wheel with the fine granularity is provided, the thinning parameters are researched on the basis of the novel grinding wheel, and therefore better machining efficiency and silicon wafer surface quality can be obtained under the grinding wheel and the thinning process parameters.

Printable resin precursor compositions and polishing articles including printable resin precursors are provided. Printable resin precursors include a curable precursor formulation having a viscosity of less than or about 15 cP at 70° which include at least one urethane acrylate oligomer, at least one reactive monomer, and a photoinitiator. The curable precursor formulation exhibits an ultimate tensile strength measured in mPa and an elongation at break (%), where a product of the ultimate tensile strength and the elongation at break is greater than or about 2,000.

The invention discloses a preparation method and device for an abrasive grain texturing diamond grinding wheel. According to an existing diamond grinding wheel, diamond abrasive particles are bonded through a binder, and ideal surface micro-texture morphology is difficult to machine. According to the method, the diamond covering layer is formed on the outer surface of the metal matrix through chemical vapor deposition, and laser ablation is carried out, so that the regular diamond micro-texture morphology is machined, and the grinding quality is improved. Moreover, the diamond covering layer is formed on the surface of the metal matrix matched with the ground surface through chemical vapor deposition, and the diamond grinding wheel with the complex surface appearance is obtained, so that the grinding efficiency and precision of the complex surface are improved; meanwhile, the diamond covering layer formed through chemical vapor deposition is of an integrated structure on the molecular level, and compared with a conventional grinding wheel with each abrasive particle being of an independent structure, the abrasion resistance of the diamond grinding wheel can be greatly improved, and the problem that the grinding precision is reduced due to the fact that the grinding wheel is shrunk is relieved and even eliminated.

The invention relates to a high-wear-resistance resin abrasive disc and a preparation method thereof, and belongs to the technical field of high polymer materials. The high-wear-resistance resin abrasive disc comprises the following components in parts by weight: 30-40 parts of microcrystalline diamond, 20-30 parts of white corundum, 6-10 parts of fused alumina zirconia, 5-8 parts of a modified toughening agent, 20-25 parts of modified phenolic resin and 3-5 parts of magnesium oxide, modified boron nitride in the modified flexibilizer promotes resin curing, amino and resin cross-linking, interface bonding force is enhanced, toughening is achieved, carboxyl-terminated nitrile rubber improves the resin toughness, and dopamine increases the distance between boron nitride, weakens Van der Waals force and prevents boron nitride agglomeration; the boron element is introduced into the modified phenolic resin, a three-dimensional network structure is formed during curing, good heat resistance is given, and vinyl trimethoxy silane is high in Si-O bond energy and large in molecular flexibility, so that the heat stability is enhanced; the high-wear-resistance resin abrasive disc prepared by the preparation method disclosed by the invention not only has a good toughening effect, but also has excellent high-temperature-resistant and flame-retardant effects.

The invention discloses a wire threading mechanism and a wire threading method. The wire threading mechanism comprises a rack and a brush disc. The axis direction of the brush disc is the vertical direction, the brush disc can rotate in the axis direction of the brush disc, and a plurality of screw holes are evenly distributed in the end face of the brush disc in the circumferential direction. A wire conveying mechanism is arranged above the brush disc, a wire cutting mechanism is arranged between the brush disc and the wire conveying mechanism, a wire clamping mechanism is arranged below the brush disc, the wire conveying mechanism, the wire clamping mechanism and the wire clamping mechanism are arranged on the rack in the longitudinal direction, and the size and space occupied by the wire penetrating mechanism are saved; meanwhile, when wire threading is carried out, by means of cooperation of the wire conveying mechanism, the wire clamping mechanism and the wire cutting mechanism, after the prepared material wires are dragged in place, the material wires with the preset length are cut off, wire threading is completed, the efficiency of the wire threading mode is high, and wire threading can be completed one by one at all the wire holes in the brush disc at high efficiency.

The present invention discloses a carbon fiber matrix composite structure grinding wheel and a manufacturing method thereof. The carbon fiber matrix composite structure grinding wheel comprises a carbon fiber matrix, a grinding wheel piece and a monofilament pre-tightening cloth. The grinding wheel piece is sleeved on the carbon fiber matrix, and the two are bonded by gluing. The monofilament pre-tightening cloth is wound on the carbon fiber matrix. The carbon fiber matrix composite structure grinding wheel of the present invention solves the problems of large mass, low specific strength and modulus, large inertia and poor vibration resistance of existing metal grinding wheels; the present invention also discloses a manufacturing method of a carbon fiber matrix composite structure grinding wheel, by which a carbon fiber matrix composite structure grinding wheel can be manufactured.

The invention relates to the technical field of semiconductors, and discloses a preparation method of a heat-conducting polyurethane polishing pad, which comprises the following steps: coupling a silane coupling agent with a hydroxylated inorganic heat-conducting material, and carrying out condensation reaction on silanol groups in the silane coupling agent and hydroxyl groups in the hydroxylated inorganic heat-conducting material to form Si-O-Si covalent bonds; bridging a hydroxylated inorganic heat-conducting material at one end of a silane coupling agent to obtain an intermediate; the intermediate is an inorganic heat-conducting material modified by a silane coupling agent; mixing the polyurethane prepolymer with the intermediate to form a mixed prepolymer, and curing the mixed prepolymer at a first temperature to obtain heat-conducting polyurethane; or curing the polyurethane prepolymer to obtain polyurethane, carrying out melt blending on the polyurethane and the intermediate at a second temperature, and curing at a first temperature to obtain heat-conducting polyurethane, in the heat-conducting polyurethane, polyurethane is bridged at the other end of the silane coupling agent. Compared with the prior art, the heat transfer and heat conduction performance of the polishing pad is effectively improved.

The present invention relates to the field of coated abrasive technology, specifically to anti-clogging ceramic sandpaper and its preparation method. The technical key features are as follows: from bottom to top, it comprises: latex paper, a base glue, abrasive, a double glue, and an anti-clogging coating. The anti-clogging coating is prepared from the following components, calculated by weight: 30-50 parts aqueous emulsion, 10-15 parts graded filler, 3-5 parts dispersant, 2-3 parts water-soluble curing agent, and 60-70 parts water. The graded filler is ceramic corundum particles with the following gradation: particle size R < 250nm, 1-3%; 250≤R < 350nm, 65-75%; 350nm≤R < 450nm, 15-19%; 450≤R < 550nm, 3-5%. The anti-clogging ceramic sandpaper and its preparation method provided by the present invention significantly enhance the anti-clogging effect of the anti-clogging coating while effectively improving the sharpness and self-sharpening properties of the sandpaper surface.

The invention relates to the technical field of polishing and grinding, and discloses a polishing disc and a preparation method and application thereof. The polishing disc comprises a hot melting material layer and metal nanoparticles embedded in the hot melting material layer, the metal nanoparticles are evenly distributed on the polishing face of the polishing disc, and parts of the metal nanoparticles are exposed on the polishing face. According to the polishing disc, abrasive particles do not need to be added in the polishing process, the surface of a to-be-polished component cannot be damaged, and polishing of sub-angstrom-level surface roughness can be achieved.

The invention relates to the field of polyurethane polishing materials, and discloses a polyurethane polishing pad and a preparation method thereof. The polyurethane polishing pad is prepared from the following raw materials in parts by weight: 35-45 parts of diisocyanate, 15-20 parts of polycarbonate polyol, 8-14 parts of polyether polyol, 50-60 parts of a modified abrasive, 4-8 parts of a chain extender, 2-4 parts of a catalyst, 0.5-1.5 parts of a foaming agent and 1-3 parts of an antioxidant, the modified abrasive material is prepared from an abrasive material, a silane coupling agent, dimer acid diglycidyl ester and 4-hydroxybutyl vinyl ether; the grinding material is a combination of at least two of cerium oxide, zirconium oxide and / or aluminum oxide. The polyurethane polishing pad is suitable for fine grinding and polishing of sapphire optics, silicon carbide wafer metal and glass materials, the mirror surface effect can be achieved, good polishing stability and polishing smoothness are achieved, and the problems of scratching and uneven polishing are not prone to occurring after long-term polishing.

A method for forming an abrasive article via an additive manufacturing technique including forming a layer of powder material comprising a precursor bond material and abrasive particles, compacting at least a portion of the layer to form a compacted layer, binding at least a portion of the compacted layer, and repeating the steps of forming, compacting, and binding to form a green body abrasive article.

The invention relates to the technical field of grinding tools, in particular to a preparation process of a grinding oilstone, silicon nitride and diamond are adopted as raw materials to prepare the grinding oilstone, the silicon nitride has high hardness, high wear resistance and good chemical stability, and the diamond as the hardest substance in the nature has extremely high cutting capacity and wear resistance; silicon nitride and diamond are effectively combined to prepare the composite grinding oilstone, the grinding efficiency of the oilstone can be remarkably improved, the service life of the oilstone can be remarkably prolonged, and compared with an existing mode, the performance during use is improved; meanwhile, by adopting one or at least two of an oil-based binder, a wax-based binder, an oil-wax-based binder and a polyaldehyde binder as the binder, the surface brightness, smoothness, strength and abrasion resistance of the grinding oilstone can be improved, and the problems that in the prior art, the grinding oilstone is poor in performance in actual use, and the grinding oilstone is prone to being damaged are solved in this way. And the surface brightness and smoothness of the oilstone are poor.

The cBN resin superhard grinding wheel is prepared from the following raw materials in percentage by mass: 30 to 45 percent of cBN grinding material, 1 to 3 percent of nano yttrium oxide, 2 to 3 percent of nano zirconium oxide, 2 to 4 percent of coupling agent, 1 to 3 percent of silicon dioxide compound and the balance of phenolic resin. The phenolic resin matrix is jointly modified by the nano yttrium oxide, the nano zirconium oxide and the specific silicon dioxide compound, and the prepared grinding wheel has good wear resistance, hardness and temperature resistance.

The invention relates to the field of chemical mechanical polishing, in particular to a polishing pad material and a preparation method and application thereof. The method is mainly characterized in that an N, N-dimethylformamide solution with a proper concentration is utilized to promote ordered arrangement of polyurethane chains during solidification and forming, and the proper water content of the impregnated cloth can ensure uniform solidification and forming of polyurethane. By controlling the water content of the impregnated cloth and the concentration of the N, N-dimethylformamide solution during solidification forming, the polishing pad material can form a stable and uniform microporous structure, so that the surface defects of a wafer silicon wafer polished by the soft polishing pad material are reduced, and the quality of the wafer silicon wafer is improved. The technical problem that many defects exist on the surface of a silicon wafer after an existing polishing pad material is ground is solved.

The invention discloses a grinding and polishing tool applied to curved surface machining and a preparation method of the grinding and polishing tool. The grinding and polishing tool comprises a grinding and polishing layer, a base body layer and a rigid layer. The grinding and polishing layer is a uniform mixture of hydrophilic resin and grinding materials, protrusions are evenly distributed, the center axes of the protrusions are perpendicular to the lower end face of the tool, and the spherical surface where the tops of the protrusions are located and the spherical surface where the bottoms are located are the same in radius and collinear in sphere center. The matrix layer is made of hydrophilic resin the same as that of the grinding and polishing layer; the rigid layer 3 is one of an organic glass plate, a polyvinyl chloride plate and a polycarbonate plate. A convex tool is adopted for concave surface machining, and a concave tool is adopted for convex surface machining. The grinding and polishing tool is integrally formed, bonding is reduced, functional structure integration of the tool is achieved, and the machining precision is improved; the hydrophilic resin has the swelling characteristic when encountering water, full flexibility of the tool is achieved, and the tool can be attached to the surface of a workpiece easily and has the self-finishing function.

The invention discloses automatic precise diamond distributing equipment for a CMP grinding pad trimmer small ingot with a planarized tip. The automatic precise diamond distributing equipment comprises a rack, a diamond distributing mechanism, a material moving mechanism and a tray. A tray positioning table for placing a tray is arranged on the table surface of the rack; the diamond distributing mechanism and the material moving mechanism are arranged on the table top; the tray is provided with containing grooves used for containing small ingots in an array mode. During use, a tray loaded with pretreated small ingots is placed on the tray positioning table, and the small ingots are subjected to automatic diamond distribution operation by the diamond distribution mechanism, so that the diamond distribution efficiency is greatly improved, and favorable conditions are provided for commercialization of CMP (chemical mechanical polishing) pad trimmer products; the diamond distribution mechanism is of a specific structure, after diamond distribution is completed, diamond particles on the surfaces of the small ingots are evenly arranged in a single-layer mode, and the height of the tips of the diamond particles has the advantages of being good in consistency, so that the CMP polishing pad finisher has the high finishing capacity, and the CMP polishing pad is not prone to being damaged.

The utility model discloses a wire pressing clamp and a wire pressing device.The wire pressing clamp comprises a wire pressing disc body used for being concentrically matched with a brush disc, a plurality of sliding grooves are evenly distributed in the periphery of the wire pressing disc body in the circumferential direction, and telescopic rods capable of stretching out and drawing back in the radial direction are arranged in the sliding grooves; the multiple telescopic rods can change the pressing and covering area of the wire pressing disc body through radial stretching and retracting; when the two wire pressing discs are vertically oppositely combined to the two sides of the brush disc to form the wire pressing device, the telescopic rods stretch out to press wires on the two sides of the brush disc, the situation that the wires are scattered due to accidental springback is avoided, it is guaranteed that the next strand splitting and fixing process can be stably carried out, and the grinding brush disc forming efficiency and quality are improved.

The invention is applied to the technical field of polishing pad preparation, and particularly discloses a preparation method of a high-density and high-hardness foamed polyurethane polishing pad, which comprises the following steps: S1, raw material pretreatment; s2, a prepolymer synthesis step; s3, a foaming and forming step; s4, demolding and post-processing are carried out; and S5, sheet detection and formula optimization: detecting the hardness and density of the treated polishing pad finished product, and correspondingly adjusting the mixing ratio of the raw materials according to the detection result. According to the preparation method of the high-density and high-hardness foamed polyurethane polishing pad, polyether polyol and polyester polyol are mixed and then react with isocyanate, the polyether polyol and the polyester polyol do not react, and the polyether polyol and the polyester polyol jointly participate in the reaction of the isocyanate after being mixed, so that the high-density and high-hardness foamed polyurethane polishing pad is prepared. The generated polymer combines the advantages of polyether polyol and polyester polyol, and has stronger mechanical properties and chemical resistance than a polymer generated from a single component, so that the quality of a finished product of the polishing pad can be improved.

The utility model relates to a double-press 22-station large slice automatic forming machine which comprises a machine frame with a slide way and mold turning plates with molds, the slide way is bent to be arranged on the machine frame in a shape like a Chinese character'hui ', a plurality of mold turning plates are sequentially arranged in the slide way, the mold turning plates circularly slide on the machine frame along the slide way, and the molds are arranged on the mold turning plates. Intermittent motion propelling devices used for pushing the mold turning plate to slide are further arranged at the four corners of the machine frame. Two sets of production stations are diagonally arranged on the rack, the mold turning plate carries the mold to circulate between the two sets of production stations, and each set of production station comprises a bottom pressing station, a primary feeding and spreading station, a net placing station, a net pressing station, a secondary feeding and spreading station, a fine spreading station, an idle station, a trademark core ring station, a pressing station, a waxing station and a mold unloading station. The main machine and the auxiliary machine are arranged on the same rack in an end-to-end connection mode and share the same group of sliding ways arranged in a square frame and the same intermittent motion propelling device, so that one device is equal to two devices, and the yield can be doubled.

The invention relates to a photoetching ordered microcosmic fixed abrasive polishing pad and a preparation method thereof. Compared with the prior art, the method has the advantages that the to-be-photoetched surface of the substrate is photoetched according to the photoetched pattern, so that the plurality of microscopic grinding columns are orderly distributed and formed on the grinding material base according to the preset distribution and arrangement mode, the distribution shape, direction and position of the microscopic grinding columns on the grinding material base are kept unchanged, and regular distribution and uniform distribution can be presented; the distribution and the size of the micro grinding columns can be adjusted according to the photoetching pattern to meet different polishing requirements, then the micro grinding columns of the substrate are compositely filled with the filling body to keep the stability of the micro grinding columns, and the polishing pad can be suitable for the micro level to meet the requirement of the manufacturing procedure below 5nm, so that the production efficiency is improved, and the production cost is reduced. The microcosmic grinding columns are formed through photoetching to replace traditional grinding particles, the chemical stability of the polishing pad during polishing is improved, the removal rate is increased, the surface roughness is reduced, and the polishing effect of the polishing pad on a polishing product is improved.

The invention provides electric grinder grinding head turn-over polishing equipment accurate in positioning, and belongs to the technical field of electric angle grinder grinding head manufacturing. The polishing device solves the problem that special polishing equipment with good positioning performance and good coordination for the grinding head of the electric grinder urgently needs to be developed in the existing market. The full-automatic polishing machine comprises a rack, a rotary table component, a material taking component, a discharging component, a positioning detection component, a forward polishing component, a reverse polishing component and a face turning component, the rotary table component is provided with six stations, and the six stations are the feeding station, the forward polishing station, the face turning station, the reverse polishing station, the discharging station and the positioning station in sequence in the clockwise direction. Compared with the prior art, the polishing device has extremely high automation capacity and precision performance, and the front face and the back face of the grinding head can be automatically subjected to polishing operation with high connection performance and accurate positioning.

The utility model relates to the technical field of grinding wheel production, in particular to a clamping device for grinding wheel production and machining, which comprises a bottom plate, two supporting plates fixedly connected to the upper end face of the bottom plate, two sliding rods fixedly connected between the two supporting plates, two sliding plates slidably connected to the outer walls of the two sliding rods, triangular notches formed in the outer walls of the two sliding plates, and a clamping block fixedly connected with the triangular notches. Two clamping grooves are formed in the outer walls of the two triangular notches, a rotating shaft is fixedly connected to the upper end face of the bottom plate, a rotating plate is rotationally connected to the outer wall of the rotating shaft through a bearing, two connecting rods are rotationally connected to the upper end face of the rotating plate, and the other ends of the two connecting rods are rotationally connected with the lower ends of the two sliding plates correspondingly; through cooperation of the electric push rod, the rotating plate, the connecting rod, the sliding plates and the sliding rod, the two sliding plates can be driven to synchronously move towards each other or away from each other, triangular notches are formed in the outer walls of the two sliding plates, when the two sliding plates slide oppositely, a grinding wheel can be automatically centered, follow-up machining is facilitated, and the use effect is good.

According to the conductive gel grinding tool provided by the invention, the foamy copper framework is added on the basis of a conventional gel resin grinding tool, and the conductive gel grinding tool is prepared according to specific steps, so that the grinding tool has conductivity; during polishing, the conductive gel grinding tool is connected with the negative electrode of a power source to serve as a cathode, polishing liquid is matched, and an electrolytic reaction can occur in a polishing area on the surface of the grinding tool. Correspondingly, the invention further provides an electro-Fenton catalysis auxiliary polishing method. According to the method, electro-Fenton catalytic auxiliary polishing of the hard and brittle materials is achieved through the conductive gel grinding tool with the specific structure, the polishing efficiency is high, little iron-containing sludge is generated, and environmental pollution is small; generation of hydroxyl free radicals in a polishing solution in a machining area is controlled through the electro-Fenton effect, oxidation of the surface of a workpiece is achieved, then an oxidation layer on the surface of the workpiece is mechanically removed through a conductive gel grinding tool, the workpiece and the grinding tool do not need to be soaked in an electrolytic solution for polishing, the electro-Fenton auxiliary polishing device and the operation process are simplified, and the practical value is high.

The invention relates to the technical field of polishing, in particular to a composite polishing layer, a polishing pad and a preparation method of the polishing pad. The composite polishing layer comprises a first polishing layer and a second polishing layer, and the first polishing layer is coated with the second polishing layer; wherein the first polishing layer comprises first polyurethane, the hardness of the first polyurethane ranges from 95 A to 110 A, and the number-average molecular weight of the first polyurethane ranges from 3 wg / mol to 5 wg / mol; the second polishing layer comprises second polyurethane, the hardness of the second polyurethane is 50-70 A, and the number-average molecular weight of the second polyurethane is 5-20 w g / mol. According to the composite polishing layer, the uniformity and adjustability can be enhanced while resin can be enhanced and fibers are prevented from being pulled out too early, and the polishing pad has the longer service life while the high removal rate of the wafer is guaranteed.