1426results about "Grinding devices" patented technology

The invention provides a high-porosity ceramic bond diamond micro-powder grinding tool and a preparation method and application thereof. The preparation method comprises the following steps: preparing ceramic bond diamond micro-powder composite powder by adopting a sol-gel method; the preparation method comprises the following steps: preparing porous agglomerated diamond microspheres by taking ceramic bond diamond micro-powder composite powder and an organic pore-forming agent as raw materials and adopting an atomization granulation method; the preparation method comprises the following steps: taking sodium alginate and calcium salt as raw materials, and preparing a calcium alginate water ball solution by adopting a multiple emulsion method and an atomization granulation method; the porous agglomerated diamond microspheres and the calcium alginate water balls are used as main raw materials, and a gel casting method is adopted for preparing the ceramic bond diamond micro-powder grinding tool. According to the diamond micro-powder grinding tool, the organic pore forming agent and the sodium alginate water balls are used as the pore forming agents, so that the particle size and proportion of pores in the prepared diamond micro-powder grinding tool can be accurately controlled, and the diamond micro-powder grinding tool has the characteristics of high porosity, good self-sharpening performance, low grinding resistance and the like and can be used for efficient and high-quality machining of semiconductor materials.

The invention discloses a mechanical polishing pad with a CMP composite groove and a preparation method of the mechanical polishing pad, and belongs to the technical field of polishing pads. The mechanical polishing pad comprises a polishing layer, a bonding layer and a substrate layer, and the polishing layer is bonded to the surface of the substrate layer through the bonding layer; the bonding layer is prepared from the following raw materials in parts by mass: 47 to 50 parts of EVA resin, 35 to 36 parts of tackifier, 8 to 12 parts of paraffin, 3 to 7 parts of filler and 0.5 to 2 parts of antioxidant. The mechanical polishing pad solves the problem that when an existing mechanical polishing pad is used, a groove of the mechanical polishing pad cannot well convey polishing liquid, the mechanical polishing pad cannot be well supported, and the mechanical polishing effect is poor. The polishing liquid conveying performance of the mechanical polishing pad can be improved, the mechanical polishing pad is prevented from deforming during polishing, it can be guaranteed that polishing pressure is evenly transmitted, the size stability and the compression permanent deformation resistance of the mechanical polishing pad can be improved, and the mechanical polishing effect can be effectively improved.

The invention relates to a high-wear-resistance resin abrasive disc and a preparation method thereof, and belongs to the technical field of high polymer materials. The high-wear-resistance resin abrasive disc comprises the following components in parts by weight: 30-40 parts of microcrystalline diamond, 20-30 parts of white corundum, 6-10 parts of fused alumina zirconia, 5-8 parts of a modified toughening agent, 20-25 parts of modified phenolic resin and 3-5 parts of magnesium oxide, modified boron nitride in the modified flexibilizer promotes resin curing, amino and resin cross-linking, interface bonding force is enhanced, toughening is achieved, carboxyl-terminated nitrile rubber improves the resin toughness, and dopamine increases the distance between boron nitride, weakens Van der Waals force and prevents boron nitride agglomeration; the boron element is introduced into the modified phenolic resin, a three-dimensional network structure is formed during curing, good heat resistance is given, and vinyl trimethoxy silane is high in Si-O bond energy and large in molecular flexibility, so that the heat stability is enhanced; the high-wear-resistance resin abrasive disc prepared by the preparation method disclosed by the invention not only has a good toughening effect, but also has excellent high-temperature-resistant and flame-retardant effects.

The invention relates to the technical field of semiconductors, and discloses a preparation method of a heat-conducting polyurethane polishing pad, which comprises the following steps: coupling a silane coupling agent with a hydroxylated inorganic heat-conducting material, and carrying out condensation reaction on silanol groups in the silane coupling agent and hydroxyl groups in the hydroxylated inorganic heat-conducting material to form Si-O-Si covalent bonds; bridging a hydroxylated inorganic heat-conducting material at one end of a silane coupling agent to obtain an intermediate; the intermediate is an inorganic heat-conducting material modified by a silane coupling agent; mixing the polyurethane prepolymer with the intermediate to form a mixed prepolymer, and curing the mixed prepolymer at a first temperature to obtain heat-conducting polyurethane; or curing the polyurethane prepolymer to obtain polyurethane, carrying out melt blending on the polyurethane and the intermediate at a second temperature, and curing at a first temperature to obtain heat-conducting polyurethane, in the heat-conducting polyurethane, polyurethane is bridged at the other end of the silane coupling agent. Compared with the prior art, the heat transfer and heat conduction performance of the polishing pad is effectively improved.

The present invention relates to the field of coated abrasive technology, specifically to anti-clogging ceramic sandpaper and its preparation method. The technical key features are as follows: from bottom to top, it comprises: latex paper, a base glue, abrasive, a double glue, and an anti-clogging coating. The anti-clogging coating is prepared from the following components, calculated by weight: 30-50 parts aqueous emulsion, 10-15 parts graded filler, 3-5 parts dispersant, 2-3 parts water-soluble curing agent, and 60-70 parts water. The graded filler is ceramic corundum particles with the following gradation: particle size R < 250nm, 1-3%; 250≤R < 350nm, 65-75%; 350nm≤R < 450nm, 15-19%; 450≤R < 550nm, 3-5%. The anti-clogging ceramic sandpaper and its preparation method provided by the present invention significantly enhance the anti-clogging effect of the anti-clogging coating while effectively improving the sharpness and self-sharpening properties of the sandpaper surface.

The invention relates to the field of polyurethane polishing materials, and discloses a polyurethane polishing pad and a preparation method thereof. The polyurethane polishing pad is prepared from the following raw materials in parts by weight: 35-45 parts of diisocyanate, 15-20 parts of polycarbonate polyol, 8-14 parts of polyether polyol, 50-60 parts of a modified abrasive, 4-8 parts of a chain extender, 2-4 parts of a catalyst, 0.5-1.5 parts of a foaming agent and 1-3 parts of an antioxidant, the modified abrasive material is prepared from an abrasive material, a silane coupling agent, dimer acid diglycidyl ester and 4-hydroxybutyl vinyl ether; the grinding material is a combination of at least two of cerium oxide, zirconium oxide and / or aluminum oxide. The polyurethane polishing pad is suitable for fine grinding and polishing of sapphire optics, silicon carbide wafer metal and glass materials, the mirror surface effect can be achieved, good polishing stability and polishing smoothness are achieved, and the problems of scratching and uneven polishing are not prone to occurring after long-term polishing.

A method for forming an abrasive article via an additive manufacturing technique including forming a layer of powder material comprising a precursor bond material and abrasive particles, compacting at least a portion of the layer to form a compacted layer, binding at least a portion of the compacted layer, and repeating the steps of forming, compacting, and binding to form a green body abrasive article.

The cBN resin superhard grinding wheel is prepared from the following raw materials in percentage by mass: 30 to 45 percent of cBN grinding material, 1 to 3 percent of nano yttrium oxide, 2 to 3 percent of nano zirconium oxide, 2 to 4 percent of coupling agent, 1 to 3 percent of silicon dioxide compound and the balance of phenolic resin. The phenolic resin matrix is jointly modified by the nano yttrium oxide, the nano zirconium oxide and the specific silicon dioxide compound, and the prepared grinding wheel has good wear resistance, hardness and temperature resistance.

The invention relates to the field of chemical mechanical polishing, in particular to a polishing pad material and a preparation method and application thereof. The method is mainly characterized in that an N, N-dimethylformamide solution with a proper concentration is utilized to promote ordered arrangement of polyurethane chains during solidification and forming, and the proper water content of the impregnated cloth can ensure uniform solidification and forming of polyurethane. By controlling the water content of the impregnated cloth and the concentration of the N, N-dimethylformamide solution during solidification forming, the polishing pad material can form a stable and uniform microporous structure, so that the surface defects of a wafer silicon wafer polished by the soft polishing pad material are reduced, and the quality of the wafer silicon wafer is improved. The technical problem that many defects exist on the surface of a silicon wafer after an existing polishing pad material is ground is solved.

The invention discloses a grinding and polishing tool applied to curved surface machining and a preparation method of the grinding and polishing tool. The grinding and polishing tool comprises a grinding and polishing layer, a base body layer and a rigid layer. The grinding and polishing layer is a uniform mixture of hydrophilic resin and grinding materials, protrusions are evenly distributed, the center axes of the protrusions are perpendicular to the lower end face of the tool, and the spherical surface where the tops of the protrusions are located and the spherical surface where the bottoms are located are the same in radius and collinear in sphere center. The matrix layer is made of hydrophilic resin the same as that of the grinding and polishing layer; the rigid layer 3 is one of an organic glass plate, a polyvinyl chloride plate and a polycarbonate plate. A convex tool is adopted for concave surface machining, and a concave tool is adopted for convex surface machining. The grinding and polishing tool is integrally formed, bonding is reduced, functional structure integration of the tool is achieved, and the machining precision is improved; the hydrophilic resin has the swelling characteristic when encountering water, full flexibility of the tool is achieved, and the tool can be attached to the surface of a workpiece easily and has the self-finishing function.

The utility model discloses a wire pressing clamp and a wire pressing device.The wire pressing clamp comprises a wire pressing disc body used for being concentrically matched with a brush disc, a plurality of sliding grooves are evenly distributed in the periphery of the wire pressing disc body in the circumferential direction, and telescopic rods capable of stretching out and drawing back in the radial direction are arranged in the sliding grooves; the multiple telescopic rods can change the pressing and covering area of the wire pressing disc body through radial stretching and retracting; when the two wire pressing discs are vertically oppositely combined to the two sides of the brush disc to form the wire pressing device, the telescopic rods stretch out to press wires on the two sides of the brush disc, the situation that the wires are scattered due to accidental springback is avoided, it is guaranteed that the next strand splitting and fixing process can be stably carried out, and the grinding brush disc forming efficiency and quality are improved.

The invention relates to a photoetching ordered microcosmic fixed abrasive polishing pad and a preparation method thereof. Compared with the prior art, the method has the advantages that the to-be-photoetched surface of the substrate is photoetched according to the photoetched pattern, so that the plurality of microscopic grinding columns are orderly distributed and formed on the grinding material base according to the preset distribution and arrangement mode, the distribution shape, direction and position of the microscopic grinding columns on the grinding material base are kept unchanged, and regular distribution and uniform distribution can be presented; the distribution and the size of the micro grinding columns can be adjusted according to the photoetching pattern to meet different polishing requirements, then the micro grinding columns of the substrate are compositely filled with the filling body to keep the stability of the micro grinding columns, and the polishing pad can be suitable for the micro level to meet the requirement of the manufacturing procedure below 5nm, so that the production efficiency is improved, and the production cost is reduced. The microcosmic grinding columns are formed through photoetching to replace traditional grinding particles, the chemical stability of the polishing pad during polishing is improved, the removal rate is increased, the surface roughness is reduced, and the polishing effect of the polishing pad on a polishing product is improved.

According to the conductive gel grinding tool provided by the invention, the foamy copper framework is added on the basis of a conventional gel resin grinding tool, and the conductive gel grinding tool is prepared according to specific steps, so that the grinding tool has conductivity; during polishing, the conductive gel grinding tool is connected with the negative electrode of a power source to serve as a cathode, polishing liquid is matched, and an electrolytic reaction can occur in a polishing area on the surface of the grinding tool. Correspondingly, the invention further provides an electro-Fenton catalysis auxiliary polishing method. According to the method, electro-Fenton catalytic auxiliary polishing of the hard and brittle materials is achieved through the conductive gel grinding tool with the specific structure, the polishing efficiency is high, little iron-containing sludge is generated, and environmental pollution is small; generation of hydroxyl free radicals in a polishing solution in a machining area is controlled through the electro-Fenton effect, oxidation of the surface of a workpiece is achieved, then an oxidation layer on the surface of the workpiece is mechanically removed through a conductive gel grinding tool, the workpiece and the grinding tool do not need to be soaked in an electrolytic solution for polishing, the electro-Fenton auxiliary polishing device and the operation process are simplified, and the practical value is high.

A bonded abrasive comprising a body including abrasive particles contained within a bond material, wherein the abrasive particles comprise a first group of abrasive particles in a first content (Cl), the first group including shaped abrasive particles having a first average particle size (PSI) and a second group of abrasive particles in a second content (C2), the second group including non-shaped abrasive particles having a second average particle size (PS2), wherein PS2<PS1 and a content ratio (C2 / C1) of at least 0.05 to 1.

The present invention discloses a cold pressing and forming device for the production of a metal-bonded diamond grinding wheel in the field of diamond grinding wheel forming technology. A cold pressing and forming assembly is installed on the basic assembly. The output end of the hydraulic telescopic cylinder is fixedly assembled with an upper mold, and a lower mold adapted to the upper mold is fixed on the basic assembly. A flattening assembly is assembled in the lower mold, and a cooling assembly driven by the flattening assembly is installed in the basic assembly. By setting the flattening assembly, the cold pressing and forming disk is set to be rotatable and relatively rotate with the lower mold, which can flatten the raw materials on the cold pressing and forming disk without affecting the use of the lower mold. The cooling assembly is added and the cooling assembly is driven to act when the flattening assembly acts to achieve an effective heat exchange effect, solving the problem that it is difficult to effectively dissipate heat from the overall cold pressing of the grinding wheel. A demoulding assembly is added to complete the automatic mold lifting operation.

The invention relates to a cover plate cold carving grinding head, a machining method of the cold carving grinding head and an application method of the cold carving grinding head. A cover plate cold carving grinding head comprises a cutter handle, a cutter head, cooling holes, a cooling groove and a cooling transverse groove, the cutter head is arranged at one end of the cutter handle, the cooling holes are formed in the middle of the cutter handle and the middle of the cutter head, the cooling groove is formed in the bottom of the cutter head, the cooling holes penetrate through the cutter handle and the cooling groove in the bottom of the cutter head, and the cutter head is provided with a plurality of grinding heads. The multiple grinding heads are evenly distributed on the periphery of the tool bit, and a cooling transverse groove is formed between every two adjacent grinding heads. By means of the mechanism, the problems that a traditional cold carving grinding head does not have the cooling function, multiple times of tool switching and multiple times of program switching are needed in the machining process, due to the fact that the cooling effect of the grinding head is poor, the grinding head is seriously worn, tool marks are likely to appear on glass, the follow-up polishing procedure is difficult to manufacture, and continuous automatic production cannot be achieved are solved.

The utility model relates to the technical field of optical polishing, in particular to a polishing asphalt millstone grooving device which comprises a shell, a clamping shell and a grooving die, a millstone with heated asphalt is pressed into the grooving die by pressing the shell to achieve the grooving task of the millstone, then a handle is pressed, the millstone is pushed out of the device, and the millstone is clamped by the clamping shell. By means of the mechanical grooving mode, the labor cost is saved, the grooving task of the asphalt millstone can be rapidly and accurately achieved, the grooving efficiency and the grooving precision are greatly improved, and the machining precision, smooth finish and other indexes of a polished workpiece can be improved. And the grooving die can be designed and manufactured according to specific workpiece requirements, so that the flexibility and adaptability of grooving work are improved.

The invention discloses a resin binding agent for a resin diamond wire, the resin diamond wire and a preparation method of the resin binding agent, and belongs to the technical field of binding agents for resin diamond wires. Two brand-new modified compounds are designed and synthesized, boron-containing and nitrogen-containing compounds are introduced to form a covalent bond enhanced polyurethane derivative; and the other one is a double-functional-group siloxane oligomer containing an epoxy group and a carboxyl group, which is prepared by carrying out hydrolytic condensation on raw materials such as methyltrimethoxysilane and the like, neutralizing and purifying. The resin binder takes epoxy-phenolic hybrid resin as a main body and is compounded with the two modified compounds, a curing agent, a coupling agent and other components. The resin diamond wire is prepared through wire core pretreatment, glue solution preparation, coating, multi-stage curing and post-treatment. The heat resistance, the bonding strength with diamond and the impact toughness of the bonding agent are remarkably improved, and the bonding agent is suitable for high-precision cutting of hard and brittle materials such as photovoltaic silicon wafers and the like.

The invention belongs to the technical field of grinding materials and grinding tools, and particularly relates to a diamond electroplated grinding wheel directionally arranged in a magnetic field and a preparation method and application thereof. Firstly, electroplating liquid is added into an electroplating bath, then 30%-40% of magnetic diamond abrasive materials are added into the electroplating liquid, directional magnetic sanding is carried out with the grinding wheel base body A as a cathode and a nickel plate as an anode, the magnetic field intensity is controlled to be 0.1-1 T, the cathode current density is controlled to be 0.4 A / dm < 2 >-0.6 A / dm < 2 >, the electroplating time is 10-20 min, and a grinding wheel base body B is obtained; removing floating sand from the grinding wheel base body B to obtain a grinding wheel base body C; and the grinding wheel base body C is thickened to obtain a grinding wheel base body D, and the grinding wheel base body D is modified to obtain the grinding wheel. The grinding rate of the manufactured grinding wheel is reduced by 10%-25%, the service life is prolonged by 30%-50%, the machined surface roughness (Ra) can reach 0.3 micrometer or below, and the machined surface precision is reduced by 10%-25%. The grinding wheel is applied to nanoscale grinding of optical glass, sapphire and silicon carbide wafers and forming machining of turbine blade mortises and ceramic matrix composites, and the precision and roughness of the grinding wheel can be effectively guaranteed.

The utility model discloses a polishing wheel base body of a folding steel structure, which comprises a mounting seat, a rubber base body and a grinding material belt base body, the middle part of the mounting seat is mounted on a grinding wheel rod, the rubber base body is positioned on the peripheral wall surface of the mounting seat, the grinding material belt base body is folded and pleated to form a belt-shaped structure with wrinkles, and the rubber base body is positioned on the outer wall surface of the mounting seat. Rubber reinforced isolation blocks are arranged between the corrugation structures on the upper face and the lower face of the abrasive belt base body respectively, the abrasive belt base body of a belt-shaped structure is wound around the outer side wall face of the rubber base body, and then a complete polishing wheel base body is formed for polishing machining. The polishing wheel base body does not contain seams in the circumferential direction, the bonding strength is higher, the polishing wheel base body is not prone to falling off due to scratching, meanwhile, automation is easy to achieve in the process, mass production can be achieved, the manufacturing cost can be remarkably reduced, the polishing wheel base body can be popularized and applied to the civil industry grinding and polishing process, comprehensive automation of the process is achieved, and manual grinding is thoroughly eliminated.

The invention discloses a chemical mechanical polishing pad with an improved service life and a machining method and application thereof.The chemical mechanical polishing pad comprises a polishing layer, the polishing layer is provided with a rotation center, a polishing track area and radial grooves, the polishing track area and the radial grooves are concentric with the rotation center, and annular micro grooves are formed in the polishing track area; the orientation of the annular micro-groove is based on a vortex and source flow function of the movement of a polishing medium during polishing, and a vertical function of the function is taken. According to the design of the annular micro grooves, the optimal attack angle and the proper depth can be derived according to the boundary conditions of vortex and source flow, the same angular pitch is repeated, the polishing layer is divided into different areas through the adjacent radial grooves, and therefore the effects of area oscillation and pulse generation are achieved, the use area of the polishing layer is enlarged, and the service life of the polishing layer is indirectly prolonged; and the in-chip and inter-chip uniformity can be improved.

The invention discloses an efficient and precise super-hard grinding tool preparation device, and relates to the technical field of grinding tool preparation. A vacuum box is fixedly installed at the bottom of the prefabricating cylinder through bolts, a strong vortex field is formed under the temperature control condition through a revolution-rotation composite stirring system driven by a planetary gear set, it is ensured that the superhard abrasive and a binding agent are mixed highly evenly and formed in a high-density mode, and then bubbles of the mixed material are effectively removed in a vacuum constant-temperature environment; a stable blank is formed through hot-pressing curing, the online resin synthesis function is integrated, the process efficiency is remarkably improved, meanwhile, zero-clearance interference fit of an inner hole of the grinding tool is achieved through the electromagnetic expansion clamping technology, and surface damage caused by traditional clamping is thoroughly eliminated. The precise slit coating head which is combined with multi-axis dynamic posture adjustment is suitable for uniformly coating silicone resin on a grinding tool with a complex curved surface, and high-precision and self-adaptive detection on the surface quality of the coated grinding tool is realized through multi-specification detection of the detection box.

The present disclosure provides a bionic Australian thorny devil grinding wheel, a grinding device, and a preparation process, and relates to the field of grinding equipment. For the problem of the poor effect of conveying grinding fluid by a grinding wheel at present, imitating semi-open capillary channels and a honeycomb structure on the skin of the Australian thorny devil, prisms with isosceles trapezoidal bottom surfaces are arranged on a matrix in sequence to form directional liquid self-conveying flow channels and a superhydrophilic honeycomb-like hexagonal distribution structure.

The invention discloses a preparation method of a micro-comb-tooth structure diamond grinding wheel with abrasive particle positive relief angles and the obtained diamond grinding wheel, and the preparation method comprises the following steps: step 1, preparing grooves which are arranged in order to form a certain array on the circumferential surface of a grinding wheel base body through precision milling, and directionally bonding diamond abrasive particles in the grooves by using conductive adhesive; nickel-cobalt alloy is deposited through a pulse electroplating method to achieve mechanical solidification of the abrasive particles; 2, the grinding wheel obtained in the step 1 is shaped through a pulse laser system, and effective control over the outer circumference run-out of the grinding wheel is achieved; 3, the abrasive particle positive relief angle, obtained in the step 2, of the grinding wheel is subjected to forming machining; and 4, micro comb tooth structure machining is conducted on the grinding wheel in the step 3.

A method of processing a superabrasive element includes providing a superabrasive element including a polycrystalline diamond table that includes a metallic material disposed in interstitial spaces defined within the polycrystalline diamond table. The method also includes leaching the metallic material from at least a volume of the polycrystalline diamond table to produce a leached volume in the polycrystalline diamond table.

The invention discloses a low-heat efficient steel rail cutting blade for railway steel rail cutting and a manufacturing method of the low-heat efficient steel rail cutting blade, and belongs to the technical field of tools for grinding, polishing or cutter grinding. The low-heat efficient steel rail cutting blade is prepared from the following raw materials in parts by mass: 100 to 135 parts of grinding material, 10 to 20 parts of resin adhesive, 20 to 30 parts of functional filler, 4 to 8 parts of self-lubricating pore-forming material and 3 to 5 parts of wetting agent. The steel rail cutting fluid has good cutting performance and anti-burn performance, 60 # steel rails can be cut at a time within 90 s, it is guaranteed that no obvious burn exists on the cutting face, and the steel rail cutting machining tolerance requirement is met.

The invention provides a composite abrasive part, application, a preparation method and a processing machine tool, the composite abrasive part can be used for inner hole processing and grinding wheel processing, and the composite abrasive part is formed by mixing and pressing multi-granularity composite abrasive particles and a metal-resin binding agent. According to the multi-granularity composite abrasive particles, small-granularity particles are used for filling gaps among large-granularity particles, so that the number of effective abrasive particles participating in material removal on the surface of an abrasive layer is increased, the material removal depth of a single abrasive particle is reduced, and the surface roughness is improved; the composite grinding material piece comprises a rigidity grinding and polishing composite section, and the rigidity grinding and polishing composite section comprises rigidity grinding areas and flexible polishing areas which are sequentially and alternately combined in the axial direction or the circumferential direction of the composite grinding material piece, so that the material removal process is discretized, the possibility of generating machining cracks is reduced, and efficient mirror surface machining is achieved.

The present application relates to a modified diamond micro-powder and a preparation method and application thereof. The preparation method of the modified diamond micro-powder comprises the following steps: performing hydroxylation treatment on diamond micro-powder to obtain surface hydroxylated diamond micro-powder; performing pretreatment on the surface hydroxylated diamond micro-powder in a mixed solution of a silane coupling agent and an organic solvent under ultrasonic conditions with a frequency of 25KHz-40KHz and an intensity of 1W / cm 2 -3W / cm 2 to obtain pretreated diamond micro-powder; and performing vacuum heat treatment on the pretreated diamond micro-powder to obtain modified diamond micro-powder. The preparation method greatly improves the bonding force between the modified layer and the diamond and improves the micro-powder agglomeration, so that the pretreatment link before chemical plating has the feasibility of batch processing, which not only doubles the production efficiency, but also reduces the production cost to one third of the traditional method.

The present invention belongs to the technical field of abrasives. Provided are a modified diamond abrasive, and a preparation method therefor and the use thereof. The preparation method for the modified diamond abrasive comprises: modifying a diamond abrasive by means of a silane coupling agent, so as to obtain a first abrasive; uniformly mixing the first abrasive, a polyamide acid solution and an ionic liquid, and then subjecting the mixture to spray granulation, so as to obtain a second abrasive; and subjecting the second abrasive to an imidization treatment, so as to obtain the modified diamond abrasive, wherein the viscosity of the polyamide acid solution is 200-900 cp. The obtained modified diamond abrasive has a high sphericity degree and a high mechanical strength, thereby effectively solving the problems of passivation and a grinding efficiency reduced along with same of a grinding blade of a traditional diamond abrasive.

The invention discloses a manufacturing method of a grinding wheel for a high-uniformity and easy-to-sharpen grinding single crystal diamond cutter, and belongs to the field of superhard materials and products in machining, the manufacturing method mainly comprises the steps of wet mixing, tape casting, laser cutting, lamination, matrix surface treatment, integrated sintering, size processing, sharpening and the like, and finally the grinding wheel with the total thickness of an abrasive layer being 7-15 mm is formed. The grinding wheel layer is formed by intersecting and laminating a piece a and a piece b, the height of diamonds at the junction of the piece a and the piece b tends to be consistent, the diamond exposure height and smoothness are better compared with direct feeding sintering, meanwhile, the piece a can be designed to be of a porous structure through proper binder selection, and therefore the dressing efficiency is further improved, and the dressing effect is better. And higher processing quality and efficiency of the diamond cutter are indirectly improved.