A method and
system are taught for a
system comprising an LED
package. The LED
package may comprise a leadframe having an annular contact and a base contact. An LED die may be coupled to the annular and base contacts such that the P-type material portion is electrically connected to an annular contact and the N-type material portion is electrically connected to a base contact. Alternatively the N-type material portion may be electrically connected to the annular contact and the P-type material portion may be electrically connected to the base contact. A lens may be coupled to the leadframe, and an optical material may be located in a cavity defined by the lens, the base contact, and the annular contact. The optical material may be a gel, a
grease, a resilient material, a non-resilient material, a rigid material, a liquid material or a non-liquid material. The method and
system may further comprise a mounting device, wherein the LED
package is mechanically coupled to the mounting device in a socket, bayonet, or threaded fashion. The method and system may further comprise a strip comprising an array of annular contacts utilized to form an array of the LED packages and a carrier strip comprising receiving devices to receive the array of LED packages. A portion of the lens may either be coated with or comprise light excitable material or the optical material may comprise light excitable material, such that the system emits
white light.