123 results about "Optical integrated circuit" patented technology

An optical integrated circuit includes: a waveguide including a first part and a second part and configured to couple an electromagnetic wave propagating in the first part and an electromagnetic wave propagating in the second part; and a non-reciprocal member positioned alongside the second part in an amplitude direction of an electric field component of the electromagnetic wave. In a range where the first part and the second part are coupled with each other, deviation between a center of an energy distribution of an electric field component of the electromagnetic wave propagating in the first part and a center of an energy distribution of an electric field component of the electromagnetic wave propagating in the second part falls within a prescribed range.

An electro-optical integrated circuit comprising an optical transmitter and an optical receiver is disclosed in which a monolithically integrated electro-absorption modulated laser (EML) can operate bi-directionally in both transmitter and receiver modes. Vertically stacked waveguides for lasers and electro-absorption modulators (EAMs) are provided. The laser and the EAM are optically coupled through a transverse conical vertical optical coupler. The EML includes monolithically integrated electronic circuitry, such as drivers and control electronics for driving the laser as the EML and the EAM in the transmitter mode. The control circuit includes a transimpedance amplifier (TIA). The EAM has a first portion and a second portion that may be independently biased. In receiver mode, the laser current is reduced near a threshold, a first portion of the EAM is biased to absorb residual laser light, while a second portion of the EAM provides photocurrent to the TIA as a photodiode receiver.

The invention provides a three-dimensional photoelectric integrated packaging structure and a preparation method thereof, and the packaging structure comprises a TSV substrate, a rewiring layer, a first electric chip, a second electric chip, a dielectric layer, a conductive column, an optical chip module, a 3D stacked chip, and a horizontal storage chip. The optical chip module, the first electric chip and the 3D stacked chip are connected through the TSV substrate and the rewiring layer to form the optical integrated circuit, and the 3D stacked chip, the second electric chip and the horizontal storage chip are connected through the TSV substrate and the rewiring layer to form the electric integrated circuit, so that the transmission distance between the optical integrated circuit and the electric integrated circuit is shortened; the packaging area is reduced, the power consumption is reduced, and high-density integrated packaging of the photoelectric chip is realized.

The invention discloses a laser radar system, and relates to the technical field of laser radars. The laser radar system comprises a silicon optical integrated circuit, a laser generating circuit, an optical scanning circuit, a scanning driving circuit, a laser driving circuit and a main control circuit. The laser generating circuit, the scanning driving circuit, the laser driving circuit and the main control circuit are arranged on different circuit boards; the main control circuit provides a laser driving signal for the laser driving circuit and provides a scanning driving signal for the scanning driving circuit; the laser driving circuit controls the laser generating circuit to emit a laser signal according to the laser driving signal; the scanning driving circuit controls the optical scanning circuit to shape a laser signal according to the scanning driving signal, transmits the laser signal to an object to be scanned, and controls the optical scanning circuit to feed back a detection optical signal detected by the object to be scanned to the silicon optical integrated circuit; the silicon optical integrated circuit provides a detection electric signal for the main control circuit; the master control circuit determines an optical scanning result. According to the invention, the measurement precision and stability of the laser radar system are improved.

The invention provides a preparation method of a 3DIC photoelectric integrated semiconductor packaging structure, and the method comprises the steps: carrying out the integrated packaging of an optical chip module, a 3D stacked chip and a horizontal storage chip through a TSV substrate, a rewiring layer, a first electric chip, a second electric chip, a dielectric layer and a conductive column, enabling the optical chip module to be connected with the 3D stacked chip through the first electric chip, enabling the optical chip module to be connected with the 3D stacked chip through the second electric chip, and enabling the optical chip module to be connected with the horizontal storage chip through the second electric chip; and the 3D stacked chip is connected with the horizontal storage chip through the second electric chip, so that short-distance connection between the optical integrated circuit and the electric integrated circuit is realized, the transmission distance of photoelectric signals is greatly reduced, the packaging area is reduced, the power consumption is reduced, and high-density integrated packaging of the photoelectric chip is met.

A chip structure includes an optical integrated circuit chip including a first waveguide extending in a horizontal direction and an optical guide unit, an electronic integrated circuit chip on the optical integrated circuit chip, and a connector above the optical integrated circuit chip and including a body, a second waveguide extending from an upper surface to a lower surface of the body, and an engagement groove extending inward from the upper surface of the body, wherein the first waveguide includes an edge coupler located at an end adjacent to the optical guide unit among both ends of the first waveguide, and the optical guide unit is configured to transfer signals between the first waveguide and the second waveguide.

An optical integrated circuit includes a substrate, at least one open cavity provided in said substrate, at least one set of optical waveguides for each open cavity, each set including a first optical waveguide and a second optical waveguide. The first and second optical waveguides are arranged in the substrate and include a first end facet ending in the open cavity of that set, and a first collimating element for each set. The first collimating element is arranged in the open cavity at or near the first end facet of the first optical waveguide to collimate light from that waveguide. A second collimating element for each set is arranged in the open cavity at or near the first end facet of the second optical waveguide to collimate light into that waveguide. A method for fabricating the same.

To provide an optical connector capable of easily and detachably fitting an optical fiber to an optical integrated circuit.SOLUTION: An optical connector 5 for connecting an optical integrated circuit 3 and an optical fiber 40 together, comprises: a plug member 7 fitted to the optical fiber 40; a receptacle member 6 arranged on the optical integrated circuit 3 and connected to the plug member 7 to transmit light L between the optical integrated circuit 3 and optical fiber 40; and a lock mechanism 9 which switches between a locked state in which the plug member 7 and receptacle member 6 stay connected and an unlocked state in which the plug member 7 and receptacle member 6 are attachable / detachable.SELECTED DRAWING: Figure 14

The application provides a preparation method of a 3DIC optoelectronic integrated semiconductor packaging structure. The light chip module, the 3D stacked chip and the horizontal storage chip are collectively packaged through a TSV substrate, a rewiring layer, a first electric chip, a second electric chip, a dielectric layer and a conductive column. The light chip module is connected with the 3D stacked chip through the first electric chip, and the 3D stacked chip is connected with the horizontal storage chip through the second electric chip. Thus, the short-distance connection of the optical integrated circuit and the electric integrated circuit is realized, the transmission distance of the optoelectronic signal is greatly reduced, the packaging area is reduced, the power consumption is reduced, and the high-density integrated packaging of the optoelectronic chip is met.

An inspection device 1 comprises: a pulse formation unit that generates a pulse train Pb in which a plurality of light pulses Pb1, Pb2 having different center wavelengths are arranged at predetermined time intervals; a light detection unit 8 that detects a time waveform of the pulse train Pb output from an optical integrated circuit 5; and an evaluation unit 9 that evaluates the optical integrated circuit 5 on the basis of the feature amount of the time waveform. For each of a plurality of waveguides having different lengths that are already known, the evaluation unit 9 refers to the feature amount of the time waveform corresponding to said waveguide to calculate the amount of change in the feature amount of the time waveform with respect to the length of the waveguide, and uses the amount of change to calculate the feature amount of a time waveform of another structure.

A semiconductor package includes a package substrate, a plurality of stacked structures on the package substrate, each stacked structure including a plurality of core chips stacked on each other, each core chip including a memory cell array including a plurality of memory cells, a buffer chip on the package substrate, and spaced apart from the plurality of stacked structures in a horizontal direction, and a photonics package including an optical integrated circuit chip on the package substrate, an electronic integrated circuit chip on the optical integrated circuit chip, and a first molding layer surrounding side surfaces of the electronic integrated circuit chip, wherein the buffer chip is configured to control the memory cell of the core chip of each of the plurality of stacked structures.

A semiconductor package includes a package substrate, an interposer substrate disposed on the package substrate, and a photonics chip structure mounted on the interposer substrate, wherein the photonics chip structure includes an electronic integrated circuit portion including an electronic integrated circuit chip mounted on the interposer substrate, an optical integrated circuit portion including an optical integrated circuit chip having a groove at a corner of an upper portion thereof and mounted on the electronic integrated circuit chip, an edge coupler extending toward the groove, and a waveguide connected to the edge coupler, and a glass connector mounted in the groove of the optical integrated circuit portion and facing the edge coupler.

This optical integrated circuit is provided with a substrate having a substrate surface, a first waveguide and a second waveguide for propagating electromagnetic waves along the substrate surface, and a non-reciprocal member positioned on the side away from the substrate surface of the first waveguide and the second waveguide. At least a part of the non-reciprocal member is located in the range of the mode field diameter of an electromagnetic wave in the TM mode in the first waveguide. The non-reciprocal member is not located in the range of the mode field diameter of the electromagnetic wave in the TM mode in the second waveguide.

This optical integrated circuit comprises an optical waveguide device, a light-emitting device, and a support unit. The optical waveguide device includes a substrate, and an optical waveguide layer that is disposed on the substrate and includes an input coupler and an optical waveguide. The light-emitting device is spaced apart from the optical waveguide device. The light-emitting device includes a light-emitting layer and a phase modulation layer. The phase modulation layer includes a base layer and a plurality of different refractive index regions. The support unit includes a first support portion in which one device is disposed, and a second support portion that supports the other device. The distance between the optical waveguide device and the light-emitting device is smaller than the width of the second support portion in the direction in which the one device and the second support portion are lined up.

This disclosure relates to optical integrated devices, optical integrated circuit wafers, and methods for manufacturing optical integrated devices. The optical integrated device includes a substrate and a waveguide having a hollow structure. The waveguide includes a first waveguide and a second waveguide, the second waveguide being optically coupled to the first waveguide and having a relative refractive index difference smaller than that of the first waveguide, and the waveguide converting a mode diameter to the mode diameter of an optical fiber according to the propagation of light. The optical integrated device includes a recessed portion formed near a cleavage line on the substrate, such that, with the cleavage end surface of the substrate protruding further in the axial direction of the optical waveguide than the output end surface of the second waveguide, the width of the output end surface is smaller than the core width of the optical fiber optically coupled to the output end surface.

To provide a manufacturing method of an optical integrated circuit capable of obtaining the optical integrated circuit operable with desired circuit characteristics without depending on temperature adjustment.SOLUTION: The method includes a detection step S01 of inputting the inspection light L to the optical integrated circuit S and detecting the inspection light L output from the optical integrated circuit S, a calculation step S01 of calculating a feature quantity of a time waveform or a feature quantity of a waveform spectrum of the inspection light L detected in the detection step S02, and a processing step S02 of performing refractive-index adjustment processing on the waveguides Se on the basis of a comparison result between the feature quantity calculated in the calculation step S04 and a preset designed value of the feature quantity.SELECTED DRAWING: Figure 8

A connector component (10) according to one embodiment connects an optical component (40), optically coupled to light (H), to an optical IC substrate (20) that has a substrate surface (21) with a component mounted thereon and that emits the light (H) from the substrate surface (21) in a direction intersecting the substrate surface (21). The connector component (10) includes a fixing part (11) to which the optical component (40) is fixed and which contacts the substrate surface (21). The fixing part (11) contains a heat-resistant material that withstands the heat of solder reflow. The fixing part (11) has a hole (11h) for reducing the contact area with respect to the substrate surface (21).

A low refractive resin composition for TPP nano 3D printing and a photonic wire bonding method using the same are disclosed. The low refractive resin composition for TPP nano 3D printing is a fluorinated resin composition with low refractive index characteristics that contains a (meth)acrylic reactive group that has sufficient solubility for a photoinitiator for TPP reaction, and thus, a photonic wire bonding (PWB) method is presented that can minimize optical loss and fabricate a highly reliable photonic integrated circuit (PIC) by supporting printing of not only a micro-sized single mode optical waveguide but also a clad for an optical waveguide surrounding the single mode optical waveguide formed in this way by the TPP nano 3D printing method.

To provide an optical integrated circuit element capable of avoiding an increase in size.SOLUTION: An optical integrated circuit element includes: a first optical circuit element and a second optical circuit element each requiring temperature control; and a temperature sensor that measures temperatures of the first optical circuit element and the second optical circuit element.SELECTED DRAWING: Figure 1

An optical integrated circuit is described that is constructed from a plurality of passive layers and active layers, arranged in a cascaded order, alternating between passive layer and active layer. Each passive layer relates its inputs to its outputs through a respective transmission matrix that may be implemented as an inverse designed diffractive block, such as metasurface. Each active layer includes one or more reconfigurable optical phase shifters. The layouts of each of the plurality of passive layers and the plurality of active layers are jointly determined using co-design having an optimization function incorporating parameters for the passive layers and the active layers.

An optical integrated circuit (IC) structure includes: a substrate including a fiber slot formed in an upper surface of the substrate and extending from an edge of the substrate, and an undercut formed in the upper surface and extending from the fiber slot; a semiconductor layer disposed on the substrate; a dielectric structure disposed on the semiconductor layer; an interconnect structure disposed in the dielectric structure; a plurality of vents that extend through a coupling region of the dielectric structure and expose the undercut; a fiber cavity that extends through the coupling region of dielectric structure and exposes the fiber slot; and a barrier ring disposed in the dielectric structure, the barrier ring surrounding the interconnect structure and routed around the perimeter of the coupling region.

An object of the present disclosure is to provide a zero refractive index material having no ohmic loss, high compatibility with an optical integrated circuit, and further a wide bandwidth for exhibiting a zero refractive index.The present disclosure provides a resonator including a plurality of divided air holes in a unit cell, and the plurality of divided air holes includes two or more types of divided air holes different in dimension or shape, or both of them. The plurality of divided air holes may be provided at respective corners of the unit cell. The plurality of divided air holes has a shape in which a circular, elliptical, polygonal, or star-shaped polygonal air hole is divided. In addition, the present disclosure also provides a metamaterial including a plurality of the resonators. In addition, the present disclosure also provides an optical element and an optical device including the metamaterial.

The application provides a three-dimensional optoelectronic integrated packaging structure and a preparation method thereof. The packaging structure comprises a TSV substrate, a rewiring layer, a first electric chip, a second electric chip, a dielectric layer, a conductive column, an optical chip module, a 3D stacked chip and a horizontal storage chip. The optical chip module, the first electric chip and the 3D stacked chip are connected by the TSV substrate and the rewiring layer to form an optical integrated circuit. The 3D stacked chip, the second electric chip and the horizontal storage chip are connected by the TSV substrate and the rewiring layer to form an electric integrated circuit. The transmission distance between the optical integrated circuit and the electric integrated circuit is shortened, the packaging area is reduced, the power consumption is lowered, and high-density integrated packaging of the optical and electric chips is realized.

An optical integrated circuit element according to the present disclosure includes: a first optical circuit element and a second optical circuit element each requiring temperature control; and a temperature sensor configured to measure temperatures of the first optical circuit element and the second optical circuit element.

A connector component according to one embodiment of the present invention is disposed on a substrate surface of an optical IC substrate. This connector component comprises: a reflective component that reflects, in a second direction along the substrate surface, light emitted in a first direction intersecting the substrate surface; an optical component that is optically coupled with light emitted from the reflective component in the second direction; a receptacle which holds the reflective component and to / from which the optical component is attached / detached; and a positioning part that positions the optical component with respect to the receptacle. The positioning part is disposed at a position aligned along the first direction with the optical path of the light emitted in the second direction.

To provide an optical module that can suppress the decline in yield. [Solution] The optical module (10) includes a wiring board (20), a plurality of electronic components (30) mounted on the wiring board (20), and a waveguide component (40) mounted on the wiring board (20) and interconnecting the plurality of electronic components (30). The waveguide component (40) includes a waveguide substrate (50) having an optical waveguide (52) and an upper surface and a lower surface, and an optical integrated circuit element (70) mounted on the lower surface of the waveguide substrate (50) and optically connected to the optical waveguide (52). The waveguide component (40) includes an electrical integrated circuit element (60) mounted on the upper surface of the waveguide substrate (50) and electrically connected to the optical integrated circuit element (70).

A connector component according to an embodiment includes a substrate component fixed to an optical IC substrate configured to allow light to be incident on and emitted from a substrate surface in a direction intersecting the substrate surface, and an optical component configured to be attached to and detached from the substrate component and optically coupled with the light when attached to the substrate component. One of the substrate component and the optical component has a guiding pin configured to fix a position of the optical component with respect to the substrate component. One of the substrate component and the optical component not having the guiding pin has a guiding hole into which the guiding pin is inserted. The guiding hole is opened in a direction intersecting a direction in which the guiding pin is inserted into the guiding hole.

Optical integrated circuit package (BT), comprising a support substrate (SUB) comprising a mounting face (FM) and an electrical interconnection network (INTCNX) between the mounting face and contact pads (PAD1, PAD2) located on a lower face (FL) of the support substrate, a cover (CPT) having a side wall (PRLAT) fixed on the mounting face and an upper wall (PRSUP1) comprising a first opening (FNT1), a first optical element (OPT1) fixed on the upper wall of the cover (CPT) and closing the first opening (FNT1), an electromagnetic shielding element (SHLD) embedded in the cover (CPT) and intended to be coupled to a cold supply point (GND) via the interconnection network (INTCNX) and at least one contact pad (PAD1), a first electronic chip (CHP1) mounted on the mounting face (FM) and in optical cooperation with the first optical element (OPT1). Figure for abstract: Fig 1

This reduces the time required for alignment processing, enabling efficient inspection of optical waveguides provided in optical integrated circuits. [Solution] This invention is an optical device for inspecting an optical integrated circuit, comprising: a light source that emits light; an illumination optical unit that shapes the light emitted by the light source into a predetermined shape; a modulation unit that receives the light shaped by the illumination optical unit and modulates the received light with the spatial light modulator to emit light having a predetermined pattern shape; and a light guide unit that guides the light emitted from the modulation unit to the input end of an optical waveguide provided in the optical integrated circuit.