84 results about "Optical integrated circuit" patented technology

An electro-optical integrated circuit comprising an optical transmitter and an optical receiver is disclosed in which a monolithically integrated electro-absorption modulated laser (EML) can operate bi-directionally in both transmitter and receiver modes. Vertically stacked waveguides for lasers and electro-absorption modulators (EAMs) are provided. The laser and the EAM are optically coupled through a transverse conical vertical optical coupler. The EML includes monolithically integrated electronic circuitry, such as drivers and control electronics for driving the laser as the EML and the EAM in the transmitter mode. The control circuit includes a transimpedance amplifier (TIA). The EAM has a first portion and a second portion that may be independently biased. In receiver mode, the laser current is reduced near a threshold, a first portion of the EAM is biased to absorb residual laser light, while a second portion of the EAM provides photocurrent to the TIA as a photodiode receiver.

The invention discloses a laser radar system, and relates to the technical field of laser radars. The laser radar system comprises a silicon optical integrated circuit, a laser generating circuit, an optical scanning circuit, a scanning driving circuit, a laser driving circuit and a main control circuit. The laser generating circuit, the scanning driving circuit, the laser driving circuit and the main control circuit are arranged on different circuit boards; the main control circuit provides a laser driving signal for the laser driving circuit and provides a scanning driving signal for the scanning driving circuit; the laser driving circuit controls the laser generating circuit to emit a laser signal according to the laser driving signal; the scanning driving circuit controls the optical scanning circuit to shape a laser signal according to the scanning driving signal, transmits the laser signal to an object to be scanned, and controls the optical scanning circuit to feed back a detection optical signal detected by the object to be scanned to the silicon optical integrated circuit; the silicon optical integrated circuit provides a detection electric signal for the main control circuit; the master control circuit determines an optical scanning result. According to the invention, the measurement precision and stability of the laser radar system are improved.

The application provides a preparation method of a 3DIC optoelectronic integrated semiconductor packaging structure. The light chip module, the 3D stacked chip and the horizontal storage chip are collectively packaged through a TSV substrate, a rewiring layer, a first electric chip, a second electric chip, a dielectric layer and a conductive column. The light chip module is connected with the 3D stacked chip through the first electric chip, and the 3D stacked chip is connected with the horizontal storage chip through the second electric chip. Thus, the short-distance connection of the optical integrated circuit and the electric integrated circuit is realized, the transmission distance of the optoelectronic signal is greatly reduced, the packaging area is reduced, the power consumption is reduced, and the high-density integrated packaging of the optoelectronic chip is met.

An inspection device 1 comprises: a pulse formation unit that generates a pulse train Pb in which a plurality of light pulses Pb1, Pb2 having different center wavelengths are arranged at predetermined time intervals; a light detection unit 8 that detects a time waveform of the pulse train Pb output from an optical integrated circuit 5; and an evaluation unit 9 that evaluates the optical integrated circuit 5 on the basis of the feature amount of the time waveform. For each of a plurality of waveguides having different lengths that are already known, the evaluation unit 9 refers to the feature amount of the time waveform corresponding to said waveguide to calculate the amount of change in the feature amount of the time waveform with respect to the length of the waveguide, and uses the amount of change to calculate the feature amount of a time waveform of another structure.

This optical integrated circuit comprises an optical waveguide device, a light-emitting device, and a support unit. The optical waveguide device includes a substrate, and an optical waveguide layer that is disposed on the substrate and includes an input coupler and an optical waveguide. The light-emitting device is spaced apart from the optical waveguide device. The light-emitting device includes a light-emitting layer and a phase modulation layer. The phase modulation layer includes a base layer and a plurality of different refractive index regions. The support unit includes a first support portion in which one device is disposed, and a second support portion that supports the other device. The distance between the optical waveguide device and the light-emitting device is smaller than the width of the second support portion in the direction in which the one device and the second support portion are lined up.

This disclosure relates to optical integrated devices, optical integrated circuit wafers, and methods for manufacturing optical integrated devices. The optical integrated device includes a substrate and a waveguide having a hollow structure. The waveguide includes a first waveguide and a second waveguide, the second waveguide being optically coupled to the first waveguide and having a relative refractive index difference smaller than that of the first waveguide, and the waveguide converting a mode diameter to the mode diameter of an optical fiber according to the propagation of light. The optical integrated device includes a recessed portion formed near a cleavage line on the substrate, such that, with the cleavage end surface of the substrate protruding further in the axial direction of the optical waveguide than the output end surface of the second waveguide, the width of the output end surface is smaller than the core width of the optical fiber optically coupled to the output end surface.

To provide a manufacturing method of an optical integrated circuit capable of obtaining the optical integrated circuit operable with desired circuit characteristics without depending on temperature adjustment.SOLUTION: The method includes a detection step S01 of inputting the inspection light L to the optical integrated circuit S and detecting the inspection light L output from the optical integrated circuit S, a calculation step S01 of calculating a feature quantity of a time waveform or a feature quantity of a waveform spectrum of the inspection light L detected in the detection step S02, and a processing step S02 of performing refractive-index adjustment processing on the waveguides Se on the basis of a comparison result between the feature quantity calculated in the calculation step S04 and a preset designed value of the feature quantity.SELECTED DRAWING: Figure 8

A connector component (10) according to one embodiment connects an optical component (40), optically coupled to light (H), to an optical IC substrate (20) that has a substrate surface (21) with a component mounted thereon and that emits the light (H) from the substrate surface (21) in a direction intersecting the substrate surface (21). The connector component (10) includes a fixing part (11) to which the optical component (40) is fixed and which contacts the substrate surface (21). The fixing part (11) contains a heat-resistant material that withstands the heat of solder reflow. The fixing part (11) has a hole (11h) for reducing the contact area with respect to the substrate surface (21).

To provide an optical integrated circuit element capable of avoiding an increase in size.SOLUTION: An optical integrated circuit element includes: a first optical circuit element and a second optical circuit element each requiring temperature control; and a temperature sensor that measures temperatures of the first optical circuit element and the second optical circuit element.SELECTED DRAWING: Figure 1

An optical integrated circuit is described that is constructed from a plurality of passive layers and active layers, arranged in a cascaded order, alternating between passive layer and active layer. Each passive layer relates its inputs to its outputs through a respective transmission matrix that may be implemented as an inverse designed diffractive block, such as metasurface. Each active layer includes one or more reconfigurable optical phase shifters. The layouts of each of the plurality of passive layers and the plurality of active layers are jointly determined using co-design having an optimization function incorporating parameters for the passive layers and the active layers.

The application provides a three-dimensional optoelectronic integrated packaging structure and a preparation method thereof. The packaging structure comprises a TSV substrate, a rewiring layer, a first electric chip, a second electric chip, a dielectric layer, a conductive column, an optical chip module, a 3D stacked chip and a horizontal storage chip. The optical chip module, the first electric chip and the 3D stacked chip are connected by the TSV substrate and the rewiring layer to form an optical integrated circuit. The 3D stacked chip, the second electric chip and the horizontal storage chip are connected by the TSV substrate and the rewiring layer to form an electric integrated circuit. The transmission distance between the optical integrated circuit and the electric integrated circuit is shortened, the packaging area is reduced, the power consumption is lowered, and high-density integrated packaging of the optical and electric chips is realized.

An optical integrated circuit element according to the present disclosure includes: a first optical circuit element and a second optical circuit element each requiring temperature control; and a temperature sensor configured to measure temperatures of the first optical circuit element and the second optical circuit element.

A connector component according to one embodiment of the present invention is disposed on a substrate surface of an optical IC substrate. This connector component comprises: a reflective component that reflects, in a second direction along the substrate surface, light emitted in a first direction intersecting the substrate surface; an optical component that is optically coupled with light emitted from the reflective component in the second direction; a receptacle which holds the reflective component and to / from which the optical component is attached / detached; and a positioning part that positions the optical component with respect to the receptacle. The positioning part is disposed at a position aligned along the first direction with the optical path of the light emitted in the second direction.

To provide an optical module that can suppress the decline in yield. [Solution] The optical module (10) includes a wiring board (20), a plurality of electronic components (30) mounted on the wiring board (20), and a waveguide component (40) mounted on the wiring board (20) and interconnecting the plurality of electronic components (30). The waveguide component (40) includes a waveguide substrate (50) having an optical waveguide (52) and an upper surface and a lower surface, and an optical integrated circuit element (70) mounted on the lower surface of the waveguide substrate (50) and optically connected to the optical waveguide (52). The waveguide component (40) includes an electrical integrated circuit element (60) mounted on the upper surface of the waveguide substrate (50) and electrically connected to the optical integrated circuit element (70).

A connector component according to an embodiment includes a substrate component fixed to an optical IC substrate configured to allow light to be incident on and emitted from a substrate surface in a direction intersecting the substrate surface, and an optical component configured to be attached to and detached from the substrate component and optically coupled with the light when attached to the substrate component. One of the substrate component and the optical component has a guiding pin configured to fix a position of the optical component with respect to the substrate component. One of the substrate component and the optical component not having the guiding pin has a guiding hole into which the guiding pin is inserted. The guiding hole is opened in a direction intersecting a direction in which the guiding pin is inserted into the guiding hole.

Optical integrated circuit package (BT), comprising a support substrate (SUB) comprising a mounting face (FM) and an electrical interconnection network (INTCNX) between the mounting face and contact pads (PAD1, PAD2) located on a lower face (FL) of the support substrate, a cover (CPT) having a side wall (PRLAT) fixed on the mounting face and an upper wall (PRSUP1) comprising a first opening (FNT1), a first optical element (OPT1) fixed on the upper wall of the cover (CPT) and closing the first opening (FNT1), an electromagnetic shielding element (SHLD) embedded in the cover (CPT) and intended to be coupled to a cold supply point (GND) via the interconnection network (INTCNX) and at least one contact pad (PAD1), a first electronic chip (CHP1) mounted on the mounting face (FM) and in optical cooperation with the first optical element (OPT1). Figure for abstract: Fig 1

This reduces the time required for alignment processing, enabling efficient inspection of optical waveguides provided in optical integrated circuits. [Solution] This invention is an optical device for inspecting an optical integrated circuit, comprising: a light source that emits light; an illumination optical unit that shapes the light emitted by the light source into a predetermined shape; a modulation unit that receives the light shaped by the illumination optical unit and modulates the received light with the spatial light modulator to emit light having a predetermined pattern shape; and a light guide unit that guides the light emitted from the modulation unit to the input end of an optical waveguide provided in the optical integrated circuit.

An optical integrated circuit (IC) structure includes: a substrate including a fiber slot formed in an upper surface of the substrate and extending from an edge of the substrate, and an undercut formed in the upper surface and extending from the fiber slot; a semiconductor layer disposed on the substrate; a dielectric structure disposed on the semiconductor layer; an interconnect structure disposed in the dielectric structure; a plurality of vents that extend through a coupling region of the dielectric structure and expose the undercut; a fiber cavity that extends through the coupling region of dielectric structure and exposes the fiber slot; and a barrier ring disposed in the dielectric structure, the barrier ring surrounding the interconnect structure and routed around the perimeter of the coupling region.

This substance sensing device comprises: an optical integrated circuit having a substrate; a ring resonator formed on the substrate, the ring resonator having a first waveguide, a ring waveguide provided with a plurality of receptors to which a substance is bonded, and a second waveguide; a light splitting unit to which measurement light traveling through the first waveguide is input and that splits the measurement light into first light and second light at a predetermined splitting ratio, which monotonically changes over a predetermined wavelength range; a light detection unit that detects at least one of the first light and the second light; and a calculation unit that acquires information relating to the centroid wavelength of the measurement light on the basis of at least the result of the detection by the light detection unit, and then acquires information relating to the amount of the substance bonded to the plurality of receptors on the basis of the information relating to the centroid wavelength.

This optical integrated circuit comprises: a demultiplexer having a plurality of output terminals for dividing an input optical signal into a plurality of optical signals and outputting the optical signals; a plurality of first optical attenuators connected to the plurality of output terminals,respectively; and a second optical attenuator connected in series to at least one of the plurality of first optical attenuators. The plurality of first optical attenuators are configured to be able to dynamically control the attenuation rate in accordance with the intensity of the optical signal inputted from the plurality of output terminals. The second optical attenuator is configured to attenuate the optical signal at a prescribed attenuation rate.

A semiconductor package includes an interposer including a first optical bridge chip between the first redistribution structure and the second redistribution structure, and a first bridge chip between the first redistribution structure and the second redistribution structure and laterally separated from the first optical bridge chip, a plurality of semiconductor devices including a first semiconductor device and a second semiconductor device, the first and second semiconductor devices being on the interposer, and a first optical integrated circuit chip on the interposer and laterally separated from the first semiconductor device. A first region of the first optical bridge chip vertically overlaps a first region of the first semiconductor device. A first part of a second region of the first optical bridge chip vertically overlaps a first region of the second semiconductor device.

To provide an optical integrated circuit and an optical transceiver capable of reducing a difference in a signal level after separation.SOLUTION: An optical integrated circuit 1 or 2 includes a demultiplexer 10 having a plurality of output terminals 141 and 142 for dividing an input optical signal into a plurality of optical signals and outputting the optical signals, a plurality of first optical attenuators 151 and 152 connected to the plurality of output terminals 141 and 142, respectively, and a second optical attenuator 161 connected in series to at least one of the plurality of first optical attenuators 151 and 152. The plurality of first optical attenuators 151 and 152 are configured to be capable of dynamically controlling an attenuation rate according to an intensity of the optical signal input from the plurality of output terminals 141 and 142. The second optical attenuator 161 is configured to attenuate the optical signal at a predetermined attenuation rate.SELECTED DRAWING: Figure 1

The present invention provides a material sensing device, an optical integrated circuit, and a material sensing method that can perform material sensing with high accuracy. [Solution] The material sensing device 1 comprises an optical integrated circuit 10 having a substrate 11, a ring resonator 5 formed on the substrate 11 having a first waveguide 51, a ring waveguide 52 provided with a plurality of receptors RP to which material S is coupled, and a second waveguide 53, an optical separation unit 21 that receives measurement light L traveling through the first waveguide 51 and separates the measurement light L into a first light L1 and a second light L2 at a predetermined separation ratio, wherein the separation ratio changes monotonically in a predetermined wavelength range, an optical detection unit that detects at least one of the first light L1 and the second light L2, and a calculation unit 9b that acquires information on the centroid wavelength of the measurement light L based at least on the detection result of the optical detection unit and acquires information on the amount of material S coupled to the plurality of receptors RP based on the information on the centroid wavelength.

An optical sensor package includes an emitter die mounted to an upper surface of a package substrate. A sensor die is mounted to the upper surface of the package substrate using a film on die (FOD) adhesive layer that extends over the upper surface and encapsulates the emitter die. The sensor die is positioned in a stacked relationship with respect to the emitter die such that a light channel region which extends through the sensor die is optically aligned with the emitter die. Light emitted by the emitter die passes through the light channel region of the sensor die. The emitter die and the sensor die are each electrically coupled to the package substrate.

The present invention provides a waveguide photodetector integrated with an antenna, a system, and a method for sending a signal. The waveguide photodetector integrated with an antenna includes: a photodetector, N optical waveguides and an antenna, where N is a positive integer; the antenna is disposed on a substrate, and a feed gap is formed on a central axis of two arms of the antenna, the photodetector being disposed in the feed gap; and the N optical waveguides are formed on the substrate, and the photodetector is connected to the optical waveguides to obtain modulated optical signals transmitted from the optical waveguides. According to the present invention, the feed gap is formed on a central axis of two arms of the antenna, and the photodetector is disposed in the feed gap, such that the antenna and the photodetector can be integrated on a same device of a same chip, thereby improving the integration level of an optical integrated circuit and system.

This optical integrated circuit is provided with: a substrate; an optical waveguide layer that is disposed on the substrate and includes an input coupler and an optical waveguide; a light-emitting device that is disposed on the optical waveguide layer and has a first surface on the optical waveguide layer side and a second surface on the opposite side from the optical waveguide layer; and a first heat dissipation member that is disposed on the light-emitting device and has a third surface on the light-emitting device side and a fourth surface on the opposite side from the light-emitting device. The light-emitting device includes a light-emitting layer and a phase modulation layer. The phase modulation layer includes a base layer and a plurality of regions having different refractive indices.

Embodiments described herein relate to electronic and photonic integrated circuits and methods for fabricating integrated interconnect between electrical, opto-electrical and photonic devices. One or more optical silicon photonic devices described herein may be used in connection with one or more opto-electrical integrated circuits (opto-electrical chip) on a single package substrate to from a co-packaged optical and electrical device. The methods described herein enable high volume manufacturing of electrical, opto-electrical and the optical silicon photonic devices having a plurality of optical structures, such as waveguides, formed on or integral with a photonic glass layer substrate.

A laser diode may include a substrate, a first semiconductor layer, an active layer, and a second semiconductor layer, which are sequentially stacked on the substrate in a vertical direction of the laser diode, and a plurality of pattern layers spaced apart from each other in a horizontal direction of the laser diode, on the second semiconductor layer, wherein widths of the plurality of pattern layers are different from each other in the horizontal direction.

A cap for an optical integrated circuit package is formed by a molded body including a peripheral side wall and a front wall. The front wall of the cap laterally encapsulates a stack of a clear plate and a diffractive optical element. The peripheral side wall extends from the front wall and includes portions which extend over a rear surface of the stack such that peripheral edge regions of the stack are encapsulated between the front wall of the cap and the peripheral side wall of the cap.