142 results about "Optical integrated circuit" patented technology

Optical Integrated Circuits (OIC) in Surface Plasmon Resonance (SPR) Analysis Systems combined with micorarray or microwell plates to provide enhanced sensitivity, stability, speed of analysis and reduced size are disclosed. Using the OIC with other optical analysis methods to provide enhance analysis systems is also disclosed.

A chip package includes an optical integrated circuit (such as a hybrid integrated circuit) and an integrated circuit that are proximate to each other in the chip package. The integrated circuit includes electrical circuits, such as memory or a processor, and the optical integrated circuit communicates optical signals with very high bandwidth. Moreover, a front surface of the integrated circuit is electrically coupled to a top surface of an interposer, and this top surface is in turn electrically coupled to a front surface of an input / output (I / O) integrated circuit that faces the top surface. Furthermore, the front surface of the I / O integrated circuit is electrically coupled to a top surface of the optical integrated circuit, where the top surface of the optical integrated circuit faces the front surface of the I / O integrated circuit.

An optically-enabled integrated circuit (IC) package for connecting an electrical circuit board to an optical fiber is presented. The IC package comprises an OSA having a laser which is pre-aligned with the optical fiber. The OSA further comprises a standard electrical interface for the connection to the microchip and a standard optical interface for the connection to the optical fiber. A set of mechanical concepts for connecting optical connectors and cables to integrated circuit packages is also presented and can be applied for any type of optical connector such as single optical fiber ferrules, MT-RJ type optical ferrules and 2-D MT-type optical ferrules.

The present invention comprises tunable optical wavelength filters and multi-level optical integrated circuits which use resonant optical cavities in a vertical arrangement with input and output waveguides. The resonant optical cavities are vertically separated from the input and output waveguides by a material or region of lower refeactive index. The vertical arrangement allows accurate control over the gap size between the waveguides and the cavities during manufacture. The present invention also enables the use of electrodes for enhancing tuning characteristics and for multiple tunable optical wavelength filters to be created in vertical alignment with one another by placing two resonant optical cavities and their respective input and output waveguides in vertical alignment with a low refractive index buffer between the multiple tunable optical wavelength filters. In addition, the present invention includes multiple manufacturing methods in which tunable optical wavelength filters are created on different substrates.

A chip package includes an integrated circuit and an optical integrated circuit (such as a hybrid integrated circuit) with an optical source and / or an optical receiver. The integrated circuit and the optical integrated circuit may be proximate to each other on opposite sides of an interposer in the chip package. Moreover, the integrated circuit may include a driver circuit of electrical signals for the optical source and / or a receiver circuit of electrical signals from the optical receiver. Furthermore, the optical integrated circuit may be positioned in a hole or an etch pit in a substrate, and an alignment feature may mechanically couple the substrate to an optical-fiber assembly, so that the optical-fiber assembly is positioned relative to the interposer and the optical integrated circuit. In particular, the optical-fiber assembly may partially overlap the interposer, so that optical signals are provided and / or received from the optical integrated circuit through the interposer.

A chip package includes an optical integrated circuit (such as a hybrid integrated circuit) and an integrated circuit that are proximate to each other in the chip package. The integrated circuit includes electrical circuits that modulate data, communicate data, and serialize / deserialize data, and the optical integrated circuit communicates optical signals with very high bandwidth. Moreover, a front surface of the integrated circuit is electrically coupled to a top surface of an interposer, and a top surface of the integrated circuit is electrically coupled to a front surface of the optical integrated circuit. Furthermore, a bottom surface of the optical integrated circuit faces the top surface of the interposer, and the front surface of the optical integrated circuit is optically coupled to an optical-fiber receptacle, which in turn is optically coupled to an optical-fiber connector.

A chip package includes an optical integrated circuit (such as a hybrid integrated circuit) and an integrated circuit that are adjacent to each other on the same side of a substrate in the chip package. The integrated circuit includes electrical circuits, such as memory or a processor, and the optical integrated circuit communicates optical signals with very high bandwidth. In addition, an input / output (I / O) integrated circuit is coupled to the optical integrated circuit between the substrate and the optical integrated circuit. This I / O integrated circuit includes high-speed I / O circuits and energy-efficient driver and receiver circuits and communicates with optical devices on the optical integrated circuit. By integrating the optical integrated circuit, the integrated circuit and the I / O integrated circuit in close proximity, the chip package may facilitate improved performance compared to chip packages with electrical interconnects.

Optical Integrated Circuits (OIC) in Surface Plasmon Resonance (SPR) Analysis Systems combined with micorarray or microwell plates to provide enhanced sensitivity, stability, speed of analysis and reduced size are disclosed. Using the OIC with other optical analysis methods to provide enhance analysis systems is also disclosed.

A chip package includes an optical integrated circuit (such as a hybrid integrated circuit) and an integrated circuit that are adjacent to each in the chip package. The integrated circuit includes electrical circuits, such as memory or a processor, and the optical integrated circuit communicates optical signals with very high bandwidth. Moreover, a front surface of the integrated circuit is electrically coupled to a front surface of the optical integrated circuit by a top surface of the interposer, where the top surface faces the front surface of the integrated circuit and the front surface of the optical integrated circuit. Furthermore, the integrated circuit and the optical integrated circuit may be on a same side of the interposer. By integrating the optical integrated circuit and the integrated circuit in close proximity, the chip package may facilitate improved performance compared to chip packages with electrical interconnects.

An embodiment of the invention is an optical interconnect module comprising a silicon carrier; a communication integrated circuit mounted on the silicon carrier and an optical integrated circuit flip chip mounted on the silicon carrier. The optical integrated circuit is in electrical communication with the communication integrated circuit by electrical paths in the silicon carrier. Optical paths in the silicon carrier provide optical coupling between the optical integrated circuit and an optical link.

An optical integrated circuit having optical devices is fabricated. These optical devices must be biased in the mutually opposite directions. If such an optical integrated circuit is fabricated using a conductive semiconductor substrate as conventionally, it is not possible to drive the devices by a single power supply since the substrate side is shared as a common polarity by the devices. The present invention realizes a structure where both anode and cathode of each device can be isolated electrically by conventional process technology and provides an optical integrated circuit which can be driven by a single power supply. An optical integrated circuit is formed on a semi-insulative or insulative substrate. A high resistivity region which extends at least from the active layer to the substrate and includes part of an optical waveguide between the devices is formed so as to electrically isolate the anode and cathode of each integrated device from the other device.

A manufacturing method for an optical integrated circuit including a spatial reflection type structure having a perpendicular end surface and an inclined surface formed in an optical waveguide layer. The manufacturing method includes the steps of applying a first photoresist to the upper surface of the optical waveguide layer, removing the first photoresist except a portion corresponding to the inclined surface, and heating the first preferred embodiment to a given temperature to melt the first photoresist at least partially and deform the first photoresist by surface tension, thereby forming a first mask having an inclined shape. The manufacturing method further includes the steps of applying a second photoresist to the upper surfaces of the optical waveguide layer and the first mask, removing the second photoresist at a portion ranging from a position corresponding to the perpendicular end surface to a position corresponding to the upper end of the inclined surface to form a second mask, and etching the first mask, the second mask, and the optical waveguide layer by RIE to thereby simultaneously form the perpendicular end surface and the inclined surface.

The present invention provides an optical bridge for interconnecting optical networking components and methods of making optical bridges that include a waveguide that are compatible with semiconductor processing steps. The optical bridge of the present invention has less optical losses and is less affected by misalignment that prior art interconnections. The waveguide is formed of a curable optical material that spans optically active areas of two components. In one embodiment of the present invention, one optical component is an optical circuit board and the connected optical component is an electro-optical integrated circuit package containing light emitting or light receiving elements. The method provides a curable optical liquid to the components, bringing the components together to form a continuous optical liquid between the components, and curing the optical liquid.

Provided are an electronic device and a light-receiving and light-emitting device which can control the electron configuration of a graphene sheet and the band gap thereof, and an electronic integrated circuit and an optical integrated circuit which use the devices. By shaping the graphene sheet into a curve, the electron configuration thereof is controlled. The graphene sheet can be shaped into a curve by forming the sheet on a base film having a convex structure or a concave structure. The local electron states in the curved part can be formed by bending the graphene sheet. Thus, the same electron states as the cylinder or cap part of a nanotube can be realized, and the band gaps at the K points in the reciprocal lattice space can be formed.

The invention belongs to the colloid photonic crystal preparation and application technical field, in particular to a method for preparation of high quality extensive patterning colloid photonic crystal by ink-jet printing. Under room temperature and by effective control of the substrate wetting quality and the surface tension of monodisperse emulsion particle emulsion ink for ink-jet printing, two or more types of monodisperse emulsion particle emulsion with the same particle diameter are respectively put into different ink boxes of an ink-jet printer and the concentration of the monodisperse emulsion particles in the emulsion in each ink box is 0.5-20 wt percent; and after monodisperse emulsion particle emulsion ink is used for the ink-jet printer to print patterns and then dried, a high-quality colloid photonic crystal with photon ban gaps in the ultraviolet light region and the visible light region is formed on the substrate surface. The highly-sequentially assembled colloid photonic crystals prepare by the invention has good optical property, realizes control effect of photon ban gaps to light and has wider application prospect in the fields of optical devices and optical integrated circuits.

The present invention reduces the waveguide loss in an optical coupling between an optical waveguide layer and a photodetector. A cladding layer having a first refractive index is formed on a photodetector formed on a substrate by repeating spin-coating and curing of SOG. The cladding layer is formed in such a way as to gently cover a step portion between the photodetector and a light shielding layer. An optical waveguide layer which can allow propagating light to be coupled to the photodetector is formed on the cladding layer. This structure can suppress steep curvature of the optical waveguide layer above the photodetector.

An optical integrated circuit includes a planar lightwave circuit, and a semiconductor element, which are fixed at one contact surface. A semiconductor optical amplifier (SOA) and a turnaround waveguide having a turnaround portion are formed on a semiconductor substrate. The turnaround waveguide is turned around on the second substrate and is connected to an output port of the SOA. An input port and an output port of the turnaround waveguide are optically coupled at the contact surface with an input port and an output port of the optical waveguides respectively.

Methods and systems for coupling a light source assembly to an optical integrated circuit are disclosed and may include a system comprising a laser source assembly having a laser, a rotator, and a mirror, where the laser source assembly is coupled to a die including an angled grating coupler and a waveguide. The system may generate an optical signal utilizing the laser, rotate the polarization of the optical signal utilizing the rotator, reflect the rotated optical signal onto the grating coupler on the die, and couple the optical signal to the waveguide, where an angle between a grating coupler axis that is parallel to the waveguide and a plane of incidence of the optical signal reflected to the angled grating coupler is non-zero. The angle between the grating coupler axis and the plane of incidence of the optical signal reflected to the angled grating coupler may be 45 degrees.

Actuators facilitating mechanical beam steering for optical integrated circuits are disclosed. The mechanical beam steering can mitigate thermal sensitivity of optical circuits, for example, arrayed waveguides. Also disclosed are methods for fabricating optical integrated circuits employing actuators.

A chip package includes an optical integrated circuit (such as a hybrid integrated circuit) and an integrated circuit that are adjacent to each other on the same side of a substrate in the chip package. The integrated circuit includes electrical circuits, such as memory or a processor, and the optical integrated circuit communicates optical signals with very high bandwidth. In addition, an input / output (I / O) integrated circuit is coupled to the optical integrated circuit between the substrate and the optical integrated circuit. This I / O integrated circuit includes high-speed I / O circuits and energy-efficient driver and receiver circuits and communicates with optical devices on the optical integrated circuit. By integrating the optical integrated circuit, the integrated circuit and the I / O integrated circuit in close proximity, the chip package may facilitate improved performance compared to chip packages with electrical interconnects.

Optical integrated circuits are disclosed having a gap traversing the lens or the waveguide grating and an actuator that controllably positions the optical integrated circuit on each side of the gap. As a result, the thermal sensitivity of the optical integrated circuits, for example, arrayed waveguide gratings, is mitigated. Also disclosed are methods for fabricating optical integrated circuits employing the gap and actuator.

Optical integrated circuits are disclosed in which a polarization swapping portion is formed in a portion of a waveguide using polarized light from a laser. Also disclosed are methods for fabricating optical integrated circuits and for mitigating polarization dependence in optical integrated circuits.

The present invention discloses an optical IC including a photo-detector formed on a substrate, at least one light-blocking film layer formed in a portion of the main surface of the substrate other than the portion where the light-detector is formed, at least two insulator film layers formed so as to cover the light-blocking film layer, a clad layer formed consecutively over the photo-detector and the insulator film layers, and an optical wave-guide path layer formed on the clad layers, in which the insulator film layers are formed so as to form a plurality of staircase-like steps toward the photo-detector.

Consistent with the present disclosure, a non-adiabatic polarization rotator is provided that can rotate the polarization of an incoming over a relatively short length. Light is supplied to the polarization rotator via a polarizer, which insures that the optical input to the polarization polarization rotator has a desired polarization. Preferably, the polarization rotator has a structure that is readily implemented with semiconductor materials and can be fabricated with known processing techniques. In addition, the polarization rotator and polarizer may include similar materials and / or layers, such that both may be readily integrated on a common substrate, such as an indium phosphide (InP) substrate.

A light source 10 is connected sequentially through a single mode optical fiber and a coupler to one end of a polarization maintaining optical fiber, the other end of which is connected to an optical waveguide of an optical integrated circuit having a branching optical waveguide which has a polarizing function with the polarization axis of the optical fiber being coincident with the direction of the TE mode in the optical waveguide. One end of each of polarization maintaining optical fibers are connected to two other ends of the optical waveguide with the polarization axis of the optical fibers being coincident with the direction of the TE mode in the optical waveguide. The other ends of the optical fibers are connected to one end of each of polarization maintaining optical fibers with their polarization axis displaced by an angle of 45° from each other. The other ends of the optical fibers are connected to the opposite ends of a single mode fiber optic coil.