48 results about "Optical integrated circuit" patented technology

An electro-optical integrated circuit comprising an optical transmitter and an optical receiver is disclosed in which a monolithically integrated electro-absorption modulated laser (EML) can operate bi-directionally in both transmitter and receiver modes. Vertically stacked waveguides for lasers and electro-absorption modulators (EAMs) are provided. The laser and the EAM are optically coupled through a transverse conical vertical optical coupler. The EML includes monolithically integrated electronic circuitry, such as drivers and control electronics for driving the laser as the EML and the EAM in the transmitter mode. The control circuit includes a transimpedance amplifier (TIA). The EAM has a first portion and a second portion that may be independently biased. In receiver mode, the laser current is reduced near a threshold, a first portion of the EAM is biased to absorb residual laser light, while a second portion of the EAM provides photocurrent to the TIA as a photodiode receiver.

To provide a manufacturing method of an optical integrated circuit capable of obtaining the optical integrated circuit operable with desired circuit characteristics without depending on temperature adjustment.SOLUTION: The method includes a detection step S01 of inputting the inspection light L to the optical integrated circuit S and detecting the inspection light L output from the optical integrated circuit S, a calculation step S01 of calculating a feature quantity of a time waveform or a feature quantity of a waveform spectrum of the inspection light L detected in the detection step S02, and a processing step S02 of performing refractive-index adjustment processing on the waveguides Se on the basis of a comparison result between the feature quantity calculated in the calculation step S04 and a preset designed value of the feature quantity.SELECTED DRAWING: Figure 8

A connector component (10) according to one embodiment connects an optical component (40), optically coupled to light (H), to an optical IC substrate (20) that has a substrate surface (21) with a component mounted thereon and that emits the light (H) from the substrate surface (21) in a direction intersecting the substrate surface (21). The connector component (10) includes a fixing part (11) to which the optical component (40) is fixed and which contacts the substrate surface (21). The fixing part (11) contains a heat-resistant material that withstands the heat of solder reflow. The fixing part (11) has a hole (11h) for reducing the contact area with respect to the substrate surface (21).

A connector component according to one embodiment of the present invention is disposed on a substrate surface of an optical IC substrate. This connector component comprises: a reflective component that reflects, in a second direction along the substrate surface, light emitted in a first direction intersecting the substrate surface; an optical component that is optically coupled with light emitted from the reflective component in the second direction; a receptacle which holds the reflective component and to / from which the optical component is attached / detached; and a positioning part that positions the optical component with respect to the receptacle. The positioning part is disposed at a position aligned along the first direction with the optical path of the light emitted in the second direction.

To provide an optical module that can suppress the decline in yield. [Solution] The optical module (10) includes a wiring board (20), a plurality of electronic components (30) mounted on the wiring board (20), and a waveguide component (40) mounted on the wiring board (20) and interconnecting the plurality of electronic components (30). The waveguide component (40) includes a waveguide substrate (50) having an optical waveguide (52) and an upper surface and a lower surface, and an optical integrated circuit element (70) mounted on the lower surface of the waveguide substrate (50) and optically connected to the optical waveguide (52). The waveguide component (40) includes an electrical integrated circuit element (60) mounted on the upper surface of the waveguide substrate (50) and electrically connected to the optical integrated circuit element (70).

A connector component according to an embodiment includes a substrate component fixed to an optical IC substrate configured to allow light to be incident on and emitted from a substrate surface in a direction intersecting the substrate surface, and an optical component configured to be attached to and detached from the substrate component and optically coupled with the light when attached to the substrate component. One of the substrate component and the optical component has a guiding pin configured to fix a position of the optical component with respect to the substrate component. One of the substrate component and the optical component not having the guiding pin has a guiding hole into which the guiding pin is inserted. The guiding hole is opened in a direction intersecting a direction in which the guiding pin is inserted into the guiding hole.

This reduces the time required for alignment processing, enabling efficient inspection of optical waveguides provided in optical integrated circuits. [Solution] This invention is an optical device for inspecting an optical integrated circuit, comprising: a light source that emits light; an illumination optical unit that shapes the light emitted by the light source into a predetermined shape; a modulation unit that receives the light shaped by the illumination optical unit and modulates the received light with the spatial light modulator to emit light having a predetermined pattern shape; and a light guide unit that guides the light emitted from the modulation unit to the input end of an optical waveguide provided in the optical integrated circuit.

This substance sensing device comprises: an optical integrated circuit having a substrate; a ring resonator formed on the substrate, the ring resonator having a first waveguide, a ring waveguide provided with a plurality of receptors to which a substance is bonded, and a second waveguide; a light splitting unit to which measurement light traveling through the first waveguide is input and that splits the measurement light into first light and second light at a predetermined splitting ratio, which monotonically changes over a predetermined wavelength range; a light detection unit that detects at least one of the first light and the second light; and a calculation unit that acquires information relating to the centroid wavelength of the measurement light on the basis of at least the result of the detection by the light detection unit, and then acquires information relating to the amount of the substance bonded to the plurality of receptors on the basis of the information relating to the centroid wavelength.

A semiconductor package includes an interposer including a first optical bridge chip between the first redistribution structure and the second redistribution structure, and a first bridge chip between the first redistribution structure and the second redistribution structure and laterally separated from the first optical bridge chip, a plurality of semiconductor devices including a first semiconductor device and a second semiconductor device, the first and second semiconductor devices being on the interposer, and a first optical integrated circuit chip on the interposer and laterally separated from the first semiconductor device. A first region of the first optical bridge chip vertically overlaps a first region of the first semiconductor device. A first part of a second region of the first optical bridge chip vertically overlaps a first region of the second semiconductor device.

The present invention provides a material sensing device, an optical integrated circuit, and a material sensing method that can perform material sensing with high accuracy. [Solution] The material sensing device 1 comprises an optical integrated circuit 10 having a substrate 11, a ring resonator 5 formed on the substrate 11 having a first waveguide 51, a ring waveguide 52 provided with a plurality of receptors RP to which material S is coupled, and a second waveguide 53, an optical separation unit 21 that receives measurement light L traveling through the first waveguide 51 and separates the measurement light L into a first light L1 and a second light L2 at a predetermined separation ratio, wherein the separation ratio changes monotonically in a predetermined wavelength range, an optical detection unit that detects at least one of the first light L1 and the second light L2, and a calculation unit 9b that acquires information on the centroid wavelength of the measurement light L based at least on the detection result of the optical detection unit and acquires information on the amount of material S coupled to the plurality of receptors RP based on the information on the centroid wavelength.

An optical sensor package includes an emitter die mounted to an upper surface of a package substrate. A sensor die is mounted to the upper surface of the package substrate using a film on die (FOD) adhesive layer that extends over the upper surface and encapsulates the emitter die. The sensor die is positioned in a stacked relationship with respect to the emitter die such that a light channel region which extends through the sensor die is optically aligned with the emitter die. Light emitted by the emitter die passes through the light channel region of the sensor die. The emitter die and the sensor die are each electrically coupled to the package substrate.

The present invention provides a waveguide photodetector integrated with an antenna, a system, and a method for sending a signal. The waveguide photodetector integrated with an antenna includes: a photodetector, N optical waveguides and an antenna, where N is a positive integer; the antenna is disposed on a substrate, and a feed gap is formed on a central axis of two arms of the antenna, the photodetector being disposed in the feed gap; and the N optical waveguides are formed on the substrate, and the photodetector is connected to the optical waveguides to obtain modulated optical signals transmitted from the optical waveguides. According to the present invention, the feed gap is formed on a central axis of two arms of the antenna, and the photodetector is disposed in the feed gap, such that the antenna and the photodetector can be integrated on a same device of a same chip, thereby improving the integration level of an optical integrated circuit and system.

Embodiments described herein relate to electronic and photonic integrated circuits and methods for fabricating integrated interconnect between electrical, opto-electrical and photonic devices. One or more optical silicon photonic devices described herein may be used in connection with one or more opto-electrical integrated circuits (opto-electrical chip) on a single package substrate to from a co-packaged optical and electrical device. The methods described herein enable high volume manufacturing of electrical, opto-electrical and the optical silicon photonic devices having a plurality of optical structures, such as waveguides, formed on or integral with a photonic glass layer substrate.

A laser diode may include a substrate, a first semiconductor layer, an active layer, and a second semiconductor layer, which are sequentially stacked on the substrate in a vertical direction of the laser diode, and a plurality of pattern layers spaced apart from each other in a horizontal direction of the laser diode, on the second semiconductor layer, wherein widths of the plurality of pattern layers are different from each other in the horizontal direction.

A cap for an optical integrated circuit package is formed by a molded body including a peripheral side wall and a front wall. The front wall of the cap laterally encapsulates a stack of a clear plate and a diffractive optical element. The peripheral side wall extends from the front wall and includes portions which extend over a rear surface of the stack such that peripheral edge regions of the stack are encapsulated between the front wall of the cap and the peripheral side wall of the cap.

The present invention provides a light source device that can perform wavelength monitoring and power monitoring while reducing losses. [Solution] The light source device 1 comprises an optical integrated circuit 10 having a substrate 11, an optical element 5a formed on the substrate 11 that outputs a measurement light LM having a predetermined wavelength, an output unit 6 formed on the substrate 11 that outputs the measurement light LM to the outside of the substrate 11, an optical separation unit 21 that receives a portion of the measurement light LM output from the output unit 6 and separates a portion of the measurement light LM into a first light L1 and a second light L2 at a predetermined separation ratio, wherein the separation ratio changes monotonically in a predetermined wavelength range, an optical detection unit that detects at least one of the first light L1 and the second light L2, and a calculation unit 9b that calculates the total light amount and centroid wavelength of the measurement light LM based at least on the detection result of the optical detection unit.

An optical integrated circuit includes wavelength multiplexing / demultiplexing elements. Each wavelength multiplexing / demultiplexing element includes a directional coupler and a delay line. The wavelength multiplexing / demultiplexing elements are connected to each other in a cascade-like manner in multiple stages.

To provide an FMCW _ LIDAR transceiver mounted on an optical integrated circuit.SOLUTION: A light detection and ranging (LIDAR) transceiver for in-vehicle applications, the LIDAR transceiver comprising a light source configured to emit a light beam, a plurality of coherent pixels each comprising an optical antenna, and an optical switch network configured to switchably couple the light beam between a plurality of optical paths, wherein: An optical switch network, wherein each optical path of the plurality of optical paths corresponds to a respective coherent pixel of the plurality of coherent pixels, wherein a transmitted signal is emitted via an optical antenna of a respective coherent pixel of the plurality of coherent pixels and a reflection of the transmitted signal is received as a reflected signal via the optical antenna of the respective coherent pixel.SELECTED DRAWING: Figure 5a

The optical modulator (100) includes a photoelectric conversion unit (1), a two-dimensional material layer (2), and an optical waveguide unit (4). A control light (CL) is incident on the photoelectric conversion unit (1). The two-dimensional material layer (2) faces at least a portion of the photoelectric conversion unit (1). When viewed from the direction in which the control light (CL) is incident, at least a portion of the optical waveguide unit (4) is covered by the two-dimensional material layer (2).

The present disclosure relates to a semiconductor package, and the semiconductor package according to an embodiment includes a substrate having a recess at an edge; a waveguide structure in the recess, the waveguide structure comprising an internal interconnector configured to be connected to an external interconnector; an optical integrated circuit above the waveguide structure, the optical integrated circuit optically connected to the waveguide structure; an electronic integrated circuit on the optical integrated circuit; a semiconductor chip on the electronic integrated circuit; a first conductive post connecting the substrate and the electronic integrated circuit; and a second conductive post connecting the substrate and the semiconductor chip, wherein a first side surface of the waveguide structure is aligned with a side surface of the substrate.

The present invention provides an optical coupling element that improves optical coupling efficiency between an optical fiber and an optical waveguide on an optical integrated circuit. An optical coupling element 100 comprises: a substrate 140; a pair of first optical waveguides 110 disposed in a first direction D1 on the substrate 140; a second optical waveguide 120 disposed in the first direction D1 between the pair of first optical waveguides 110; and a cladding 130 covering the pair of first optical waveguides 110 and the second optical waveguide 120 on the substrate 140. The second optical waveguide 120 is disposed in a manner that allows for optical coupling with the first optical waveguides 110. Each of the pair of first optical waveguides 110 has: a first core 111 disposed in a manner that allows for optical coupling with the second optical waveguide 120; and a second core 112 which is laid above and spaced apart from the first core 111 in a second direction D2 intersecting the first direction D1, and which contributes to a light confinement structure when optically coupled with the first core 111.

A fiber array for edge coupling of at least one optical fiber to at least one wafer substrate is provided, the fiber array including an optical fiber core, a cladding covering the optical fiber core, a V-groove mount on top of the cladding, and a polished tapered lid on the bottom of the cladding.

In an optical module having an electrical integrated circuit and an optical integrated circuit, the heat dissipation performance of the optical integrated circuit is improved. [Solution] The optical module comprises a wiring board having a core layer, a first laminate stacked on the upper surface of the core layer, recesses opening on the upper and side surfaces of the first laminate, and a first metal layer disposed on the upper surface of the core layer with its upper surface exposed at the bottom of the recess; an optical integrated circuit disposed on the upper surface of the first metal layer; and an electrical integrated circuit disposed on the upper surface of the first laminate, capable of transmitting and receiving signals with the optical integrated circuit, wherein the first metal layer extends from a region overlapping with the optical integrated circuit in a plan view to a region not overlapping with the optical integrated circuit in a plan view.

To provide an optical device which realizes both miniaturization and high speed.SOLUTION: The optical device includes an optical integrated circuit chip and a resin member. The optical integrated circuit chip has a first surface on which an optical circuit and a first electrical wiring are formed. The resin member is in contact with at least a part of the optical integrated circuit chip. A dam structure is formed along an outer periphery of the first surface. At least a part of the optical circuit is configured using a heterogeneous material different from a material of the optical integrated circuit chip. The resin member seals the optical integrated circuit chip without sealing a region inside the dam structure on the first surface. A second electric wiring is formed on the surface of the resin member. The second electrical wire is electrically connected to the first electrical wire.SELECTED DRAWING: Figure 1

A device includes an optical integrated circuit device mounted over an upper surface of a support substrate. The optical integrated circuit device includes an optical sensor array supported by a semiconductor substrate made of a first semiconductor material. A discrete semiconductor block, made of a second semiconductor material, is mounted over an upper surface of the optical integrated circuit device adjacent the optical sensor array. The first and second semiconductor materials have substantially matched coefficients of thermal expansion. A parallelpipedal-shaped optical filter is mounted over an upper surface of the discrete semiconductor block and extends over the optical sensor array. One or more edges / corners of the parallelpipedal-shaped optical filter cantilever over the optical sensor array without any provided support.

To provide an optical integrated circuit and an optical transceiver that can execute wavelength separation with good performance on input in which polarized wave is not specified.SOLUTION: An optical integrated circuit 200 comprises: a first element 82 that has a function to separate a plurality of polarized waves from an electromagnetic wave including the polarized waves, or a function to rotate at least part of the plurality of polarized waves after separating the polarized waves from the electromagnetic wave including the polarized waves; and a second element 83 that has a function to separate a plurality of wavelength components included in the electromagnetic wave into respective wavelength components. The first element 82 and the second element 83 are connected in a cascade manner.SELECTED DRAWING: Figure 8

An optical adapter intended to be used as an interface on an optical integrated circuit to produce a widened light beam and thus facilitate the coupling with optical fibers and / or an optical connector. The optical adapter includes a planar mirror on its upper surface and a converging mirror on its lower surface. The light beam propagates by widening between the optical integrated circuit and the converging mirror inside the transparent optical adapter, the path being folded back due to the upper planar mirror.

A light source device (1) comprises: an optical integrated circuit (10) which has a substrate (11); an optical element (5a) which is formed on the substrate (11) and outputs measurement light having a predetermined wavelength; an output unit (6) which is formed on the substrate (11) and outputs the measurement light to the outside of the substrate (11); a light separation unit (21) to which a portion of the measurement light outputted from the output unit (6) is inputted, and which separates the portion of the measurement light into first light and second light at a predetermined separation rate, the separation rate changing monotonously in a predetermined wavelength region; a light detection unit (25, 26) which detects the first light and / or the second light; and a computation unit (9b) which computes the total light amount and centroid wavelength of the measurement light on the basis of at least the detection result of the light detection unit (25, 26).

The present invention comprises: a chip 22 including a substrate 22a and a phase shifter 222 that controls an optical switch which is formed on the substrate 22a; a chip 21 including a substrate 21a and a phase shifter 212 that controls an optical switch which is formed on the substrate 21a; and a wire bonding substrate 25 including an electrode 254 and a common electrode 255 for supplying power to the chips 21 and 22, wherein an optical signal processing device is configured by the chip 22 including an electrode 226 and wiring 223 for connecting the electrode 254 and the common electrode 255 to the phase shifter 222, and an electrode 224 and the wiring 223 for connecting the electrode 254 and the common electrode 255 to a phase shifter 211.