This invention relates to a single-mode
optical fiber supporting
fiber-to-
chip interconnect applications, comprising a core layer and a cladding layer, wherein the core layer R1 has a
radius of 4.2–6.2 μm, and Δ n The cladding thickness ranges from 0.25% to 0.4%, and from the inside out, it consists of an inner cladding, a first planarization layer, a first depressed cladding, a second planarization layer, a second depressed cladding, and an outer cladding. The
radius of the inner cladding, R2, is 5.6–9 μm, and Δn2 decreases linearly. The
radius of the first planarization layer, R3, is 8.1–9.2 μm, and Δn2 decreases linearly. n 3 is -0.05% to 0.05%, the radius of the first indented
blanket R4 is 18.8 to 28.4 μm, Δ n 4 is -0.95% to -0.55%, the radius R5 of the second flattening layer is 24.2 to 29.2 μm, Δ n 5 is -0.05% to 0.05%, the radius of the second indented
blanket R6 is 35 to 50 μm, Δ n The 6-value is -0.50% to -0.75%, and the outer cladding layer is a pure
silica glass layer. This invention has a low cutoff
wavelength, a large
mode field diameter, and good bending performance in short-distance applications.