395 results about "Fiber array" patented technology

The invention belongs to the technical field of environment monitoring, and discloses an underground water environment monitoring system, which comprises a monitoring well body; the packers can be remotely controlled and are arranged in the depth direction of the monitoring well body; the optical fiber array can invert the seepage velocity field of the stratum around the well by applying controlled thermal pulse and monitoring temperature response; the robot flying shuttle can move in the well, and an in-situ chemical analysis module or a geophysical imaging module can be carried on the robot flying shuttle; the artificial intelligence model runs on the remote cloud platform; the artificial intelligence model can fuse multi-source data, takes a seepage field obtained by active detection and a stratum structure obtained by imaging as physical constraints, and can autonomously dispatch a robot shuttle to execute minute-level in-situ chemical diagnosis or scan inter-well strata. According to the invention, the leap from passive observation to active intelligent exploration is realized, and the monitoring precision and timeliness are significantly improved.

The utility model discloses silicon optical wafer test equipment. The silicon optical wafer test equipment comprises a camera assembly, a deflection optical path assembly, a probe station and an optical fiber coupling module, the driving assembly is used for driving the probe station and the deflection optical path assembly to move to the lower part of the camera assembly and the optical fiber end part of the optical fiber array in a mutual switching manner; the optical fiber coupling module is used for clamping the optical fiber end part of the optical fiber array; when the probe station moves to the position below the camera assembly, a cross cursor of a camera of the camera assembly is adjusted to be parallel to a cutting channel of the silicon optical wafer; when the deflection light path assembly moves into the imaging view field of the camera assembly, the camera assembly is used for collecting a first lateral image and a second lateral image through the deflection light path assembly and collecting a vertical image; and adjusting the end part of the optical fiber by using an optical fiber coupling module according to the image, so that the end part of the optical fiber and the optical waveguide are aligned and coupled. According to the application, the operation difficulty and the equipment structure for realizing alignment coupling between the optical fiber end part and the silicon optical waveguide are simplified, and the equipment cost is reduced.

The utility model discloses a high-reliability optical fiber array, the high-reliability optical fiber array comprises a substrate, a cover plate and a plurality of optical fibers, the substrate is provided with a plurality of first V-shaped grooves, one side, close to the substrate, of the cover plate is provided with a concave structure matched with the first V-shaped grooves, and the plurality of optical fibers are fixed through the first V-shaped grooves and the concave structure. The span of the first V-shaped groove is larger than the diameter of the optical fiber. The concave structure abuts against the optical fiber, stress is dispersed, single-point stress of contact between the cover plate and the optical fiber is improved, deformation of the cover plate after stress can be reduced, the thickness of an adhesive layer between the cover plate and the substrate is reduced, meanwhile, the span of the first V-shaped groove is larger than the diameter of the optical fiber, the sharp corner position of the substrate is made to avoid the optical fiber, and the stability of the optical fiber is improved. And adverse problems caused by stress concentration are avoided.

The invention provides a photoelectric integrated packaging structure and a packaging method thereof, and relates to the technical field of photoelectric module packaging. The packaging method of the photoelectric integrated packaging structure comprises the following steps: providing an electric wafer and an optical wafer, and respectively planting welding salient points on bonding pads of the electric wafer and the optical wafer; cutting the electric wafer and the optical wafer to obtain an electric chip and an optical chip respectively; providing a substrate, and forming a bonding pad pattern matched with the welding salient points on the surface of the substrate; the electric chip and the optical chip are inversely welded to the positions, corresponding to the bonding pad patterns, of the substrate through the welding protruding points; an optical waveguide is constructed between the optical fiber array unit and the optical chip, the input end of the optical waveguide is aligned and coupled with the optical output port of the optical chip, and the output end of the optical waveguide is aligned and coupled with the optical fiber end face of the optical fiber array unit. According to the invention, the optical waveguide is directly constructed between the optical chip and the light array unit, so that the alignment difficulty of the optical waveguide is reduced.

A photonic assembly includes: a composite die including a photonic integrated circuits (PIC) die and an electronic integrated circuits (EIC) die, the PIC die including waveguides and photonic devices therein, and the EIC die including semiconductor devices therein; an optical connector unit including a first connector-side mirror reflector and a first transition edge coupler and attached to a top surface of the composite die, wherein the first connector-side mirror reflector is configured to change a beam direction between a vertically-extending beam path through the composite die and a horizontally-extending beam path through the first transition edge coupler; and a fiber array units assembly attached to a sidewall of the optical connector unit.

The utility model provides a laser ablation device which comprises a first laser light source used for emitting treatment laser; the optical splitter is arranged at the output end of the first laser light source and is used for splitting the treatment laser into multiple paths of split laser; wherein the branch lasers are arranged in rows and columns; the optical modulator is arranged at the output end of the optical splitter and is used for performing independent power regulation and control on each branch laser; the optical fiber coupler is arranged at the output end of the optical modulator and is used for coupling the branch lasers into the optical fiber branches of the optical fiber array one by one; the optical fiber array is connected between the optical fiber coupler and the focusing micro-lens array, and each optical fiber branch corresponds to one focusing micro-lens of the focusing micro-lens array; and the focusing microlens array is used for focusing the split laser onto the diseased tissue in space through focusing microlenses for ablation treatment. The technical scheme can be used for ablation treatment of various irregular pathological tissues, and damage to surrounding healthy tissues is avoided.

The invention provides a light emitting module, an optical device and a packaging method of the light emitting module, and relates to the technical field of optical modules. The light emitting module comprises a first substrate, at least two groups of optical components and a driving chip. The first substrate comprises a first surface and a second surface which are oppositely arranged. Wherein one group of optical components is arranged on the first surface, the other group of optical components is arranged on the second surface, and the two groups of optical components have the same structure. Each optical assembly comprises a silicon optical chip, an optical fiber array and a laser assembly. The silicon optical chip of the first surface and the silicon optical chip of the second surface are oppositely arranged, the optical fiber array of the first surface and the laser assembly of the second surface are oppositely arranged, and the laser assembly of the first surface and the optical fiber array of the second surface are oppositely arranged. The first surface and the second surface are respectively provided with a driving chip, the driving chips are electrically connected with the silicon optical chips on the same side, and the silicon optical chips are electrically connected with the first substrate. The light emitting module is high in integration level, compact in structure and good in heat dissipation performance.

The utility model discloses an integrated two -dimensional optical fiber array module, include: fixed base, be equipped with the assembly recess on the fixed base, the optical fiber fixed base piece of card embedding fixed in the assembly recess, the optical fiber fixed base piece is made by glass material and adopts laser processing, be equipped with a plurality of through arrangement and array distribution's optical fiber fixed hole on the optical fiber fixed base piece, and the one side of optical fiber fixed hole is equipped with the guide mouth, and, optical fiber group, optical fiber group includes a plurality of optical fiber bundles, and the front end of optical fiber bundle is from the guide mouth and enters the optical fiber fixed hole, and fills with the glue solid layer in the guide mouth and the optical fiber fixed hole to fix optical fiber bundle, by adopting the optical fiber fixed base piece made of glass material to replace the multilayer single crystal silicon base piece, on one hand manufacturing cost project, and the processing assembly process is simpler, and thus production efficiency is higher, on the other hand can eliminate multilayer single crystal silicon base piece after assembling and appear corresponding precision error, has improved the optical fiber direction precision.

The invention relates to the technical field of optical fiber communication, and discloses a high-precision optical fiber array, an optical communication module and a processing method, the high-precision optical fiber array comprises N optical fibers, a substrate and a cover plate, the substrate is provided with N accommodating grooves, the optical fibers are at least partially arranged in the accommodating grooves, the cover plate covers the N accommodating grooves, and the optical fibers and the cover plate are fixed through laser welding. According to the design, before the N optical fibers and the substrate are assembled, the N optical fibers can be fixed on the cover plate through a laser welding process by adopting the positioning tool with the high-precision V-shaped groove in advance, so that the optical fiber array does not depend on the processing precision of the accommodating groove on the substrate in the assembling process, the manufacturing precision of the optical fiber array is improved, and the manufacturing cost is reduced. And moreover, the accommodating groove on the substrate is not limited to a V-shaped groove any more and can be expanded to a U-shaped groove, a square groove or a circular groove and other groove-shaped structures, so that the Pitch precision and consistency of the optical fiber array are improved.

The application discloses a method for using a fiber array pre-assembly tool, a first positioning block is placed on a mounting seat with a lifting pressing needle, and a side of the first positioning block abuts against a side wall of a stop table; a slide needle is slid until it abuts against the first positioning block; a first fiber array is installed in a mounting groove; a second positioning block is placed above the first positioning block; a second fiber array is installed in a buckle groove; a clamping jaw cylinder is aggregated to make two clamping blocks clamp the second positioning block; the front end faces of the coplanar first positioning block, the second positioning block, the first fiber array and the second fiber array are all arranged in the same plane; the pressing needle is fixed, and the adjusting pin is loosened; a visual detection device is finely adjusted to be the same height as the first positioning block; the visual detection device is turned on; a visual signal transmitted by the visual detection device is observed; a micrometer knob assembly is adjusted to make the first fiber array and the second fiber array reach a predetermined position.

The invention relates to an array detector chip, the upper surface of the detector chip is provided with a plurality of photosensitive surfaces, the upper surface of the detector chip is provided with a bonding pad at each photosensitive surface, the upper surface of the detector chip is provided with two auxiliary photosensitive surfaces, and the upper surface of the detector chip is provided with an auxiliary bonding pad at each auxiliary photosensitive surface. According to the optical engine coupling method, a bonding pad on an array detector chip and an auxiliary bonding pad are respectively bonded with a bonding pad on an electric chip through gold wires; under the active condition, bare optical fibers in two optical channels of an optical fiber array are firstly coupled and aligned with two auxiliary photosensitive surfaces on an array detector chip so as to realize coarse light finding; the method comprises the following steps: firstly, roughly moving the optical fiber array to enable a plurality of bare optical fibers in the optical fiber array to be respectively coupled and aligned with a plurality of photosensitive surfaces, and then finely adjusting to enable the coupling between the optical fiber array and the array detector chip to be maximum. The optical engine is obtained through coupling by adopting the optical engine coupling method. The method has the beneficial effect that the proportion of damaged gold wires is greatly reduced.

The application provides a chip loss testing method and a chip loss testing device. The chip loss testing method comprises the following steps: coupling a first optical fiber in a test optical fiber array with an input waveguide of a chip to be tested; coupling a second optical fiber in the test optical fiber array with an output waveguide of the chip to be tested, wherein the number of the second optical fiber is not less than the number of the output waveguide of the chip to be tested; testing a test data set obtained by inputting a first laser into the first optical fiber, passing through the input waveguide of the chip to be tested and the output waveguide of the chip to be tested, and outputting by the second optical fiber, wherein the number of test data in the test data set is the same as the number of the output waveguide of the chip to be tested; and calculating loss data of each channel of the chip to be tested according to test data set and calibration data matched with the test optical fiber array, wherein the input waveguide of the chip to be tested and any one of the output waveguides of the chip to be tested form a channel.

The application relates to the technical field of optical communication, in particular to a silicon optical engine packaging structure and method. The packaging structure comprises a circuit board and a double-layer chip assembly; the double-layer chip assembly comprises a first chip and a second chip which are arranged in a stack, the first chip is interconnected with the circuit board through a flip process, and the second chip is stacked above the first chip and interconnected with the circuit board; a first optical fiber array is fixed on the first chip, and a second optical fiber array is fixed on the second chip, the first optical fiber array is aligned and coupled with the first chip, and the second optical fiber array is aligned and coupled with the second chip, so that optical signal transmission is realized. The original horizontally-arranged first chip and second chip are converted into vertically-arranged chips through stacking, and the first optical fiber array and the second optical fiber array corresponding to the first chip and the second chip are also correspondingly arranged in a vertical layout, so that the occupied space of the chips and the optical fiber arrays on the circuit board is reduced, and the space utilization in the vertical direction of the circuit board is improved.

The invention discloses an optical fiber array connecting structure, and relates to the technical field of optical fiber communication, the optical fiber array connecting structure comprises a socket, a tray, a gland and an optical fiber array, the socket is provided with a first end and a second end which are mutually connected, the second end is used for being connected with a PIC substrate, and the first end is provided with a limiting groove and a first clamping part; the tray is fixedly connected with the first end, a containing groove communicated with the limiting groove is formed in the tray, and an insertion opening is formed in the end, away from the socket, of the tray; the pressing cover covers the notch of the containing groove, the pressing cover is provided with a second clamping part, the second clamping part is clamped with the first clamping part, and the pressing cover is configured to move relative to the tray so that the first clamping part can be separated from the second clamping part; one part of the optical fiber array is arranged in the containing groove and inserted into the limiting groove in the first direction, and the other part of the optical fiber array penetrates through the insertion opening and extends out of the containing groove. Disassembly can be achieved by translating the gland, compared with hasp connection, the space needed for disassembly and assembly is reduced, and compared with magnetic attraction connection, the anti-drawing force is higher, and connection is more stable.

This application relates to the field of composite materials and discloses a carbon fiber thermally conductive composite material and its preparation method. The composite material includes a thermally conductive layer comprising a first polymer matrix with a longitudinally arranged carbon fiber array along its thickness direction and filling gaps, and an adhesive interface layer disposed on the surface of the thermally conductive layer for bonding external devices. The adhesive interface layer includes a second polymer matrix and sheet-like thermally conductive fillers. Along the direction from near to far from the thermally conductive layer, the angle between the sheet-like thermally conductive filler and the surface of the thermally conductive layer decreases gradually, as does the crosslinking density of the second polymer matrix. By forming a dual-gradient structure of filler angle gradient and matrix crosslinking density gradient in the adhesive interface layer, a directional thermally conductive network is constructed, achieving efficient heat transfer between the external device and the carbon fiber array. Simultaneously, the inner rigid region resists puncture impacts from the carbon fiber ends, while the outer flexible region provides high surface adhesion for bonding the device, enhancing interface reliability.

An auto alignment system is used with a base board that is mounted with at least one laser source, and a fiber array unit (FAU) that includes at least one lens facing the base board. The system includes a location determination unit configured to capture an image of the base board and the FAU, a processor, a motor, and a goniometer. The processor compares a current location of the FAU and an ideal position of the FAU, at which the at least one lens is aligned with the at least one laser source, and determines an offset value associated with the current location of the FAU and the ideal position of the FAU. Then, the processor controls the motor to actuate the goniometer to move the FAU to the ideal position based on the offset value.

The utility model discloses an angle positioning device for FA (Fiber Array) grinding, relates to the technical field of grinding positioning devices, aims to solve the technical problem that the current optical fiber grinding angle fixing device adopts a single fixing structure and is tedious to operate, and comprises an outer ring, an inner disc, an inserting mechanism, a locking mechanism and an adjusting sheet, a hoisting rod is fixed to the middle of the upper end face of the inner disc, side connectors are formed in the outer side of the inner disc in an annular array mode, wiring grooves are formed in the side connectors at equal intervals, butt joint pieces are fixed into the wiring grooves, adjusting openings are formed in the two ends of the interior of each side connector, and the outer rings are fixed to the outer side of the inner disc through connecting screws after being connected in a sleeving mode. Inserting openings are formed in the outer side of the outer ring in an annular array mode, the inserting-connecting mechanisms are inserted into the inserting openings in a sliding mode, the inserting-connecting mechanisms are composed of inserting-connecting boxes, and side blocks are fixed to the two ends of each inserting-connecting box. The utility model has the advantages that the operation is simple, a plurality of optical fiber ends in the light array are positioned in one step, and the operation difficulty is reduced.

The invention discloses a manufacturing method and a structure of a CPO optical module assembly, and belongs to the technical field of semiconductor packaging. The technology comprises the following steps that an EIC wafer and a PIC wafer are prefabricated, an EIC chip set and a PIC chip set are formed, and an end face coupler and an optical waveguide layer are arranged at one end of the upper layer in the front face of the PIC chip set; a plurality of EIC chip sets are temporarily and positively installed and fixed; all the EIC chip sets are plastically packaged, solidified and thinned, the end faces of the metal columns on the EIC chips are exposed, and a plastic package body is formed; manufacturing an RDL layer above the plastic package body; metal balls are planted on the RDL layer, and then the PIC chip set is inversely installed; removing the temporary fixation, and cutting to form an OE light engine module; an OE optical engine module, an optical fiber array assembly and a heat dissipation block are assembled on the PCB, and the optical fiber array assembly is attached to the end face coupler of the PIC chipset and one end of the optical waveguide layer. According to the invention, the difficulty of a packaging process is reduced, the product performance is improved, and the process cost is reduced.

The present invention provides an end capped optical fiber that can reduce the angular misalignment of the optical axis of a collimated light beam. [Solution] The optical fiber with an end cap comprises an optical fiber and an end cap having a first surface connected to the end face of the optical fiber, a second surface located opposite the first surface, and a side surface connecting the first and second surfaces. The end cap includes a convex lens, the second surface includes the convex lens surface, and the side surface includes an outer surface surrounding the optical axis of the convex lens. The angle formed by each of the two intersecting lines between the virtual plane containing the optical axis and the outer surface with respect to the optical axis changes as the virtual plane rotates once around the optical axis.

Provided is a resin composition for an adhesive, which has a low refractive index and a low weight loss rate after a reflow step. A resin composition is used for an adhesive and comprises (A) a siloxane compound having a reactive functional group and (B) a polymerization initiator, and the polymerization initiator (B) comprises at least one onium salt selected from a group consisting of a boric acid onium salt and a gallic acid onium salt. In addition, the onium salt preferably contains at least one cation selected from the group consisting of sulfonium and sulfonium.

The invention discloses a non-polishing low-loss coupling optical fiber array adaptive to a deep silicon etching photon chip, a deep silicon etching photon chip coupling assembly and a method, and belongs to the technical field of silicon photon integration. The device comprises an optical fiber array main body, a V-shaped groove substrate and a special-shaped cover plate, the special-shaped cover plate is attached to the upper surface of the V-shaped groove substrate, an avoiding groove is formed in the position, corresponding to a deep silicon etching area of the end face of the chip, of the special-shaped cover plate, and the depth of the avoiding groove is not smaller than the total height of a residual step on the end face of the chip and a deep groove protruding structure so as to eliminate mechanical interference. The tail end of the optical fiber is positioned in the V-shaped groove, and the light-emitting end face is parallel and tightly butted with the end face of the chip. The customized avoiding groove is integrated in the cover plate, direct, lossless and low-loss coupling of the optical fiber array and the deep silicon etching silicon optical chip with the composite three-dimensional morphology end face can be achieved without extending the optical fiber, removing a bottom cover or polishing the end face of the chip, the integrity of the end face of the chip is effectively protected, and the coupling precision and the device yield are improved.

The application discloses a kind of multi-photon fiber array endoscopic imaging device and method based on hollow spiral scanning, belong to biological imaging technical field.The device includes laser collimation and beam expansion module, pulse chirp module, beam switching module, endoscopic detection module and fluorescence acquisition module.The beam switching module contains optical switch and at least two low group velocity dispersion single-mode fiber array;Endoscopic detection module drives fiber array to perform hollow spiral scanning by resonant driver, its track starting point is not located at the origin of field of view, to avoid central dense sampling.The method switches fiber by optical switch, so that each fiber performs spatial non-overlapping hollow spiral scanning, collects multi-photon signals such as fluorescence, second harmonic and fluorescence lifetime, and completes the central cavity by image reconstruction and fusion, to obtain complete field of view imaging result.The application significantly reduces the central region light damage, improves the uniformity of imaging resolution, and the fused image is based on physical sampling to ensure authenticity and reliability, with high system stability.

This invention discloses a three-dimensional waveguide glass chip based on CPO (Continuous Photonic Optical Array) with an integrated weak-reflection grating sensor array, relating to the field of integrated photonic sensors. The three-dimensional waveguide glass chip of this invention has a multi-core single-mode fiber array connection unit on the left end and a single-mode multi-core fiber optic connection unit on the right end, connected in the middle by a femtosecond laser direct-write multi-channel three-dimensional waveguide. The end directly connected to the optical chip also integrates a weak-reflection fiber grating for temperature measurement. Simultaneously, multiple three-dimensional waveguide glass chips connect to the optical chip, forming a grating temperature sensing array. The signal processing end uses host computer software to perform real-time online monitoring of optical loss and the periphery of the optoelectronic chip interface. This three-dimensional waveguide high-density optical connector with an integrated weak-reflection grating sensor array for CPO applications features low loss, low power consumption, high capacity, and multifunctionality, and can monitor chip temperature and interface quality using non-primary communication bands.

The utility model discloses an optical fiber array end face coupling packaging structure, which relates to the field of optical fiber communication, and comprises a glass substrate and a glass cover plate, the top surface of the glass substrate is provided with a plurality of V-shaped grooves for placing optical fiber arrays, and one ends of two groups of optical fiber arrays are arranged in the V-shaped grooves and are in butt joint one by one; the glass cover plate is arranged on the top surface of the glass substrate and used for being matched with the glass substrate to fix the optical fiber array; and injecting optical glue into one side where the glass substrate and the glass cover plate are connected so as to bond and cure the two groups of butted optical fiber arrays. According to the utility model, the glass substrate with the V-shaped groove is used for bearing the two groups of optical fiber arrays, so that the two groups of optical fiber arrays are respectively arranged at the two sides of the glass substrate with the V-shaped groove and are matched with the glass cover plate to complete fixation, and the two groups of optical fiber arrays are positioned in the same V-shaped groove to complete butt joint coupling without professional coupling equipment, thereby not only improving the butt joint precision, but also improving the accuracy of butt joint. And the operation is simpler and more convenient.

The utility model discloses a kind of pre-buried optical fiber arrays, including base, locating sheet, cover plate and multiple optical fibers, the top surface of base is opened with multiple optical fiber grooves;The top surface of base is opened with compensation groove, to separate as pre-pressing part and rear pressing part;Locating sheet is opened with multiple locating holes along thickness direction, locating hole and optical fiber groove one-to-one correspondence, locating sheet is detachably arranged in compensation groove;Cover plate cover is arranged on the top surface of base, including pre-pressing plate and rear pressing plate, pre-pressing plate and rear pressing plate plasticity connection, the bottom surface of pre-pressing plate is protruded with pressing strip, when pre-pressing plate and pre-pressing part cover, pressing strip is located in compensation groove, locating sheet is extruded and clamped between pressing strip and the side wall of pre-pressing part;Optical fiber includes pre-buried section and rear joint section, pre-buried section is located in corresponding optical fiber groove, and is arranged in corresponding locating hole;Rear joint section is located in the optical fiber groove of rear pressing part, and the inner end of rear joint section is in abutment with corresponding pre-buried section. It can solve the problem that pre-buried section of pre-buried optical fiber array is prone to microslip when sticking cover plate.

A parallel interconnect system for transmitting data comprising: a plurality of light sources for emitting light for use as a carrier for the data; a first optical transceiver array having at least one optical transmitter; at least one fiber array configured to transmit light emitted by the at least one optical transmitter; an first optical coupler configured to couple the plurality of light sources to one end of the at least one fiber array; a second optical transceiver array having at least one optical receiver; a second optical coupler configured to receive and direct the transmitted light from another end of at least one fiber array to the second optical transceiver array.

The invention discloses an optical interface structure of an integrated photonic chip for a fiber-optic gyroscope and an optical coupling method, and belongs to the technical field of integrated optics and optical fiber sensing. All input and output ports of the integrated photon chip are arranged on a coupling end face on the same side of the chip, the ports comprise at least two signal ports and two auxiliary ports, the signal ports are used for connecting tail fibers of polarization maintaining fiber rings of all measuring axes of the fiber-optic gyroscope, and the auxiliary ports are connected with a through type auxiliary coupling optical channel in the chip; each port is integrated with a spot size adaptation unit, and the spot size adaptation unit is used for matching the spot size of the polarization maintaining optical fiber and the chip waveguide; the integrated photon chip realizes single-side end face alignment coupling with the multi-channel polarization-maintaining optical fiber array through the coupling end face, tail fibers of polarization-maintaining optical fiber rings of all measuring axes of the optical fiber gyroscope are directly solidified in the multi-channel polarization-maintaining optical fiber array, a head channel and a tail channel of the multi-channel polarization-maintaining optical fiber array are aligned with two auxiliary ports of the chip respectively, and no extra welding link is needed. According to the invention, the problems of dispersed channel-by-channel coupling of optical interfaces, complex alignment of two-side FAs, large dual-link coupling loss, serious polarization cross coupling and uncontrollable coupling quality are solved, the overall precision and environmental stability of the fiber-optic gyroscope are remarkably improved, the method is suitable for various fiber-optic gyroscopes with single axes, multiple axes and the like, and the system integration level and the assembly consistency are remarkably improved.

This invention discloses a parallel demodulation and intelligent imaging system based on a reconfigurable fiber optic ultrasonic detection array, belonging to the field of ultrasonic / photoacoustic detection and imaging technology. A splicing and clamping type of flexibly reconfigurable fiber optic ultrasonic detection array structure is designed, using detachable slots and assembly fixtures for assembly, supporting dynamic splicing and reconfiguration of the array as needed to adapt to diverse detection environments. A wavelength division multiplexing (WDM) to time division multiplexing (TDM) high-capacity, streamlined parallel demodulation system is developed, forming a path-sharing delay system through the coordinated configuration of delay and beam combining, distinguishing multi-channel detection signals in the time domain, while maintaining small size and low cost. A sound velocity inversion-based highly intelligent calibration ultrasonic imaging algorithm is constructed, integrating a deep learning model to adaptively correct sound velocity distortion in non-uniform media, achieving high-quality imaging. This invention achieves flexible layout, streamlined link, and high-fidelity fiber optic array-based ultrasonic / photoacoustic imaging through synergistic optimization of front-end detection, mid-end demodulation, and back-end imaging.

The optical wave selective switch device comprises a fiber array unit comprising a plurality of input / output ports for sending / receiving laser beam signals having different bandwidths, a switching element for steering laser beams in a switching direction, to specific output ports of the fiber array unit, a dispersing element which disperses laser beam signals which are incident thereon, depending on the wavelength of the laser beam signals. Furthermore, the optical wave selective switch device comprises a diffractive optical element with a two-dimensional phase mask is located adjacent to the switching element and outside of electrodes of the switching element so as to introduce individual phase correction for each wavelength corresponding to respective channels in the optical wave selective switch device.